G450C

Michael Liehr, General Manager G450C, Vice President for Research

Global 450mm Consortium at CNSE

- CNSE Overview- G450C Vision- G450C Mission- Org Structure- Scope- Timeline

G450CThe Road Ahead for Nano-Fabrication Technology

Anal./Digit.Conversion

Integrated Passives HV Power Sensors

ActuatorsBiochipsfluidics

More than Moore: Diversification

Mor

e M

oore

: Min

iatu

rizat

ion

130nm

90nm

65nm

45nm

32nm

22nm

Bas

elin

e C

MO

S: C

PU, M

emor

y, L

ogic

Information Processing

Digital contentSystem-on-chip

(SoC)

Interacting with people and environment

Non-digital content System-in-package

(SiP)

Combining SoC and SiP: Higher Value Systems

Optoelec. IntegrationWireless

Source: 2005 ITRS, Sematech, ITPC 2011

Fewer will sit in the Front of the “Scaling” Bus…

Leading-Edge Designs drive High Cost and High Volume

Sources: International Business Strategies; GLOBALFOUNDRIES

Heterogeneous Integration using 3D Technology

Hugh Demand in Smart Devices drives Utilization of “Older” Nodes

G450C

3

Fewer public and private playgrounds for:

• Developing new materials, processes and equipment

• Developing technology integration

• Optimizing manufacturing including resource conservation

Industry consolidation will continue as all 450mm participants exploit leading-edge technologies, therefore wafer size and scaling challenges will be hard to discern

“Bigger, yet smaller and more precise”

Cost and financial pressures create need for further pre-competitive collaboration

With permission: D.Armbrust, Sematech, R.Bruck, Intel, ITPC 2011

G450C• Full complement of state-of-the-art 300mm tools.• Used for 1xnm node development.• Compatible with previous generations. • Capacity of ~30 integrated wafer starts per day. • 24/7 operation.• Staffed with professional engineering and faculty.

College of Nanoscale Science and Engineering

G450CAnnouncement on September 27, 2011

• 2,500 new high-tech jobs, including: • 800 at the CNSE• 400 in Utica• 1,500 construction jobs in Albany

• $4.8 billion investment, most of it private • $400 million coming from NYS• R&D in Albany, Canandaigua, Utica,

East Fishkill and Yorktown Heights. • Intel intends to establish its East Coast

headquarters in Albany to manage 450mm development.

G450CGoal: Establish New York State / CNSE as the leader for 450 mm Development

Define the key elements of the Global 450mm Consortium (G450C)

1.Near term (5-years)• Establish a program to develop Test Wafer

fabrication infrastructure, equipment prototypes & high-volume tools to enable industry transition to 450mm.

2.Long term• Equipment set capable of advanced

semiconductor process module development installed and operational at CNSE.

• Establish, staff, and support a follow on process technology development program.

G450C

A public-private partnership program to develop a cost-effective test wafer fabrication infrastructure, equipment prototypes & high-volume tools to enable a coordinated industry transition to 450mm wafers, located primarily at CNSE.

Use of the capability established at CNSE for joint development activities and support of a comprehensive industry ecosystem .

G450C Vision

A partnership of New York State (CNSE), Intel, TSMC, Samsung, IBM and Globalfoundries

G450C

GM and CoordinatorCNSE

450mm Integration Manager

TBD

Program CoordinationManager

TBD

Engineering MangerCVD/PVD/Implant

TBD

450mm Fab OPS Managers (2)

TBD

Internal / OPS GM TSMC

Industry / Strategy GMIntel

Engineering MangerCMP/thermal/cleans

TBD

Engineering MangerPhoto/Etch

TBD

G450C Program Management

• Industry consortium coordinated by not-for-profit entity• Leveraging New York State funding, matched by all industry participants

• Could be the template for interactions with equipment suppliers / SEMI

G450C

• G450C as an umbrella initiative • Assure smooth and coordinated 300mm to 450mm wafer transition• Significant benefit to the industry and the State of New York. • New York state-of-the-art cleanroom and associated infrastructure.• Collective investments of

• G450C members, • State of New York, • Original equipment manufacturers, • Tool, material, and chemical suppliers, and • Facilities and infrastructure contractors.

• Assemble a critical mass of intellectual and physical assets.

G450C Mission

G450C

• New York/CNSE based consortium. – Headquarter and core operations in NY.– CNSE, Intel, Samsung, TSMC, GlobalFoundries, and IBM.

• Consortium to collaboratively work with suppliers – Develop and test 450 mm equipment– Wafers, equipment, people, and fab space will be put in place.– Consortium will have a complete fab tool set at CNSE.– Consortium will work with suppliers and other associations /

consortia to • develop standards and • support the development of common equipment building blocks.

G450C Overview

G450C

• Enable supplier development.• Support tool demonstrations.• Establish wafer support operations.• Enable innovation and do not slow scaling.• Demonstrate a full 450 mm fab tool set.

• Enable OEMs and tool makers to transition to 450mm in a highly coordinated fashion under a financially (New York) leveraged business strategy.

G450C Objectives

G450C

NFX –New CNSE Cleanroom

• >25,000 ft2 in NFX and NFN• NFX RFE in 4Q12

12

Late Tools?

– Expand Test Wafer operations to accelerate and support Supplier development and to support tool demonstrations

– Demonstrate a full 450 mm tool set with ~ 2 Suppliers for each of ~ 50 tool types (~100 demos) by 2014 / 2015

– Current status: RFQ sent, responses due in April

Projected Timeline2012 2013 2014 2015

LaunchG450C

Expand Test Wafer Operations

Demonstrate Full 450 mm Tool Set

Define Further Program Scope

Full‐flow 450 mm Tool Set and Process 

@ CNSE• Objectives Beyond TW/Demo:

Imprint 193i EUV TBDLitho capability   

(Phase 2)

(Phase 1)

G450C

Development and Technology Intercept Targets for 450 mm

Detailed technology goals will be defined by individual company business requirements

2008 2009 2010 2011 2012 2013 2014 2015

Target for IC Maker Pilot Line Tools

Full (flow) set of production process and metrology tools+ automation systems capable of meeting technology targets

Early 450 mm Development

Early Development of Silicon and factory integration / automation standards, interoperability testbeds for component andstandards verification;early tool development

Consortium Programs

ISMI 32/22 nm Equipment Performance MetricsTechnologySynchronizationPoints(ITRS DRAM stagger-contacted Metal 1 half-pitch) 450 mm and 300 mm tools progress

synchronously through technology generations

Process and metrology modules evolve on systems extending several generations

10 nm and beyond

“1X nm Range” forG450C Demonstrations

Tool Demonstrations moved from 2010-12 to 2013-14Tools for Consortium Demonstrations

unit process capable (no full-flow)

450 mm Test Wafer Generation supports tool development and demonstrations

EquipmentDemonstrations

Test WaferGeneration

14 nm Nominal

450-mm Lithography Tool Alignment

1. Prototype  tool*,  193i (G450C) 20132. Beta tool, 193 i/dry 20143. Beta tool, EUV 20154. Early production 193i/dry  20155. Early production  EUV 20166. Production  193i/dry 20167. Production   EUV 2017 

* prototype tool: 14 nm patterning capability,  (relax WPH and overlay )

450mm tool development will strategically align with 300mm EUV schedule to ensure both programs success.

G450C Aligned Schedule

G450C

G450C Summary

– Unique Industry Consortia – Academia - Government partnership

• Successful model applied to 450mm program• Associate memberships for suppliers possible

G450C