For Y. Unno, KEK · BeO facings (cooling side) Silicon sensors BeO facings (far side) Connector...
Transcript of For Y. Unno, KEK · BeO facings (cooling side) Silicon sensors BeO facings (far side) Connector...
ATLAS silicon microstrip detectorSystem (SCT)
Y. Unno, KEKFor SCT collaboration
Endcap modules
Barrel modules
SCT
Diameter 25 mBarrel toroid length 26 mEndcap end-wall chamber span 46 mOverall weight 7000 Tons
ATLAS detector
Name Duration Start FinishUX 15 Hand-over 0 days 14 Apr '03 14 Apr '03
PHASE 1: Infrastructure 377 days 14 Apr '03 24 Sep '04
UX available for ATLAS 0 days 21 Nov '03 21 Nov '03
PHASE 2: Barrel Toroid & Barrel Calorimeter 466 days 21 Nov '03 16 Sep '05
Phase 2a: Bedplates & Feet 20 days 21 Nov '03 19 Dec '03
Phase 2b: Barrel Toroid 309 days 12 Dec '03 1 Mar '05
Phase 2c: Barrel Calorimeter 354 days 3 May '04 16 Sep '05
Phase 2d: Racks, Pipes & Cables 273 days 24 Nov '03 13 Dec '04
PHASE 3: End-cap Calorimeters & Muon Barrel 408 days 7 Sep '04 10 Apr '06
Phase 3a: Pipes & Cables 205 days 7 Sep '04 28 Jun '05
Phase 3b: Endcap Calorimeter C 245 days 22 Oct '04 7 Oct '05
Phase 3c: Muon Barrel 155 days 14 Dec '04 26 Jul '05
Phase 3d: Endcap Calorimeter A 237 days 12 May '05 10 Apr '06
PHASE 4: Big Wheels & Inner Detector 234 days 11 Jul '05 2 Jun '06
Phase 4a: Big Wheels 161 days 11 Jul '05 21 Feb '06
Phase 4b: Inner Detector 191 days 8 Sep '05 2 Jun '06
PHASE 5: End-Cap Toroid & Small Wheels 166 days 22 Nov '05 12 Jul '06
Phase 5a: Endcap Toroid 166 days 22 Nov '05 12 Jul '06
Phase 5b: Small Wheels 56 days 12 Apr '06 28 Jun '06
PHASE 6: Beam Vacuum, End wall Chambers, Shielding54 days 26 May '06 9 Aug '06
Phase 6a: Completion of the Beam Vacuum 25 days 26 May '06 29 Jun '06
Phase 6b: End wall Chambers (EO) 21 days 14 Jun '06 12 Jul '06
Phase 6c: Shielding & full Magnet test 26 days 5 Jul '06 9 Aug '06
Global Commissioning 60 days 10 Aug '06 1 Nov '06
Cosmic tests 40 days 2 Nov '06 29 Dec '06
ATLAS Ready For Beam 0 days 29 Dec '06 29 Dec '06
14 Apr '03 UX 15 Hand-over
377 days PHASE 1
21 Nov '03 UX available for ATLAS
466 days PHASE 2
20 days Phase 2a: Bedplates & Feet
309 days Phase 2b: Barrel Toroid
354 days Phase 2c: Barrel Calorimeter
273 days Phase 2d: Racks, Pipes & Cables
408 days PHASE 3
205 days Phase 3a: Pipes & Cables
245 days Phase 3b: Endcap Calorimeter C
155 days Phase 3c: Muon Barrel
237 days Phase 3d: Endcap Calorimeter A
234 days PHASE 4
161 days Phase 4a: Big Wheels
191 days Phase 4b: Inner Detector
166 days PHASE 5
166 days Phase 5a: Endcap Toroid
56 days Phase 5b: Small Wheels
54 days PHASE 6
25 days Phase 6a: Completion of the Beam Vacuum
21 days Phase 6b: End wall Chambers (EO)
26 days Phase 6c: Shielding & full Magnet test
60 days Global Commissioning
40 days Cosmic tests
29 Dec '06 ATLAS Ready For Beam
Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q32002 2003 2004 2005 2006 2007 2008
Installation schedule v. 6.0
The construction and installation planning, as presented to the recent LHCC Installation Review, foresees to have the initial staged detector ready at the end of 2006
Central solenoid
2 Tesla magnetic field for the inner tracking volumeSharing vacuum cryostat of Liquid Argon EM calorimeter
Contribution of the ATLAS-Japan by the superconducting-magnet experts of KEK
Fabricated by Toshiba
Completed and tested in Japan in Jan. 2001Transported to CERN in Oct. 2001
Port Rotterdam (2001.8.24)
CERN B180 (2001.9.3)
the Rhine
Yokohama Bay(2001.7.25)
Completed and Tested at Toshiba (2001.1.20)
Transportation of ATLAS Central Solenoid
Basel (2001.8.31)
Acceptance test (2001.9.28 – 10.3)
34053405
6810
5550
2300
CryostatSolenoid coil
Inner detector volume
Liquid Argon EM calorimeter
Inner detector
Solenoid coil insideLiq. Argon cryostat
2 TeslaVolume = φφφφ2.3 m x 6.8 m
ATLAS Silicon Microstrip Semiconductor Tracker (SCT)
Radiation fluence
• 1 MeV neut ron equi valent , yearly fluence
SCT: ~1.8x10
13
n/cm
2
/ yr / L=10
34
• 50% unce rtainty in the fluence (c ross section , etc.)
• 10 yrs operation : 3 yrs at 10
33
+ 7 yrs at 10
34
• Neutron dam age ~ 1.5x Proton dam age
• Fluence over 10 y rs:
- Neutrons ~2x10
14
n/cm
2
(=1.8x10
13
x1.5x7.3)
- Protons ~3x10
14
p/cm
2
(=2x10
14
x1.5)
Z(cm)
R(c
m)
SCTSCT
TRT TRT
PIXEL
0.7x1013
1.0x1013
1.5x1013
2.2x1013
1040 mm
1500 mm
SCT Barrel (and Endcap)
Endcap:9 discs x 21976 modules7104 sensors
Barrel:
r [mm] #modulesB3 300 384B4 373 480B5 447 576B6 520 672Total 2112
8448 sensors34.4 m2
Baseboard TPG
Hybrid assembly
BeO facings (cooling side)Silicon sensors
BeO facings (far side)
Connector
Slotted washer
Datum washer
SCT barrel module
p-in-n singled-sided sensorsback-to-back gluing
40 mrad stereo
1.2% Xo
Barrel module parameters
l Sensors : 63.56 x 63.96 mm2, p-in-n, single-sided
l Strip directions : ±20 mrad
l Operating temperature : - 7°C
l Total chip power : 6.0 W nom., 8.1 W max.
l Thermal runaway heat flux: > 240 µW/mm2 at 0°C
l Mechanical precisions :
n back-to-back: < 5 µm (in-plane lateral), < 10 µm (in-plane longitudinal), < 50 µm (out-of-plane)
n Fixation point: < 30 µm (in-plane)
l Radiation length: < 1.2% X0
ATLAS silicon microstrip sensorsproduction
Hamamatsu Photonics:
Barrel: 8448 + spares (~20%) ~ 10500Japan + UK + Nordic
Endcap: ~61% of (7104 + spares(~20%) ~ 5200UK + Spain
CIS:
Endcap: ~39% ~ 3300Germany
Production: Mar. 2000 started, Nov. 2002 near completion
glass pitch-adaptor(2 x 6 x 128 ch)
Hybrid of the barrel ATLAS SCT
ABCD3T chips(12 x 128 ch)
flexible Cu/PI circuitconnector carbon-carbon bridge
(underneath)
TPG 1 mm
10 mm
ABCD chip
Carbon-carbon bridge Si sensor
Cu/polyimide flexBeO facing Air gap (0.4mm)
Connetor
Cooling block
Cooling blockFlow paths of heat
Cross section of the module
Barrel module baseboard
Encapsulated VHCPG
Baseboard with
BeO facing plates
VHCPG:(very high thermal
Conductivity pyrolytic graphite)
In-plane thermal conductivity:
1450 - 1850 W/mKThickness: 380 15 m
Thermal Properties
bulk heat generation (µW/mm2@0°C)
-14°C-17°C
-20°C
Simulated thermal profile with Qchip=6W
ATLAS silicon micstrip sensors6 different shapes from 4-inch wafer
Barrel - Square Endcap - Wedges
100
64
63.6
80 µm x 768 strip = 61.4 mm, 62.0 mm strip length1 mm edge space
5
62
5 Wedge detectors for forward
p-in-n, 80 µµµµm pitch, 768 strips, AC-coupled, 285 µµµµm thick
0
1
2
3
4
5
0 100 200 300 400 500
mod1mod2mod5mod6mod3mod4
Med
ian
ch
arg
e [f
C]
Bias voltage [V]
Y. Unno et al, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 49, NO. 4, AUGUST 2002
Operation bias voltage in ATLAS
Non-irradiated Irradiated 3x1014 p/cm2
Non-irradiated ~ 150 V Near the end of experiment ~ 350~500 V
Pre-irradiation, room temp.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 100 200 300 400 500
Bias voltage [V]
Leak
age/
Vol
ume
[uA
/cm
^3]
1331138914161467
Pre-irradiation
Barrel sensor = 1.16 cm3
~200 nA Very Good!
3x1014 p/cm2, -18C, 7d@25C
0
20
40
60
80
100
120
140
160
180
0 100 200 300 400 500
Bias voltage [V]
Leak
age/
Vol
ume
[uA
/cm
^3]
<B2-111><W12><W21><W22><W31><W32><B2-100>
Post irradiation
Current 3 orders of magnitude higher
Average of irradiated sensors
Little differencein shapes
Smooth up to 500 V!
15432365
Pre-irradiation, room temp.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 100 200 300 400 500
Bias voltage [V]
Leak
age/
Vol
ume
[uA
/cm
^3]
729737751834921
What will happen in case ...Microdischarges below 350 V
(Spec: no MD below 350 V)
Samples from rejected sensors
Post irradiation, -18C
0
20
40
60
80
100
120
140
160
180
0 100 200 300 400 500
Bias voltage [V]
Leak
age/
Vol
ume
[uA
/cm
^3]
729737751834921
Post irradiation of microdischarged sensors
Smooth!
No visible effect
Why?Type inversionP-N junction in the backsideLittle field till full-depletion in the strip side
I-V Curve at +15 C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 100 200 300 400 500
Bias voltage [V]
Lea
kag
e cu
rren
t [u
A]
Series module productionSeries barrel module production started in Feb. 2002
As of Sep. 2002, ~100 moduesMicrodischarge11 modules >350 V
Two modulesstrip's pad damaged
postIrrad, -15C, 20220170200034
0
100
200
300
400
500
600
700
800
900
1000
0 100 200 300 400 500
Bias voltage [V]
Leak
age
[uA
]
postIrrad
preIrrad, +15C, 20220170200034
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 100 200 300 400 500
Bias voltage [V]
Leak
age
[uA
]
preIrrad
Post irradiationof
microdischargemodule
Smooth up to 500 V
Same as individual sensors
500V, +15 C
0
1
2
3
4
5
6
7
8
9
10
0 200 400 600 800 1000 1200 1400Time [min.]
Lea
kag
e cu
rren
t [u
A]
55
61
69
74
88
99
100
101
102
106
Decay of microdischarge currentAlso, microdischarge currents decay out to normal currentsin a few hundred minutes
#100 has very long time const...
Visualization of hot spot
Discharging location is hot (minutely)
CCD camera with extendedsensitivity to infrared, andcooled to reduce thermal noise
Hot spot is visible in overlaying over visual image
#100 - tiny hairline metalbetween the wire (GND) and sensor edge (HV)
Multi-module system test12 modules in a row, Double row overlap, ...
Room temp. run, Cold run (with irradiated modules)
Studies of noise pickups, grounding and shielding, etc
Barrel system test
ATLAS SCT: 3-pt gain scans - Wed Jul 31 11:08:34 2002 - B186 Barrel System TestRun 991 Scans 5-7Input-noise at 2fC from 3point gain scans
Module
Inp
ut-
no
ise
(EN
C)
1200
1400
1600
1800
2000
0035 0046 0011 0019 0018 0029 0036 0026 0052 0030 0022 0008
Multimodule
Elec. Stand
Endcap systemtest
On-going ...
Barrel sector testFinal support structure, cooling pipes, refrigeration system
Dummy heatermodules
Real modules
Barrel sector test
Thermal imaging - visualize temperature distribution
Coolant in - Blue cold pipes
(Dummy) module heater on - green to yellow
Sector carbon-fibre cylinder - room temp. red
Barrel support cylinder in production
Carbon skin -Carbon honycombcore
1st cylinder (B3)delivered
Still long way toattach brackets,cooling pipes,opto-power-harnesses
SummaryATLAS is targetting the completion of the detector in the end of 2006, expecting the first beam collision in Feb. 2007
Central solenoid was completed and is in preparation for installation at CERN
Series production of SCT barrel modules has started.1st support cylinder (B3) has been delivered
Series production of SCT silicon microstrip sensors of ~18000 are near completion
Sensors show good performance in pre- and post-irradiation, and even in the case of microdischarge as low as 250V there is no visible effect after irradiation. Together with the decay of the microdischarge current, the sensors are robust for high voltage operation
System tests are progressing. No show-stopper, yet
Lots of details lie ahead toward the installation of SCT in early 2005