Grinding and Finishing - IIT Bombayramesh/courses/ME338/grinding.pdf · ME 338: Manufacturing...

54
ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Grinding and Finishing Illegitimi non carborundum ver. 1 1

Transcript of Grinding and Finishing - IIT Bombayramesh/courses/ME338/grinding.pdf · ME 338: Manufacturing...

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton

Grinding and Finishing

Illegitimi non carborundum

ver. 1

1

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton

Overview

• Processes

• Analysis

2

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton 3

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ME 338: Manufacturing Processes II

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Singh/Melkote/Colton

Horizontal Grinding

4

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton 5

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ME 338: Manufacturing Processes II

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Horizontal grinding Vertical grinding

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Centered grinding

Centerless grinding

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Creep Feed Grinding

8

• Full depth and stock is removed with

one or two passes at low work speed

• Very high forces are generated

• High rigidity and power

Advantages • Increased accuracy

• Efficiency

• Improved surface finish

• Burr reduction

• Reduced stress and fatigue

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ME 338: Manufacturing Processes II

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Singh/Melkote/Colton 9

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton 10

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton 11

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ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton 12

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Singh/Melkote/Colton

Grinding Wheels

13

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ME 338: Manufacturing Processes II

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Singh/Melkote/Colton

Grinding Wheels

14

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Grinding Wheel Information

15

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Correctly Mounted Wheel

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Grinding Wheel Surface

17

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Grind Wheel Dressing

18

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Grinding Wheel Dressing

19

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Grinding Chips

20

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Chip formation geometry

21

D

v

V

d

t

q

l

w

t l

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Chip geometry

• As with rolling contact length, the chip length,

l

– D = wheel diameter, d = depth of cut

• Material removal rate, MRR

– v = workpiece velocity, d = depth of cut, b = width

of cut

23

dDl

bdvMRR

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ME 338: Manufacturing Processes II

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Material removal rate

• The chips have a triangular cross-section,

and ratio (r) of chip thickness (t) to chip width

(w)

• So, the average volume per chip

24

2010 tot

wr

wtlltwVolchip4

1

2

1

2

1

w

t l

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Chips

• The number of chips removed per unit time

(n), where c = number of cutting edges

(grains) per unit area (typ. 0.1 to 10 per mm2,

and V = peripheral wheel velocity

25

cbVn

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Combining

26

trw dDl

chipVolnbdvMRR

wtlVbcbdv4

1

dDttrbcVbdv 4

1

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Chip thickness

27

dDrcV

dvt

42

or

D

d

rcV

vt

4

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Specific grinding energy, u

• Consist of chip formation, plowing, and sliding

28

slidingplowingchip uuuu

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Total grinding force

• Get force from power

29

MRRuPower

bdvuVFgrinding

V

bdvuFgrinding

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ME 338: Manufacturing Processes II

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Total grinding force

• From empirical results, as t decreases, the

friction component of u increases

30

tu

1

tKu

11 or

substituting

V

bdv

tKFgrinding

11

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Total grinding force

31 ME 6222: Manufacturing Processes and

Systems Prof. J.S. Colton © GIT 2006

Substituting for t

V

bdv

D

d

rcV

vKFgrinding

4

11

rearranging

dDV

vrcdbKFgrinding

41

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ME 338: Manufacturing Processes II

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Force on a grain

• The force per grain can be calculated

32

AreauFgrain

wtuFgrain2

1

rtw and

tKu

11

ttrt

KFgrain 2

111

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Force on a grain

33 ME 6222: Manufacturing Processes and

Systems Prof. J.S. Colton © GIT 2006

substituting for t, and rearranging

D

d

rcV

vr

KFgrain

4

21

D

d

cV

rvKFgrain

1

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Grinding temperature

• Temperature rise goes with energy delivered

per unit area

34

area

inputEnergyKT 2

dt

KKlb

dlbuKT

1122

D

d

Vcr

v

dKKT

4

121

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ME 338: Manufacturing Processes II

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Grinding temperature

• Rearranging

∆𝑇 = 𝐾1𝐾2𝑑34

𝑉 𝑐 𝑟

4 𝑣𝐷

• Temperatures can be up to 1600oC, but for a

short time.

35

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Grinding – Ex. 1-1

• You are grinding a steel, which has a specific

grinding energy (u) of 35 W-s/mm3.

• The grinding wheel rotates at 3600 rpm, has a

diameter (D) of 150 mm, thickness (b) of 25 mm, and

(c) 5 grains per mm2. The motor has a power of 2

kW.

• The work piece moves (v) at 1.5 m/min. The chip

thickness ratio (r) is 10.

• Determine the grinding force and force per grain.

• Determine the temperature (K2 is 0.2oK-mm/N).

Room temperature is 20oC.

36

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Grinding – Ex. 1-2

• First we need to calculate the depth of cut.

We can do this from the power.

37

bdvuMRRuPower

sec60

min1025

min5.1352000

2

26

3

m

mmmmd

m

mm

sWW

md 6104.91

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Grinding – Ex. 1-3

• Now for the total grinding force

38

V

bdvuFgrinding

mm

m

rev

mmrev

mmmmmm

mm

sWFgrinding

1000150

min3600

25104.91min

150035

3

3

NFgrinding 7.70

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Grinding – Ex. 1-4

• Next, the force per grain

39

wtuFgrain2

1 rtw

ttruFgrain 2

1

and

we need t

mm

mm

mm

grainsmm

mm

D

d

rcV

vt

150

104.91

105min

1503600

min15004

4 3

2

mmt 31032.1

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Grinding – Ex. 1-5

• Substituting

40

231032.1102

135

2

1 ttruFgrain

mmJFgrain /1005.3 4

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Grinding – Ex. 1-6

• For the temperature, we need K1 and K2. K2 is

given, so we need to calculate K1.

41

trKttrt

KttruFgrain 2

1

2

11

2

111

mKN 6

1

1 1032.1102

11005.3

m

NK 3

1 102.46

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Grinding – Ex. 1-7

• substituting

42

Kmmm

N

N

mKT

640104.91

1032.1

12.462.0 6

6

CTTT initial 66064020

dt

KKT 1

12

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ME 338: Manufacturing Processes II

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Honing and Superfinishing

Honing tool used to improve

the surface finish of bored or

ground holes.

Schematic

illustrations of the

superfinishing

process for a

cylindrical part.

(a) Cylindrical

mircohoning, (b)

Centerless

microhoning.

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Lapping

(a) Schematic illustration of the lapping process. (b)

Production lapping on flat surfaces. (c) Production lapping

on cylindrical surfaces.

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Polishing Using Magnetic

Fields

Schematic illustration of polishing of balls and rollers

using magnetic fields. (a) Magnetic float polishing of

ceramic balls. (b) Magnetic-field-assisted polishing of

rollers. Source: R. Komanduri, M. Doc, and M. Fox.

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Abrasive-Flow Machining

Schematic illustration of

abrasive flow machining to

deburr a turbine impeller.

The arrows indicate

movement of the abrasive

media. Note the special

fixture, which is usually

different for each part

design. Source: Extrude

Hone Corp.

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Robotic Deburring

A deburring operation on a robot-held die-cast

part for an outboard motor housing, using a

grinding wheel. Abrasive belts or flexible

abrasive radial-wheel brushes can also be used

for such operations. Source: Courtesy of

Acme Manufacturing Company and

Manufacturing Engineering Magazine,

Society of Manufacturing Engineers.

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Conformal Hydrodynamic Nanopolishing:

Case-study

Applications

• Optics

• Defence & Nuclear

• Electronics

• Industrial

Existing Methods

• Diamond Turning

• Precision Grinding

• Lapping

• Ion Beam Polishing

• Spot Hydrodynamic Polishing

Challenges

• Most processes can polish only flat

surfaces; concave/profiled surfaces

are difficult to superfinish

• Concave surface on hard brittle

materials, such as single crystal

sapphire can not be finished via form

grinding due to process-induced

cracks

• Diamond turning center can be used

for non ferrous materials but it is a

super-precision machine-tool (The

equipment cost is ~ 20 crores besides

the expensive operational cost)

1

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Conformal Hydrodynamic

Nanopolishing Process and Machine

Process Description

• Improvement over existing spot hydrodynamic polishing methods

• Superfinish hard and brittle concave surfaces, specially, sapphire and hardened steels

• Mitigates existing surface microcracks

• Polishing action due to elastohydrodynamic film in the slurry submerged rotating conformal contact (silicone ball in the cavity being polished) 1st Generation

2nd Generation Conformal Hydrodynamic Nanopolishing Machine

Delivered to Precison Engineering Division BARC

(designed and fabricated in the Machine Tools Lab

at IIT Bombay)

2

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Novelty and Technology Breakthrough

• Existing hydrodynamic polishing employs spot polishing unable to

polish small cavities (< 6mm in dia)

– More than 3 degrees of freedom required to polish the entire cavity

effectively

– Small actuation system and polishing tool is required

• Conformal contact has a rotating soft tool which conforms to the shape

of the cavity

• Axis of this tool is inclined at 45˚ and the workpiece is rotated inside a

slurry filled tank which ensures non-zero relative motion between tool

and workpiece at every location in the cavity

• The entire cavity can be polished at once which will be much cheaper

and faster than programming the tool path

• Alternative to expensive Diamond Turning

• Can finish wide range of materials ceramics (sapphire, glass) and

hardened steels

3

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Technology Outcomes • Superfinished surfaces in

steels (< 3nm 3D surface roughness)

• Crack-free surface of < 100 nm 3D surface roughness in single crystal sapphire cavity

• Process knowhow and machine transferred to Precision Engineering Division, BARC for strategic applications in a nuclear device

• The superfinished obtained at a fraction of cost of Diamond turning

• It can also be used by gem polishers which could reduce the health hazard by reducing the dust inhalation and automation is possible

Nanometric finish on hardened steel

Crack-free superfinished surface on single

crystal sapphire cavity

4

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Economics of Grinding and Finishing

Operations

Increase in the cost of

machining and finishing a

part as a function of the

surface finish required.

This is the main reason

that the surface finish

specified on parts should

not be any finer than

necessary for the part to

function properly.

Page 54: Grinding and Finishing - IIT Bombayramesh/courses/ME338/grinding.pdf · ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Grinding and

ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs.

Singh/Melkote/Colton

Summary

• Overview of processes

• Analysis of process

• Example problem

54