FOR CERTIFIED IPC SPECIALISTS (CIS)...C2 3 3 2 Q1 4 4 3 Q2 4 4 3 U1 17 17 16 U2 17 17 16 Wire 1 1 1...
5
Possible Actual Possible Actual Possible Actual R1 3 3 2 R2 3 3 2 CR1 3 3 2 CR2 3 3 2 C1 3 3 2 C2 3 3 2 Q1 4 4 3 Q2 4 4 3 U1 17 17 16 U2 17 17 16 Wire 1 1 1 1 Wire 2 1 1 1 Board 1 1 0 Totals 63 63 52 PLATED THROUGH-HOLE SKILL BUILDING Comp ID D PI A Condition Description Assembly Solder Instructor Initials Inspection Verify polarity and orientation Use provided standoffs for Q1, Q2, C1, and C2 (round footfaces the PCB) Straight through, partial, and full clinch must be demonstrated. See Instructor for guidance Boards must be clean Student Name _________________________________ Date _____________________ Minimum passing score Assembly = 50 (13 defects) Minimum passing score Inspection = 50 (13 defects) Minimum passing score Solder = 42 (10 defects) PASS PASS FAIL ASSEMBLY SOLDER INSPECTION PASS FAIL FAIL FOR CERTIFIED IPC SPECIALISTS (CIS) Revision 2 10/14/2015
Transcript of FOR CERTIFIED IPC SPECIALISTS (CIS)...C2 3 3 2 Q1 4 4 3 Q2 4 4 3 U1 17 17 16 U2 17 17 16 Wire 1 1 1...
Po
ss
ible
Ac
tua
l
Po
ss
ible
Ac
tua
l
Po
ss
ible
Ac
tua
l
R1 3 3 2
R2 3 3 2
CR1 3 3 2
CR2 3 3 2
C1 3 3 2
C2 3 3 2
Q1 4 4 3
Q2 4 4 3
U1 17 17 16
U2 17 17 16
Wire 1 1 1 1
Wire 2 1 1 1
Board 1 1 0
Totals 63 63 52
PLATED THROUGH-HOLE SKILL BUILDING
Comp ID D PI A Condition Description
Assembly Solder Ins
truc
tor
Initia
ls
Inspection
Verify polarity and orientation
Use provided standoffs for
Q1, Q2, C1, and C2 (round
foot faces the PCB)
Straight through, partial, and
full clinch must be
demonstrated. See Instructor
for guidance
Boards must be clean
Student Name _________________________________ Date _____________________
Minimum passing score Assembly = 50 (13 defects)Minimum passing score Inspection = 50 (13 defects)
Minimum passing score Solder = 42 (10 defects)
PASS PASS
FAILASSEMBLY SOLDERINSPECTION
PASS
FAILFAIL
FOR CERTIFIED IPC SPECIALISTS (CIS)
Revision 2 10/14/2015
Po
ss
ible
Ac
tua
l
Po
ss
ible
Ac
tua
l
Po
ss
ible
Ac
tua
l
R1 3 3 2
R2 3 3 2
CR1 3 3 2
CR2 3 3 2
C1 3 3 2
C2 3 3 2
Q1 4 4 3
Q2 4 4 3
U1 17 17 16
U2 17 17 16
Wire 1 1 1 1
Wire 2 1 1 1
Board 1 1 0
Totals 63 63 52
PLATED THROUGH-HOLE WORKMANSHIP
Comp ID D PI A Condition Description
Assembly Solder Ins
truc
tor
Initia
ls
Inspection
Verify polarity and orientation
Use provided standoffs for
Q1, Q2, C1, and C2 (round
foot faces the PCB)
Straight through, partial, and
full clinch must be
demonstrated. See Instructor
for guidance
Boards must be clean
Student Name _________________________________ Date _____________________
Minimum passing score Assembly = 50 (13 defects)Minimum passing score Inspection = 50 (13 defects)
Minimum passing score Solder = 42 (10 defects)
PASS PASS
FAILASSEMBLY SOLDERINSPECTION
PASS
FAILFAIL
FOR CERTIFIED IPC SPECIALISTS (CIS)
Revision 2 10/14/2015
Po
ssib
le
Actu
al
Po
ssib
le
Actu
al
Po
ssib
le
Actu
al
CR3 3 3 2
CR4 3 3 2
C3 3 3 2
C4 3 3 2
R3 3 3 2
R4 3 3 2
R7 3 3 2
R8 3 3 2
U3 15 15 14
U4 101 101 100
U5 21 21 20
Q3 4 4 3
Q4 4 4 3
Board 1 1 1
Totals 170 170 157
Assembly Solder Instru
cto
r
Initia
ls
Comp
ID D PI A Condition Description
Inspection
SURFACE MOUNT SKILL BUILDING
R5 and R6 are not
graded
U6 is not graded
U6 can be used if U4
defects are excessive
Verify polarity and
orientation
Boards must be clean
Minimum passing score Assembly = 136 (34 defects)Minimum passing score Inspection = 136 (34 defects)
Minimum passing score Solder = 126 (31 defects)
Student Name _________________________________ Date _____________________
PASS
FAIL
PASS
FAILASSEMBLY SOLDERINSPECTION
PASS
FAIL
FOR CERTIFIED IPC SPECIALISTS (CIS)
Revision 2 10/14/2015
Po
ssib
le
Actu
al
Po
ssib
le
Actu
al
Po
ssib
le
Actu
al
CR3 3 3 2
CR4 3 3 2
C3 3 3 2
C4 3 3 2
R3 3 3 2
R4 3 3 2
R7 3 3 2
R8 3 3 2
U3 15 15 14
U4 101 101 100
U5 21 21 20
Q3 4 4 3
Q4 4 4 3
Board 1 1 1
Totals 170 170 157
SURFACE MOUNT WORKMANSHIP
Assembly Solder Instru
cto
r
Initia
ls
Comp
ID D PI A Condition Description
Inspection
R5 and R6 are not
graded
U6 is not graded
U6 can be used if U4
defects are excessive
Verify polarity and
orientation
Boards must be clean
Minimum passing score Assembly = 136 (34 defects)Minimum passing score Inspection = 136 (34 defects)
Minimum passing score Solder = 126 (31 defects)
Student Name _________________________________ Date _____________________
PASS
FAIL
PASS
FAILASSEMBLY SOLDERINSPECTION
PASS
FAIL
FOR CERTIFIED IPC SPECIALISTS (CIS)
Revision 2 10/14/2015
Task Wire Gauge DefectProcess
IndicatorAcceptable Condition Description
Instructor
Initials
Mechanical
Stripping20 AWG
Thermal Stripping 22 AWG
Tinning
(Solder Pot)20 AWG
Tinning
(Soldering Iron)22 AWG
Tinning *
(Gold removal)
Turret 22 AWG
Turret 22 AWG
Bifurcated 22 AWG
Bifurcated 22 AWG
Pierced/Hook 22 AWG
Pierced/Hook 22 AWG
Hollow Cup 20 AWG
Hollow Cup 20 AWG
* If required
Student Name______________________________ Date___________________________
PASS FAIL
WIRES AND TERMINALS WORKMANSHIP
PASS FAIL
FOR CERTIFIED IPC SPECIALISTS (CIS)
Revision 2 10/14/2015
