Fundamentals of ‘E’-chip..

CONTENTS…• Defining a microprocessor• First microprocessor• Material used in the making of a

microprocessor• Steps involved in the making of a

microprocessor• Chip and its design• Fabrication and test of a chip• High performance packaging• Conclusion

MICROPROCESSOR??????

“A multipurpose, multiprogramable device, that

processes the instructions stored in the memory and generates a corresponding output for the fed

input is a microprocessor”

FIRST MICROPROCESSOR…..• Robert Noyce , the co-founder of Intel, was the co-inventor

of the IC too. • The first microprocessor was designed by Intel in 1971.• It was a 4-bit microprocessor -4004.• The assignment for the manufacture of a 4-bit

microprocessor was laid down in 1969 and by 1971, it was designed.

• The Moore’s Law acted as a raising bar for the design of microprocessor.

MATERIAL USED IN THE MAKING OF AN IC…..

o is the natural semiconductoro abundant in nature( except oxygen).o principal ingredient in beach sand.

STEPS IN THE MAKING OF A MICROPROCESSOR…• Step1: Acquiring the material required for

the design• Step2: Wafers• Step3: Chips• Step4: Clean rooms• Step5: Bunny suits

DESIGN OF A CHIP….• chip is a complex device, that contains the

brains of any computing device.• the way a chip works is a result of how a

chip’s transistors and gates are designed and it’s ultimate use.

• the specifications create a schematic-symbolic representations of the transistors and interconnections.

FABRICATION AND TEST OF A CHIP….o depending on the chip use, different ‘recipe’ are employed.o patterned layers of various materials, built one on the top of other is then made.o a photolithographic printing process is used to form a chip’s multilayered transistors.o hundreds of similar wafers are created on a single ‘Si’ wafer.o now, ‘wafer sort test’ is performed.oThe wafer sort test ensures the chips perform to design the specifications.

HIGH PERFORMANCE PACKAGING…o here, the wafer is cut into individual pieces called ‘die’.

o the die is packaged between a substrate and a heat spreader to form a completed processor.

o the package protects the die and delivers a critical power and electrical conditions, when placed directly on a computer circuit board.

o different chips have different packaging technologies.

CONCLUSION..

Chips are electrically coded, visually inspected, packaged in a protective shipping material for

shipment….

Designed by:

Aishwariya Varadan…