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7/28/2019 Glass Coating TechnFunction and Production of Coatings on Architectural Glass: Basics and overviewology Primer
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Function and Production ofCoatings on
Architectural Glass
Basics and overview
Leybold Optics GmbH, Alzenau, Germany
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Outline
Outline
Type and function of glass coatings
Coating processes
Coating machine
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[ Mio m / year ]
745605485438
387
3.910
4.735
533657
815
3.195
2.473
2.760
1.151 1.278
1.510
1.910
2.365
810738601 667576
4433590
500
1.000
1.500
2.000
2.500
3.000
3.500
4.000
4.500
1989 1994 1999 2004 2009
Miom
Residential
Specialitymarkets
M o t o rvehicles
N o n
residential
T o t a lWorld Flat
Flat Glass demand worldwide
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Low-E demand worldwide
40 5565
110
160
1994 1999 2004 2010 2015
Americas
50110
140
210
320
1994 1999 2004 2010 2015
Europe
1,56
1230
80
1994 1999 2004 2010 2015
Asia
Total World: 1994 91 Mio m / year
1999 171 Mio m / year2004 217 Mio m / year
2010 350 Mio m / year
2015 560 Mio m / year
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Requirements:
Block out solar energy
keep building interiors cool(low ShadingC., low g-value)
Nice appearance
from outside ( flexible a*, b* )
Shading coefficients:
monolithic: 0.22 - 0.5
double: 0.14 - 0.4
Flexible transmittance8% - 50%
High selectivity
Solar Control Layer
Solar-Control Coatings
Single glazing orDouble glazing
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Reflection
Metal layer acts
like a mirror toheat waves
Absorption
Heat will be
dissipated inthe layer
What is a Solar Control Coating?
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GLASS
SS
GLASS
SnO2metalCrN
GLASS
TiN
Standard Solar Control Coatings
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Solar control
GLASS
top coat, e.g. Si3N
4
blocker layer, e.g. CrN
Bottom coat, e.g. Si3N4
Ty 7-50 %
many colours possible (bronce, silver, green, blue, pink,) temper able versions available
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What is a Low-E Coating?
Low-E = Low emissivityReduction of heat loss through a window
by reflection and NOT absorption
Three functions of a window:
Transmitting the visible lightReflecting the heat (mirror for infra red light)
Neutral appearance
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0
10
20
30
40
50
60
70
80
90
100
300,0 800,0 1300,0 1800,0 2300,0
Wavelength [nm]
Transmission/Reflection[%]
Typical spectrum of a Low-E Coating
Transmission T
Reflection Glass side Rglass
Reflection Film Side RFilm
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Low-E is Working as a IR-Mirror
TCO transparent conductive oxides CVD processes / Pyrolytic coatings / hard coatings
ZnO
SnO2:F / ITO / ZnSnO4/...
Thin metal films sputtering of thin Ag, Cu or Au films (~20 nm)
soft coatings
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Characteristics of Low-E Coatings
Parameters of a Low-E coating transmission Ty [%] L*
reflection Ry (glass) [%] L* colors in reflection a*, b*
emissivity [%] Rsq [sq]
mechanical stability Brush-test (washing machine)
chemical stability SO2/ NaCl-spray-test / climate-test stray light loss haze [%]
Parameters of a complete double/triple glazing (IGU)
U-value / g-value / shading factor / shading coefficient
solar heat gain / k-value
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Composition of a soft coated Low-E
Nearly all commercial used sputtered Low-E
are based on thin silver films
Ag has the best thermal and electrical conductivity
Cu is not as noble as silver and the color can not becompensated by the dielectric layers
Au is very expensive
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Structure of Low-E Coatings - Principal Layout
Dielectric Layer 2 nd = 50-150 nm
Ag d = 5-20 nm
Dielectric Layer 1 nd = 50-150 nm
Glass ZnO Ag - ZnO ASAHI 1988Glass ITO Ag - ITO IMI-Layers
GLASS
e.g. {
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Protection of Silver
Sputtering the second dielectric layer in a reactive atmosphere(SnO2) could destroy the silver layer.
Protecting the silver allows a following reactive process and might improveadhesion.
D2 nd = 50 - 150 nm
Blocker metallic/suboxide d = 0,5 5 nm
Ag d = 5 - 20 nm
D1 nd = 50 - 150 nmGLASS
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Protection of Silver on Both Sides
The first blocker might improve adhesion.
For temperable systems the first blocker protects the silver of diffusingoxygen and sodium.
Both blockers induce stress to the silver layer to avoid agglomeration duringthe heat treatment.
D2 nd = 50 - 150 nm
B2 d = 0,5 5 nm
Ag d = 5 - 20 nmB1 d = 0,5 5 nmD1 nd = 50 - 150 nm
GLASS
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Better Growth of the Silver Film
The growth of the silver layer is depending on the surface and on thesputtering process. The growth has several steps:
cluster island formation percolation homogenous film
A seed layer can improve the properties of the silver film.ZnO is a well known seed layer.
D2 nd = 50 - 150 nmB2 d = 0,5 - 5 nm
Ag d = 5 - 20 nmSeed d = 3 - 15 nmD1 nd = 50 - 150 nm
GLASS
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Splitting one or both dielectric layers gain better optical appearance.
Different materials with different refractive indices led to more neutralcolors and less loss in reflection.
Additionally some materials have a better adhesion to the next neighbor.
Some dielectric layers are able to improve the protection of silver or can
work as top layers.
D2_2 nd = 50 - 150 nmD2_1 nd = 50 - 150 nm
B2 d = 0,5 5 nm
Ag d = 5 - 20 nmSeed d = 3 15 nm
D1_2 nd = 50 - 150 nm
D1_1 nd = 50 - 150 nm
Improvement of Optical Appearance
GLASS
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Splitting one or both blocker layers could gain better mechanical andchemical resistance of the coating, especially for temperable products.
One blocker is catching the oxygen, the other one improves the adhesionor works as a seed layer for the silver (NiCr-ZnO-Ag-NiCrOx).
D2
B2_2B2_1
AgB1_2 or SeedB1_1D1
Improvement of Stability
GLASS
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The coating is sometimes covered with a very hard layer to obtain a scratchresistance surface. This function is very often combined with the seconddielectric layer D2. Typical materials: Si3N4, SiC or TiO2.
Sometimes temperable coatings are temporary covered with Graphite (C) toprotect the coating before tempering. During the heating process the carbon
will be burned.
Top layerD2
B2_2B2_1
AgB1_2 or seedB1_1D1
Scratch Resistance
GLASS
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Deposition conditions
A sputtered film has severalstages. Thin films are typically
more or less amorphous.
After several atom layers aformation of small crystals begin.The sputtering conditionsinfluence the density and thegrain size in a film.
Sometimes the film is split byan other material to avoid the
formation of crystalline grains.
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Addition of Ag Layers Sharpens SolarTransmission Cut Off
Increasing SelectivityIncreasing Number of
Ag-Layers (0-3)
solar
vis
T
TS=
Comparison of Single-, Double-, and Triple Low-E
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Outline
Coating process
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How to produce such Coatings?
Coating Requirements:
Thin layers (5-100nm) and multiple layers
Optical layers with good uniformity
human eye is the standard (d 2%) Adhesion and corrosion
(Coatings have to survive 20years of usage)
Production Requirements:
Substrate sizes: Jumbo: 6,0x3,2m2 // US: 100x166
Glass thickness: 2mm up to 15mm (varies..)
Yearly throughput: 1.0 Mio m2 up to 10 Mio. m2
Costs: Cost of Ownership and First Investment
Large Area Sputtering within an In-Line Systemis the common solution
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Characteristics:
source is distributed over a certain area
moderate heat impact on the substrate
medium deposition rate
high uniformity coatings
metal and dielectric layers possible
Sputtering: Plasma Process
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Principle Of DC - Diode Sputter Process
Ar+
Ar+
Ar+
Ar+
5000 V
Cathode (watercooled)GroundShield
Target
Substrates
Sputtered
Atoms
Electron In duced
SecondaryEmission
Ion Induced
ScondaryEmission
+
Ano de
Primary
Electrones
Los t
Ions
Sputtering Process
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Principle Of DC - magnetron Sputter Process
Ar+
Ar+
Ar+
Ar
Ar+
Ar+
600 V
N NSS
Cathode (wate rcooled)GroundShield
Target
Substrates
MagneticField
High Density
Plasma
Electron Induced
SecondaryEmissio n
Ion Induced
ScondaryEmission
Primary
Electrones
Lost
Ions
Ar. Pressure
5x10 mbar-3
+
Anode
Magnetron Sputtering
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A sputtering environment comprises
What do we need?
Chamber (vacuum tight)Vacuum system:
pumps, valves,pressure gauges
Substrate and transport system
Sputtering source:cathode, anode,
target, power supply,cooling system,control loop,
Constant plasma:gas inlet and distribution,control loopmeasurement equipment
HMI, maintenance, data storage, etc..
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Outline
Coating Machine
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Transfer1Buffer1Entrance
Sputter1 Sputter x / Proces Area10 Compartments per Sputter Chamber
ExitBuffer2Transfer2
Top View Apollon
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Top View of Complete Coater
Glas
sflow
Bring the substrate from atmosphere to process condition Pressure adaption
Continuous substrate flow
E l f
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Example for an vacuum system
Pump layout for a 5 chamber coater
WAU 2001
SV 630F
L1 B1
100 TMP (tbd)
8 x RA 7001
1x RA 3001
SP 630F
Transfer T1 Process Z (partly)Entrance L1 Buffer B1
2 stages @ B1
RA 7001
RA 3001
2 x SV 630F
2 stages
RAV 8000
RAV 4000
SV 630F
C l ti E l 60 d
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Cycle time: Example 60 seconds
Step1: Glass through L1
L1 B1
V1 V2 V3
F1
L1 B1
V1 V2 V3
F1
Action
Entrance L1 time a
p(L1)
[mbar]
p(B1)
[mbar] Pumps
Open VL1 2,0 1000
Glass m oving into L1 6,0
Close V1 2,0 1000 L0
Pum p tim e L1 33,5 32 L1Open V2 2,0 18,0 18,0 L1+B1
Pum p down during L1+B1
Glass m oving from L1 to B1 6,0 L1+B1
Close V2 2,0 1,1 1,1 L1+B1
Venting L1 5,0 1000
SPS reaction tim e 1,5
Sum 60,0
Cycle time Example 60 seconds
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Action
Buffer chamber B1 p(B1) p(T1)
Open V2 2,0 18,0 18,0 L1+B1
Pump down during L1+B1
Glass moving L1 to B1 6,0 L1+B1
Close V2 2,0 1,1 1,1 L1+B1pump down 38,5 0,015 0,015 B1
open V3 2,0 0,005 6x TMP's
Glass moving B1-T1 6,0
close V3 2,0
SPS reaction time 1,5
Sum 60,0
Step2: Glass through B1
L1 B1
V1 V2 V3
F1
L1 B1
V1 V2 V3
F1
Cycle time: Example 60 seconds
Cycle time: Pump Down Diagram
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Cycle time: Pump Down Diagram
32 mbar
18 mbar 2,90 mbar1,05 mbar
3,510-2 mbar1,5 10-2 mbar
Time [s]
pressu
re[mbar]
Pump down L1 Pump down L1+B1 Pump down B1
System A: 4x (rotary vane pumps + roots blower)System B: 6x (rotary vane pumps + roots blower)
Concept of the Machine
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Concept of the Machine
Entrance Chamber 01
Concept of the Machine
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Concept of the Machine
Single Compartment View
Entrance Chamber
Entry/Exit Chambers
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Entry/Exit Chambers
Sputter Compartments / Drive system
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Sputter Compartments / Drive system
Full protection against heat and dust
Entrance & Exit Chambers
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Entrance & Exit Chambers
Optional hydraulic lid
Buffer Chamber
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Buffer Chamber
Shown here with optional hydraulic lid
Transfer
Transfer
Buffer
Transfer Chamber
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Transfer Chamber
Chamber toa) build up the continuous substrate flowb) adapt the pressure to process conditions
Speed Matching and Differential Pumping
Flow Schematic
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Flow Schematic
Entry Buffer Transfer
Discontinuous loading
decreasing pressure increasing pressure
Pressure adaption
Glass catch up
Continuous glasstransport
Process area
Process chambers with identicalmultipurpose processcompartments (standard: 10)
Process ExitBufferTransfer
Coater-Layout: SLE Example
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y p
2 2 2 3 3 3 3 3 3 2 1 2 2 1 1 2 2 1 1 2 2 1 2 2 2 2 2 2 2 2 2 2
Transfer 1 Transfer 2
TiO2 TiO2 TiO2 ZnO Ag NiCr Si3N4 Si3N4 Si3N4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
AC AC AC AC DC DC AC AC AC150kW 150kW 150kW 150kW 30kW 60kW 150kW 150kW 150kW
Layer-Stack TiO2 TiO2 TiO2 ZnO Ag NiCr Si3N4 Si3N4 Si3N4
1 1 1
Apollon
The layer stack terminates the sequence of the processesand their configuration inside the coater.
Type of process: metal, saturated or transitionLayer thickness, deposition rate, throughput, production speed
Cross talk of the processes, gas separation factors
Gas Separation with tunnel only
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p y
Pumping Sputter Process to both sides via half compartments
GasSeparationProcess A Process B
SPP P P
( ) ( )[ ]
( ) ( )[ ]BpBpApAp
GSF01
01
=
Sputter Section with gas separation
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p g p
Pumping Sputter Process to both sides via half compartments
Process A: Oxide Process B: Nitride
S S PPP P
Gas
Separation
( ) ( )[ ]
( ) ( )[ ]BpBp
ApApGSF
01
01
=
Example for Apollon configurations by LO
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Virtually any coater configuration is possible and can be adjusted tocustomer needs
A few examples of coater configurations :
5.53300 x 7000SuperJumbo
4.53210 x 6100Jumbo
single silver low E,
double silver low E,solar control,temperable low E &solar control,transparentconductive oxides,
1.52540 x 3660US
Estimated Pricein 2008 [M] *
Product rangesAnnual
productivity[Mm] *
Glassdimensions
[mm]Format
*The pricing and the productivity inevitably depends upon the exact scope of the coaters configuration.
Top View of Apollon
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Glas
sflow
Realize the sputtering process for the moving substratesDifferent conditions (Pressure / Gas Mix)
Different materials
Different thicknesses
Process Chamber
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Empty open chamber
Process Chamber
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Single Compartment View
1st compartment with pump lid
Process Chamber
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Configuring the Machine 2
Single Compartment View
Compartment 2 and 3 filled with rotatable cathodes
Process Chamber
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Configuring the Machine 3
Single Compartment View
Further population of the chamber
Process Chamber
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Configuring the Machine 4
Single Compartment View
All 10 compartments closed
Configuring the Machine 5
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View on the shield covered rollers
What Fits in a Process Chamber?
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10 compartment chamber - module
Longitudinal Cross Section
Sputter Compartment
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Cross section view with an installed Rotatable Cathode
Sputter Compartment
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Exemplary set up with Twin Rotatable