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Component Focus: pages 3-18 New ams sensor module provides for a superiordisplay-viewing experience in any ambient light

Design Note: page 19 How to give expensive components protection fromESD risks without sacrificing performance

Application Spotlight: pages 20-25 Atmel’s ARM® Cortex®-A5 processor offers 720pvideo decoding and advanced encryption

Technical View: pages 26-27 Adding sophisticated intelligence and connectivitywith an off-the-shelf computing system-on-module

Application Spotlight on

Microcontrollers

FREEISOLATION CALCULATOR

INSIDE – SEE PAGE 2

For more information [email protected]:

C O M P O N E N T F O C U S – S T A R P A R T

3

Family of digital temperature sensorsprovides I2C and SMBus outputs

Atmel AT30TS: drop-in replacement for LM75-type devices

The Atmel AT30TS family of digitaltemperature sensors provides acomplete, real-time temperature-monitoring solution which operates overthe -55°C to 125°C temperature range.

The devices produce digitised temperaturedata via a standard I2C/SMBus-compatibleserial interface, eliminating the need for anyexternal components such as ADCs or datapost-processing blocks.

The family includes variants that offerselectable temperature resolutions andconversion rates, fault-tolerance queuing, andselectable hysteresis thresholds to account forminor temperature variances near theprogrammed temperature limits.

Non-volatile configuration and temperaturelimit registers are also available, to retainapplication-specific configurations and userpreferences even when the devices arepowered off.

The AT30TS74, AT30TS75A, AT30TS750A,AT30TSE752A, AT30TSE754A and

AT30TSE758A are drop-in replacements for theindustry-standard LM75-type devices.

The AT30TS74 is available in a tiny 4-ballWLCSP package, which is perfect for space-constrained applications and allows for theclosest placement of the temperature sensornext to the heat source to be monitored.

Some devices also feature integrated non-volatile registers. This improves applicationsafety and reliability by allowing pre-configuredpower-up settings to be permanently retainedacross power cycles. It also keeps themicrocontroller’s involvementin the power-up process to a minimum.

61V buck regulator features adjustable current limit

The L7987L from STMicroelectronics isa monolithic step-down switchingregulator with an adjustable currentlimit, and capable of producing anoutput of up to 2A.

The device’s adjustable currentlimit enables the designer tospecify an inductor with anaverage current rating appropriateto the nominal output current.This means that the size of theinductor may be kept to aminimum. At the same time, thehigh switching frequency, up to amaximum of 1.5MHz, restricts theamount of capacitance required inthe circuit. Together, thesefeatures help the designer torealise a compact power system.

The L7987L, which implementsa voltage-mode, constant-frequency control loop, producesan output voltage that may beadjusted from a low of 0.8V up tothe value of the input voltage.Operating across a wide input-

voltage range of 4.5V to 61V and a duty cycleup to 100%, the L7987L meets the fail-safespecifications set in industrial systems.

Pulse-by-pulse current sensing with digitalfrequency fold-back provides for effectiveconstant-current protection in all operatingconditions. In addition, peak-current fold-backreduces the stress on power components inextreme short circuits.

Multiple devices may be synchronised via theSynch pin to prevent beating noise in noise-sensitive applications such as analoguesensing. The embedded switch-over featureon the Bias Voltage pin maximizes efficiency atlight loads.

ATMEL

STMICROELECTRONICS

APPLICATIONS• 24V bus power systems• Fail-safe systems• Programmable logic controllers

FEATURES• 300mΩ on-resistance• Switching frequency adjustable from

250kHz to 1.5MHz • 11µA typical shut-down current• 1mA typical quiescent current• Adjustable soft-start time• Output-voltage sequencing

SECURITYAUTOMOTIVEMEDICALLIGHTINGINDUSTRIALENERGY CONSUMER TELECOMMS

APPLICATIONS• DDR4/DDR3 DIMM memory• Lithium ion and lithium polymer batteries• Plasma and LCD TVs• Solid-state drives and servers• Digital video recorders • Energy meters and industrial controls• Surveillance cameras• Smart lighting• Medical equipment

FEATURES• SMBus time-out• I2C High-speed Mode or Fast Mode Plus• Supports two or three programmable

temperature limits


For samples or pricing [email protected]:


STARPRODUCT

©Copyright 2014 Future Electronics Ltd. All trademarks contained herein are the property of their respective owners. Applications for product samples, badge boards, demonstration boards, Future Electronics’ boards and other advertised materials from Future Electronics are offered subject to qualification.

Atmel’s SAMA5D4: page 20PARTNERWORKING

Digital temperature sensingThe kit includes an AT88Microbase board, an AT30TK175daughterboard, a ribbon cable to support remotesensing, and a USB cable extension. Orderable Part Number: AT30TK175STK

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Apply now at my-boardclub.comFast-track board request code: FTM410A

C O M P O N E N T F O C U S

4 EMAIL [email protected] FOR SAMPLES AND DATASHEETS

AC thyristor triac safely handles hightransient voltages

The ACTT10-800C triac has an 850V maximum clamping voltage

The ACTT10-800C from NXPSemiconductors is an AC thyristor triacpower switch featuring clampingcapabilities which protect it against low-and high-energy transients.

It is rated for a repetitive peak voltage of 800V,and can withstand pulsed peak currents of90A. The clamping voltage is rated at 850V. Itsover-voltage withstand capability complies withthe IEC 61000-4-5 standard.

The gate is triggered by a maximum current of35mA, and only in three quadrants. Thisrelatively insensitive gate is useful in applicationscalling for high noise immunity.

NXP SEMICONDUCTORS

APPLICATIONS• AC fan, pump and compressor controls• Highly inductive, resistive and safety loads• Large and small appliances • White goods• Reversing induction-motor controls

FEATURES• Full-cycle AC conduction• Pin-compatible with standard triacs• Planar-passivated for voltage ruggedness

and reliability• Protective automatic turn-on capability for

high-energy transients• Very high immunity to false turn-on by dV/dt


60V MOSFET family adds new members offering highefficiency and current density

International Rectifier has added 19new devices to its 60V StrongIRFET™

power MOSFET family, which offers lowon-resistance with very high currentcapability for the industrial market in a versatile range of through-hole and surface-mount power packages.

The ultra-low on-resistance ofthese devices helps boostefficiency in low-frequencyapplications. The devices alsohave a typical threshold voltageof 3V, which improves noiseimmunity. Each device in thefamily is 100% avalanche testedat the industry’s highestavalanche-current levels toensure the most robust solutionfor demanding industrialapplications.

Various standard and high-performance package optionsare available, such as the low-profile, ultra-compact MediumCan (ME) DirectFET® packagethat delivers high current densitywhile reducing overall systemsize and cost. Devices in thispackage, such as theIRF7580M, are well suited forspace-constrained high-powerindustrial designs, and feature

wirebond-free construction deliveringenhanced reliability.

Moreover, the DirectFET® package meets allRoHS requirements such as a completelylead-free bill of materials, and is, therefore,ideally suited for long-lifecycle designs.Alternative high-performance packages featurelead (Pb) die attach under RoHS exemption7(a) which is due to expire in 2016.

60V MOSFETs: standard and high-performance package options

INTERNATIONAL RECTIFIER

APPLICATIONS• Power tools• Light Electric Vehicles (LEV) • Inverters including solar, back-up and

mobile• DC-motor drives• Li-ion battery-pack protection• Switched-Mode Power Supplies (SMPS)

FEATURES• Designed for industrial applications• Ultra-low on-resistance• High-current capability, highest in the

industry for some packages• Wide portfolio• Softer body diode improved performance

in low-frequency applications• 3V typical threshold voltage to improve

noise immunity




Part Number ID @ 25ºCMaximum

on-resistance @ VGS = 10V

Package

IRF7580M 116A 3.6Ω Medium Can;DirectFET™ (ME)

IRFH7085 100A 3.2Ω PQFN 5x6 (B)

IRFR7540 110A 4.8Ω D-PAK

IRFR7545 85A 5.2Ω PQFN 5x6 (E)

IRFR7546 71A 7.9Ω D-PAK

IRFS7530-7P 240A 1.4Ω D2-PAK-7

IRFS7534-7P 240A 1.9Ω D2-PAK-7

IRFS7530 195A 2.0Ω D2-PAK




IRFB7530 195A 2.0Ω TO-220

IRFP7530 195A 2.0Ω TO-247

IRFB7534 195A 2.4Ω TO-220

IRFB7537 195A 3.3Ω TO-220

IRFP7537 195A 3.3Ω TO-247

IRFB7540 110A 5.1Ω TO-220

IRFB7545 85A 5.9Ω TO-220

IRFB7546 58A 7.3Ω TO-220

5VISIT THE ONLINE FTM MAGAZINE AT: WWW.My-FTM.COM


Miniature immersible fluid-temperature sensor isrobust, responsive and accurate

The NTCAIMME3 consistsof an NTC thermistor chipmounted in a stainless-steel housing, which allowsthe sensor to remain inpermanent contact with themonitored fluid.

The tip of the sensor issmall, with a diameter ofonly 2.0mm, which allowsfast and accurate sensingof the fluid temperature.Typical response time is1.5 seconds. In addition,the electrical connection ismade through twin PVC-insulated AWG #30 lead

wires, which impose minimal heat loss helpingto promote sensing accuracy and precision.Together, the small tip size and thin-gauge wirehelp to achieve overall thermal gradient of lessthan 0.02K/K.

The NTCAIMME3 is available with a brasscollar for applications that require a sealedmounting. An alternative version without thecollar is also available, and is suitable forcustom mounting. The end wire is suitable for

soldered or crimped termination, andequipment designers can also choose theoption of a connector for wire-to-wire or wire-to-board connection.

For engineers needing low to midannual volumes of custom-frequencyTemperature-Compensated CrystalOscillators (TCXOs), the AbraconASGTX series now delivers a fast-turnaround, NRE-free solution.

An ASGTX series fixed-frequency TCXO orVoltage-Controlled TCXO (VCTCXO) can bedelivered within days, avoiding the typicalwaiting time of 12 weeks or longer for customoscillators from other manufacturers. Theoscillators are available at any desiredfrequency from 10MHz to 1.50GHz, such as149.875MHz or 1.00GHz, with stability as tightas ±1.00ppm over temperature. No othersolution in the marketplace currently offerssuch capability, especially in the small ASGTXform-factor of 9.0mm x 7.0mm x 2.24mm.

ASGTX oscillators are suitable for a widevariety of precision timing applications whereTCXOs or VCTCXOs are typically employed.They can also be used in high-frequencyLocal-Oscillator (LO) applications to replace

traditional SAW-based oscillators,which are typicallyonly available at afew fixed frequencies,often in 9mm x14mm or largerpackages, and canvary by as much as±100ppm overtemperature. TheASGTX series canprovide any carrierfrequency from10MHz to 1.50GHz,is stable to within

±1.00ppm over -30ºC to 70ºC and ±2.00ppmover -40ºC to 85ºC, and offers the advantageof a small form factor. There is no NRE or leadtime, and devices are available with LVCMOSoutput from 10MHz to 250MHz, or LVDS orLVPECL output from 10MHz to 1.50GHz.

Abracon has also launched a new web-based reference design tool that helpsengineers to link the ICs used in referencedesigns, such as microcontrollers, to thecorrect crystal-oscillator part number. For moreinformation, and to gain password-protectedentry, contact [email protected].

VISHAy

ABRACON

APPLICATIONS• Water boilers• Heating or chiller systems• Water and used-water systems• Water or oil tanks• Consumer appliances• Industrial appliances• Solar-powered heating systems

FEATURES• Resistance value at 25°C (R25):

10kΩ ±3%• B25/85 value: 3984K ±5%• 100mW maximum power dissipation• Measurement-temperature range:

25°C to 105°C


APPLICATIONS• Carrier infrastructure equipment• Point-to-point communication networks• Ethernet equipment• Embedded electronics• Test and measurement equipment

FEATURES• LVCMOS output at any frequency

between 10MHz and 250MHz• LVDS/LVPECL output at any frequency

between 10MHz and 1.50GHz• Low phase noise, harmonics and spurious

content• ±10ppm minimum guaranteed pull ability

in VCTCXO mode• 1.80ps maximum guaranteed RMS jitter

@ 1.50GHz carrier


Vishay’s NTCAIMME3 captures temperature measurements in liquid in just 1.5s



The Vishay NTCAIMME3 miniatureimmersion sensor for fluid-temperaturesensing combines a number of featuresthat allow a long service life, versatilemounting options, and accuratetemperature measurement.

Small-outline, custom crystal oscillators cut NRE costsand lead-times


CUI’s 1W, 2W and 3W isolated DC-DCconverters are ideal forconverting and isolatingvoltage rails, and are housedin space-efficient packagesallowing use close to thepoint of load.

The converters have been designed tomaximise efficiency under light-load and no-load conditions, making them well suited forportable and battery-powered equipment.

CUI INC

APPLICATIONS• Network equipment• Industrial automation• Smart-building systems• Smart meters• Lighting controllers

FEATURES• Isolation voltage up to 1500V DC or

3000V DC• Single- and dual-output versions available• Short-circuit protection with automatic

recovery• Lightweight, UL94-V0 plastic case




To request samples go to: www.futureelectronics.com/en/promotions/promotions/Pages/CUIDC-DCConvertersSamples.aspx

Series InputRatio Output Voltage Package

1W Converters

PDS1-S 1:1 3.3V, 5V, 9V, 12V, 15V, 24V SIP4PDS1-D 1:1 3.3V, 5V, 9V, 12V, 15V, 24V DIP8PDM1-S 1:1 5V, 12V, 15V, 24V, ±5V, ±12V, ±15V, ±24V SIP6PDS1-M 1:1 5V, 9V, 12V, 15V, 24V SMT8PEM1-S 1:1 5V, 12V, 15V, 24V, ±5V, ±12V, ±15V, ±24V SIP7PES1-M 1:1 5V, 9V, 12V, 15V, 24V SMT8PQMC1-S 2:1 5V, 12V, 15V, ±5V, ±12V, ±15V SIP8PRMC1-S 2:1 5V, 12V, 15V SIP82W Converters

PDM2-S 1:1 5V, 12V, 15V, 24V, ±5V, ±12V, ±15V, ±24V SIP7PEM2-S 1:1 5V, 12V, 15V, 24V, ±5V, ±12V, ±15V, ±24V SIP73W Converters

PQMC3-S 2:1 5V, 12V, 15V, ±5V, ±12V, ±15V SIP8PQM3-M 2:1 5V, 12V, 15V, ±5V, ±12V, ±15V SMT16PQB3-D 2:1 5V, 12V, 15V, ±5V, ±12V, ±15V DIP24PVB3-D 2:1 5V, 12V, 15V, ±5V, ±12V, ±15V DIP24

Rugged, efficient, economical DC-DC converterssatisfy broad range of applications

In total, over 90 different variants areavailable, offering a choice ofregulated and unregulated outputsat standard voltages from 3.3V to48V.

These DC-DC converters arehoused in SIP, DIP or surface-mountpackages, and have industry-standard pin configurations. Anultra-wide operating-temperaturerange from -40°C up to 105°C andan encapsulated case make theunits ideal for applications that mayexperience challenging operatingconditions.



Tiny quadrature encoder simplifies design ofspace-constrained motor controls

Step-up DC-DC converter saves batteryenergy and component count

The PAM2401 step-up DC-DCconverter from Diodes Incorporatedhelps battery-powered devices lastlonger by operating at up to 95%efficiency and by providing power-saving modes, true output disconnectto prevent leakage, and safe start-upat an input as low as 1V.

The PAM2401 accepts an input voltage in therange 0.9V to 4.75V, and produces an outputbetween 2.5V and 5.0V as determined by anexternal resistor divider connected betweenthe Output, Feedback and Analogue-groundpins. The output-current limit is alsoprogrammable from 1.0A to 3.0A using asingle external resistor connected to thedevice’s current-limit setting pin (RSET). Thepin can be left floating to select a current limitof 3.0A without using external components.

To help maximise battery life, the PAM2401automatically enters a high-efficiency pulse-skipping mode when driving light loads. Thedevice also has a shutdown mode, which hasquiescent current of less than 1µA.

PAM2401: highly integrated design for small board footprint

AVAGO TECHNOLOGIES

DIODES INCORPORATED

APPLICATIONS• Miniature motors• Card readers• Miniature camera modules• Portable measurement devices• Scientific and healthcare equipment • Optometric equipment

FEATURES• 3.3V or 5V supply voltage• 27mA typical operating current• Up to 960kHz counting frequency (x16)• ±0.2mm radial/axial-alignment tolerance• Minimum/maximum gap: 0.5mm/1.0mm• Index gating:

AEDR-8710: Gated 90ºeAEDR-8711: Gated 180ºeAEDR-8712: Gated 360ºe


APPLICATIONS• Handheld computers• Battery backups• Cordless phones• GPS receivers

FEATURES• Input-voltage range: 0.9V to 4.75V• Programmable output-voltage range:

2.5V to 5.0V• Inrush current limiting when power on • Output current up to 1000mA at

VIN = 3V and VOUT = 5.0V



Rohm’s ML610400 series: page 25PARTNERWORKING


The AEDR-871x reflective opticalencoder from Avago Technologies formotor-positioning applications isan extremely compact 3-channel device thatoffers high resolution, highintegration, easy design-in, and low powerconsumption.

Offering the convenienceof a 3-channelencoder in a singlepackage, theAEDR-871xintegrates the LED light sourceand a photo-detecting circuitryfor dual-channel quadrature (AB)digital outputs and a digital index-channeloutput in a 3.95mm x 3.4mm x 0.956mmsurface-mount leadless package. Compared toother devices, the AEDR-871x provides high

encoding resolution of up to 318 Lines Per Inch(LPI), and features a built-in interpolation circuit

supporting interpolationfactors of 4x, 8x and

16x therebyensuring flexibilityand versatility inresolution range.

The quadraturedigital outputs are

TTL-compatible,allowing the AEDR-871x

to be connected directly tomany types of digital signalprocessor or host processor.This simplifies design andallows easy integration into anexisting motion-control system.The AEDR-871x also has built-in automatic LED-currentregulation, which furthersimplifies design by eliminatingthe need for an external biasing

resistor. Specified over theoperating-temperature range of

-20°C to 85°C, the AEDR-871x issuitable for both commercial and

industrial end applications.

Low-voltage boost converterEvaluation boards for Diodes Incorporated’s PAM24011MHz step-up DC/DC converter targeting battery-powered applications. Orderable Part Numbers: PAM2401 EB33AA, PAM2401 EB33AB

FREEBOARDS


By operating at a fixed switching frequency of1MHz, and integrating a 0.1Ω N-channelMOSFET switch, a 0.15Ω P-channelsynchronous rectifier and a power-good indicator,the converter reduces the number and size ofexternal components as well as overall board-space requirement.

The PAM2401 also provides over-voltage andover-temperature protection functions, with thedevice’s soft-start circuit ensuring safe automaticrestart. Other features include anti-ringing controland hiccup-mode short-circuit protection.

The PAM2401 EB33AA and EB33ABevaluation boards provide a choice of fast andeasy-to-use evaluation environments forconverter designs targeting the PAM2401.



Ambient-light sensor adds colour and distance detectionfor better display-viewing experiences

The ams TMD3782 integrated sensor forambient light, colour (RGB) andproximity enables mobile devices toadjust the display continuously for morebrilliant colours and a superior viewingexperience in all lighting environments.

High sensitivity enables theTMD3782 to detect light intensitythrough a variety of attenuationmaterials, including darkenedglass. Integrated filters minimisethe effects of ultra-violet andinfrared light and enable photopicresponse thus improving theoverall accuracy of light andcolour sensing. The light-sensingphotodiodes have a radialstructure resulting in a uniformand optimised angular responsewhen mounted under the 360°module lens. Their 45° field ofview enables broad, accuratelighting measurements.

By also integrating a proximitysensor, the TMD3782 helpsdesigners eliminate false ambient-light sensing measurements whenthe user’s hand or finger iscovering the sensor.

It can also support user-interface features suchas intelligent touchscreen on/off control. Theproximity-sensing feature has a large dynamicrange of operation, for accurate distancedetection, and is factory-calibrated to adistance of 100mm. This saves OEMs fromperforming production-line calibration, andsimplifies end-product manufacturing.

The module has an interrupt capability thatgenerates an alert when pre-set light and

AMS


RF power transistors ideal for use in UHFbroadcast transmitters

The BLF888D and BLF888DS fromNXP Semiconductors are 600WLDMOS power transistors for use inUHF TV broadcasting transmitters.

The BLF888D(S) devices are designed for usein NXP’s ultra-wideband Doherty application,which offers 40% efficiency with DVB-T signalsacross the digital TV frequency band from470MHz to 800MHz. This performance ismuch better than that of traditional Class-ABcircuits, reducing heat dissipation and enablingcustomers to reduce energy costs markedly.

The devices are extremely rugged, makingthem suitable for both digital and analoguetransmitters. They are capable of withstandinga load mismatch corresponding to a voltagestanding-wave ratio of ≥40:1 through all

phases at a frequency of 810MHz, at 50V andthe rated load power.

Power gain at 860MHz is typically 21dB,enabling the use of low-power drivers to makevery compact and cost-effective TV transmitters.

The BLF888D is produced in a bolt-downSOT539A package, and the BLF888DS in aSOT539B earless package to reduce PCB sizeand cost.

600W LDMOS transistors: 225°C maximum junction-temperature

NXP SEMICONDUCTORS

APPLICATIONS• Broadcast transmitter applications in the

UHF band• Digital broadcasting

FEATURES• Integrated ESD protection• One Doherty design covers the full

bandwidth from 470MHz to 800MHz• Internal input matching for ease of use




APPLICATIONS• Touchscreen control• Ambient-light sensing• Light colour-temperature sensing• Medical diagnostics• Optical switches

FEATURES• Photopic response• Programmable gain and integration time• 1,000,000:1 light-sensing dynamic range• I2C Fast Mode interface compatible• Power-management features

colour thresholds are crossed. This eliminatesthe need for continuous polling and reducesoverall system-power requirements therebyextending battery life. Compact dimensions of3.9mm x 2.4mm x 1.4mm allow the module tobe mounted in densely populated and low-profile board assemblies.


SMD transmissive sensor designed to work in harsh,high-temperature applications

Compared to other sensors withsmaller air gaps, the TCPT1350X01and TCUT1350X01 provide greaterpositional flexibility and can be usedwith a wider variety of materials. At thesame time, the sensors have compactdimensions of 5.5mm x 4mm x 4mm.The detector has a phototransistoroutput with typical drive current of1.6mA, which simplifies connection tothe host-system electronics.

The single-channel TCPT1350X01includes an infrared emitter and

phototransistor detector located face-to-face ina surface-mount package, and is suitable formotion and speed sensing. The dual-channelTCUT1350X01 includes an infrared emitter andtwo phototransistor detectors, which enablesmotion, speed and direction sensing therebyenabling use in applications such as ElectronicPower-Steering (EPS) systems.

Boost PFC controller minimiseslow-load losses

The ON Semiconductor NCP1611active PFC controller uses aninnovative combination of techniquesto maximise efficiency across the loadrange and minimise acoustic noise inapplications such as home-entertainment systems and lighting.

Designed for use as a boost pre-converter inmedium-power offline applications,the NCP1611 operates in Criticalconduction Mode (CrM) when theinductor current is above a pre-programmed threshold value. Atlower current levels, the NCP1611uses Current-Controlled FrequencyFoldback (CCFF) to reduce theoperating frequency linearly downto about 20kHz when the currentis at a null. This maximisesefficiency at both nominal and lightload, and ensures extremely lowstandby losses.

In addition to these energy-efficient operatingmodes, the NCP1611 uses valley turn-on toenhance efficiency and reduce EMI generationand also features dynamic responseenhancement for improved transient responsein the event of line or load steps.

There is also a robust suite of protectionfeatures including Soft Over-Voltage Protection(SOVP), which reduces acoustic noise andstress in the event of an over-voltage fault.

The NCP1611’s high output-drive capabilityof -500mA/+800mA gives engineers flexibilitywhen choosing external MOSFETs to designfor a wide variety of power levels.

In addition, the wide supply-voltage range of9.5V to 35V simplifies biasing even at light-load and high-line conditions. Two versions areavailable, offering the choice of start-up from10.5V or 17V supply. 17V start-up allows asmaller capacitor and faster start-up in self-biased applications.

NCP1611: valley turn-on helps to reduce EMI emissions

VISHAy

ON SEMICONDUCTOR

APPLICATIONS• Sensors for motion, speed and direction• Ignition locks • Adaptive headlights• EPS systems• Industrial motor controls• Printer-head position-feedback sensing

FEATURES• AEC-Q101 qualified • 0.3mm apertures• 3.0mm gap width• MSL 1 rating for unlimited floor life• Reflow-compatible surface-mount

package (acc. JEDEC–STD-020D)


APPLICATIONS• AC-DC adapters• Flat-screen television power supply• Lighting ballasts

FEATURES• AC-line brownout detection• Saturated inductor and shorted boost or

bypass protection• Open-pin protection including ground• Under-voltage and fast over-voltage

protection• Cycle-by-cycle current protection





With a wide operating-temperaturerange of -40°C to 125°C, and a largeair-gap width of 3mm, VishayTCPT1350X01 and TCUT1350X01transmissive optical sensors are ideal for automotive and industrial applications that require larger mechanical tolerances.

Vishay’s optical sensors: large air-gap width of 3mm


3A buck regulator handles very wide range ofinput voltages

The BD9G341EFJ from ROHMSemiconductor is a buck switchingregulator with an integrated powerMOSFET operating from a very wide inputvoltage range of 12V to 76V. It provides amaximum output current of 3A.

As well as offering the flexibility of a wide input-voltage range, the device also lets the userprogramme the operating frequency, from aminimum of 50kHz up to a high switchingfrequency of 750kHz.

The support for high switching speedcombined with an advanced current-modearchitecture provides for fast transientresponse. The BD9G341EFJ also benefits froma simple phase-compensation set-up.

The regulator is well equipped with circuit-protection features, including over-currentprotection, thermal shut-down and Under-Voltage Lock-Out (UVLO). The UVLO andhysteresis can be set by the user throughselection of an external resistor value.

The on-resistance of the N-channel powerMOSFET is rated at a typical 150mΩ, and thedevice as a whole achieves a peak efficiency ofnearly 90% when supplying a load of morethan 1A. The BD9G341EFJ is available in anHTSOP-J8 package measuring 4.9mm x 6mmx 1mm.

MEMS module combines accelerometer andgyroscope in compact package

The LSM6DS0 MEMS module fromSTMicroelectronics combines a 3Ddigital accelerometer die with a 3Ddigital gyroscope die to produce acompact sensor system-in-packagesupporting advanced motion-sensingapplications.

The LSM6DS0 offers a full-scale accelerationrange of ±2/±4/±8g and an angular-rate rangeof ±245/±500/±2,000 degrees/s.

It has two operating modes: • the accelerometer and gyroscope sensors

may be activated at the same time • the accelerometer may be enabled while the

gyroscope is in Power-down mode

One of ST’s large family of MEMS sensormodules, the LSM6DS0 benefits from therobust and mature manufacturing processesproven in the production of ST’s existingmicro-machined accelerometers andgyroscopes.

The various sensing elements are producedwith special micro-machining processes, whilethe IC interfaces use CMOS technology tofabricate a dedicated circuit which is trimmed

to match the characteristics of the sensingelements.

The LSM6DS0 is available in a 16-lead LGApackage measuring 3mm x 3mm x 0.9mm.

A sister part to the LSM6DS0 is theLSM6DB0, a smart sensor system in the samesize package. This module includes a three-axis accelerometer, a three-axis gyroscopeand a signal-processing circuit. The signalprocessing is implemented by an ARM®

Cortex®-M0 core with Flash and SRAMmemory, dual timers, and I2C, SPI and UARTinterfaces.

ROHM SEMICONDUCTOR

STMICROELECTRONICS

APPLICATIONS• Distributed power systems• Automotive• Battery-powered equipment

FEATURES• 1.0V reference voltage accurate to ±1.5%• 20ms typical soft-start time• Stand-by current:

0µA typical10µA maximum


APPLICATIONS• GPS navigation systems• Impact recognition and logging• Gaming and virtual-reality input devices• Motion-activated functions• Intelligent power saving for handheld

devices• Vibration monitoring and compensation• Free-fall detection

FEATURES (LSM6DS0)• Analogue supply voltage: 1.71V to 3.6V• 1.8mA ‘Eco power’ mode current• Embedded temperature sensor• Embedded FIFO







Switching regulator for offline SMPS complieswith latest energy-saving regulations

NCP1136 voltage regulator: low acoustic noise at low loads

The ON Semiconductor NCP1136 high-voltage switching regulator enhancesefficiency and reliability, and helpsminimise electromagnetic and acousticnoise in offline SMPS used forapplications such as audio/visualequipment and domestic appliances.

The NCP1136 integrates a fixed-frequencypeak-current mode controller with a rugged,avalanche-rated 800V MOSFET of low on-resistance to deliver high efficiency up to fullload. A choice of 65kHz or 100kHz fixedoperating frequency, with internal rampcompensation, gives engineers flexibility toscale the design for optimum efficiency andsize. The output-current limit can be adjustedwith an external resistor to satisfy applicationsranging from 5W to 20W.

When the output-power demand diminishes,the NCP1136 automatically enters a 26kHzfrequency-foldback mode to ensure highefficiency with low acoustic noise at light loads.

Frequency jittering on both normal andfoldback modes helps to minimiseelectromagnetic emissions over the load range.When the power demand reduces furthertoward no-load condition, the device operatesin skip mode to achieve the minimum possiblepower consumption. With standby power ofless than 100mW at high line, the NCP1136 iscompliant with the ENERGy STAR EPS 2.0regulations for external power supplies.

ON SEMICONDUCTOR

APPLICATIONS• Television or appliance auxiliary supply• USB auxiliary supply• DVD or set-top box power supply

FEATURES• Overload and short-circuit detection• Option for auto-recovery or latched

short-circuit protection• PDIP-7 through-hole package with

creepage distance• Maximum power:

• 17W (adapter)• 34W (open-frame PSU)


Dual power MOSFET is efficient performerup to 175°C

The NXP SemiconductorsBUK9K12-60E dual powerMOSFET contains two 60Vlogic-level N-channel FETs,each capable of handling draincurrent of up to 35A and withmaximum on-resistance of11.5mΩ for energy-efficientoperation in industrial andautomotive applications.

Rated for a maximum operatingtemperature of 175°C, the BUK9K12-60E ensures consistent performancein thermally demanding environments.Each integrated MOSFET maintains itsthreshold voltage rating of greater than0.5V up to 175°C and so exhibits truelogic-level device behaviourthroughout the entire specifiedtemperature range.

The BUK9K12-60E is qualified to AEC-Q101for use in high-performance automotiveapplications and is repetitive-avalanche ratedthereby providing the assurance of robustoperation in electrically hazardous conditions.

BUK9K12-60E: performs reliably in electrically hazardous conditions

NXP SEMICONDUCTORS

APPLICATIONS• 12V automotive systems• Motors, lamps and solenoid control• Transmission control• Ultra high-performance power switching

FEATURES• 9.5mΩ typical on-resistance• 68W maximum power dissipation per

MOSFET• 2.21K/W thermal resistance junction-to-

case, minimum footprint, mounted onPCB

• LFPAK56D dual Power-SO8 (SOT1205)package





40A IGBT operates efficiently in high-speedpower converters

STMicroelectronics has released theSTGW40H120F2, an IGBT whichbenefits from a precisely balanced trade-off between switching and conductionlosses to give outstandingefficiency in high-frequencypower converters.

The STGW40H120F2 IGBT has aminimum breakdown voltage of 1,200V,and can carry a continuous 40A in arealistic operating environment, with acase temperature of 100°C.

Part of ST’s improved H series ofIGBTs, this device owes its highefficiency in large part to its advancedand proprietary trench gate field-stopstructure developed by ST.

Furthermore, a slightly positivetemperature coefficient of saturationvoltage, and very tight parameterdistribution, result in safer parallelingoperation.

Total gate charge at 40A is rated at a typical187nC, and ST specifies total switching lossesat 4.27mJ at 40A/600V, when operating at themaximum junction temperature of 175°C.

Three related parts, the STGy80H65DFB,STGW80H65DFB and STGWT80H65DFB, offersimilar characteristics to the STGW40H120F2,but with a maximum current capability of 80A ata case temperature of 100°C.

Versatile miniature buck converter meets nVidiaregulator specifications

The Vishay SiP12116 microBuck® low-power synchronous buck converter iseasy to use in point-of-loadapplications with a 5V or 12V rail, andalso meets nVidia™ OpenVreg Type 0specifications, including the packageand footprint requirement.

The SiP12116 is highly integrated,combining the high-side and low-sideN-channel MOSFETs as well as aCurrent-Mode Constant On-Time (CM-COT) controller in a compact 3mm x3mm DFN10 leadless surface-mountpackage. The converter is capable ofsupplying up to 3A continuously, andoutput voltage is adjustable down to0.6V. The fixed switching frequency of650kHz ensures high energy efficiencyand allows the use of small externalcomponents to help minimise overallcircuit size.

STMICROELECTRONICS

VISHAy

APPLICATIONS• Uninterruptible power supplies• Welding machines• Photovoltaic inverters• Power factor correction• High-frequency converters

FEATURES (STGW40H120F2)• Low tail current• 2.1V saturation voltage @ 40A• 5µs minimum short-circuit withstand time

150°C junction temperature• Low thermal resistance


APPLICATIONS• nVidia graphic cards• Server-system power• Set-top boxes• Television power supplies • Point-of-load power for DSPs, FPGAs,

ASICs

FEATURES• Input-voltage range: 4.5V to 15V• ±2% output-voltage accuracy• High operating efficiency• Thermally efficient package





STGW40H120F2: low gate charge for high efficiency

CM-COT control enables the SiP12116 todeliver ultra-fast transient response, excellentline and load regulation, and enhanced ripplecontrol under light-load conditions. In addition,no external compensation is required, and thedesign can be completed using all ceramiccapacitors with no requirement to use speciallow-ESR components.

A full set of protection features is built into theSiP12116, including cycle-by-cycle current limit,short-circuit protection, over-temperatureprotection, and input Under-Voltage Lockout(UVLO). A power-good function and 1.2ms fixed-duration soft-start function are also provided.


Versatile range of standard antennas provides off-the-shelf convenience for complex wireless designs

The latest range of standard antennasfrom TE Connectivity (TE) deliversconvenient, off-the-shelf access tohighly optimised antennas capable ofsupporting increased complexity andminiaturisation in newwireless designs, includingmulti-radio applications.

A broad spectrum of antennasolutions is available, offering acombination of features in avariety of shapes and sizes. Therange encompasses low-profile,high-performance antennas instamped-metal, Flexible PrintedCircuit (FPC) and PCB-embeddedformats, suitable for single-bandand multi-band applications.Moreover, antennas are availableto accommodate numerous setsof frequency bands for operation

on many types of networks in both regionaland global markets.

This emerging range of standard antennasdelivers customers with the benefit of TE’sexperience with advanced wireless designsoffering leading-edge performance in trend-setting devices. These antennas are developedusing TE’s state-of-the-art test facilities toensure dependable performance and quality.

Robust interconnect for street-lightingcontrols meets latest ANSI specification

The TE Connectivity (TE) multi-channelphoto-control receptacle with spring-leaf contacts provides a convenientand reliable interconnection betweenan industry-standard photo-control celland the luminaire in dimmablestreetlights or outdoor areailluminations such as car-park lighting.

TE’s new interconnect meets the latestNational Electrical Manufacturers Association(NEMA) standard ANSI C136.41-2013

governing light-level controls between anexternal locking-type photo-control cell and adimmable ballast or driver, which waspublished in February 2014.

The receptacle is available with a choice oftwo or four dimming contacts to support 0-10V DC dimming protocols or DigitalAddressable Lighting Interface (DALI)applications. Both types have three twist-lockpower contacts to ensure reliableinterconnection.

All signal and power contacts are pre-terminated with wire leads that meet UL1015or UL3321 specifications, which simplifiesintegration into new or existing light fixtures.The wire insulation is available with 105°C or150°C temperature rating, allowing use inluminaires of various temperature ratings.

TE’s photo-control receptacle: either two or four dimming contacts

TE CONNECTIVITy

TE CONNECTIVITy

APPLICATIONS• Smart meters• Building automation and security• Telematics and IoT applications• Home/office networking• Wireless sensor networks• GPS devices• Game terminals

FEATURES• Small and lightweight • Proven performance • Minimum or no matching components

required • Low cost • No tooling or lead-time overheads


APPLICATIONS• Street lights• Photo controls• Car-park lighting• Commercial lighting

FEATURES• Power-contact rating: 480V AC-DC; 15A• Meets dimensional requirements of ANSI

C136.41-2013• cUR recognised to UL 773




C O M P O N E N T F O C U S P • I • ES E C T I O N

Component Description

Orderable Part Number

150°C Wires 105°C Wires

5-position receptacle (3 power, 2 signal) 2213362-1 2213362-3

7-position receptacle (3 power, 4 signal) 2213362-2 2213362-4

Spring-Leaf Brush Contact 2213365-1

TE Connectivity: standard antennas support up to five frequency bands


High-quality mechanical relays approvedfor use worldwide

RZ power relays: 10mm creepage and clearance

RZ single-pole PCB-mount power relaysfrom TE Connectivity carry Chinese CQCapproval as well as UL recognition andVDE approval, and so can be easilydesigned-in to applications intended forsale in multiple markets worldwide.

The RZ series comprises high-quality relaysthat meet the IEC 60335-1 glow-wire test foruse in household appliances. The contacts arerated to 12A in 1-form-C (CO) arrangement, or16A in 1-form-A (NO). 10mm creepage andclearance distances, and reinforced insulationto 5000VRMS between coil and contacts,ensure high levels of resilience against surges,spikes and Electro-Static Discharge (ESD).

Standard RZ relays are designed for 85°Cambient temperature, while high-temperatureversions are available for applications requiringoperation up to 105°C. A further version isavailable, featuring a clear cover, which has amaximum operating temperature of 70°C.

The rated coil power is 400mW, and RZ relaysare available with various coil-voltage ratingsfrom 3V DC to 48V DC.

The RZ relays are produced on a fullyautomated production line in Waidhofen,Austria, which enables designers to rely on fastdelivery within Europe in addition to highproduct quality and reliability.

Board-to-board connectors with ‘float’ maximisecontact reliability

Hirose’s popular FX18 high-speed, board-to-board connector series, which allows bothtypes to be used on the same board.

TE CONNECTIVITy

HIROSE

APPLICATIONS• Household appliances• Boiler controls• Timers• Garage-door controls• General automation

FEATURES• Mechanical lifetime of 10 million cycles • Class-F coil insulation system (UL1446)• 3.5mm or 5mm pinning (12A version)• 5mm double pinning (16A versions)• Case dimensions:

29.0mm (L) x 12.7mm (W) x 15.7mm (H)


APPLICATIONS• Industrial equipment• Broadcast equipment• Smart meters• Medical devices• BTS• Measuring instruments• Projectors

FEATURES• Right-angle or vertical connector options• Pin counts available: 20, 40, 60, 80, 100,

120, 140• Vacuum pick-up area for automatic

mounting• 1.5mm effective mating length• Self-aligning and self-guiding structure




C O M P O N E N T F O C U S P • I • ES E C T I O N

Hirose FX20 series 0.5mm-pitchboard-to-board connectors haveseveral features to ensure reliableelectrical contact, as well as a floatingdesign to tolerate mountingmisalignment in applicationswhere multiple stackingconnectors are used.

The headerconnector has aunique floating structureembedded inside the fixedbase of the housing. This allowsan alignment movement in Xydirections of ±0.6mm minimum toabsorb mounting misalignment, vibrationand dimensional errors. Large mating guideson each side of the connector allow for analignment movement of ±1.2mm in Xydirections to simplify the mating operation andprevent incorrect insertion.

The receptacle features highly reliable double-beam contacts. Each beam contact isdesigned with different contact forces toensure dissimilar vibration characteristics andthereby widen the frequency range to avoidresonance. In addition, the first beam contacthas a self-cleaning function which eliminatesdust from the contact path of the secondbeam contact. Despite the fine pitch of

0.5mm, each contact is able to handlecurrent up to 0.5A.

Also helping to ensure optimumelectrical integrity, the

clearance between thecontact and housing is

engineered toprevent

capillaryaction

and soprotect the

contact area fromsolder wicking and

penetration of flux duringassembly. The board layout

design allows board patterningunderneath the connector for design flexibility.

The FX20 has the same stack height as



CAN transceivers implementstand-by mode for power savings

The Atmel® ATA6560 and ATA6561 arehigh-speed CAN transceivers whichprovide an interface between a CANprotocol controller and the two-wirephysical bus.

The transceivers supporthigh-speed CANapplications at a datarate of up to 5Mbits/s.They also feature adifferential transmit andreceive capability to aCAN protocol controller.

Both the ATA6560 andthe ATA6561 offerexcellent EMC and ESDperformance. Designsusing the devices willalso benefit from theirideal passive behaviourin relation to the CANbus when the supplyvoltage is off.

ATMEL

APPLICATIONS• Automotive control networks• Body electronics• Diagnostic equipment• Infotainment• Power train • Transportation • Backplanes• Automation equipment• Process control equipment• Lift and elevator controls

FEATURES• Fully compliant with ISO 11898-2,-5 and• SAE J2284 standards• Wide common-mode range• Functional behaviour predictable under all

supply conditions• Transceiver disengages from the bus

when not powered-up• Recessive clamping detection in Receive

mode• Bus pins protected against transients in

automotive environments


Innovative design boosts MEMS accelerometer’sthermal and mechanical stability

STMicroelectronics has introduced theLIS2HH12, a miniature MEMSaccelerometer which can withstand thehigh thermal and mechanical stressesexperienced in space-constrainedportable devices.

Today’s portable devices are prone to higherthermal variation and greater bending forcesthan previous generations of products becauseof the heat generated by their advancedprocessors, and because of their slim andlightweight case designs. At the same time,applications such as gesture recognition, gaming,indoor navigation and augmented reality callfor extremely precise, stable and responsivemotion sensing under all operating conditions.

The new LIS2HH12 three-axisaccelerometer is intended to meet thischallenge, drawing on an innovativemechanical structure and integratedprocessing capabilities to provide consistentand stable high performance.

For instance, its typical zero-g level changeversus temperature is just ±0.25mg/°C. Thisstability characteristic is twice as good as thatof previously released accelerometers from ST.

Rejection of the effects of bending has alsoimproved markedly, and the device offers atypical offset accuracy of ±30mg, 25% betterthan that of existing accelerometers.

The LIS2HH12 features selectable full-scaleranges of ±2g, ±4g or ±8g and a 16-bit digitaloutput. It also includes a temperature sensor,I2C and SPI channels, and two programmableinterrupt generators which help to streamlinesystem designs.

LIS2HH12: stable and responsive motion sensing

STMICROELECTRONICS

APPLICATIONS• Motion-controlled user interfaces• Gaming and virtual reality• Pedometers• Intelligent power saving for handheld

devices• Display orientation• Impact recognition and logging• Vibration monitoring and compensation

FEATURES• Supply voltage range: 1.71V to 3.6V• Embedded self-test• Embedded FIFO• Temperature sensor• Survives 10,000g shock




The ATA6561 offers the capability to interfacedirectly to a CAN microcontroller with a supplyvoltage between 3V and 5V.

Three operating modes, together withdedicated fail-safe features, make the ATA6560and ATA6561 an excellent choice for all typesof high-speed CAN networks, especially innodes requiring a low-power mode with wake-up triggered via the CAN bus.

The devices are designated as ready forCAN FD (Flexible Data rate).

ATA656x: suitable for high-speed CAN networks in passenger cars

The accelerometer is housed in a 2mm x 2mmx 1mm package. It is board- and software-compatible with ST’s LSM303C and LSM303EMEMS eCompass modules. The LIS2HH12can also be used with ST’s LIS3MDL stand-alone magnetic sensor to create an eCompassusing discrete components.

The LIS2HH12 is also board-compatiblewith the LIS2DH12 12-bit accelerometer.


LITTELFUSE

A high-performance processor, FPGA or System-on-Chip ICcould be the most valuable component on any given board.Adequate protection is vital to prevent events such asElectrostatic Discharge (ESD) destroying its internal circuitry.

This Design Note from Littelfuse discusses the ESD threatfacing the latest generations of ICs, explains key parametersdefining the performance of ESD-protection devices, andshows how protection can be improved without impacting onIC performance.

Each new generation of integrated circuits delivers enhancedcapabilities, such as faster data rates, smaller size, or lower powerconsumption. These improvements enable innovative and higher-performing applications that can take advantage of the new ICs’capabilities. However, the benefits also come with a potential pitfall;successive new generations of ICs are more sensitive to ESD than everbefore.

In the case of devices such as MCUs and DSPs, theESD threat enters through the interface pins, which willhave some exposure to the outside world. For low-level orentry-level units, there will be basic I/Os including UARTand I2C. For higher-level units, there will be interfacesincluding USB, CAN and LIN. The ESD-protection solutionwill need to be coordinated with the specific interface withrespect to operating voltage and capacitance. Capacitanceis particularly important where high-speed buses areconcerned, to avoid any adverse effect on signal integrity.

Fortunately for IC manufacturers and applicationdevelopers, suppliers of semiconductor-based board-levelESD-protection components relentlessly improve thecapabilities of these solutions.Companies like Littelfuse, Inc.continually invest in developingnew processes that enhancetheir protection products. Somekey recent developments arelisted below.

Lower clamping voltage toimprove protection ofsensitive ICsDuring an ESD event, theprimary job of the ESD protectoris to divert and dissipate asmuch of the energy contained inthe ESD transient as possible.The characteristic governing itsability to do this is typicallycalled ‘dynamic resistance’. Byreducing the dynamic resistance,the ESD protector carries substantially more of the surge current thanthe circuit being protected. In doing this, it reduces the electrical stresson the integrated circuit and ensures that it survives. For example, theSP3014 series TVS diode array from Littelfuse has dynamic resistance ofless than 0.1Ω to provide best-in-class performance.

ESD Protection of MCUs and DSPsTechnology improvements facilitate better protection devices

Lower capacitance to avoid interfering with high-speed datatransferAlthough circuit protection is central to an ESD protection device’spurpose, it must perform this role without interfering with the day-to-dayfunctioning of the circuit being protected. For example, on an RFinterface, such as a Bluetooth® or ZigBee® interface, or wired port suchas USB2.0, the ESD protector must not cause distortion or loss ofstrength of the data signals. To ensure signal integrity, the capacitance ofthe ESD protector must be minimised without compromising protectionlevels. The SP3022 series TVS diode from Littelfuse features acapacitance value of 0.35pF,ensuring that it will remain‘invisible’ to high-speed signals.

Smaller form factors to fit limitedboard space No matter how well a protectiondevice performs, it is not able toprovide value if it cannot fit into theapplication it is meant to protect.

For example, wearabletechnologies such assmart watches orwristbands willcontinue to get thinnerand smaller, andultimately may beincorporated directlyinto clothing. Hencethe circuit boards willhave minimal spaceavailable for any ESD-protection circuitry.Discrete diodes areideal for providingdesigners withexceptional flexibility

when determining the layout of a new board. The 30pFSP1020 and 6pF SP1021 series from Littelfuse arepackaged in the 01005 package outline to minimise theamount of real-estate they take up.

So, although upcoming MCUs and DSPs willcontinue to improve their capabilities as well as those ofnew applications, they will challenge the designers whohave to make sure that any new ICs can perform theirrequired tasks and also provide long-lasting reliability.Manufacturers of ESD-protection devices continue towork hard to provide protection for these devices whilenot interfering with their core functionality.

D E S I G N N O T E


By James Colby, Littelfuse, Inc.

SP3014

SP3022 SP1020

The microcontroller design ecosystem: as importantas the microcontroller itself?

The firmware designer’s ability to produce reliable, secure codehas a greater effect on the success of a new microcontroller-based design now than ever before. The designer who canquickly produce code which minimises both cost and powerconsumption, while surviving the rigours of field deployment,can help an OEM get to market quickly and successfully.

But at the same time, the astonishing computing power intoday’s MCUs and the array of on-chip peripherals they supporthave introduced an unprecedented degree of complexity to thetask of implementing interfaces, drivers and operating systems.

Producing the firmware to support today’s advanced MCUs is ademanding task, fraught with technical and commercial risks. It is clear, then, that the quality of the development and debugtools available to the firmware designer is of huge importance.In fact, the development ecosystem is becoming nearly as higha priority in choosing an MCU architecture as the core and theperipheral offering.

Fortunately, Future Electronics provides both MCUs and theecosystems supporting them. This Application Spotlight carriesnews of the latest MCU product introductions from

STMicroelectronics, NXPSemiconductors, Microchip andAtmel. The table, left, shows thateach is backed by a choice ofdevelopment and debug tools andlibraries. Future Electronics is afranchised supplier of all of them.

And with its own team of softwareengineers worldwide, ready toassist customers with firmwaredevelopment, Future Electronics iswell equipped to help customers tosucceed with their nextmicrocontroller-based products.

A P P L I C A T I O N S P O T L I G H T


ARM Cortex-A5-based processor offers 720p videodecoder and advanced security

SAMA5D4: advanced video, connectivity and security features

Modern microcontrollers are backed by a wide array of development boards, tools and software

The new Atmel Smart SAMA5D4 seriesexpands the company’s SAMA5 familyof microprocessors based on the ARM®

Cortex®-A5 core, adding a 720phardware video decoder and offering avaluable increase in system performanceand data-processing capability, as wellas advanced security features. TheSAMA5D4 processors’ security functionsprotect the application againstcounterfeiting, safeguard software assetsand securely store and transfer data.

The SAMA5D4 operates at 528MHz(840DMIPS), and features ARM’s NEON™

Single Instruction, Multiple Data (SIMD)processor engine for applications requiringhigh-precision computing and fast signalprocessing. The chips also come equippedwith 128kbytes of L2 cache.

The SAMA5D4 processors’ sophisticatedsecurity features include: • On-the-fly encryption/decryption of code

from an external DDR memory• Encryption engines supporting AES, RSA,

ECC and SHA protocols

• Eight tamper-detection pins and secure keyand data storage

• ARM’s TrustZone® technologyIn addition, the devices support DDR2,

LPDDR, LPDDR2 and MLC NAND memorieswith 24-bit error-correction circuitry.

The series consists of four devices and twopackage options: BGA289 and BGA361. Thechips are supplied with Atmel’s free Linuxdistribution and an Android™ port. A Qtsoftware development kit is available for theSAMA5D4, as well as a complete set of Ccode examples for developers who are notusing an operating system.

ATMEL

APPLICATIONS• Control panels• Industrial human-machine interfaces• Industrial and residential gateways• Data concentrators• Hi-fi equipment• Robot entertainment and toys• Security equipment• White goods• Home appliances • Health and fitness equipment• Automation equipment• Test and measurement instruments • Programmable logic controllers

FEATURES• Hardware video decoder supporting

H264/263, VP8, MPEG-4 and JPEG videocodecs

• LCD TFT controller with overlays forimage composition

• Three Hi-Speed USB ports • Dual Ethernet media access controllers

with IEEE 1588 support



STMicro’s L7987L: page 3PARTNERWORKING

Manufacturer Compiler IDE RTOS Evaluation Boards Code Libraries

Atmel

ARM® DS-5Atmel Studio 6.2

IARGNU

ARM DS-5Atmel Studio 6.2

Free RTOSMicrium

Linux

Xplained andXplained ProEvaluationPlatforms

Atmel Software Framework

Microchip MPLAB®-XC MPLAB-X Free RTOSMPLA Starter Kits

PIC® KitsMicrosticks

Embedded Source Code

NXP SemiconductorsARMIAR

LPCXpressoLPCXpresso Free RTOS

ucLinuxLPCXpresso

MbedLPC Open Software Platform

emWin

STMicroelectronicsIAR-EWARMIAR-EWSTM8

ARM MDK

IAR-IWARMIAR-EWSTM8

ARM MDKRTX

NucleusSTM32cube

Discovery Boards

STM32 SnippetsSTM8 Code Libraries

STM32 Embedded Code ExamplesBLDC Motor Suite

M I C R O C O N T R O L L E R S


Analogue integration hits new levels in16-bit MCU with dual ADCs and DAC

Microchip has introduced thePIC24FJ128GC010, a family of analoguesystems-on-chip which integrate a fullanalogue signal chain along witheXtreme Low Power (XLP) technologyfor extended battery life in portablemedical and industrial applications.

The analogue signal chain in thePIC24FJ128GC010 includes a precision 16-bitADC and a 10Msamples/s, 12-bit ADC, plusa DAC and dual operational amplifiersalongside the familiar 16-bit PIC® MCU core.The PIC24FJ128GC010 parts also offer anintegrated LCD display driver whichprovides the ability to drive up to 472segments with information-rich user displayssupporting scrolling alphanumeric banners.

Integrated USB capability supports theuploading of data in a medical device, andcan act as a service and data port inindustrial equipment. An on-chip mTouch®

peripheral provides for capacitive touchsensing.

MICROCHIP

APPLICATIONS• Blood glucose meters • Blood pressure monitors• Voltage monitors• Current monitors• Gas sensors • High-speed sensor arrays

FEATURES• Three voltage references• Charge-time measurement unit• Up to 16MIPS processor performance• 18nA current in Deep Sleep mode• 180µA/MHz current in Run mode• Hardware real-time clock and calendar• Watchdog timer


Low-end MCU supports both digitaland analogue sensor interfaces

NXP SEMICONDUCTORS

APPLICATIONS• IoT end-nodes• Sensor gateways • Basic motor control • Thermostats and home-environment

monitoring devices• Toys and models• Home and building automation• Industrial controls• Lighting• Server and rack monitoring• Wearable fitness products

FEATURES• 105°C maximum operating temperature• LPCOpen software development platform• Switch matrix tool for flexible I/O pin

configuration




For details, see the Board of the Month onpage 25Orderable Part Number: OM13071

FREEBOARDS


Starter Kit for PIC24F Intelligent IntegratedAnaloguePlatform for evaluating the performance and signalintegrity provided by the PIC24F family.Orderable Part Number: DM240015

FREEBOARDS


NXP Semiconductors has launched itslatest family of ARM® Cortex®-M0+microcontrollers, dramaticallyextending the versatility of itspopular LPC800 series byproviding more analoguefeatures, more serialinterfaces, larger memorycapacity and greaterdata throughput.

The new LPC820 seriesshares the power efficiencyand timing capabilities ofexisting LPC800microcontrollers. The 30MHz ARMCortex-M0+ core draws as little as 90µA/MHzin Active mode. Five power modes and power-profile APIs give designers simple means toperfect their run-time power schemes.

But the new devices, the LPC822 andLPC824, now add an accurate ADC running ata fast 1.2Msamples/s. This 12-bit device is

ideal for oversampling to improve conversionaccuracy, and offers flexible triggers to helpthe user to optimise power use.

In addition, the LPC820 series MCUsprovide twice as many serial connections asprevious LPC800 devices. These include threeI2C interfaces, ideal for digital sensors, two

serial peripheral interfaces, four UARTsand up to 29 GPIOs

connected via aswitch matrix.

With up to 32kbytesof Flash and 8kbytes ofSRAM, the memoryprovision in the LPC820is large by comparisonwith competing MCUsbased on the ARMCortex-M0+ core.

In addition, theavailability of an 18-channel

DMA engine enables thecore to offload data-intensive

tasks, providing for better throughput andpower efficiency.

The LPC822 and LPC824 provide an easyupward migration path for designs currentlyusing NXP’s LPC81x series of MCUs.

This combination of analogue integration, MCUfunctions and XLP technology for low powerconsumption results in reduced system costand noise, and improves the signal throughputin many medical and industrial applications.

In addition, the integration of a 16-bit ADC,USB and LCD into a single low-power MCUallows for the implementation of very smallform-factor, battery-powered applications. Byusing the PIC24FJ128GC010, designers canachieve a valuable cost reduction compared toa multi-chip implementation, while benefittingfrom lower noise, faster throughput, a smallerPCB footprint and faster time to market.

PIC24FJ128GC010: integrated LCD driver for up to 472 segments



New low-cost digital signal controllers withfloating-point unitThe STM32F301 from STMicroelectronics is a family of microcontrollers with an ARM®

Cortex®-M4 core running at 72MHz and providing floating-point unit capability fordigital-signal control applications.

These devices are equipped with up to three ultra-fast, <30ns comparators and 144MHz motor-control timers offering resolution of <7ns. Generous analogue provision includes an operatingamplifier with programmable gain, a 12-bit DAC and a 5Msamples/s ADC with selectable resolution.

The STM32F301 parts also feature a seven-channel DMA controller supporting timers, ADCs,SPIs, I2C and USART interfaces and the DAC.

STMICROELECTRONICS

APPLICATIONS• Motor-control systems• Programmable logic controllers

FEATURES• 32kbytes or 64kbytes of Flash memory• 16kbytes of SRAM • Temperature sensor• Up to 18 capacitive sensing channels



MCU’s peripheral choice ideal for digital power applicationsThe range and performance of theperipherals in the STM32F334 series ofmicrocontrollers from STMicroelectronicsmakes it particularly well suited to digitalpower conversion.

For instance, a high-resolution, 217ps timer isself-compensated in relation to the power supplyand temperature drift. The timer offers a variableduty cycle, variable frequency and a Transitionmode. The STM32F334 also features an ultra-fast comparator which can switch from ananalogue input to PWM shut-down in just 26ns,and a 12-bit ADC operating at a fast 5Msamples/s.

The microcontrollers are based on an ARM®

Cortex®-M4 core operating at a maximum

72MHz and implementing single-cyclemultiplication and hardware division, and DSPinstructions.

The STM32F334 series is supported by theSTM32F3348-DISCO development kit, and bythe NUCLEO-F334R8, an STM32 Nucleoboard which is compatible with Arduino.

APPLICATIONS• Digital power supplies• LED lighting• Solar inverters

FEATURES• Up to 64kbytes of Flash memory• Up to 12kbytes of SRAM with hardware

parity check• Seven-channel DMA controller



Performance and low power combined in ARM Cortex-M4 MCUsoffering always-on system awareness

STMicroelectronics has introduced a newseries of STM32 Dynamic Efficiency™

microcontrollers which bring the power-saving benefits of data batching – thetechnique used in Google’s latestAndroid™ operating system to extendbattery life – to many more applicationsbesides smartphones and tablets.

The 4.4 KitKat version of Android uses a low-power sensor hub to manage always-onsensors such as accelerometers and pressuresensors. This relieves the power-hungry mainsystem processor of the task, and thus helpsthe device to consume less battery energy.

The new STM32F411 microcontrollers,which are based on the ARM® Cortex®-M4core, are a perfect fit for these new sensor-hubapplications. The STM32F411’s BatchAcquisition Mode (BAM) saves power bystoring sensor data directly into SRAM while theMCU’s core sleeps. When operating in BAM,the core wakes briefly to process these storeddata before returning to power-saving mode.

The ARM Cortex-M4 processor core in theSTM32F411 provides DSP and floating-pointunit functionality, and features up to 512kbytesof Flash with a high SRAM capacity of up to128kbytes.

Drawing on ST’s ART Accelerator™ cachetechnology and advanced 90nm fabricationprocess, the new STM32F411 is the industry’sfirst ARM Cortex-M4-class device to drawcurrent in Run mode as low as 100µA/MHz, afigure achieved when executing CoreMark™

code from Flash with peripherals switched off.Current in Stop mode is just 10µA with allSRAM content and context saved.

APPLICATIONS• Sensor hubs • Industrial controls• Medical monitors• Building automation • Wearable technology

FEATURES• 1.7V minimum power supply• 12-bit, 2.4Msamples/s ADC• Motor-control timer• Three USARTs up to 12.5Mbits/s• Five SPI up to 50Mbits/s• Three I²C interfaces up to 1Mbit/s• One SDIO interface up to 48MHz • One Full-Speed USB2.0 OTG interface• Two full-duplex I2S audio interfaces • Three simplex I2S audio interfaces



STM32F microcontroller developmentProvides Arduino™ connectivity support, and ST Morphoheaders make it easy to expand the functionality of theSTM32 Nucleo open development platform with a widechoice of specialised shields. Orderable Part Number: NUCLEO-F411RE

FREEBOARDS


STM32F microcontroller developmentOrderable Part Numbers: STM32F3348-DISCO and NUCLEO-F334R8

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All the development tools listed above areavailable on the Board Club website

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A relatively high maximum operatingtemperature of 105°C makes theLPC11U68JBD100 suitable for commercialand industrial environments.

NXP SEMICONDUCTORSAPPLICATIONS

• Three-phase e-meter• GPS tracker• Gaming accessories• Car radio• Medical monitor• PC peripherals

FEATURES• 16-channel DMA engine • Pin interrupt and pattern-match engine

using eight selectable GPIO pins• Up to four 32-bit and two 16-bit

counter/timers or two 32-bit and four 16-bit counter/timers

• Up to 19 PWM outputs with sixindependent time bases

• Real-time clock with separate battery-supply pin

• Temperature sensor• Four power-saving modes


Dual-core Power Architecturecontrollers support strict automotivesafety requirements

The SPC56EL70 series, as well as itsSPC56EL60 sister part, also benefit from thedevelopment infrastructure available to users ofexisting Power Architecture devices. Softwaredrivers, operating systems and configurationcode may all be used to ease and acceleratethe system development process.

STMICROELECTRONICS

APPLICATIONS• Hydraulic power steering • Electric power steering • Airbags• Safety-critical applications

FEATURES• Dual issue five-stage pipeline core• Memory management unit • 4kbyte instruction cache • 2Mbyte Flash memory • 192kbyte SRAM • Replicated 16-channel DMA controller• Two LIN channels• FlexRay module • Sine-wave generator • On-chip CAN/UART/FlexRay® bootstrap

loader


ARM Cortex-M0+ MCU offers easyroute to USB connectivity



Full-Speed USB for low-power designsThe LPC11U68 development board features a 240 x 320LCD, a PWM speaker, a smart card reader and externalkeys including a joystick key. Orderable Part Number: OM13065

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Safety-critical automotive applicationsThe SPC56xL Discovery+ kit provides engineers with fullaccess to the CPUs, I/O signals and peripherals such asCAN, UART, FlexRay®, JTAG, K-Line and LIN in theSPC56L line of Power Architecture MCUs. Orderable Part Number: SPC56EL70L5DISP

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NXP Semiconductors has introduced theLPC11U68JBD100, a 32-bit MCUbased on the ARM® Cortex®-M0+core which offers designers aneasy means to implement Full-Speed USB and many otherconnectivity options in low-power,low-cost designs.

The LPC11U68JBD100 includes a USBdevice controller certified by the USBImplementers Forum, and gives designersaccess to all the USB driver software, tools andshort-cuts they need for simple systemdevelopment and fast time to market. Thisincludes a royalty-free USB stack library, andextensive sets of example code for popularclasses of USB device.

The hardware design aspect of USBimplementation is also addressed, since thedevice features an on-chip PHy, helping usersto reduce the system-level bill-of-materials costand design complexity.

To support more demanding data and bufferingrequirements, as well as larger application codesizes, the LPC11U68JBD100 offers high Flashmemory capacity of 256kbytes and SRAM of

36kbytes. Serial connectivityprovision includes five USARTs,

two I²C interfaces, two serialperipheral interfaces and up

to 80 GPIOs. USART, I2Cand DMA drivers areincluded in the on-chipROM alongside the USB

drivers. The device also includes

a new 12-channel, 12-bit,2Msamples/s ADC, providing

high bandwidth and precise inputs.

The SPC56EL70 seriesof MCUs fromSTMicroelectronicsare sophisticated 32-bit systems-on-chip with a dual-coree200z4d PowerArchitecture® CPU, andare aimed at safety-criticalautomotive applications.

They are very well suited to SIL3/ASILDdesigns in cars, for which they provideinnovative safety concepts such as a Lock-stepmode and fail-safe protection, as well as a faultcollection and control unit.

In this latest addition to the SPC56 family ofMCUs, ST has introduced enhancementswhich improve the architecture’s fit inembedded applications.

These include additional instruction support forDSP functions, and the integration of

technologies such as an enhanced time-processor unit, a queued ADC, CANsupport, and an improved modularinput-output system.

The advanced yet cost-effectivehost processor core of theSPC56EL70 operates at speeds ashigh as 120MHz, and combineshigh performance with lowpower consumption.

Future Electronics’ Board Club: supporting innovative electronics designEurope’s electronics industry thrives on the application of innovation and creativity, and an essentialinnovator’s tool in design projects is the development board. The Board Club website is a Future Electronicsresource for users of development boards. Here, and only here, Board Club members can gain access toexclusive free development boards and development board offers.If you would like to register for membership, please visit: www.my-boardclub.com/register.php

To apply for these free boards go to: www.my-boardclub.com/ftmTerms and conditions apply. Visit www.my-boardclub.com/about_us for details


25

Board provides simple development environmentfor evaluation of new LPC820 MCU

The LPCXpresso824-MAX development board providesan ideal environment to start design projects using NXP'sLPC824, a member of NXP’s new LPC820 series ofmicrocontrollers based on the ARM® Cortex®-M0+ core.

APPLICATIONS• IoT end-nodes• Sensor gateways • Basic motor control • Thermostats and home-environment

monitoring devices• Toys and models• Home and building automation• Industrial controls• Lighting• Server and rack monitoring• Wearable fitness products

FEATURES• LPCXpresso toolchain is available in free

and Pro versions• Three-colour LED, ISP and WAKE buttons

for easy testing of software functionality


8-bit micro draws ultra-low current

The ML610400 from LAPISSemiconductor, a division of ROHM, isa series of high-performance 8-bitmicrocontrollers which have a very lowcurrent requirement and areideal for use in smallbattery-powered products.

Based on LAPIS Semiconductor's8-bit U8 RISC core, the MCUs arecapable of efficient instructionexecution through a three-stagepipelined, parallel-processingarchitecture. In addition, theML610400 devices’ Flashmemory benefits from LAPISSemiconductor's proprietary low-power technology, operating on asupply voltage as low as 1.0V. On-chip Flash memory densitiesranging from 32kbytes to128kbytes are available.

The ML610400 MCUs’ inputvoltage range is 1.1 to 3.6V.

Like all NXP’s LPCXpresso™ boards, theLPCXpresso824-MAX supports a simpleEclipse-based integrated developmentenvironment, and includes an attached JTAGdebugger. It is possible to implement an entireproject on the LPCXpresso platform, frominitial evaluation through to final production.

The LPCXpresso824-MAX includes astandard 10-pin JTAG/SWD connector plusanalogue/digital expansion headers, making iteasy to extend its capabilities. The headersconform to the LPCXpresso, Arduino UNO andPMOD standards.

The LPCXpresso824-MAX can be configuredto use external debug probes from Keil, IARand other development tools that support theARM CMSIS-DAP software protocol.

The LPC820 family is featured on page 21.

ROHM ML610400: suitable for battery-powered devices with an LCD

ROHM SEMICONDUCTOR

APPLICATIONS• Thermostats• Data loggers• Access control equipment• Remote controls• Calculators• Electric bicycles

FEATURES• Dot-matrix and segment LCD drivers• Real-time clock• 16-bit PWM controller• Battery-level detector• 0.15µA shut-down current• 0.5µA stand-by current• 0.8mA operating current at 4MHz core

frequency




Diodes’ PAM2401: page 7PARTNERWORKINGFeaturing a built-in LCD driver and two ADCs,the ML610400 MCUs are well suited toportable devices with an LCD display, such aswrist watches, pedometers, heart-ratemonitors and thermostats.

Parts in the ML610400 series are rated foroperation over a wide temperature range of -40°C to 85°C, and are therefore suitable foruse in industrial electronics equipment.

Orderable Part Number: OM13071

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T E C H N I C A L V I E W

Consumers have become accustomed to the permanentavailability of internet access on touchscreen devices that wecan easily carry in a pocket or a bag. This is leading todramatic changes in users’ expectations of many kinds ofpreviously stand-alone and single-function products.

These new expectations are not only having an impact on personalconsumer devices. Intel, for instance, has demonstrated a concept foran in-store advertising panel: its futuristic design is a huge 2m x 1mtouchscreen with a camera that can ‘recognise’ shoppers and serve upappropriate advertising messages. The touchscreen lets the shopperclick on items of interest, go online to find out more information orreserve the item for collection at a checkout desk.

This is a challenge for the panel’s manufacturer: conventionaladvertising panels are, in essence, no more than a light box or a largedisplay screen. But the trend is for this kind of ‘dumb’ product tobecome an application-specific computer: this massively increases thecomplexity of the design.

So what is the best way to streamline the architecture and avoid thedifficulties of introducing a complex processor into a previously simpleend-product design?

Flexible off-the-shelf optionsPerhaps the most obvious choice is to use one of the hundreds ofembedded or industrial computers offered by manufacturers such asAdvantech or Technexion. This provides a complete hardware platformincluding not only the processor and main memory, but also storage,board-to-board interfaces, networking capability, supervisory functionsand an AC-DC power supply.

But although there is a very wide choice of these off-the-shelf products,the problem with them is precisely that they provide a complete platformwith a huge range of built-in functions: this means that they are relativelyexpensive, and also inflexible. In an embedded computer, thespecification of everything, down to the peripherals and interfaces, ischosen by the computer manufacturer, not by the customer.

For some users, then, a System-on-Module (SoM) might be a betterchoice. An SoM is an electronic module that provides the basiccomponents of an embedded computer. And it is popular because itgives the user an easy way to support advanced applications andconnectivity without needing knowledge of how to design a processorboard.

This means that the design team benefits from: • A shorter development time• The flexibility to choose exactly the peripherals, storage and interfaces

required for the application

At the same time, a module is cheaper than a complete embeddedcomputer, and the designer avoids paying for features or peripherals thatthe end product does not need.

SoM choicesAn SoM incorporates the circuitry essential to all embeddedapplications. It provides a microprocessor that interfaces with RAM andFlash memory, a power-management system, and Ethernet, USB andother interfaces.

Fig. 1: Form factors of the most common embedded CoM and SBC standards

Systems-on-Module: suitable computing designs?

EMAIL [email protected] FOR SAMPLES AND DATASHEETS26

READ THIS ARTICLE TO FIND OUT ABOUT• How a COTS system-on-module helps OEMs to quickly add more

intelligence and connectivity to end-product designs• The variety of standard form factors in which systems-on-module

are available• Examples of end-products which have been rapidly enhanced by

the addition of a system-on-module

By Patrice BrossardTechnical Solutions Manager, Future Electronics (France)

The module manufacturer handles all the difficulties of processorimplementation: board layout for a fine-pitch BGA device, high-speedrouting, design verification, EMC conformance, and the significant effortinvolved in board bring-up and Board Support Package (BSP)development.

Today, the market offers two main types of SoM:• Fully modular solutions are designed to sit on a carrier card. Standard

carrier cards are available from SoM manufacturers. In somecircumstances, the carrier card may be customised, and this gives thedesigner complete flexibility to design a board with the exact mix ofstorage, peripherals, interfaces and connectors required. This providesfor the use of a general-purpose SoM.

• Integrated solutions do not require a carrier board and provide a fixedset of connections and interfaces, of which the most commonly foundare SPI, I2C, UART, CAN, PCI, PCIe, SATA and MMC/SD/SDIO. Thistype of system is better described as a Single-Board Computer (SBC)or Computer-on-Module (CoM). Many CoMs also provide on-boardaudio functions, display controllers and camera interfaces.

It follows that a true SoM on a custom carrier board can be sized to fitthe application’s mounting requirements precisely. The CoM market, bycontrast, is highly standardised, and CoM boards’ form factors aredefined by standards bodies, as shown in Figure 1.

T E C H N I C A L V I E W

including VxWorks®, Linux, Android, Windows® Embedded and Integrityfrom Green Hills Software.

Users should also expect the SoM manufacturer to provide acomplete set of drivers for devices on the board. Device-driverdevelopment requires a high level of expertise, and would distractattention and resources from application development if the SoM userattempted to undertake it. The SoM supplier should take care of driversin the following categories:• Protocols and communication such as: TCP/IP, 10/100/1000 Ethernet,

Profibus, PCI, PCIe, PCMCIA• Wireless connectivity: Wi-Fi®, SDIO, Bluetooth®, ZigBee®, GPS, RFID,

IrDA, Wireless USB, GSM/GPRS• Peripherals: LCD, touch sensing, SPI, I2C, real-time clock, DMA• Storage: SATA/PATA, non-volatile memory, SD/MMC/Compact Flash,

smart card• Multimedia: MP4/H264 codec, camera, audio

SoMs in useThanks to the use of an SoM, Intel’s vision of smart display panels hasalready been realised in part. Future Electronics recently supported aEuropean manufacturer of LED public information panels, for use forinstance in airports and train and bus stations, which has addedconnectivity and user-interface functions to a previously simple paneldesign.

This manufacturer found that an architecture based on the use of anindustrial PC was expensive and incompatible with the environmentalconstraints of the application.

Its successful design used a SoM carrying an ARM® Cortex®-A9-based processor and running embedded Linux. The module wasconnected to the internet via a GSM mobile phone network: wirelessconnectivity was implemented with a Sierra Wireless module mountedalongside the SoM.

Since the BSP and device drivers were provided by the SoMmanufacturer, the designers were able to start developing theirapplication early in the project. And by using an SoM, they were able tointroduce a completely new hardware architecture based on anembedded computer, without having to handle the power, thermal,board-layout and compliance issues involved in implementing a complexprocessor design.

Other telling examples in which an SoM has been used successfullyinclude:• Adding a sophisticated human-machine interface to a vending

machine – this calls for a computer module which is easy to use, andoffers high computing performance and high reliability.

• Public information panels containing a full-HD LCD screen. Thisapplication requires video capability with an HDMI interface. A processor based on the ARM Cortex-A9 core is ideal, as it may bespecified with a built-in high-performance video codec.

Enhancing value of end-productAs the examples above show, there is an opportunity for manufacturersof stand-alone products to create a new, premium product without atotal reconfiguration of the design operation. Modern processors areenormously capable devices, but the use of an SoM insulates designteams from the difficulties involved in realising a processor design.

The latest SoMs from suppliers such as Technexion and Advantechprovide a way to radically rethink end-product designs, without a hugeinvestment in new design staff or new expertise.


for first-time embedded

The standard specification generally defines not only the size of theboard, but also the connector types used. The location of theconnectors might also be specified, or decided by the boardmanufacturer.

The issue for the embedded system designer is to choose the level ofintegration that best fits the application. As ever in electronics, the trendis towards more and more integration. Some of the most innovativedesigns are appearing in boards that have a very small form factor.

Advantech, for example, offers various PC/104 (96mm x 90mm)computer modules, as shown in Figure 2. Several modules for

embedded-computing designsare based on the x86 processorarchitecture, with up to 1Gbyteof DDR3 memory, dual10/100/1000 Ethernet interfaces,an audio codec, a mini-PCIeexpansion slot, and SATA as wellas dual-display capability.

Another popular form factor isthe COM Express®, orETXexpress, format. One of thelatest modules available fromAdvantech is shown in Figure 3.COM Express is the firstindependent module standard tosupport very high-speedinterface technologies such asUSB3.0. Embedded applications,however, normally favour the useof more mature interfaces suchas PCIe and SATA.

Another proven SoM supplier,Technexion, offers the designer achoice between ARM-based andx86-based modules. Usefully, thetwo families of boards are pin-compatible with each other.

They are produced in the newEDM Compact form factor. Theaim of the developers of this newopen standard is to providereliable and interoperablehardware, so that users can

simply swap modules in and out of a design to provide a ‘modularcomputing’ approach.

EDM Compact is very similar to the Q7 standard, making use of acommon connector which carries all signals, such as Gigabit Ethernet,SPI and HDMI. EDM Compact boards from Technexion are availablewith single-, dual- or quad-core ARM Cortex-A9 processors. Theirspecifications include up to 2Gbytes of main memory, a 10/100/1000Ethernet interface, USB2.0, CAN, PCIe, SATA, an audio codec andstrong video capabilities. The EDM Compact boards are qualified forindustrial use, and have a smaller, 60mm x 82mm outline than thePC/104 form factor.

Application-development resourcesOne of the biggest advantages to system developers of using an SoM isthe speed with which they can progress to application development.Most SoMs incorporate a BSP based on Workbench, an integrateddevelopment environment. This provides a graphical and highlyautomated environment that makes it easy even for inexperienceddevelopers to create applications on a choice of operating systems,


Fig. 2: The latest Advantech PC/104 board.This standard form factor is still very popular

Fig. 3: High-end COM Express module fromAdvantech

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