Gaurav slides

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The Path to Exascale Computing Challenges and Opportunities HPC Meet - up 21 st May Gaurav Kaul Solutions Architect Intel

Transcript of Gaurav slides

The Path to Exascale Computing –Challenges and Opportunities

HPC Meet-up21st May

Gaurav KaulSolutions Architect

Intel

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Outline

Why Exascale?

Existing Trends – The End of Moore’s Law?

Major Technology Challenges (aka “Walls”)

Technologies On the Horizon

Scaling Applications for Peta/Exa-Scale Era

Summary

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Performance Roadmap

1.E-04

1.E-02

1.E+00

1.E+02

1.E+04

1.E+06

1.E+08

1960 1970 1980 1990 2000 2010 2020

GF

LO

P

MFLOP

GFLOP

TFLOP

PFLOP

EFLOP

12 Years 11 Years 10 Years

Client

Hand-held

A bit of History …

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The Top 500 Waterfall

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50 years of Moore’s Law

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Moore and Dennard Scaling

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Current Processor Performance Trends

Technology Scaling Outlook

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The Power & Energy Challenge

200W

150W

100W

100W

4550W

5KW

Compute

Memory

Com

Disk

TFLOP Machine today

5W2W

~5W~3W5W

TFLOP Machine thenWith Exa Technology

~20W

Promising Technologies

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Rethink System Level Architecture

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DRAM Scaling Using 3D Memory

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Innovative Packaging and I/O

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Needs a Paradigm Shift

Evaluate each (old) architecture feature with new priorities

Single thread performance Frequency

Programming productivity Legacy, compatibility

Architecture features for productivity

Constraints (1) Cost

(2) Reasonable Power/Energy

Throughput performance Parallelism

Power/Energy Architecture features for energy

Simplicity

Constraints (1) Programming productivity

(2) Cost

Past and present priorities—

Future priorities—

Intel: Investing to Remove 6 Bottlenecks

Interconnect

Memory

&

Storage

Processor

Performance

Reliability

and

Resiliency

Standard Programming

Model for Parallelism

Power

Efficiency

Impact on Applications

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The Many Ways to Parallelism

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And New Workloads will

Emerge

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Code Modernization – The 4D Approach

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New for Knights Landing(Next Generation Intel® Xeon Phi™ Products)

2nd half ’15 1st commercial systems

3+ TFLOPS1

In One Package Parallel Performance & Density

On-Package Memory: High Performance

up to 16GB at launch

5X Bandwidth vs DDR47

Compute: Intel® Silvermont Arch. (Intel® Atom™)2

Low-Power Cores with HPC Enhancements3

3X Single Thread Performance4 vs Prior Gen.

Intel Xeon Processor Binary Compatible5

1/3X the Space6

5X Power Efficiency6

..

.

..

.

Integrated Fabric

Intel® Silvermont Arch. Enhanced for HPC6

Processor Package

Conceptual—Not Actual Package Layout

Platform Memory: DDR4 Bandwidth and

Capacity Comparable to Intel® Xeon® Processors

LEARN MORE: Knights Landing Webcast (Tuesday June 24th): https://www.brighttalk.com/webcast/10773/116329

Jointly Developed with Micron Technology

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What is an FPGA?

FPGAs (Field Programmable Gate Arrays) are

semiconductor devices that can be programmed

- Desired functionality of the FPGA can be (re-)programmed by downloading a configuration into the device

FPGAs offer several advantages over potential

alternatives:

- Lower one-time development cost, and faster time to market compared to custom designed chips (ASICs)

- Ability to implement customer-specific functionality beyond

what is available from standard products (ASSPs)

- Customizable and reprogrammable after the device has been deployed to the field compared to both ASIC and ASSP

0.01

0.1

1

10

100

1000

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Acceleration Architectural

Landscape

Source: ISSCC Proceedings

En

erg

y e

ffic

ien

cy (

MO

PS

/mW

)

Processor Number (sorted by efficiency)

MicroprocessorsReconfigurable

Dedicated HWMore programmable…

More efficient…

10X

100X

Potential for 10-100X higher performance/watt vs. general purpose cores

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FPGAs as Reconfigurable

Accelerators

Intel Confidential — Do Not Forward

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Example Use Case – HFT

What will matter in 10 years

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Intel Confidential — Do Not Forward

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What Next?

Intel Confidential — Do Not Forward

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Summary