Fused Deposition Modeling (Fdm)

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FUSED DEPOSITION MODELING (FDM) MADE BY: OWAIS AHMED KHAN RAFAY MALIK TAHA SHOIAB MEMON ZEESHAN MASOOD

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rapid prototyping for engineers

Transcript of Fused Deposition Modeling (Fdm)

FUSED DEPOSITION MODELING (FDM)

FUSED DEPOSITION MODELING (FDM)MADE BY:OWAIS AHMED KHANRAFAY MALIKTAHA SHOIAB MEMONZEESHAN MASOODINTRODUCTIONFused deposition modeling (FDM) is an additive manufacturing technology commonly used for modeling, prototyping, and production applications. It is one of the techniques used for 3D printing.

FDM works on an "additive" principle by laying down material in layers; a plastic filament or metal wire is unwound from a coil and supplies material to produce a part.

The technology was developed by S. Scott Crump in the late 1980s and was commercialized in 1990.

The term fused deposition modeling and its abbreviation to FDM are trademarked by Stratasys Inc. The exactly equivalent term, fused filament fabrication (FFF), was coined by the members of the RepRap project to give a phrase that would be legally unconstrained in its use. It is also sometimes called Plastic Jet Printing (PJP).APPLICATIONSPrototypes are produced for form / fit and functional testing in standard materials by FDMSupport parts (jigs, fixtures, helps) can be produced directlySmall series parts down to one of a kind are built in standard materials by fused deposition modelingINDUSTRIESAerospaceAutomotiveCommercialConsumer Industrial MedicalADVANTAGES High strength It is cost-effective WaterproofIt can use ABS(Acrylonitrile butadiene styrene is a common thermoplastic polymer. Its glass transition temperature is approximately 105 C (221 F)) material for its impact resistance and toughness, and multiple material colors are availableDISADVANTAGES & LIMITATIONSThe extrusion head must continue moving, or else material bumps upSupports may be requiredPart strength is weak perpendicular to build axisMore area in slices requires longer build timesTemperature fluctuations during production could lead to delamination.Maximal build envelope: 914x610x914 mm3Minimum feature size: 0.178 mmTypical tolerance: +/-0.178 mm (can be improved through post-processing)Minimum layer thickness: 0.178 mm