Getting started with the digital MEMS microphone expansion ...
Transcript of Getting started with the digital MEMS microphone expansion ...
IntroductionThe X-NUCLEO-CCA02M2 expansion board has been designed around MP34DT06J digital MEMS microphone.
It is compatible with the ST morpho connector layout and with digital microphone coupon boards such as STEVAL-MIC001V1,STEVAL-MIC002V1 and STEVAL-MIC003V1.
The X-NUCLEO-CCA02M2 embeds two MP34DT06J microphones and allows synchronized acquisition and streaming of up to4 microphones through I²S, SPI, DFSDM or SAI peripherals.
It represents a quick and easy solution for the development of microphone-based applications as well as a starting point foraudio algorithm implementation.
Figure 1. X-NUCLEO-CCA02M2 expansion board
Getting started with the digital MEMS microphone expansion board based on MP34DT06J for STM32 Nucleo
UM2631
User manual
UM2631 - Rev 1 - September 2019For further information contact your local STMicroelectronics sales office.
www.st.com
1 Getting started
1.1 Hardware requirements
The X-NUCLEO-CCA02M2 expansion board can be connected to any STM32 Nucleo board.However, the related firmware, X-CUBE-MEMSMIC1, offers an out-of-the-box package for some STM32 Nucleoboards (for further details, refer to the firmware documentation on www.st.com).
Figure 2. X-NUCLEO-CCA02M2 on STM32 Nucleo board
When mounting the X-NUCLEO-CCA02M2 on the STM32 Nucleo, align all the pins with their correspondingconnector.
Note: Handle the boards carefully during this operation and implement ESD prevention measures to avoid damaging(or bending) the male/female pins, connectors and the expansion board components.
1.2 System requirements
To use the X-NUCLEO-CCA02M2 expansion board you need the same hardware and software resources ofSTM32 Nucleo boards (for details, refer to UM1724 on www.st.com) as well as 40 MB of free space on your harddisk and at least 128 MB of RAM to run the related X-CUBE-MEMSMIC1 firmware package.
UM2631Getting started
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2 Hardware description
The X-NUCLEO-CCA02M2 allows testing STMicroelectronics digital MEMS microphones: two MP34DT06Jmicrophones are mounted on the board and 6 headers (4 mounted with 2 additional footprints) are available forconnecting additional microphones by connecting digital microphone coupon boards (STEVAL-MIC001V1,STEVAL-MIC002V1 and STEVAL-MIC003V1).The X-NUCLEO-CCA02M2 interfaces with the STM32 Nucleo microcontrollers via the I²S, SPI, DFSDM or SAIperipherals for the synchronized acquisition of up to 4 microphones.The board also provides USB streaming using the STM32 Nucleo microcontroller USB peripheral: a USBconnector is available together with the footprint to mount a dedicated oscillator that can be used to feed the hostMCU through the OSC_IN pin.Solder bridges allows choosing from different options, depending on the number of microphones and the MCUperipherals involved.
Figure 3. Microphone coupon board connected to X-NUCLEO-CCA02M2
2.1 USB connector and power source
The on-board USB connector supports audio streaming to the host PC and can also be used to power the wholesystem up, including the STM32 Nucleo board, by:• closing Jumper J1 on the X-NUCLEO-CCA02M2 expansion board• placing JP5 in position E5 on the STM32 Nucleo board
2.2 Audio acquisition strategy
A digital MEMS microphone can be acquired via different peripherals (SPI, I²S, GPIO, SAI or DFSDM). It requiresan input clock to output a PDM stream at the same frequency of the input clock.The PDM stream is further filtered and decimated for conversion into PCM standard for audio transmission.
UM2631Hardware description
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Two different digital MEMS microphones can be connected on the same data line, configuring the first one togenerate valid data on the rising edge of the clock and the other one on the falling edge, by setting the L/R pin ofeach microphone accordingly.On the X-NUCLEO-CCA02M2 expansion board two microphones share the same data line. Depending on theperipherals available on the host MCU, different acquisition methods can be implemented to get microphone dataas further detailed in the following paragraphs.
2.2.1 DFSDM microphone acquisitionThe DFSDM peripheral generates the clock needed by the microphones and reads the data on the rising andfalling edges of each PDM line.The acquired signals become an input to DSFDM filters for hardware filtering and decimation to generatestandard PCM streams.An additional software high pass filtering stage removes any DC offset in the output stream. DMA is used toreduce MCU load.
2.2.2 I²S and SPI microphone acquisitionIn this scenario, I²S peripheral is used for the first and second microphone, while SPI is adopted for the third andfourth one.A precise clock signal is generated by the I²S peripheral while the SPI is configured in slave mode and is fed bythe same timing signal generated by I²S. This clock is then halved by a timer and input to the microphones. TheSPI and I²S peripherals operate at twice the microphone frequency to read the data on both the rising and fallingedges of the microphone clock, thus reading the bits of two microphones each.A software demuxing step separates the signal from the two microphones and allows further software processing;typically PDM to PCM conversion is performed to transform PDM signals in the widely adopted and easy tomanage PCM format.For further information regarding MEMS microphones acquisition and PDM to PCM decimation, refer to AN5027and UM2372 on www.st.com.
Figure 4. General acquisition strategy using I²S and SPI
UM2631Audio acquisition strategy
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For single microphone acquisition, the microphone precise clock is generated directly by I²S and one singlemicrophone data line is read by the same peripheral.
2.2.3 SAI microphone acquisitionLike DFSDM, the SAI peripheral with PDM interface is able to generate the precise clock needed by themicrophones and can read the data on the rising and falling edges of each PDM line.Unlike DFSDM, however, SAI cannot convert PDM to PCM in hardware, thus a software step for the conversion isneeded after data acquisition.
2.3 Solder bridge configurations
Several board configurations are possible, depending on the use case.MEMS microphones can be plugged into ST morpho pins, and thus to MCU peripherals, with appropriate solderbridges.Clock routing can also be changed according to specific needs.
2.3.1 Solder bridge functions
Table 1. Solder bridge functions with respect to audio acquisition strategies
Solder bridge Function
SB1 Connects USB DM pin from connector to MCU
SB2 Connects USB DP pin from connector to MCU
SB6 Routes on-board oscillator output to OSC_IN MCU pin
SB7 Connects MEMS clock to MCU timer output channel
SB8 Routes I²S clock to SPI clock
SB9 Merges on-board microphone PDMs to be acquired with one interface
SB10 Connects MIC34 PDM to MCU SPI
SB11 Connects MIC12 PDM to MCU I2S
SB12 Clock from the DFSDM peripheral
SB13 I²S clock from MCU
SB14 Connects I²S clock directly to MIC clock without passing through timer
SB15 Connects I²S clock to MCU timer input channel
SB16 Connects MIC12 PDM to MCU DFSDM
SB17 Connects MIC34 PDM to MCU DFSDM
SB24 Connects MIC34 PDM to MCU SAI
SB25 Connects MIC12 PDM to MCU SAI
SB26 Clock from the SAI peripheral
2.3.1.1 Sample use casesIn this section, we analyze specific use cases together with the corresponding solder bridge configurations basedon the acquisition peripherals involved. Custom setups are also possible for ad-hoc functions.
Note: SB1, SB2, SB6 are reserved for the USB or oscillator pins and are not involved in the audio acquisition process.
2.3.1.1.1 Jumper settings for DFSDM-based systems
1 or 2 microphone acquisition
The clock is generated by DFSDM peripheral and the PDM line of the first and second microphone is routed tothe MCU.
UM2631Solder bridge configurations
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Table 2. Solder bridge configuration for 1 or 2 microphone acquisition
Solder bridge Status
SB7 Open
SB8 Open
SB9 Open/closed
SB10 Open
SB11 Open
SB12 Close
SB13 Open
SB14 Open
SB15 Open
SB16 Close
SB17 Open
SB18 Open
SB19 Open
SB20 Open
SB21 Open
SB24 Open
SB25 Open
SB26 Open
Note: J2 must be placed in position 1-2 for on-board microphone acquisition or 2-3 when using an externalmicrophone while J3 must be left open. When acquiring on-board microphones, close SB9 to acquire both ofthem.
4 microphone acquisition
The PDM line of the third and fourth microphone is also routed to the MCU.
Table 3. Solder bridge configuration for 4 microphone acquisition
Solder bridge Status
SB7 Open
SB8 Open
SB9 Open
SB10 Open
SB11 Open
SB12 Close
SB13 Open
SB14 Open
SB15 Open
SB16 Close
SB17 Close
UM2631Solder bridge configurations
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Solder bridge Status
SB18 Open
SB19 Open
SB20 Open
SB21 Open
SB24 Open
SB25 Open
SB26 Open
Note: J2 and J3 must be placed in position 2-3 for external microphone acquisition.
2.3.1.1.2 Jumper settings for I²S-plus-SPI-based systems
1 microphone acquisition
The I²S peripheral is used directly to give the right clock to the microphone and to acquire the same microphone.
Table 4. Solder bridge configuration for 1 microphone acquisition
Solder bridge Status
SB7 Open
SB8 Open
SB9 Open
SB10 Open
SB11 Closed
SB12 Open
SB13 Closed
SB14 Closed
SB15 Open
SB16 Open
SB17 Open
SB18 Open
SB19 Open
SB20 Open
SB21 Open
SB24 Open
SB25 Open
SB26 Open
Note: J2 must be placed in position 1-2 for on-board microphone acquisition or 2-3 when using an externalmicrophone, while J3 must be left open. If using external microphones, do not plug anything in M2_EXT header.
UM2631Solder bridge configurations
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2 microphone acquisition
The I²S peripheral is used to generate twice the frequency needed by the microphones. In this scenario, the clockis then halved by the timer and routed to the microphones to give them the right clock. I²S therefore reads valuesfrom both edges of the merged PDM lines.
Table 5. Solder bridge configuration for 2 microphone acquisition
Solder bridge Status
SB7 Closed
SB8 Open
SB9 Open /closed
SB10 Open
SB11 Closed
SB12 Open
SB13 Closed
SB14 Open
SB15 Closed
SB16 Open
SB17 Open
SB18 Open
SB19 Open
SB20 Open
SB21 Open
SB24 Open
SB25 Open
SB26 Open
Note: J2 must be placed in position 1-2 for on-board microphone acquisition or 2-3 when using external microphones,while J3 must be left open. When acquiring on-board microphones, close SB9 to acquire both of them.4 external microphone acquisitionThe I²S peripheral is used to generate a clock frequency that is twice the frequency needed by the microphones,and SPI is configured in slave mode to use such timing. As in the previous case, the clock is then halved by thetimer and routed to the microphones to give the right clock. I²S and SPI read values from both the edges of themerged PDM lines.
Table 6. Solder bridge configuration for 4 microphone acquisition
Solder bridges Status
SB7 Closed
SB8 Closed
SB9 Open
SB10 Closed
SB11 Closed
SB12 Open
UM2631Solder bridge configurations
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Solder bridges Status
SB13 Closed
SB14 Open
SB15 Closed
SB16 Open
SB17 Open
SB18 Open
SB19 Open
SB20 Open
SB21 Open
SB24 Open
SB25 Open
SB26 Open
Note: J2 and J3 must be placed in position 2-3 for external microphone acquisition.
Note: Other configurations are available, based on the MCU used.
Note: When acquiring 4 microphones using a NUCLEO-F746ZG development board, JP6 jumper on the board mustbe opened.
2.3.1.1.3 Jumper settings for SAI-based systems
1 or 2 microphone acquisition
The clock is generated by SAI peripheral and the PDM line of the first and second microphone is routed to theMCU.
Table 7. Solder bridge configuration for 1 or 2 microphone acquisition
Solder bridge Status
SB7 Open
SB8 Open
SB9 Open/closed
SB10 Open
SB11 Open
SB12 Open
SB13 Open
SB14 Open
SB15 Open
SB16 Open
SB17 Open
SB18 Open
SB19 Open
SB20 Open
SB21 Open
UM2631Solder bridge configurations
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Solder bridge Status
SB24 Open
SB25 Closed
SB26 Closed
Note: J2 must be placed in position 1-2 for on-board microphone acquisition or 2-3 when using an externalmicrophone while J3 must be left open. When acquiring on-board microphones, close SB9 to acquire both ofthem.
4 microphone acquisition
The PDM line of the third and fourth microphone is also routed to the MCU.
Table 8. Solder bridge configuration for 4 microphone acquisition
Solder bridge Status
SB7 Open
SB8 Open
SB9 Open/closed
SB10 Open
SB11 Open
SB12 Open
SB13 Open
SB14 Open
SB15 Open
SB16 Open
SB17 Open
SB18 Open
SB19 Open
SB20 Open
SB21 Open
SB24 Closed
SB25 Closed
SB26 Closed
Note: J2 and J3 must be placed in position 2-3 for external microphone acquisition.
UM2631Solder bridge configurations
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3 NUCLEO-F746ZG support
To connect an X-NUCLEO-CCA02M2 expansion board to a NUCLEO-F746ZG development board, morphoheader connectors must be soldered on the relevant footprint available on the STM32 Nucleo.
Note: For the expansion board, you do not need to solder the whole 2 x 80 pin header but only a pair of 2 x 38 pinstripline connectors.
UM2631NUCLEO-F746ZG support
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4 Connectors
The pin assignments for the Arduino UNO R3 and the ST morpho connectors are shown in Table 9. ST morphoconnectors and Table 10. Arduino connectors respectively.
Table 9. ST morpho connectors
Connector Pin Signal Remarks
CN7
1 MIC_CLKx2 If SB20 is closed
3 MIC_PDM34 If SB20 is closed
6 E5V
12 3V3
16 3V3
18 5V
20 GND
22 GND
24 V_IN
29 OSC_CLK_OUT If SB6 is closed
35 MIC_CLK_NUCLEO If SB12 is closed
CN10
11 MIC_CLKx2 If SB8 is closed
12 OTG_FS_DP_NUCLEO If SB1 is closed
14 OTG_FS_DM_NUCLEO If SB2 is closed
15 MIC_PDM34 If SB10 is closed
19 MIC_PDM34 If SB24 is closed
24 MIC_CLK_NUCLEO If SB26 is closed
25 MIC_PDM34 If SB17 is closed
26 MIC_PDM12 If SB11 is closed
27 MIC_CLKx2 If SB15 is closed
28 MIC_PDM12 If SB16 is closed
29 MIC_CLK_NUCLEO If SB7 is closed
30 MIC_CLKx2 If SB13 is closed
31 MIC_PDM12 If SB25 is closed
UM2631Connectors
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Table 10. Arduino connectors
Connector Pin Signal Remarks
CN6
2 3V3
4 3V3
5 5V
6 GND
7 GND
8 V_IN
CN5
6 MIC_CLKx2 If SB8 is closed
4 MIC_PDM34 If SB10 is closed
2 MIC_PDM34 If SB24 is closed
CN9
7 MIC_PDM34 If SB17 is closed
7 MIC_CLK_NUCLEO If SB26 is closed
6 MIC_CLKx2 If SB15 is closed
5 MIC_CLK_NUCLEO If SB7 is closed
4 MIC_PDM12 If SB25 is closed
UM2631Connectors
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5 Schematic diagrams
Figure 5. X-NUCLEO-CCA02M2 circuit schematic (1 of 3)
C5
NC (1.5K)
J1
E5V
2GND
D46
5VBUS
D11
3OUT
D-2SB1
NC (100nF)
OTG_FS_DM_NUCLEOOTG_FS_DP_NUCLEO
V_USB
2
3V3
SH27
ID4
GND5
EN1
C3
1
1Vbus
SH49
VDD4
3V3
100nF
R3
V_USB
1
D2
USBLC6-2SC6U1
D1
U2 NC (8MHz)
ON: 5 V Voice -> STM32 Nucleo(stream power from expansion board USB)OFF: 5 V generated on the STM32 Nucleo
8SH3
OSC_CLK_OUT
D34
D23
6SH1
2GND
ESDA7P60-1U1M
NC (15pF)
SB2
0R
USB Mini-B
C42
D+3
STPS160A
USB
Figure 6. X-NUCLEO-CCA02M2 circuit schematic (2 of 3)
2
Open
6
34
6
OTG_FS_DP_NUCLEOOTG_FS_DM_NUCLEO
5
3335
3234
E5V
1921
MIC_LED
37
61
22
SB7
CN8
9
2
262830
3
2425
SB17
SPI1_MOSI
3
17
MIC_CLK
OSC_CLK_OUT
MIC_CLK_x2
HEADER 19x2
78
1416
CN5
2
4
36
4SPI1_MISO
25
u4_LED
MIC_PDM34 MIC_PDM12
MIC_CLK_NUCLEO
35
20
3CN6
R4
CN10
SB14
SB10
1
SB1626
17
36
SPI1_SCK
1
18
3
6
31
4
7
4
18
100
11
SB24
SB21
8
238
2729
CN9
16
2
9
MIC_CLK_x2
SB20
5
SB26
5
38
29
5
24
5
15pF
MIC_CLK_NUCLEO
3
CN7
MIC_CLK_NUCLEO
11
27
MIC_CLK_x2
SPI1_CS
C6
2830
MIC_PDM12
SB15
SB25
7
2
15
10
3133
10
22
14
20
13
37
32
19
7
4
MIC_PDM34
21
1
3
9
5VV_IN
MIC_CLK_x2
SB12
8
15
6
SB13
MIC_CLK_NUCLEOMIC_CLK_x2
SB11
OpenOpen
Open
Close
Close
Close
Close
Open
Open
OpenOpen
Open
Open
Open
Open
Open
Open
17
SB23
12
3V3
1012
SB22
8
HEADER 19x2
23
4
2
385
MIC_PDM34
13
SB8 MIC_PDM34
SB6
1
6
UM2631Schematic diagrams
UM2631 - Rev 1 page 14/22
Figure 7. X-NUCLEO-CCA02M2 circuit schematic (3 of 3)
6
Open
6
GN
D5D
3V3
3CLK
MIC_PDM12_u4
MIC_PD
MIC_CLK
MIC_PDM34_u4
1
MIC_PDM12_OB
2
6
1
6
MIC_PDM12_EXTOpen
SB19
3
MIC_PDM12_OB
MIC_PDM34
MIC_CLK
MIC_PDM12_EXT
MIC_CLK
MIC_PU
1
MIC_PU
2LR
u4_LED
J2
MIC_PDM12_EXT
4
MIC_LED
MIC_PDM34_EXT
HEADER 3X2
1
HEADER 3
SB9
CLK
Mic Source Selector
Additional
Open
2
3 2
5
3V3
3
1VDD
MIC_PDM12_u4
3V3
MIC_PD6
14
4
C7
NCCN1
2
4
2
4
4
3
J3
M2
u4
On-Board (OB)
External (EXT)
5
C2
MIC_LED
GN
D5A
MIC_CLK
1
10K
MIC_PU
NC (HEADER 3x2)
4
MIC_PDM34_OB
MIC_PD
MIC_CLK
DOUT
1uF
M1_EXT_B
5
MIC_PDM34_EXT
MIC_CLK
3
MP34DT06J
GN
D5B
100nF
M1 MP34DT06J
5DG
ND
M2_EXT
6
MIC_PU
8
MIC_PD
3V3
MIC_PDM12_EXT
1uF
1
3
SB18
HEADER 3X2
3
DOUT
5
55
MIC_PU
2
GN
D5A
MIC_PD
M3_EXT
GN
D5C 5C
MIC_PDM34_u4
3V3
MIC_PU
C8
MIC_PDM12_u4
MIC_PDM12_EXT
MIC_PDM34_EXT
R1
MIC_LED
MIC_PDM34_EXT
MIC_CLK
4
MIC_LED
9
NC (HEADER 3x2)
LR2
M4_EXT_A
3
2
R2
VDD
3V3
HEADER 3X2
4
1
3V3
3V3
3V3
10
1
MIC_PDM34_OB
MIC_PDM34_EXT
3V3
HEADER 3MIC_PDM34_OB
5
3
7
100nF
M4_EXT_B
5B
GN
D
C1
MIC_PDM12_OB
GN
D
6
HEADER 3X2
10K
3MIC_LED
2
2
MIC_PDM12
1
MIC_CLK MIC_LED
M1_EXT_A
MIC_PDM34_u4
MIC_CLK
UM2631Schematic diagrams
UM2631 - Rev 1 page 15/22
6 Bill of materials
Table 11. X-NUCLEO-CCA02M2 bill of materials
Item Quantity Reference Part/value Description Manufacturer Order code
1 1 CN1 Stripline M (notmounted) Harwin M52-040023W1045
2 1 CN5 HEADER 10 Stripline F Harwin orequivalent M20-7821046
3 2 CN6, CN9 HEADER 8 Stripline F Harwin orequivalent M20-7820846
4 2 CN7, CN10 HEADER 19x2 Stripline F Samtec ESQ-119-14-G-D
5 1 CN8 HEADER 6 Stripline F Harwin orequivalent M20-7820646
6 3 C1, C2, C5100 nF X7R±10% 0805(2012M)
Ceramic capacitor Murata GCM21BR71H104KA02L
7 1 C315 pF C0G±5% 0805(2012M)
Ceramic capacitor(not mounted) Kemet C0805C150J5GACTU
8 1 C4100 nF X7R±10% 0805(2012M)
Ceramic capacitor(not mounted) Murata GCM21BR71H104KA02L
9 1 C615 pF C0G±5% 0805(2012M)
Ceramic capacitor Kemet C0805C150J5GACTU
10 2 C7, C81 µF X7R±10% 0805(2012M)
Ceramic capacitor Murata GCM219R71C105KA37D
11 1 D1 60 V, 1 A Power Schottkyrectifier ST STPS160A
12 1 D2 ESDA7P60-1U1M
High power transientvoltage suppressor ST ESDA7P60-1U1M
13 1 J1 HEADER 2 Stripline TH 3M 961102-6404-AR
14 2 J2, J3 HEADER 3 Stripline M 3M 961103-6404-AR
15 4
M1_EXT_A, M2_EXT,M3_EXT,M4_EXT_A
HEADER 3X2 3x2 coupon header Harwin M20-7820346
16 2M1_EXT_B,M4_EXT_B
NC (HEADER3x2)
3x2 coupon header(not mounted) Harwin M20-7820346
17 2 M1, M2 MP34DT06J
MEMS audio sensoromnidirectionalstereo digitalmicrophone
ST MP34DT06J
18 2 R1, R210 K 100ppm/°C ±1%0805 (2012M)
SMD resistors TEConnectivity CRG0805F10K
19 1 R31.5 K 100ppm/°C ±1%0805 (2012M)
SMD resistor (notmounted) Vishay CRCW08051K50FKEA
UM2631Bill of materials
UM2631 - Rev 1 page 16/22
Item Quantity Reference Part/value Description Manufacturer Order code
20 1 R4100 100ppm/°C ±1%0805 (2012M)
SMD resistor Vishay CRCW0805100RFKEA
21 7
SB1, SB2,SB7, SB9,SB11,SB13,SB15
0 R 100ppm/°C ±1%0603 (1608M)
SMD resistors Vishay CRCW06030000Z0EB
22 16
SB6, SB8,SB10,SB12,SB14,SB16,SB17,SB18,SB19,SB20,SB21,SB22,SB23,SB24,SB25,SB26
0 R 100ppm/°C ±1%0603 (1608M)
SMD resistors (notmounted) Vishay CRCW06030000Z0EB
23 1 USB USB Mini-B USB connector Contact MUSB-5B-2.0-S059 SERIES
24 1 U1 USBLC6-2SC6 ESD protection forhigh speed USB 2.0 ST USBLC6-2SC6
25 1 U2 8 MHz 50 ppm7 x 5 x 1.8 mm
8 MHz oscillator (notmounted) Raltron CO4305-8.000-EXT
26 1 J1 J1 closed Jumper Molex 90059-0007
27 1 J2 J2 - position1-2 Jumper Molex 90059-0008
28 1 J3 J3 off Jumper Molex 90059-0009
UM2631Bill of materials
UM2631 - Rev 1 page 17/22
Revision history
Table 12. Document revision history
Date Version Changes
18-Sep-2019 1 Initial release.
UM2631
UM2631 - Rev 1 page 18/22
Contents
1 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
1.1 Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 System requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 Hardware description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2.1 USB connector and power source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Audio acquisition strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2.1 DFSDM microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2.2 I²S and SPI microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2.3 SAI microphone acquisition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Solder bridge configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3.1 Solder bridge functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 NUCLEO-F746ZG support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4 Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
5 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
6 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
UM2631Contents
UM2631 - Rev 1 page 19/22
List of figuresFigure 1. X-NUCLEO-CCA02M2 expansion board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Figure 2. X-NUCLEO-CCA02M2 on STM32 Nucleo board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Figure 3. Microphone coupon board connected to X-NUCLEO-CCA02M2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 4. General acquisition strategy using I²S and SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Figure 5. X-NUCLEO-CCA02M2 circuit schematic (1 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 6. X-NUCLEO-CCA02M2 circuit schematic (2 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 7. X-NUCLEO-CCA02M2 circuit schematic (3 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
UM2631List of figures
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List of tablesTable 1. Solder bridge functions with respect to audio acquisition strategies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Table 2. Solder bridge configuration for 1 or 2 microphone acquisition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Table 3. Solder bridge configuration for 4 microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Table 4. Solder bridge configuration for 1 microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Table 5. Solder bridge configuration for 2 microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 6. Solder bridge configuration for 4 microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 7. Solder bridge configuration for 1 or 2 microphone acquisition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Table 8. Solder bridge configuration for 4 microphone acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Table 9. ST morpho connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 10. Arduino connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Table 11. X-NUCLEO-CCA02M2 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Table 12. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
UM2631List of tables
UM2631 - Rev 1 page 21/22
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UM2631
UM2631 - Rev 1 page 22/22