FlexTiles Platform integrated in 19" Rack Enclosure
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www.flextiles.eu FlexTiles 1 3 t h A u g u s t 2 0 1 4 / E n c l o s u r e f o r F D P 19” Rack Solution FlexTiles Development Platform (FDP) Enclosure
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The FlexTiles Development Platform is suitable for verifying the concept of a single 3D SoC chip design, but with a 19" Rack enclosure it can scale to either a larger 3D chip design or become a FPGA-based HPC
Transcript of FlexTiles Platform integrated in 19" Rack Enclosure
www.flextiles.eu
FlexTiles
13th
Au
gust
201
4 / E
nclo
sure
for
FD
P
19” Rack Solution FlexTiles Development Platform (FDP) Enclosure
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FlexTiles Development Platform
Fully Portable and Rugged Enclosure for FDP
2U 19” Rack form-factor Durable 4mm Custom-formed Plastic design
Integrated Corsair 600W 110VAC-230VAC Power Supply Optional 48VDC
Self-contained and fully operational with Dual Fans Airflow ducted towards ‘Heat-Spots’
Light-weight and secure design Total solution less than 15kg to allow easy/low-cost air-transport
Easy Access All hardware interfaces are accessible from Front-Panel
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FlexTiles Development (FDP) External Shipping Case
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FDP in Shipping Case – Front Panel Removed
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T/D
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FDP in Shipping Case – Rear Panel Removed
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FDP in Shipping Case – Top View – Rear Cover Removed
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FDP 19” Rack Enclosure – Front Panel View
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FDP 19” Rack Enclosure – Rear view
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FDP 19” Rack Enclosure - Front View – Lid Removed
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1.1
FDP 19” Rack Enclosure - Front View – No lid
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2011
). T
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ion
1.1
FDP 19” Rack Enclosure - Rear View – No lid
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2011
). T
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1.1
FDP 19” Rack Enclosure – Top View – No lid
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4/F
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4412
785.
2011
). T
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ate
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1.1
FDP 19” Rack Enclosure – Top View – Lid Open
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The
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T/D
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785.
2011
). T
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1.1
FDP 19” Rack Enclosure – Stacked – Front View
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4/F
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4412
785.
2011
). T
empl
ate
vers
ion
1.1
FDP 19” Rack Enclosure – Stacked – Shipping Box
