General Description Features - Diodes Incorporated Sheet 1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK...

Data Sheet

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211

Apr. 2013 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

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General Description The AP3211 is a 1.4MHz fixed frequency, current mode, PWM buck (step-down) DC-DC converter, capable of driving a 1.5A load with high efficiency, excellent line and load regulation. The device integrates N-channel power MOSFET switch with low on-resistance. Current mode control provides fast transient response and cycle-by-cycle current limit. A standard series of inductors are available from several different manufacturers optimized for use with the AP3211. This feature greatly simplifies the design of switch-mode power supplies. The AP3211 is available in SOT-23-6 package.

Features • Input Voltage Range: 4.5V to 18V • Output Voltage Adjustable from 0.81V to 15V • Fixed 1.4MHz Frequency • High Efficiency: up to 92% • Output Current: 1.5A • Current Mode Control • Built-in Over Current Protection • Built-in Thermal Shutdown Function • Built-in UVLO Function • Built-in Over Voltage Protection • Built-in Soft-start Applications • LCD TV • DPF • Portable DVD

Figure 1. Package Type of AP3211

SOT-23-6

Data Sheet



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Pin Configuration

K Package (SOT-23-6)

Figure 2. Pin Configuration of AP3211 (Top View)

Pin Description

Pin Number Pin Name Function

1 BS Bootstrap pin. A bootstrap capacitor is connected between the BS pin and SW pin. The voltage across the bootstrap capacitor drives the internal high-side NMOS switch

2 GND Ground pin

3 FB

Feedback pin. This pin is connected to an external resistor divider to program the system output voltage. When VFB exceeds 20% of the nominal regulation value of 0.81V, the OVP is triggered. When VFB＜0.25V, the oscillator frequency is lowered to realize short circuit protection

4 EN

Control input pin. Forcing this pin above 1.5V enables the IC. Forcing this pin below 0.4V shuts down the IC. When the IC is in shutdown mode, all functions are disabled to decrease the supply current below 1μA

5 IN Supply input pin. A capacitor should be connected between the IN pin and GND to keep the DC input voltage constant

6 SW Power switch output pin. This pin is connected to the inductor and bootstrap capacitor

BS 1

2

3 4

5

Pin 1 Mark

6

GND

FB

SW

IN

EN

Data Sheet



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Functional Block Diagram

Figure 3. Functional Block Diagram of AP3211

Ordering Information

AP3211 -

Circuit Type G1: Green Package TR: Tape & Reel K: SOT-23-6

Package Temperature Range Part Number Marking ID Packing

Type SOT-23-6 -40 to 85°C AP3211KTR-G1 GCI Tape & Reel

BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.

Data Sheet



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Absolute Maximum Ratings (Note 1) Parameter Symbol Value UnitInput Pin Voltage VIN -0.3 to 20 V

EN Pin Voltage VEN -0.3 to VIN+0.3 V

SW Pin Voltage VSW 21 V

Bootstrap Pin Voltage VBS -0.3 to VSW+6 V

Feedback Pin Voltage VFB -0.3 to 6V V

Thermal Resistance θJA 220 ºC/W

Operating Junction Temperature TJ 150 ºC

Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10sec) TLEAD 260 ºC

ESD (Human Body Model) 2000 V

ESD (Machine Model) 200 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Input Voltage VIN 4.5 18 V

Maximum Output Current IOUT (MAX) 1.5 A

Operating Ambient Temperature TA -40 85 ºC

Data Sheet



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Electrical Characteristics

VIN=VEN=12V, VOUT=3.3V, TA=25ºC, unless otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Input Voltage VIN 4.5 18 V

Quiescent Current IQ VFB=0.9V 0.8 1.1 mA

Shutdown Supply Current ISHDN VEN=0V 0.1 1.0 μA

Feedback Voltage VFB 0.785 0.810 0.835 V

Feedback Over Voltage Threshold VFBOV 0.972 V

Feedback Bias Current IFB VFB=0.85V -0.1 0.1 μA

Switch On-resistance RDSON ISW=1A 0.35 Ω

Switch Leakage Current ILEAK VIN=18V, VEN=0V 0.1 10 μA

Switch Current Limit ILIM 1.8 2.4 A

EN Pin Threshold VENH 1.5

V VENL 0.4

Input UVLO Threshold VUVLO VIN Rising 3.3 3.8 4.3 V

Input UVLO Hysteresis VHYS 0.2 V

Oscillator Frequency fOSC1 1.1 1.4 1.7 MHz

fOSC2 Short Circuit 460 kHz

Max. Duty Cycle DMAX VFB=0.6V 90 %

Min. Duty Cycle DMIN VFB=0.9V 0 %

Minimum On Time tON 100 ns

Thermal Shutdown TOTSD 160 ºC

Thermal Shutdown Hysteresis THYS 20 ºC

Soft-start Time tSS 200 μs Note 2: RDSON , tON, TOTSD, THYS and tSS are guaranteed by design.

Data Sheet



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Typical Performance Characteristics TA=25ºC, VIN=12V, VEN=5V, VOUT=3.3V, unless otherwise noted.

Figure 4. Efficiency vs. Output Current Figure 5. Quiescent Current vs. Temperature

Figure 6. Feedback Voltage vs.Temperature Figure 7. Output Voltage vs. Output Current

0.01 0.1 0.5 1 20

10

20

30

40

50

60

70

80

90

100

Effic

ienc

y (%

)

Output Current (A)

VIN=12V,VOUT=3.3VVIN=12V,VOUT=5V

-60 -40 -20 0 20 40 60 80 100 120 140 1600.60

0.65

0.70

0.75

0.80

0.85

0.90

0.95

1.00

1.05

1.10

Qui

esce

nt C

urre

nt (m

A)

Temperature (oC)

VIN=12VVFB=0.9VVEN=5V

-60 -40 -20 0 20 40 60 80 100 120 140 1600.40

0.48

0.56

0.64

0.72

0.80

0.88

0.96

Feed

back

Vol

tage

(V)

Temperature (oC)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.42.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

VIN=12V, VOUT=3.3V

Out

put V

olta

ge (V

)

Output Current (A)

Data Sheet



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Typical Performance Characteristics (Continued) TA=25ºC, VIN=12V, VEN=5V, VOUT=3.3V, unless otherwise noted.

Figure 8. Output Voltage vs. Input Voltage Figure 9. Maximum Output Current vs. Input Voltage

Figure 10. Output Ripple (IOUT=1.5A) Figure 11.Load Transient (IOUT=1 to 1.5A)

4 6 8 10 12 14 16 18 202.6

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

Out

put V

olta

ge (V

)

Input Voltage (V)

IOUT=1.2A IOUT=1.5A

4 6 8 10 12 14 16 18 200.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

2.6

2.8

3.0

Max

imum

Out

put C

urre

nt (A

)

Input Voltage (V)

VOUT=3.3V

VOUT (AC) 20mV/div

VSW 5V/div

IL 1A/div

VIN 10V/div

VOUT (AC)100mV/div

IL 1A/div

Time (400ns/div) Time (100μs/div)

Data Sheet



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Figure 12. Enable Turn-on Characteristic Figure 13. Enable Turn-off Characteristic (Resistance Load, RLOAD=2.6Ω) (Resistance Load, RLOAD=2.6Ω)

Figure 14. Short Circuit Protection (IOUT=1.5A) Figure 15.Short Circuit Recovery (RLOAD=2.6Ω)

Time (100μs/div)

VEN 3.8V/div

VOUT 1V/div

VSW 5V/div

IL 1A/div

VEN3.4V/div

VOUT1V/div

VSW 5V/div

IL 1A/div

Time (10μs/div)

VFB 1V/div

VOUT 2V/div

IL 1A/div

VSW 10V/div

Time (400μs/div) Time (400μs/div)

VOUT2V/div

VFB1V/div

IL 1A/div

VSW 10V/div

Data Sheet



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Figure 16. Over Voltage Protection (IOUT=1.5A) Figure 17. Over Voltage Recovery (IOUT=1.5A)

Time (20μs/div)

VFB 500mV/div

VOUT 2V/div

IL 1A/div

VSW 10V/div

VFB500mV/div

VOUT2V/div

IL 1A/div

VSW 10V/div

Time (200μs/div)

Data Sheet



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Typical Application

Figure 18. Typical Application Circuit of AP3211

Data Sheet



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Mechanical Dimensions

SOT-23-6 Unit: mm(inch)

2.820(0.111)3.100(0.122)

0.950(0.037)TYP

1.800(0.071)2.000(0.079)

0.300(0.012)0.500(0.020)

0.700(0.028)REF

0.100(0.004)0.200(0.008)

0°8°

0.200(0.008)

0.300(0.012)0.600(0.024)

0.000(0.000)0.150(0.006)

0.900(0.035)1.300(0.051)

1.450(0.057)MAX

1 2 3

456

Pin 1 Mark

Data Sheet



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Mounting Pad Layout

SOT-23-6

Dimensions Z (mm)/(inch)

G (mm)/(inch)

X (mm)/(inch)

Y (mm)/(inch)

E (mm)/(inch)

Value 3.600/0.142 1.600/0.063 0.700/0.028 1.000/0.039 0.950/0.037

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for anyparticular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or useof any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights orother rights nor the rights of others.

- Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Limited800, Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6485 1491, Fax: +86-21-5450 0008

BCD Semiconductor Manufacturing LimitedMAIN SITE

REGIONAL SALES OFFICEShenzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen OfficeAdvanced Analog Circuits (Shanghai) Corporation Shenzhen OfficeRoom E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951Fax: +86-755-8826 7865

Taiwan OfficeBCD Semiconductor (Taiwan) Company Limited4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, TaiwanTel: +886-2-2656 2808Fax: +886-2-2656 2806

USA OfficeBCD Semiconductor Corporation30920 Huntwood Ave. Hayward,CA 94544, U.S.ATel : +1-510-324-2988Fax: +1-510-324-2788

- IC Design GroupAdvanced Analog Circuits (Shanghai) Corporation8F, Zone B, 900, Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6495 9539, Fax: +86-21-6485 9673

BCD Semiconductor Manufacturing Limited

http://www.bcdsemi.com

BCD Semiconductor Manufacturing Limited

IMPORTANT NOTICE


- Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.800 Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6485 1491, Fax: +86-21-5450 0008

MAIN SITE

REGIONAL SALES OFFICEShenzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen OfficeUnit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,China Tel: +86-755-8826 7951Fax: +86-755-8826 7865

Taiwan OfficeBCD Semiconductor (Taiwan) Company Limited4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, TaiwanTel: +886-2-2656 2808Fax: +886-2-2656 2806

USA OfficeBCD Semiconductor Corp.30920 Huntwood Ave. Hayward,CA 94544, USATel : +1-510-324-2988Fax: +1-510-324-2788

- HeadquartersBCD Semiconductor Manufacturing LimitedNo. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, ChinaTel: +86-21-24162266, Fax: +86-21-24162277

IMPORTANT NOTICE


- Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. 800 Yishan Road, Shanghai 200233, China Tel: +021-6485-1491, Fax: +86-021-5450-0008

MAIN SITE

REGIONAL SALES OFFICEShenzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen OfficeUnit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan DistrictShenzhen 518057, China Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958

Taiwan Office (Taipei)BCD Semiconductor (Taiwan) Company Limited3F, No.17, Lane 171, Sec. 2, Jiu-Zong Rd., Nei-Hu Dist., Taipei(114), Taiwan, R.O.CTel: +886-2-2656 2808Fax: +886-2-2656-2806/26562950

Taiwan Office (Hsinchu) BCD Semiconductor (Taiwan) Company Limited8F, No.176, Sec. 2, Gong-Dao 5th Road, East DistrictHsinChu City 300, Taiwan, R.O.CTel: +886-3-5160181, Fax: +886-3-5160181

- HeadquartersBCD (Shanghai) Micro-electronics LimitedNo. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C.Tel: +86-021-2416-2266, Fax: +86-021-2416-2277

USA OfficeBCD Semiconductor Corp. 48460 Kato Road, Fremont, CA 94538, USATel: +1-510-668-1950Fax: +1-510-668-1990

Korea OfficeBCD Semiconductor Limited Korea office. Room 101-1112, Digital-Empire II, 486 Sin-dong, Yeongtong-Gu, Suwon-city, Gyeonggi-do, Korea Tel: +82-31-695-8430

General Description Features - Diodes Incorporated Sheet 1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK...

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