FIELD EFFECT TRANSISTORS - TDL
Transcript of FIELD EFFECT TRANSISTORS - TDL
FAST TRANSIENT SWITCHING IN BIPOLAR JUNCTION
TRANSISTORS AND METAL-OXIDE-SEMICONDUCTOR
FIELD EFFECT TRANSISTORS
by
STEVEN MENHART, B.Sc.
A THESIS
IN
ELECTRICAL ENGINEERING
Submitted to the Graduate Faculty of Texas Tech University in
Partial Fulfillment of the Requirements for
the Degree of
MASTER OF SCIENCE
IN
ELECTRICAL ENGINEERING
Approved
Accepted
December, 1985
<? ACKNOWLEDGMENTS
I would like to thank Dr. w. M. Portnoy for
his professional expertise and overall guidance
during the course of this work. Also, I would
like to thank Mr. John Power of Los Alamos
National Laboratory, New Mexico, for his techni
cal advice, which helped solve many problems. I
am also indebted to Drs. J. F. Walkup, E. Jobe,
and T. F. Krile for agreeing to serve on my
committee.
I would especially like to thank my parents,
Hans and Christine Menhart, for their encourage
ment and financial support, without which this
work would not have been possible.
ii
TABLE OF CONTENTS
Page
ACKNOWLEDGMENTS ii
LIST OF TABLES V
LIST OF FIGURES vi
I. INTRODUCTION 1
11. THEORY OF THE MEASUREMENTS 3
III. EXPERIMENTAL PROCEDURES 8
Test Devices 8
Test Circuits 10
Repetitive Triggering 22
Measurements 24
IV. EXPERIMENTAL RESULTS 3 0
Base Drive Effects 30
Circuit Effects 43
Base-Triggered Bipolar Transistor
Measurements 49
The MOS Transistor 54
Collector-Triggered Measurements 58
Repetitive Measurements 64 v. CONCLUSIONS 70
LIST OF REFERENCES 71
111
APPENDICES
A. Theoretical Load Voltage Calculation for Constant dv/dt Switch 7 2
B." Photographs of the Representative Behavior of a Base-Triggered RS3500, as a Function of Load Resistance and Capacitance 74
C. Photographs of the Representative Behavior of a Gate-Triggered BS170, as a Function
of Load Resistance and Capacitance 92
D. Specifications for the RS350 Transistor liO
E. Specifications for the 2N2222 Transistor 113
F. Specifications for the BS170 Transistor 118
iv
LIST OF TABLES
Page
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Fall Times and Peak voltages for the Output Pulses Obtained with the Mercury-Wetted Relay as a Substitute for the TUT 44
Theoretical Peak Voltages Obtained with the Mercury-Wetted Relay as a Substitute for the TUT 47
Fall Times and Peak Voltages for the Output Pulses of the Base-Triggered RS3500 50
Fall Times and Peak Voltages for the Output Pulses of the Base-Triggered 2N2222 51
Fall Time and Peak voltages for the Output Pulses of the Gate-Triggered BS170 56
LIST OF FIGURES
Page
Figure 1. Representative characteristic curves for a bipolar transistor 4
Figure 2. Emitter geometries 9
Figure 3. Circuit schematic for base-triggered measurements on the RS3500 and the 2N2222 11
Figure 4. Circuit schematic for gate-triggered measurements on the BS170 12
Figure 5. Circuit schematic for the collector-triggered measurements on the RS3500 and the 2N2222 14
Figure 6. Circuit schematic for the drain-triggered measurements on the BS170 15
Figure 7. Physical layouts of the RS3500 circuits 17
Figure 8. Physical layouts of the 2N2222
circuits 18
Figure 9. Physical layouts of the BS170 circuits 19
Figure 10. Typical pulse obtained from the line pulser into a matched 50 load 21
Figure 11. Circuit schematic for the RS3500 repetitive collector-triggered measurements 25
Figure 12. Circuit schematic for the constant-base drive measurements on the RS3500 31
Figure 13. Base current, collector current and collector-emitter voltage curves: V is 250 V and the load is 500 U 34
VI
Figure 14. Base current, collector current and collector-emitter voltage curves: v^c is 250 V and the load is 47 k« 37
Figure 15. Base current, collector current and collector-emitter voltage curves: VQQ is 100 V and the load is 47 kfl 41
Figure 16. Gate trigger pulse 57
Figure 17. Circuit schematic illustrating the simplified form of the collector-triggered circuit 59
Figure 18. Collector-triggered RS3500 waveforms; the amplitude of the trigger pulse is 750 V, CL is 20 pF and RL is 50 Q 61
Figure 19. Collector-triggered RS3500 waveforms; the amplitude of the trigger pulse is 750 V, CL is 20 pF and RL is 480 « 62
Figure 20. Collector-triggered RS3500 waveforms; the amplitude of the trigger pulse is 750 V, CL is 20 pF and RL is 4.8 k« 63
Figure 21. The 750 V trigger pulse used for repetitive collector-triggering 67
Figure 22. Observed load voltage for a RS3500 device repetitively triggered at the collector 69
Vll
CHAPTER I
INTRODUCTION
This work was conducted to investigate the effects of
load resistance and capacitance on the fast transient
switching performance of both bipolar junction transistors
(BJTs) and metal-oxide-semiconductor field effect transis
tors (MOSFETs). As a consequence of this work, it was
hoped to determine the suitability and reliability of these
devices as solid state switches in pulse forming circuits,
particularly Marx banks (sometimes called generators).
These networks essentially act as voltage multipliers for
pulsed voltages. The fundamental principle is to charge
several capacitors in parallel, then switch them into a
series configuration. The output voltage then becomes
equal to the sum of the voltages across the capacitors [IJ.
The width of the output pulse is determined by the values
of resistors and capacitors used; the pulse rise time, by
the switches used and by circuit parasites. Obviously, in
order to obtain rapid pulse rise times, fast switches are
required.
Three devices were investigated: the Raytheon RS3500
avalanche transistor, the 2N2222 (obtained from TRW as
samples from a single wafer) and the Siliconix BS170. The
first two devices are BJTs; the latter is a MOSFET. All
three devices were tested in two modes: based-triggered and
collector-triggered by way of an overvoltage (in a Marx
bank utilizing solid state switches, the first stage
requires a trigger, e.g., base-trigger; the latter stages
are usually switched by means of an overvoltage). Testing
was performed single-shot and repetitively for four samples
of the RS3500.
CHAPTER II
THEORY OF THE MEASUREMENTS
Figure 1 illustrates a representative family of
characteristic curves for an n-p-n bipolar transistor.
Four breakdown voltages are shown on the v^- axis: BV^- <
®^CER ^ ^^CEX ^ ®^CBO* ®^CEO ^^ ^^® open-base collector-
emitter breakdown voltage; BV _-, is the breakdown voltage
with the base tied to the emitter through a resistance; and
BVp„^, with the base-emitter junction reverse biased.
BV QQ is the open emitter collector-base breakdown voltage.
Associated with the base-emitter junction is a parasitic
resistance which shunts the junction. The BV breakdown
voltage is established when the collector-base leakage
current becomes high enough to create a voltage drop across
the shunting resistor, which is sufficient to forward bias
the base-emitter junction. (For small values of R, in the
order of the internal shunt resistance, BV ^ ^ will be near
BV-_^; this equality was in fact observed in this work when CBO
R was around 50 J2.)
Normally, the transistor is operated along a load
line, such as A, within the safe operating region bounded
by the saturated collector voltage curve, the BV^^^ curve,
and some power limited boundary such as the dashed line in
the figure. Such conventional switching in which the
^^CEO ^^CER ^^CEX CBO
Figure 1. Representative characteristic curves for a bipolar transistor.
device behaves normally as a transistor can be relatively
fast, particularly if the transistor is kept out of
saturation. However, the total voltage switched is limited
by BVp_Q. If the transistor is biased at BV , and a load
line such as B is used, the transistor will switch from its
quiescent operating point (the intersection of the load
line and the BV curve) to a second stable point, the
intersection of the load line and the BV___ curve. This CEO
switching is enhanced by avalanche effects and is very
fast. Here also, the total voltage switched is limited,
being the difference between BV-„ and BV , it is likely
that the above phenomenon is dependent upon the base
current, i.e., for base currents less than those corre
sponding to the intersection of the load line, and the
BV-_^ curve the collector-emitter voltage will probably
remain at BV^„-.. For base currents greater than this CEO
initial value, it should be possible to drive the transis
tor directly into a region of low collector-emitter
voltage.
There is a switching mode, however, which is not only
fast, but large in voltage swing. If the base is open
circuited and V__ is increased, the transistor quiescent
point will move in a stable fashion along the BV^^^ curve
until it reaches a point at which an instability occurs.
At this point (P in Figure 1), very rapid switching occurs
to a low voltage state in which the current is limited only
by external circuit resistance. This instability is also
known as second breakdown, which is associated with high
collector-emitter voltages and collector currents f2]. It
is usually a damaging event unless the total power dis
sipated in the resistance is kept small. Using a dynamic
load line such as D in a circuit which contains small
stored energy, say in a capacitor, will then permit
extremely fast switching of reasonably high voltages with
reasonable safety. Note that the load line, D, must lie
above P for such operation. At higher resistances (load
line B), the transistor will switch to a stable point on
the BV__^ curve. Even at lower resistances (load line C), CEO
if the load line lies below P, although close to it,
switching will occur to the intermediate voltage BV even
if the intermediate point is not stable. In this case, the
output will consist of a double pulse with a low amplitude
front edge. This phenomenon is probably subject to the
same base current constraints discussed earlier.
Such behavior suggests a procedure for testing the
performance of a bipolar transistor under fast, high
voltage switching conditions. Switching speed can be
examined as a function of the load line, and vulnerability,
as a function of stored energy. In this work, the point P
was determined for the RS3500 on a curve tracer by setting
the bias supply to 250 V (just below BV^^^) and varying the
collector resistance; under these bias conditions, P
corresponded to a load line of around 4000 Q. Test
conditions were then established for a logarithmic sequence
of resistances: 47, 470, 4700 and 47,000 12. Measurements
were also made at 4.7 a, but there was considerable ringing
in the output pulse at this load resistance. Stored energy
was controlled by using a sequence of capacitance values:
20, 200, 2000 and 20,000 pF. To permit a direct comparison
of performance between devices, these values of resistance
and capacitance were used in every measurement, on each
device, and during collector-triggering as well.
CHAPTER III
EXPERIMENTAL PROCEDURES
Test Devices
The RS3500 and 2N2222 are bipolar transistors, the
RS3 5 00 having the epitaxial structure and gold-doping of a
power transistor, although smaller in size. The 2N2222 is
a small signal device. Figure 2 illustrates the emitter
geometries of both the RS3500 and the 2N2222 (the center
connection is the emitter in both cases). The avalanche
device is capable of dissipating approximately 2.25 times
more power than the 2N2222 for a given case temperature.
The large emitter-based periphery of the RS3500 is typical
for power devices, to ensure uniform emitter current flow.
The BS170 utilizes metal oxide technology and is an
n-channel enhancement device. MOSFETs are majority carrier
semiconductor devices and their construction and principles
of operation are fundamentally different from those of
traditional bipolar transistors, which are minority carrier
semiconductors. A bipolar device is current controlled,
whereas a MOSFET is a voltage controlled device and conse
quently MOSFETs are often modeled as a voltage controlled
resistor. The hermetic package of the BS170 makes it a
physically robust device.
8
b.
Figure 2. Emitter geometries for: (a) the RS3500 (MdQnifica-tion 102X); (b) the 2N222: (Magnification 154X).
10
Test Circuits
The design of the test circuits for base-triggering
was constrained by the measurements to be performed: the
dynamic load line must correspond to the load resistance
and the energy stored in the capacitor must be dissipated
in the load following each trigger event. Figure 3 is a
schematic of the circuit ultimately used for the base-
triggered measurements on the RS3500 and the 2N2222; both
circuits are identical except for the collector supply
(V^^), which is 250 V for the RS3500 and 100 V for the
2N2222. Figure 4 illustrates the circuit schematic for the
gate-triggered measurements on the BS170; it is essentially
the same as that of Figure 3, except that there is no
negative gate bias and the drain supply (Vj. .) is 100 V.
The operation of both circuits may be understood by
considering the circuit of Figure 3. The load capacitance,
C-./ charges up to the supply voltage through R^ (100 kiJ),
the collector resistor, and the load resistor, R_. When a LI
trigger voltage sufficient to forward bias the base-emitter
junction of the bipolar device (approximately 0.7 V) or
greater than the gate-source threshold voltage for the
MOSFET (approximately 2.3 V), is applied, the transistor
switches along a load line established by R^, as R is
isolated by a 10 uH inductor. The transistor will remain
turned on until C has discharged, since once unstable
switching has occurred it ceases only when the energy
11
V cc 0
R^ < 100 Kfi
10 yH
n 47 Q
R,
-2 V
•oVj^(t)
OSCILLOSCOPE (50 ^)
Figure 3. Circuit schematic for base-triggered measurements on the RS3500 and the 2N2222. Vcc is 250 V for the RS3500 and 100 V for the 2N2222.
12
n
(I
100 kfi
10 yH
47
T UT
R,
t» Vj^(t)
OSCILLOSCOPE (50 n)
Figure 4. Circuit schematic for gate-triggered measurements on the"BSl70.
13
stored in C. has been dissipated; i.e., the collector
current falls below some holding current value.
The collector-triggered (or drain-triggered) measure-
meats involve a much higher voltage (from 400 to 1000 v
peak) pulse at the collector. Figures 5 and 6 are schema
tics of the collector-triggered circuits for the RS3500 and
2N2222 and the drain-triggered circuit for the BS170,
respectively. The circuits for the bipolar transistors
differ only in the value of collector voltage (V^^) used,
which are the same as the respective base-triggered
circuits. Again, v for the BS170 is 100 v.
The load capacitor is charged through R and a second
100 ka resistor; these are isolated from the trigger pulse
by 10 uH inductors. Several base-emitter (or drain-gate)
bias configurations were considered, but the shorted base
(or gate) was chosen because it is the configuration used
for overvoltage collector-triggering in a Marx bank. A high
voltage pulse summed with the capacitor voltage was the
collector (or drain) trigger. The load resistor R was
located in the emitter or source circuit.
Several arrangements of the load were considered to
minimize stray inductance; all of these involved configura
tions of resistors to achieve the required value of load
resistor in such a manner that the individual magnetic
fields created by the current flow in each resistor
combined in such a way that they effectively cancelled.
14
C > 100 k^
10 yH
TUT
10 yH
R,
V^(t) ^
OSCILLOSCOPE
100 KQ
(50 fi)
Figure 5. Circuit schematic for the collector-triggered measurements on the RS3500 and the 2N2222. Vcc is 250 V for the RS3500 and 100 V for the 2N2222. The trigger pulse has a magnitude of three times VQQ,
^DD (100 V) 15
100 k^
10 yH
TUT
10 yH
V^it) CK
OSCILLOSCOPE (50 fi)
100 K^
Figure 6. Circuit schematic for the drain-triggered measurements on the BS170.
16
resulting in a low inductance configuration. One arrange
ment consisted of a parallel array of 1/8 W composition
resistors. This configuration was investigated; however,
it did not produce the quality of output pulse obtained
with a single 1/4 W composition resistor and hence was not
pursued further. A second configuration was an attempt to
construct what is referred to as a 'current viewing
resistor' (CVR), This type of resistor has a coaxial form;
those fabricated consisted of five resistors connected in
parallel, directly at one end, and by means of a circular
ring at the other. When incorporated into a circuit, this
configuration is arranged such that the return current path
is through the center of the ring connecting the resistors
together. It was hoped that this would yield a configura
tion with reduced inductance. Fall-time measurements did
not confirm this and hence it was concluded that a lower
inductance configuration other than a single 1/4 composi
tion resistor could not be obtained.
The principal considerations in the physical layout of
the circuits were parasitics and mismatches. All external
connections were made via coaxial lines and connectors.
The circuits themselves were fabricated, as compactly as
possible, from double-sided, copper-clad laminate; a large
ground plane was employed, to which the extensions of the
coaxial connectors were soldered. The physical layouts of
the circuits are illustrated in Figure 7, 8 and 9.
1 /
a.
b.
Figure 7. Physical layouts of the RS3500 circuits: (a) base triagered; (b) collector-triggered.
a.
b.
Figure 8. Physical iayouts of the 2N2222 circuits: (a) base triQgered; (b) collector-triggered.
a.
b.
Figure 9 1 layouts of the :ircuits: (a) gats-Phvsica.
^ ' ' ""-^^ (b) drain-triggered; VD) '-^-^ triggered.
20
Initially, base-triggered measurements utilized a
HP-214A pulse generator as the trigger source. However,
this was superseded by a line pulser which produced a more
sharply defined rectangular pulse with decreased rise and
fall times (approximately 1 ns) and constant amplitude as
compared to the trapezoidal pulse obtained from the pulse
generator. The line pulser consisted of approximately one
meter of RG-58A/U coaxial cable in series with a Magnecraft
Model W134MIP-3 mercury wetted relay and delivered a 10 ns
pulse when the relay was closed. The line was charged to
40 V through a 1.5 Mfi resistor and delivered a 20 v
rectangular pulse to a matched 50 fl load. This pulse is
shown in Figure 10. The cable pulser was used in all base-
and gate-triggered measurements; however, mismatch at the
base and gate resulted in considerable ringing. A 47 Q
resistor at the gate to the source reduced the ringing in
the MOSFET measurements, but very little improvement could
be obtained under any conditions at the base.
This line pulser was also used in the collector and
drain-triggered measurements, except that it was charged to
1500 V for the RS3500 and 600 V for the 2N2222 and the
BS170. Under these conditions, 750 V and 300 V pulses were
provided for summing with the respective voltage stored
across the capacitor in the three measurements. The
capacitor was charged in each case to v or V .
0 1
Figure 10. Typical pulse obtained from the line pulser into a matched 50 load; the line was charged to 40 V. The vertical and horizontal scales are 5 V and 10 ns per large division, respectively.
22
The coaxial cable from which the line pulser is
constructed is essentially a transmission line consisting
of distributed series inductance and parallel capacitance.
The pulse width is determined by the time required for the
voltage wave to propagate the length of the cable, which in
turn is governed by the physical dimensions of and the
materials from which the cable is manufactured. Pulse
width is given by x^ = 2ZQC , where ZQ is the character
istic impedance and C is the total capacitance of the
line.
Repetitive Triggering
Initial repetitive measurements were performed by
rep-rating the relay coil directly from a pulse generator.
However, excessive relay bounce did not permit the con
tinued use of this simple arrangement. It was determined
that a command charging scheme was required; i.e., the
bounce itself could not be eliminated. However, its
manifestations could be eliminated. The command charging
system operated in the following manner: while the relay
contacts were open, the command charging element was
activated, causing the line to be charged; before the relay
contacts were closed, the command charging element discon
nected the line. Although the relay contacts continued to
bounce, a second voltage spike was not produced as the line
was discharged and recharge was inhibited.
23
Several command charging elements were considered,
including a series combination of SCRs; these were found to
self-trigger as a result of the high dv/dt produced when
the relay contacts closed? this caused the line to recharge
in an uncontrolled fashion. High voltage MOSFETs were also
considered. However, their leakage current proved too
great, i.e., the leakage current was sufficient to charge
the line to a voltage such that a second voltage spike of
some 100 V was observed approximately 30 us after the
initial discharge. It was determined that a solid state
switch could not be used and that a second relay, operating
ISO** out of phase with the first, would be most effective.
The repetition rate at which a relay can be operated
is principally governed by the L/R time constant of the
drive circuit. The inductance of a W134MIP-3 relay coil is
fixed at approximately 230 mH; however, its overall
resistance, R, can be increased by adding external series
resistance. Reducing the L/R time constant results in a
more rapid rise of current through the relay coil, which
reduces the delay between the application of a pulse to the
relay coil and the contacts closing. However, adding
series resistance reduces the magnitude of the coil
voltage. In order to maintain the nominal voltage across
the relay coils, these were driven by placing them in the
drain circuit of a common source FET circuit. In this
manner, by operating the MOSFETs at the rated voltage
24
(100 V), an additional 4.7 kfi of resistance could be added
in series with the 1400 ft internal resistance of the coil.
This reduced the L/R time constant by 77%, enabling the
maximum rep-rate to be increased to 350 Hz.
The complete circuit used for the repetitive measure
ments is illustrated in Figure 11. The relative timing of
the relays was assured by adjusting the respective FET gate
drives, which were obtained from pulse generators.
Measurements
Switching waveforms were displayed on a Tektronix
Model 7834 400 MHz storage oscilloscope, using a 600 MHz
7A19 plug-in amplifier. The trigger source was a 7B80 time
base. A storage oscilloscope was used rather than a
sampled measurement for several reasons; first, because
single-shot testing was desirable, at least initially, in
order not to stress the devices and also because jitter in
the trigger pulse sequence introduced time spread in the
sampled waveform display. Single-shot measurements on the
7834/7A19 combination, which has a specified rise time of
0.9 ns (although the results obtained here suggest that
this rise time is conservative), were compared with and
found to agree with sampled measurements on a base-
triggered RS3500, so that the system rise time was con
sidered adequate to obtain an accurate representation of
the phenomenon occurring.
o o in
25
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tn u
<u Cr» 4J U
4J M I O U
(M O 4J
O O •H 0) 4J rH «d rH
e O • <U U 0) i 5 4-> 0 0 ) 0 : CQ > 0)
-H e •P 4-> 0) •H -H J-i 3 4J 13 U 0) CO M P i (TJ
•H 0) (U o M e
26
Several different procedures were considered for
obtaining the waveforms. A current coil produces a voltage
proportional to the current it is measuring. A current is
induced in the current coil as a result of magnetic
coupling between the current to be measured and current
coil. Consequently, current transformers offer the
advantage of being able to measure currents (and hence
voltage across a resistive load) without any physical
connection to the circuit, eliminating mismatch and loading
considerations. Unfortunately, this contrivance is, at
present, limited to a risetime response of 2 ns or greater,
which is inadequate for the sub-nanosecond fall-times
inherent in this measurement.
Having determined that a physical connection was
required, source-load matching became the primary consid
eration. When frequency components of the order of 500 MHz
are involved (as they are here), slight mismatches can
result in reflections and waveform distortion which ulti
mately yields a waveform that conveys dubious information--
if any. Since the bandwidth constraint necessitates the
use of a 50 ft input impedance plug-in amplifier, it was
decided to observe the voltage across the load by means of
direct coupling via 50 ft coaxial cable, utilizing 50 ft
attenuation at the oscilloscope input where necessary.
Initial measurements used this scheme, which produced
very "clean" waveforms without any ringing being evident.
27
However, it was determined that this scheme severely
restricted the amount of information obtainable owing to
loading of the high resistance load values by the 50 ft
parallel connection. Hence, this scheme was ultimately
considered impracticable.
A Tektronix P6057 1.4 GHz lOOX probe was considered as
a means of measuring the voltage. Certainly the frequency
response is more than adequate and, with an effective
impedance of 5 kft, it could be used across resistors of
4.8 kft, or less, without significant loading. However, it
could not be used across loads greater than 5 kft. This
limitation aside, the probe proved unsatisfactory owing to
excessive ringing of the observed pulse. Ringing could not
be eliminated even by connecting the ground-case of the
probe directly to the circuit board ground plane, i.e., by
the elimination of the probe grounding lead. As a result
of the above problems and the fact that a fast, high
voltage, high impedance probe is simply not commercially
available, the load voltage could not be measured directly.
A voltage divider, using two resistors in series as
the load, was finally considered. Inasmuch as direct
measurement using coaxial cable provided the cleanest
pulses, it was decided to use this scheme by making one of
the load resistors several ohms and to use it as a scaling
resistor across which the voltage could be observed. In
this manner a scaled version of the total load voltage was
28
obtained. Various values of the scaling resistor were
examined; unfortunately, all produced waveforms which
exhibited severe ringing.
At this point it was decided to use the plug-in
amplifier input resistance as the scaling resistor, i.e.,
to connect the oscilloscope in series with the load
resistor. The oscilloscope was used alone for load values
of 50 ft (with 50 ft Pasternack 1.5 GHz attenuators where
necessary). This scheme produced waveforms with essen
tially zero ringing; consequently, it was decided to use
this method, mutatis mutandis, for the collector-triggered
measurements.
The adoption of this scheme revealed what finally
appeared as a formidable problem. During the course of the
measurements, it was observed that the output voltage for
the higher values of load was considerably greater than its
predicted value. Because the oscilloscope impedance is
fixed at 50 ft, the remaining load impedance in that case
must be less than its nominal value. This is probably
attributable to the parasitic capacitance shunting the
load and all resistors at sufficiently high frequencies
[31.
In order to minimize the p a r a s i t i c capacitance, a l l
loads were constructed of four 1/4 w res i s tors connected in
s e r i e s (except for the 50 ft l o a d ) . In t h i s manner, the
p a r a s i t i c capac i tance of the load was reduced by a factor
29
of four, which considerably reduced the peak overshoot
voltage. No series inductance was introduced by this
arrangement; measurements made with up to ten resistors in
series, which was considered as a limiting case, provided
the same results as those obtained with four.
CHAPTER IV
EXPERIMENTAL RESULTS
Base Drive Effects
Preliminary measurements raised the question of the
effect of the magnitude of the base drive on the switching
behavior of the bipolar transistors. No intermediate
voltage levels were observed at any of the high resistance
loads. It was not clear if the dynamic load line was
affected by parasitic capacitance shunting the load
resistance, or if the high voltage at the base drove the
devices into saturation, obscuring the unstable switching
behavior. In order to determine the effects of base
current upon the switching performance of the avalanche
transistor when operated in the BV regime, a constant
base current drive, pulsed-collector supply circuit was
constructed. Figure 12 shows a schematic of the circuit.
The pulsed-collector supply was necessary in order to avoid
device damage or failure owing to excessive power dissipa
tion. The collector supply begins to turn off 375 us after
the leading edge of the base current pulse, which was 50 us
wide. The collector supply is connected to the load
resistor through a normally closed mercury-wetted reed
relay (Magnecraft W134MIP-3); the coil of this is activated
by means of an ECG 955M timer, which results in the relay
30
V^^ (250 V) , CC 15 kft
100 V 0
100 ft
IRF5
.47 ft
31
220 Kft
50 uF
0.01 yF
(. -2 V
PULSE GENERA
TOR
EXTERNAL TRIGGER
DELAYING INPUT EXTERNAL
TRIGGER OUTPUT
Figure 12. Circuit schematic for the constant-base drive measurements on the RS35O0. Ml and M2 represent Pearson current transformers used to the base and collector currents, respectively.
32
contacts opening. The relative timing between the base
current pulse and the collector supply is adjusted by using
two pulse generators and adjusting the delays between their
outputs. When the timer (commonly known as a 555) is
triggered, a pulse approximately 15 s long is applied to
the coil of the relay, during which time the collector
supply is turned off; the supply is simply disconnected and
reconnected manually.
The IRF 520 MOSFET provides a current pulse of
constant amplitude to the base of the transistor under test
(TUT). The amplitude of this pulse is varied by changing
the drain supply voltage, Vj ^ , up to a maximum of 100 V,
providing pulses of up to 1 A peak current. Very small
base currents (Ig < 1 mA) required adjustment of both V
and the amplitude of the gate trigger pulse in order to
avoid an overshoot of the leading edge of the current
pulse.
It was decided to use the same sequence of load
resistors which was established for the base and collector-
triggered measurements. However, use of a 47 ft load
resistor resulted in catastrophic device failure on the
first attempt to switch the device; consequently, values of
500 ft, 4.7 kft and 47 kft were used. (The high currents
obtained with a 47 ft load melted the chip connections.)
Three values of collector supply were used, viz., 250 v,
160 V and 90 v, the latter being within the region bounded
33
by the BV curve. Upon the application of a base current
pulse to the RS3500 device, both the collector current and
collector-emitter voltage were measured. All currents were
measured using a Pearson Model 411 current transformer.
Measurement of currents less than 50 mA necessitated the
use of a plug-in voltage amplifier capable of sensing
microvolts. For this purpose, a 7A22 differential ampli
fier was employed.
The RS3500 device used in this measurement had a BV
of 116 V at 1 mA. According to the theory, it would be
expected that v__ values greater than BV___ cannot stably
be obtained, as these voltages lie outside the transistor's
stable region of operation. For a collector supply of
2 50 V and a load of 500 ft, the device switched to a v^^ of
40 V, which was independent of base drive (above the
threshold for triggering which was found to be approxi
mately 500 uA). This is illustrated in Figure 13:
Figure 13(a) shows the base current pulse; Figure 13(b)
shows the collector-emitter voltage (lower trace), and the
collector current (upper trace). It is to be noted that
changes in V__ are reflected in the collector current C £
waveform. Forty volts is higher than voltages normally
considered to correspond to the V^^ saturation curve;
furthermore, V__ remains low even after the base drive has C£
been removed, and after some time falls to an even lower
value, around 10 v. The second reduction in collector
34
35
36
voltage is accompanied by an increase in collector current,
although this does not persist as long as the collector
voltage remains low. This result is quite reproducible and
is not understood. However, if while base current is
flowing the device is held in a quasi-stable state, upon
this current becoming zero, the operating point of the
device is undefined and hence the device is free to move
along the load line until a stable state is reached, the
current being limited only by the external resistance. The
device cannot turn off as the collector current has passed
through a point that is higher than the point of insta
bility on the BV__^ curve; i.e., the device is in second
•^ CEO
breakdown. The device would remain on indefinitely,
eventually failing owing to excess power dissipation in the
device, if the V supply were not disconnected. Although
somewhat different, these results are reminiscent of a
stepped second breakdown previously observed i4J.
For load values of 4.7 kft and 47 kft, with a V of
250 V, it was not possible to switch the device to voltages
of the order of BV^^^ and for v^^ to remain at that value,
even momentarily. Base currents of 500 uA < I^ < 1 mA,
resulted in V__ oscillating between several volts and 130 v
CE
(4.7 kft) and 180 V (47 kft). Figure 14 illustrates the base
current and corresponding collector current and collector-
emitter voltage, for a 47 kft load and a v^^ of 250 v. it
is unclear as to the mechanism by which the device is able
37
38
39
to oscillate to voltages that are greater than BV .
Large values of load resistance (e.g., 47 kft) severely
restrict the values of collector current obtainable and
inhibit the device going into second breakdown. This is
evident from the fact that the device turns off, for all
values of base current, upon this current being removed.
It may possibly be the case that, at low values of base
current, the device is in a borderline state, between being
turned on and turned off, resulting in the oscillations
observed. Base current pulses greater than 1 mA caused the
transistor to be driven directly into saturation, approxi
mately 5 V (Vpg); the device turned off upon removal of the
base current pulse.
Reducing the collector voltage moves the load line
(for any given load) closer to, or further into the stable
operating region. For any given value of load, the load
lines obtainable are always parallel to each other,
regardless of the value of V^^. The waveforms observed for
the 500 ft load at 160 V V are essentially the same as
those obtained for the 250 V V^^ measurement. This is as
expected, for again the load line does not enter any stable
region.
The results obtained for load values of 4.7 kft and
47 kft, at 160 v V-p, are interesting because the device
appears to operate in an almost conventional manner: v^^
can be stably controlled by the base current from 0 V to
40
125 V (4.7 kft) and from 0 V to 150 V (47 kft). Unlike the
results obtained for the 250 V measurement, no oscillations
were observed. Figure 15 illustrates the base current
pulse, corresponding collector current and collector-
emitter voltage for a V^^ of 160 V and load of 47 kft. (The
slow decay in V is the result of the relay contacts
opening; the contacts appeared to be damaged after conduct
ing the high currents involved in these measurements.) v__
falls from 160 V to 150 V for the duration of the base
current pulse. The high frequency noise existent on the
current waveforms is not produced by the circuit or the
Pearson current coil, but is a consequence of the sensitive
setting that had to be used on the Tektronix 7A22 ampli
fier, in order to measure the small currents present. The
fact that the device can operate at voltages in excess of
its breakdown voltage is troublesome, and raises the
question as to whether, in fact, BV^j,^ is the defining
breakdown voltage. Measurements of BV^^^ and BV ^ , for a
range of resistors, showed that for small values of R
(50 ft), BV -^ and BV^^j^ are essentially both equal to
BV . The value of BV ^ ^ begins to deviate from BV^^^ as
R is increased from approximately 20 kft. It is interesting
to note that, for a given value of R, BV^^^ is only, at
most, several volts greater than BV ^ . This indicates
that the value of R is the primary determining factor,
regarding both the BV ^ ^ and BV^^^ breakdown voltages; also
41
-t i .
a.
b .
43
that breakdown voltages up to the maximum value of BV-g^
can be obtained without recourse to a negative bias.
Clearly, by definition, the device cannot sustain voltages
greater than BV-,„Q with the base open circuited; this
suggests that it is most probable that the breakdown
voltage is determined by BV ^^^cBO ^°^ * ^^ ^^'
Although the device is operated in the BV-_^ mode when the
base-emitter lunction is forward biased, the negative base
potential need not be considered; however, the resistor
remains in the circuit. It is believed that this is the
mechanism by which the device is able to sustain these
higher voltages.
Circuit Effects
Early single-shot base-triggered line pulser measure
ments suffered from loading effects; consequently, these
measurements were repeated using the voltage divider
technique described earlier, in which the oscilloscope
input resistance acted as a sampling resistor. However,
the role of parasitics was still not clear, so a sequence
of measurements was performed using the mercury-wetted
relay as a substitute for the TUT to determine if para
sitics were still a problem in the circuits. Table 1 shows
the circuit fall times, t , which is the time required for
the output pulse amplitude to increase from 10% to 90% of
its maximum output value (V ^ = 250 V). The voltages shown
44
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45
represent the voltage across the entire load, which was
obtained by multiplying the measured voltage by R-/50 and L
adding it to the observed voltage. The values of tabulated
voltage are not the absolute peak values, which include an
overshoot caused by the parasitic capacitance which shunts
the load and changes its effective value at high frequen
cies. However, after the initial fast transient switching
of the device, the load is essentially its nominal value.
It is believed that the calculated voltages represent the
true load voltage, the voltage at which the capacitor (Cj)
begins to discharge, i.e., the beginning of the exponential
discharge curve. On an expanded time scale the voltage
spike created by the parasitic capacitance is not visible,
while the exponential curve is well defined. Despite this,
some tabulated load voltages slightly exceed 250 v. This
is physically unreasonable and is believed to be attributa
ble to estimation errors in extracting the data from the
photographs.
From Table 1 it can be seen that the relay must close
in approximately 0.7 ns. This closure time is independent
of the coil drive and of the circuit to which it is
connected. The above information is sufficient to enable
the form of the load voltage to be calculated if it is
assumed that the voltage fall across the relay is linear.
This calculation is given in Appendix A and the final
46
result shown below as Equation (1). V_(t) is the calcu-a.
lated voltage across the input impedance of the oscillo
scope, V^^ is 250 V, C^ is the load capacitance, R is the
load resistance; R represents the oscilloscope input
impedance which is 50 ft and t^ is the closure time of the
relay (0.7 ns).
v^it) = ^CC<^L^
-PlVlf^ - 1 (1)
Equation (1) is valid for 0 < t < t, only, setting
t = t^ enables the peak voltage value to be calculated.
Table 2 was constructed in an analogous manner to Table 1,
the complete load voltage being calculated using the
formula discussed earl ier . (If the relay contacts are
considered to close as an ideal voltage step function, this
yields calculated load voltages of 250 V, irrespective of
the values of load capacitance and resistance used.)
From a theoretical standpoint, Table 2 shows that the
peak load voltage is maximized for large C R products. L LI
The empirical results of Table 1 show a similar, but weaker
trend; there are other factors influencing these results,
but non-ideal switching behavior clearly affects the output
voltage. At high frequencies, the parasitic capacitance
shunts the load, resulting is an effective impedance which
is less than the nominal load value. This increases the
47
Table 2
Theoretical Peak voltages Obtained with the Mercury-Wetted Relay as a
Substitute for the TUT
50 ft 480 ft 4.8 kft
48 kft
20 pF
179.8 241.7 250.0 250.0
V (V) P
200 pF 2000 pF
241.5 249.1 250.0 250.0
249.1 250.0 250.0 250.0
20,000 pF
249.9 250.0 250.0 250.0
48
proportion of voltage that is dropped across the oscillo
scope.
The smallest magnitudes of load voltage are obtained
for the 50 ft load; Equation (1) predicts that the magnitude
of these voltages should be the smallest. However, the
voltage obtained for the 50 ft load and 20 nF capacitor is
smaller than predicted. More generally it appears that the
voltages obtained for the 50 ft load, irrespective of the
value of capacitance used, are smaller than predicted.
Equation (1) ignored parasitics: parasitic capacitance has
been discussed, but cannot be a significant influencing
factor for the 50 ft load as this measurement utilizes the
input impedance of the oscilloscope and 50 ft attenuators,
all of which are designed for high frequency operation. The
effects of parasitic inductance are proportional to the
rate of change of current with time (dl/dt). Assuming that
the parasitic inductance of the circuit is constant then
its effects will be most evident for the lowest values of
load, because these produce the highest dl/dt's. Conse
quently, the effects of parasitic inductance are most
noticeable at low values of load. As the effects of
parasitic inductance become greater, the rate of current
rise is further decreased, which results in the observed
rate of voltage fall decreasing, i.e., the switching time
increases. The peak voltage decreases as a proportion of
the voltage is dropped across the parasitic inductance.
49
Parasitic capacitance becomes more of a problem at large
values of load resistance, since the reactance it creates
has to be less than the value of load resistor in order to
create loading problems.
It is not clearly evident as to which parts of the
circuit are primarily responsible for the parasitic
inductance. However, from measurements made utilizing a
load comprised of series resistors (experimental proce
dure), it appears probable that the packaging of the relay
contributes significantly. The above measurement has
served to illuminate the effects of parasitics. It is
expected that the device packages of the various TUTs will
cause parasitic inductance effects to be manifested in
various degrees. However, results that differ substan
tially from those of Table 1 can most probably be attrib
uted to actual device phenomena, e.g., a change in switch
ing speed, etc.
Base-Triggered Bipolar Transistor Measurements
Tables 3 and 4 contain the summary of results of the
single-shot measurements on the RS3500 and the 2N2222,
respectively. Appendix B contains a complete characteriza
tion for the RS500; the results of the 2N2222 measurements
are similar. The fall time and peak voltage are as defined
in the previous section. (The peak values are estimated.
50
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51
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S t 285
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fa
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f—t
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o o • •
vo i n i n ON
o o ft •
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o o • • r ^ l-H
ON O f — t
o o • • i n —1 <t\ o
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o o • •
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1—I
o o • •
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CM CO • •
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4.8 kft
48 kft
52
based on the criteria discussed previously.) Both of the
bipolar device types switch fastest for the 48 kft load--the
effects of parasitic capacitance are again most noticeable
at this value of load. This is consistent with the
theoretical predictions made earlier, i.e., those concern
ing parasitic inductance; however, the switching speed
obtained for the RS3500 device is not in general slower for
the 50 fi load as compared to the 480 ft and 4.8 kft loads.
The RS3500 device type has exhibited switching speeds of
the order of 0.7 ns and the measurement using the 4.8 kft
load, with the relay in circuit, has demonstrated that
switching speed is not diminished for this value of load as
compared to the 48 kft load. Hence, it must be assumed that
the slower switching speed obtained for the 4.8 kft load is
attributable to the device itself.
The slower switching times exhibited for loads other
than 48 kft, may possibly be attributed to the parasitic
inductance of the device package, although this is specula
tion and again one would expect its effects to be most
noticeable for low values of R. . The extent to which this
phenomenon may be attributed to actual device physics is
unknown. A general trend is evident from Table 3: higher
peak voltages are obtained for larger values of the C R
product. A similar trend in switching times is not
apparent, i.e., there is no clear dependence upon R ,
although there is a weak dependence on C . Generally the
53
fall time either increases or remains constant as C. is LI
increased. It can be seen from Appendix B that the smooth
R^ exponential charge-up is not obtained for the 480 ft
load and values of C ^ of 200 uF, 2000 pF and 20 nF; the
reasons for this are unknown.
The preceding analysis is also applicable to the
2N2222. However, unlike the RS3500 device, there is a
clear dependence of the switching speed upon the value of
Rj ! for a given value of C^ the fall time decreases as the
value of R^ increases. As discussed earlier, the 2N2222
device is designed for small signal operation; hence, it is
possible that its deterioration in switching speed, for low
values of R., is the result of device packaging (small
diameter wires connecting the chip to its external pack
age), i.e., parasitic inductance. This suggests that the
2N2222 may be suitable for fast switching applications
provided that the current is restricted to hundreds of
mllliamperes.
The anticipated dependence of the shape of the
switched output pulse on load resistance was not observed
for either device type. There were in general no inter
mediate values of voltage to which the device switched; a
single device exhibited some discontinuity on the leading
edge of the waveform for the 48 kft load. This behavior is
not representative and is considered anomalous.
54
Two explanations for the absence of the phenomenon
discussed were considered: driving the base with a 20 V
pulse results in large base currents (on average, approxi
mately 500 mA) which may be sufficient to drive the device
directly into saturation. However, no "hang-up" of the
leading edge could be created by reducing the base drive.
Voltages of approximately 2 V were required to trigger the
devices. This trigger voltage produced a reduced-amplitude
pulse (approximately one order of magnitude smaller) but
did not exhibit any "hang-up." The effect of base drive
was discussed earlier; another possible explanation is the
shunting of the load by the parasitic capacitance. It is
possible that the effective load impedance created is less
than the 4000 ft considered necessary in order for a
discontinuity to be observed. A value of the parasitic
capacitance cannot be calculated owing to the number of
undetermined quantities incorporated in the circuit, viz.,
the actual voltage across the load, parasitic inductance,
etc.
The MOS Transistor
MOS power transistors exhibit a latch-up behavior
which is similar to the unstable switching observed in
bipolar devices. The principal model is a transition
between BV^„g (emitter-base short) and BV^^^, which occurs
when emitter current begins to flow in the parasitic n-p-n
55
bipolar transistor by way of a parasitic internal resis
tance. It is, however, possible for the parasitic bipolar
to exhibit the instability employed for switching the
avalanche transistor; in that case, a large voltage swing
is possible.
The gate-triggered results for the BS170 are listed in
Table 5. In this mode of operation, the speed at which a
MOSFET turns on is determined by how quickly the gate-
source capacitor can be charged; this has a typical value
of 60 pF for the BS170 (see Appendix F for specifications).
Figure 16 illustrates the 20 V gate trigger pulse, matched
into a 50 ft load and as observed between the gate and
source by means of a Tektronix P6057, 5 kft probe. The
degradation of the leading edge probably reflects the time
required to change the gate input.
The magnitude of the trigger voltage and v j are the
same as those used to evaluate the base triggered perform
ance of the 2N2222. This facilitates a direct comparison
between these two devices. The BS170 switches faster than
the 2N2222 for all values of C ^ and R^; from 7% (C ^ =
20 pF, R, = 4.8 kft) to 52% (C ^ = 200 pF, R^ = 50 ft) faster,
for device E as contrasted to device number 2815, although
with the absence of any apparent pattern. As with the
bipolar devices, the effects of parasitic capacitance are
evident; again this distorts the apparent value of the load
voltage. Hence, some degree of estimation was involved in
56
in
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-Tr
<u > - p
(d (d (i> 0) 04 f C
TJ <4->
C M-l <d CO (D
• H EH
r H r H
(d CLI
O
CO
(0 i H 3 O4
B B R R R tt B B R R « fl B B « B H R H tt H N tt R R tt R R R R R R R H B B B B R R R R H B B
a B B H II H u N tt H tt 11 B B B B B B tt R tt B tt M tt tt tt B tt B tt R tt H tt R tt tt tt B fl U B H B
y f - V
>
a >
CQ c
>^^
U
u
fa 1 a 1
0 1 0 1 0 1
# 1 0 1 CM
fa a ;
0 0 0 1 CM
fa a
200
fa a
0 CM
1 fa a
0 1 0
0
0 CM
1 fa a
0
200
1 fa 1 a 1 0 1 0 1 CM
1 fa 1 a 1 0 1 CM
0 0 • •
0 •«* ON 0
f—(
0 0 ft ft
00 00 00 ON
0 <* • ft
QO 00 NO ^
0 0 . ft
ON »n CO 00
0 0 ft ft
C7N f—l 0^ 0
I—1
0 0 • •
ON f.^ ON 0
f - l
0 0 ft ft
r^ 1-4 ON 0
0 0 • •
ON f t a^ 0
r-t
r«» CO
CM i-i
• ^ CO ft *
CM f t
1 00 (^ \ * *
I - I «-•
1
1 CM CM 1 * * 1 f—t <—'
50 f
t 48
0 ft
CM 00 ft ft
r-t 0
CO 00 • •
r s 0
CO 00 • •
r s 0
CO 00 • •
r- 0
4.8
kf
t 48
kf
t
b.
Figure 16. Gate trigger pulse: (a) into a matched 50 ft load, (b) observed from the gate to source by means of a P6056 Tektronix probe, vertical and hor^-ontal scales are 5 V and 5 ns large division, respectively, for both photographs .
The
per
58
extracting the peak voltages from the photographs.
Appendix C shows a complete characterization for device E,
as a function of R ^ and C . It was concluded that the
gate-triggered BS170 was operating in the active mode, so
that only one gate-triggered measurement was performed.
Despite the distortion of the load voltage, the BS170 also
appears superior to the 2N2222 in terms of the peak load
voltage. The voltage switched is either comparable to, or
greater than, the corresponding value obtained for the
2N2222 device. It is greatest for the 50 ft load, for which
it is from 25% {C^ = 20 pF) to 52% (C ^ = 200 pF) greater,
for the same pair of devices as compared earlier. This may
possibly be attributable to the TO-18 package of the 2N2222
as compared to the TO-92 MOSFET package (see Appendices E
and F).
Collector-Triggered Measurements
Some early collector triggered measurements were made
on all three devices; however, these measurements suffered
from loading effects. It was attempted to take further
collector-triggered data on the RS3500 using the modified
circuit illustrated in Figure 5, in which the oscilloscope
input resistance was used as a sampling resistor. Most of
the circuit is isolated from the trigger pulse by means of
inductors; hence, the trigger pulse sees a simplified
circuit as shown in Figure 17. Collector-triggered
59
TUT
V W134MIP-3
CC 11 1 M of RG58A/U CABLE « ».
^ .
nm
PULSE GENERATOR
1.5 Mft
150 V
•«v^(t)
OSCILLOSCOPE (50 ft)
Figure 17. Circuit schematic illustrating the simplified form of the collector-triggered circuit.
60
measurements indicate that the device again switches very
rapidly when triggered from an overvoltage at the collec
tor. The circuit of Figure 17 terminates a transmission
line with a complex impedance. Large values of load result
in a considerable mismatch, creating considerable waveform
distortion at the collector of the TUT. For the largest
values of load, the pulse amplitude is essentially doubled,
decaying in an exponential manner; small values of load
create an undershoot which decays exponentially. These
phenomena are observed in the load voltages at the oscillo
scope. Again, this is a scaled version of the true load
voltage. Superimposed onto these waveforms are reflected
waveforms that propagate to the source from the load and
then back again. (The source has a high value of resis
tance in series with it; this is necessary to create the
pulse .)
Figures 18, 19 and 20 show load voltages for a 20 pF
load capacitor and resistor values of 50 ft, 480 ft and
4.8 kft, respectively. Notice that even the 50 ft load
produces an undershoot, for which the capacitor is respon
sible. The reflections discussed earlier are clearly
evident in Figure 19(a). Figures 18(b), 19(b) and 20(b)
show that the device is capable of achieving switching
speeds, in this mode of operation, comparable to those of
the base-triggered measurements.
61
^ ^ ^ 1
^ • ^ X ^ \ / ^
'idfl
fca^ -• T-r— — 1
1 a.
20(ky Mtm IrS
XfFSOB
Figure 18.
b .
Collectcr-triggered RS3500 waveforms; the amplitude of the triaaer pulse is ' 50 v, CL is 2 0 pF and R^ is 50 ft. The vertical scale is 200 V per large division for both photographs. The horizontal scales are: (a) 10 ns and (b) 1 ns per larae division.
62
a.
Figure 19.
b.
Collector-triggered RS3500 waveforms; the amplitude of the triacer pulse if 750 V,
j_i J- a 0 pF and R^ i scale 460 ft. Tne vertica.
is 50 V per large division for both photographs. The horizontal scales are: (a) 10 ns and (b) i ns per larae division.
63
a ,
a»M li
• • ^ • * . .
20aFi.X!
Figure 20 Collector-triggered RS3500 waveforms; the amplitude of the trigger pulse is 750 v, CL is 20 pF and Rr is 4.8 kft. The vertical scale is 5 V per large division for both photographs. The horizontal scales are: (a) 50 ns and (b) 1 ns per larae iiv'ision.
64
Collector triggered measurements were terminated, as
no qualitative information could be obtained from them,
owing to the level of stress applied to the device being
dependent upon circuit component values. The same phe
nomena were observed for the 2N2222 and the MOSFET;
consequently, no collector (drain) triggered measurements
were repeated for these devices. However, early measure
ments, despite suffering from loading effects, demonstrated
that these devices are capable of fast switching when
operated in this configuration.
Repetitive Measurements
All the devices which were stressed single-shot
survived with no apparent degradation, the criterion for
which was a change in certain characteristic voltages. For
the bipolar devices, these were BV^^^ at 10 uA, BV^^^ at
10 uA and BV-_- at 1 mA. Characteristic curves were also CEO
obtained to see if there were any significant changes in
the forward current gain. The BS170 voltages were BV g ^
V„„ = 0 and I^ = 100 uA, and the threshold voltage, v_„, GS D " for V = V ^ and I^ = 1 uA. No characteristic curves were
DS GS D
obtained for the MOSFETs because of curve tracer induced
oscillations which interfered with the measurement and
which could not be suppressed. Pre- and post-stress
characterizations are contained in Appendices B and C.
65
Subsequently, measurements were begun to test the devices
under repetitive collector-triggered stress.
The line pulser relay would not close if the coil
pulse was shorter than 1.5 to 2 ms; an interval of this
duration was required for the contacts to open again, so
that initially the devices were stressed at a repetition
rate of 200 Hz. The load resistance and capacitance were
50 ft and 200 pF. This combination was calculated to give
the least amount of trigger pulse distortion. Two RS3500
transistors were tested (collector bias was the same as for
the single-shot measurements). Each device was initially
characterized, stressed, then recharacterized. The first
was stressed continuously for ten hours (7.2 million
shots); after stress, the characterization parameters, with
the exception of BV^^Q, remained essentially unchanged.
Originally, BV^„^ was found to be 122 v at 1 mA. Follow-C£«0
ing the test, BV__^ could no longer be measured at its CEO
specified current because snap-back (unstable switching)
occurred at very low collector currents. However, BV
could be increased to 130 V before snap-back took place.
The second device was tested the same way, except that
stress was interrupted at one, two and five hours to
measure BV-_^. The initial value, at 1 mA, was 120 V; CEO
after one hour, and at subsequent measurements (two, five
and ten hours), snap-back at low currents appeared; the
66
respective values of BV^^^ at the specified times were
128 V, 130 V, 142 V and 142 V.
The repetitive tests were stopped when relay contact
bounce was observed. The W134MIP-3 relay is rated at a
1000 v DC switching voltage, a 1 A switching current, and a
2 A carry current, with the maximum volt-ampere product
being 50 VA. Under the test conditions existing here
(1500 V on the line, 20 A peak current, 200 Hz), the
average VA product is 0.06 VA, which is well within the
rating. However, exceeding the maximum rated switching
voltage while switching 20 A current spikes can be expected
to affect the contacts.
The circuit used for the resumption of the repetitive
measurements is illustrated in Figure 11 and was discussed
previously. Figure 21 shows the 750 V pulse (into a 50 ft
load) used to trigger the devices. Figure 21(a) shows the
trigger pulse on an expanded time scale, and Figure 21(b),
over a period of 100 us. Figure 21(b) clearly illustrates
the absence of contact bounce (the principal bounce
previously occurred from 20 to 30 microseconds after the
initial closure). The modified repetitive test circuit
allowed the maximum rep-rate to be increased to 350 Hz.
This was desirable as a 200 Hz stress level did not result
in unambiguous device degradation. Two other RS3500
devices were tested at this higher level of stress,
resulting in degradation of the form previously described.
a.
b.
Figure 21.
i ne
The 750 v trigger pulse used for repeoitive ooilecoor-origgering; the rep-rate is 350 Hz. vertical scale is 200 both photographs, the horizontai scales are: (a) 10 ns and (b) 10 us per larae iivision.
V tor
68
Each device was recharacterized after one, two, five and
finally ten hours. Again, the collector-emitter voltage
required to initiate breakdown increased with the total
time of stress.
For device A22, the measured values of BV--, were: CEO
116 V (initial), 128 V, 130 V, 136 v and finally 138 V. For device A23, the measured values of BV__ were: 114 v
CEO
(initial), 126 V, 129 V, 134 V and finally 139 V. Device
A23 was further tested for another 10 hours without
interruption and BV „ was found to increase by another
volt. The rate at which BV-_- increases with continued CEO
stressing appears to decrease with time. It is not known whether the value of BV^-. will eventually saturate or
CEO ^
continue to increase. It is unclear whether the change in
BV-_,Q characteristics represents true degradation, inasmuch
as the output pulse (Figure 22) which was measured at
intervals during and at the end of stress, did not change.
Perhaps the low current snap-back increases the vulnera
bility of the transistor, but this cannot be established
without longer term testing.
o9
a.
b.
Figure 22 Observed load voltage for a RS3500 device repetitively triggered at the collector; the rep-rate is 350 Hz, CL is 2 00 pF and R- is 5 0 it. The vertical ocale for both photographs is 00 V oer large di'/ision, the hori zontal scales are: (a) 10 ns and (h) i ns.
CHAPTER V
CONCLUSIONS
The 2N2222 is inferior to the RS3500 with respect to
pulse rise time and switched voltage. However, the 2N2222
is a general purpose small-signal transistor which is not
designed to operate in the avalanche mode, whereas the
RS3500 is specifically designed and fabricated for enhanced
switching. Still, both devices operate in an unstable
mode, raising the question of long-term reliability.
Switching in the BS170, on the other hand, may or may not
involve instabilities, and its switching characteristics
are comparable to those of the RS3500, certainly for
drain-triggering. Both power bipolar transistors and power
FETs are available at higher collector and drain breakdown
voltages, so that higher voltage Marx banks are possible
with a small number of stages. However, there is some
indication that bipolar devices switch more slowly at
higher collector voltages than at low collector voltages.
There is no similar information respecting drain-triggered
MOSFETs.
70
LIST OF REFERENCES
fll J. F. Francis, "High Voltage Pulse Techniques," AFOSR report number AFOSR-74-2639-5, Texas Tech University, December 1, 1972.
[21 S, A. McMullen, "Energy Considerations in Second Breakdown," M.S. thesis, Texas Tech University, 1984.
[3] J, Power, Los Alamos National Laboratory, New Mexico, private communication, March, 1984.
[4] W. M. Portnoy and F. R. Gamble, "Fine Structure and Electromagnetic Radiation in Second Breakdown," IEEE Transactions on Electron Devices ED-11, 470 (1964).
71
APPENDIX A
THEORETICAL LOAD VOLTAGE CALCULATION FOR CONSTANT dv/dt SWITCH
72
73
Voltage across the switch is given by v(s) = v /s -
V^^/t^S^ 0 < t 1 t^.
CO CO = I(S) t^S' SO,
•I- R . + R
v CC
-v => 1(3) = CC
1^ [so, + R + R. .]
-V C V- C > I(S) = ^^ ^ + ^^ ^
I(t) = lexp
1
v^(t) ^CC^'^L f / -t \
where Vo(t) is the voltage observed at the oscilloscope A
input.
APPENDIX B
PHOTOGRAPHS OF THE REPRESENTATIVE BEHAVIOR OF A BASE-TRIGGERED RS3500, AS A FUNCTION OF
LOAD RESISTANCE AND CAPACITANCE
74
a.
b.
Characteristic curves for device A19: (a) initial; (b) final. The vertical and horizontal scales are 10 V and 1 mA, respectively, per large division; base current is 0.005 mA per step. The ^nitiai characterization, which remained unchanged, is: B- cEO ^ " ^ " 104 V; BV^Bo (-0 »-^ = -"^ ''' '-'EBO (10 uA) = 10.6 V.
7 6
b.
C L is 20 pf and R L is 50 ft. The horizontal scales are (a) 5 ns and (b) 1 ns; the vertical scale is 20 V (all per large division).
b.
CL is 20 pF and RL is 480 ft. horizontal scales are (a) 10 (b) 1 ns; the vertical scale (all per large division).
The ns ma is 5
a.
b.
CL is 20 pF and RL is 4.8 kftft horizontal scales are fa) 20 (b) 1 ns; the vertical scale (all per large division).
ns and is 1 V
a.
20tf 4SB?
b.
CL is 20 pF and RL is horizontal scales are and (b) 1 ns; the 100 mv (all per large
vertical
48 kft. The (a) 100 ns
scale division).
so
a,
SOOtV
mf sss
CL is 200 pF and RL is 50 ft. The horizontal scales are (a) iO ns and (b) 1 ns; the vertical scale is 50 V (all per large division).
1
500t¥ f l-'S
Tooifm
b.
CT is 200 pF and RL i-? 480 17. The horizontal scales are (a) 50 ns and (b) 1 ns; the vertical scale is 5 V (all per large
J^ \^ - ^ -w --fc .b >..>'
ivision)
8 2
a.
b.
CT is 200 pF and RL is 4.3 KL'. The horizontal scales are (a) 200 ns and (b) 1 ns; the vertical sca.e is 500 mV (all per large division).
8
a,
b.
CL is 200 pF and RL is 48 ki"!. The horizontal scales are (a) 200 ns and (b) 1 ns; the vertical scale is 100 mV (all per lar^e division).
84
b.
CL is 2 nF and RL is 50 ft. The horizontal scales are (a) 100 no and (b) 1 ns; the vertical scale is 50 V (all per larae division).
35
a.
b.
CL is 2 nF and RL IS 4eO horizontal scales are (a) _ and (b) 1 ns; the vertical :. 5 V all per large division).
ft. The 500 ns
icale
r^ •'-^•0
o X 1 i C CL is 2 nF and RL is 4.8 horizontal scales are (a) 2 us and (b) 1 ns; the vertical scale is 1 v (all per larae division).
87
a.
b.
C is 4 8 kft. The . is 2 nF ana .-.L horizontal scales are (a) 200 ns and (b) 1 ns; the vertica. scale is 100 (all per iarue division).
88
a.
CL is 20 nF and RL is 50 ft. The horizontal scales are (a) 500 ns and (b) 1 ns; the vertical scale is 50 V (all per large division)
89
a.
Than
CL is 20 nF and RL i- 4?0 ft. horizontal scales are (a) 5 u (b) 1 ns; the vertical scale is 5 (all per large division).
V
90
a.
CL is 20 nF and RL is 4.8 kft. The horizontal scales are (a) 10 us and (b) 1 ns; the vertical scale is 1 V (all per large division).
91
a.
b.
4 8 kft. The CL is 20 nF and RL is horizontal scales are (a) 200 uS and (b) 1 ns; the vertical scale is 100 V (all per large division'.
APPENDIX C
PHOTOGRAPHS OF THE REPRESENTATIVE BEHAVIOR OF A GATE-TRIGGERED BS170, AS A FUNCTION OF
LOAD RESISTANCE AND CAPACITANCE
92
BS170 Device Number E
Initial characterization: BV___(v^_ = 0, I-
OSS GS u
= 100 uA) = 130 V
^GS<^^><^DS = GS' D
= 1 mA) = 2.3 V.
Recharacterization: Unchanged.
93
94
a.
b.
CL is 20 pF and R^ is 50 ft. The horizontal scales are (a) 10 ns and (b) i ns; the vertical scale is 10 V (ail per large division).
95
a .
200Mf m^^
zmt m
4
)
^
b .
i s 480 (a )
ft. 10
The ns and C. i s 20 pF and R L ^
L ^4-aT s c a l e s -^^^ ^ , ^- •-) n o r i o o n t a . ^ s c a ^^^^^^^ s c a l e lo (b) i ^^ ' .^ t^Xe d i v i s i o n ) , ( a l l p e r l - r , e a i
96
a.
b.
CL is 2 0 pF and RL is 4.8 Kft, Tne horizontal scales are {a) 50 ns and (b) 1 ns; the vertical scale is 200 mv (all per larae division*.
97
a.
f-at i
»pF m
kft. 'N
The CL is 2 0 pF and RL IS -O horizontal scales are (a) 200 ns and (b) 1 ns; the vertical scale 50 mV (all per large iivision).
Q3
a.
200M RTt40S InS
mf SB
b .
CT is 200 pF and RL is 50 horizontal scales are (a) (b) 1 ns; the vertical sc (ail per large aivision).
ft. Tne 10 n3 and
ale is 2 V
99
b.
Cj is 200 pF and RL is 480 ft. The horizontal scales are (a) 10 ns and (b) 1 ns; the vertical scale is 200 mV (all per large division).
100
a.
2(M T-mi
mF4.9
b.
CL is 200 pF and RL IS 4.8 kft. The horizontal scales are (a) 50 ns ana (b) 1 ns; the vertical scale is 200 mV (all per large division).
1 0 1
a.
r-aw f ms
-S»t5*.
aOkFOD
b .
200 p F a n d R] CL is 20U PF ana KL is 4 8 kft. Tne horizontal scales are (a) 200 ns and (b) 1 ns; tne vertical scaxe is 50 mV (all per large division).
102
a.
axM 2)r{«tt IrS
if 509
b .
CL is 2 nr and RL is 5 0 ft. The horizontal scales are va) 10 ns and (b) 1 ns; the vertical scale is 20 V (all per large aivision).
103
a.
^ 7 CL IS / nF and RL is horizontal scales are (b) 1 ns; the vertical (all n-er large division).
4 80 Q. (a) 10 scale is
Tne n 3 a n >
2 V
103
a .
200M 29Hm IrS
ifm
b .
2 nF a n d Ri i s 480 ft. CL IS Z nt ana K.L horizontal scales are (a) 10 (b) 1 ns; the vertical scale is
Tne n s and
V 1 ^
(all per large division).
104
a.
CL is 2 nF and RL is 4.3 kft. The horizontal scales are (a' 50 ns and (b) 1 ns; the vertical scale is 500 mV (all per large division).
05
JrS
in.
af«tf
CT is 2 nF and RL is 48 kft. The horizontal scales are (a) 200 ns and (b) 1 ns; the vertical scaie 50 mV (all per large division).
13
106
CJ is 2 0 nF and RL is 5 0 ft. The horizontai scales are (a' 10 ns and (b) 1 ns; the vertical -caie is 20 V (all per large division).
107
480 Q. The (a) 10 ns and
(b) 1 ns; the vertical scale is 2 V (all per large division).
C is 20 nF and R^ is horizontal scales are
108
is 2 0 nF and RL is 4.8 kft. Tne hSrizontal scales are la) 50 ns an (b) 1 ns; the vertical scale is 500 mV (all per large division;.
109
CL is 20 nF and RL is 48 kft. The hori'ontal scales are (a) 200 ns and (b) 1 ns; the vertica^ scale is 5 0 mV (all per large division).
APPENDIX D
SPECIFICATIONS FOR THE RS350 TRANSISTOR
110
I l l
RAYTHEON Silicon Planex* Avalanche Transistor
RS3500
Description The Raytheon NPN Silicon Planex* transistor type RS3500 is designed for high breakdown voltages, and fast avalanche switching speed, useful in applications requiring rise times under 1 nanosecond.
Absolute Maximum Ratings Collector to Base Voltage Vcso Collector to Emitter Voltage VCEO
Emitter to Base Voltage VEBO
Total Device Dissipation @Case Temperature 25 'C @Case Temperature 100°C @Free Air Temoerature 25° C
Junction Temperature (Operating) Storage Temperature
200 Volts 50 Volts
7 Volts
4.0 Watts 2.0 Wans O.a Watts
—€5°C -200" C —65" C -200° C
Eiectrical Characteristics (TA =
Collector to Emitter Sreakdown Voltage
Emitter to Base Breakdown Voltage
Collector to Base Leakage Current
Emitter to Base
Leakage Current
Collector to Emitter Saturation Voltage
Base to Emitter Saturation Voltage
Collector to Emitter Breakdown Voltage
Rise Time
Pulse Width
Pulse Amplitude
Sym.
BVCES
BVE30
ICBO
lEBO
VCEfs)
VBE(s)
BVCEO
tR
PW
V pulse
25° C unless otherwise noted)
Conditions
Ic = IOMA
Ic = lOuA
VC3 = 100V
VE3 = 5.0V
10mA. 1mA
10mA. 1mA
lc= 10mA
(Figure 1)
(Figure 1)
(Figure 1)
Min.
200
7.0
50
Typ. Max.
300
Units
Volts 1 1
I Volts
! ^0
1 0.8 3.0
190
1.0
0.3
0.9
MA
1
Volts
Volts
Volts
1 nS
nS 1 Volts
•Pi«n«x—fltytntoni Owignation For Pi«n«r Eoitaxiai
112
RS3500
•300V
t f l<1nS PWslOnS
25V
100K
tOOOpF
22pF 5in -WV-
< ^ T.U.T
Sin:
-1.8V o-
lOOOoF i 1
lOOn Pot.
-OQut
Vp » 190V Typical tR » O.SnS Typical PW * 3nS Typical
Hgure 1 . Avalanche Switching Circuit
Packaging Information
•370 •" 3 3 5
DIA. ! .335 r .305 "* i OIA.
3-Lead TO-5 Package
.040 MAX. .260 h ^40
f 0 Ii U f !o.A. ^ny °- r"
3 LEADS -
^ 0 0 TYP
Mechanical Data
Case:
J ED EC TO-5
Terminal Connections:
Lead 1 Emitter Lead 2 Base L e a d 3 C o l l e c t o r (atcctneaiiy connvctM to M M )
TH« .nfonnwton eom»io«l m tfx. aata lAMt n u B M « ear^ l iv eomo.i»0: n o - * * * ' •! «n«ii not Dy .moHOi.on or <jtf»«n«.»« owom« M n e« tn« l»n»» .no eooait.OM o« any totuwiuwtt !••«. «»ivtn«on s liMinrv »n«(l M o«i«rTT,.n,o loiwv ov t» tt»na»ro i»tw« ana cenaiuon* o» tatu. NO f»0f««it inon n to (oo«>caf ion or u»« or tnm '.n* c:.«uit» ar* •.tn«r «f^Ma or trM from e«t»ni
APPENDIX E
SPECIFICATIONS FOR THE 2N2222 TRANSISTOR
113
114 TYPES 2N2217 THRU 2N2222. 2N2218A, 2N2219A. 2N2221A. 2N2222A
N-P-N SILICON TRANSISTORS B U L L E T I N N O . DL-S 7 3 1 1 9 1 6 . M A R C H 1973
DESIGNED FOR HIGH-SPEED, MEDIUM-POWER SWITCHING AND GENERAL PURPOSE AMPLIFIER APPLICATIONS
• *^FE • • . Guaranteed from 100 M A to 500 mA
• High f j at 20 V. 20 mA . . . 300 MHz (2N2219A, 2N2222A)
250 MHz (all others)
• 2N2218, 2N2221 for Complementary Use with 2N2904,2N2906
• 2N2219,2N2222 for Complementary Use with 2N2905, 2N2906
*mechanical data
Devic* types 2N2217, 2N2218, 2N2218A. 2N2219, and 2N2219A are in JEDEC TO-5 packages. Device types 2N2220. 2N2221, 2N2221A, 2N2222. and 2N2222A are in JEDEC TO-18 packages.
THE COLLECTOI IS IN E l E a i l U L CONUCT WITH THE USE
0 100—1 y-t COlUCTOt
H»-— • ^ " • l
I r « o u t 0 too MIN - - ^ — t - 000* > i»*os 1 • * " >
DdAKS Of ouniNc iw ' • 001* TMIl 20Nt OTTtONAl LjJATINC ' " ' * IMITtlt
PtANt
0e4» i n . «m 001* n * •"• OOX j j ^
^ mm ~ %~%tM
T0.5 DIMENSIONS ARE IN INCHES UNLESS OTHEIWISE SrECIFIED TO-18 I " TO-S TO-II
'absolute maximum ratings at 25°C free-air temperature (unless otherwise noted)
Collector-Base Voltage Collector-Emitter Voltage (See Note 1)
Eminer-Base Voltage Continuous Collector Current Continuous Device Dissipation at (or below) 25''C Free-Air Temperature (See Notes 2 and 3) Continuous Device Dissipation at (or below) 25*'C Case Temperature (See Notes 4 and 5) Operating Collector Junction Temperature Range
Storage Temperature Range Lead Temperature 1/16 Inch from Case for 10 Seconds
2N2217 2N2218 2N2219
60
30 5
0.8
0.8
3
2N2218A 2N2219A
75 40
6 0.8
0.8
3
2N2220 2N2221 2N2222
60 30
5 0.8
0.5
1.8
2N2221A 2N2222A
75 40
6 0.8
0.5
1.8
- 6 5 to 175 - 6 5 to 200
230
UNIT
V V V A
W
W
°C ^C ^C
N O T E S : Th«M varuM apply between 0 and 500 mA collector current when tfie bate-ennitter diode n open^ircuited. Oerata 2 N 2 2 1 7 . 2 N 2 2 1 8 , 2 N 2 2 1 8 A , 2 N 2 2 1 9 , and 2 N 2 2 1 9 A linearly to 175°C free-air temperature at the rate o« 5 33 myft/ Derate 2 N 2 2 2 0 . 2 N 2 2 2 1 , 2 N 2 2 2 1 A. 2 N 2 2 2 2 . and 2 N 2 2 2 2 A linearly to 176°C free-air temperature at the rate of 3.33 mw ' Oarate 2 N 2 2 1 7 , 2 N 2 2 1 8 . 2 N 2 2 1 8 A . 2 N 2 2 1 9 . and 2 N 2 2 1 9 A linearly to 175°C ca»e temoerature at the rate of 20 0 m w ' c . Derate 2 N 2 2 2 o ! 2 N 2 2 2 1 , 2 N 2 2 2 1 A , 2 N 2 2 2 2 , and 2 N 2 2 2 2 A linearly to 175°C ca»e temperature at iha rale of 12.0 m W / ' C .
• J E D E C regifiered data. T h u d a t a theet containt all applicable regntered data in affect at the time of publication. USES CHIP N24
TYPES 2N2217 THRU 2N2222. 2N2218A. 2N2219A, 2N2221A. 2N2222A NPN SILICON TRANSISTORS
115
2N2217THRU2N2222
'electrical characteristics at 25°C free-air temperature (unless otherwise noted)
PARAMETER
V(BR)CBO
V«BR)CE0
V(BR)EBO
•CBO
>EBO
"FE
V B E
VCE(sst)
N«i
• T
Cote
> i«(rcsl)
Coilector-BaM
Breakdown Voltage
Collector-Emitter
Breakdown Voltage
Emitter-BaM
Breakdown Voltage
Collector Cutoff
Current
Emitter Cutoff Current
Static Forward Current
Transfer Ratio
Base-Emitter Voltage
Collector-Emitter
Saturation Voltage
Small-Signal
Common-E miner
Forward Current
Transfer Ratio
Transition Frequency
Common-Base
Open-Circuit
Output Capacitance
Real Part of
Small-Signal
Common-Emitter
Input Impedance
TEST COI
I c - 10 MA,
I C " 10 mA,
I g - 10 MA,
V c B - S O V .
VcB - 50 V.
V E B - 3 V,
V c E - l O V ,
V c E - l O V ,
VcE - 10 V,
V C E - 1 0 V ,
VcE - 10 V,
VcE - 1 V, I g - 15mA.
l B - 5 0 m A ,
Ig • 15 mA,
Ig - 50 mA,
VcE • 20 V,
VcE " 20 V,
V c B - l O V ,
VcE • 20 V,
yiDITIONS
T O - 5 -
T O - 1 8 -
I g - O
I B ' O , See Note 6
i c - 0
l E - 0
' E " 0 . T A - 1 5 0 * C
I C " 0
I c - 100 MA
Ic - 1 mA
Ic - 10 mA
I c - 150 mA
I c - 500mA
I c * 150 mA
I c - 150 mA
Ic - 500 mA
I c - 150 mA
Ic - 500 mA
See Note 6
See Note 6
S*a Note fi
I C - 2 0 m A , f - 1 0 0 MHz
I C - 2 0 m A . See Note 7
l g - 0 , f - I M H z
I C - 2 0 m A , f - 3 0 0 MHz
2N2217
2N2220
MIN MAX
60
30
5
10
10
10
12
17
20 60
10
^J3
0.4
2.5
250
8
60
2N2218
2N2221
MIN MAX
60
30
S
10
10
10
20
25
35
40 120
20
20
1.3
2.6
0.4
1.6
2.5
250
8
60
2N2219
2N2222
MIN MAX
60
30
5
10
10
10
35
50
75
100 300
30
SO
1.3
2.6
0.4
1.6
2.5
250
8
60
UNIT
V
V
V
nA
MA
nA
V
V
MHz
pF
n
N O T E S : 6 . Theee parameters mutt be maaaured ut int pulte techniques, t ^ - 300 MS. Outy cycle < 2%.
7 . To obtain f x . the h f , l rewonse with frequency it extrapolated at the rete of - 6 d B per octave from f -
frequency at which h f , I " 1 .
switching characteristics at 25"C free-air temperature
100 MHz to the
P A R A M E T E R
Delay T ime
_«f_ Rise T ime
Storage T ime
Fall T ime
TEST C O N D I T I O N S ^
V C C - 3 0 V , I c - 1 5 0 m A , l B ( i ( - 1 6 m A .
V s E l o f f ) • ~ 0 - 5 V , See Figure 1
V c c - 3 0 V ,
1 0 ( 2 ) - - 1 5 m A ,
I C " 1 5 0 m A , l B ( i ) - 1 5 m A ,
See Figure 2
T Y P
15
190
23
U N I T
ns
'Voltaoe and current values thown are nominal, e.ect values vary .lightly with t r .nt i . tor pararr^tar..
• JEDEC reyitrered data
TYPES 2N2217 THRU 2N2222. 2N2218A, 2N2219A, 2N2221A. 2N2222A
N-P-N SILICON TRANSISTORS
116
2N2218A, 2N2219A. 2N2221A, 2N2222A
•electrical characteristics at 25°C free-air temperature (unless otherwise noted)
PARAMETER
V(BR)CB0
V(BR)CEO
V(8R)EB0
>CBO
'CEV
'BEV
•EBO
hFE
VBE
VcE(sat)
' 'ie
Nt
»»r«
^'oe
^ f e |
fr
Cote
Cjte
^ietreal)
^b'Cc
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Collector Cutoff Current
Base Cutoff Current
Emitter Cutoff Current
Static Forward Current
Transfer Ratio
Base-Emitter Voltage
Collector-Emitter Saturation Voltage
Small-Signal Commort-Emitter
Input Impedance
Small-Signal Forward Current
Transfer Ratio
Small-Signal Common-Emitter
Reverse Voltage Transfer Ratio
Small-Signal Common-Emitter
Output Admittance
Snull-Signal Common-Emitter
Forward Current Transfer Ratio
Transition Frequency
Common-Base Open-Circuit
Output Capacitance
Common-Base Open-Circuit
Input Capacitance
Real Pan of Small-Signal
Common-Emitter Input Impedance
Collector-Base Time Constant
TEST CO
I c - I O M A ,
I C " 10mA.
I E - I O M A ,
VcB - 60 V.
VcB - 60 V,
VcE - 60 V,
VcE • 60 V,
V E B - 3 V ,
VcE • 10V,
V c E - l O V ,
V c E - 10 V,
V c E - l O V ,
VcE - 10 V,
VcE - 1 V,
V c E - l O V ,
T A - - 5 5 * C
IB - 15mA.
I B - 50 mA,
I B - 15mA,
Ig - 50 mA,
V c E - l O V ,
V c E - l O V ,
V c E - 10 V,
V c E - 10 V,
VcE - 10 V,
V C E - 1 0 V ,
V c E - 10 V,
VcE - 10 V,
VcE " 20 V,
VcE - 20 V,
V C B - 1 0 V ,
V E B - 0 . 5 V,
VcE - 20 V,
VcE - 20 V,
NOITIONS
T O - B -
T O - 1 8 -
l E - 0
I B ' 0, See Note 6
i c - 0
lE-0 l E " 0 , T A - . 150°C
V B E - - 3 V
V B E - - 3 V
I c - 0
I c - I O O M A
I C " 1 mA
I C " 10 mA
I c - 150 mA
Ic - 500 mA
I c - 150 mA
I c - 10 mA,
Ic " 150 mA
Ic - 500 mA
Ic - 150 mA
Ic - 500 mA
Ic • 1 mA
• C - 10 mA
I c - 1 mA
•C - 10 mA
I c * 1 mA
Ic - 10 mA
I c - 1 mA
Ic " 10 mA
See Note 6
See Note 6
See Note 6
f - 1 kHz
I C " 20 mA, f - 100 MHz
I C " 2 0 m A , See Note 7
I E - 0, f - 100 kHz
I c - 0 , f - 100 kHz
Ic - 20 mA, f - 300 MHz
I C - 2 0 m A , f - 3 1 . 8 MHz
2NZ218A
2N2221A
MIN MAX
75
40
6
10
10
10
- 2 0
10
20
25
35
40 120
25
20
15
0.6 1.2
2
0.3
1
1
0.2
30
50
3.5
1
150
300
5 x 1 0 - *
2 .5x10-*
3
10
15
100
2.5
250
8
25
60
150
2N2219A
2N2222A
MIN MAX
75
40
6
10
10
10
- 2 0
10
35
50
75
100 300
40
50
35
0.6 1.2
2
0.3
1
2
0.25
50
75
8
1.25
300
375
8x10~*
4x10—*
5
25
35
200
3
300
8
25
60
150
UNIT
V
V
V
nA
MA
nA
nA
nA
V
V
kn
*imho
MHz
pP
pF
n
PS
N O T E S : 6. These parametert mutt be meatured uting pulte techniquet. tyy - 300 M». duty cycle < 2%.
7. To obtain fy. the ^ f , | retoonte with frequency ii extrapolated at the rate of - 6 d B oer octave from f - 100 M H i to the
frequency at which ^ f , | - 1 .
' J E D E C registered data
117 TYPES 2N2217 THRU 2N2222. 2N2218A. 2N2219A. 2N2221A. 2N2222A N-P-N SILICON TRANSISTORS
•operating characteristics at 25*'C free-air temperature
PARAMETER
F Spot Noise Figure
TEST CONDITIONS
T O - S -
T O - 1 8 -
VcE - 10V. I c - I O O M A , R Q • 1 kn , f - 1 kHz
2N2218A
2N2221A
MAX*
2N2219A
2N2222A
MAX
4
UNIT
dB
^switching characteristics at 25°C free-air temperature
PARAMETER
t(j Delay Time
tf Rise Time
TA Active Region Time Constant^
tf Storage Time
tf Fall Time
TEST CONDITIONSf
T O - 5 -
TO-18 -
V c c - 3 0 V. I c - 1 5 0 m A , l B ( , ) - 1 5 m A .
^BEJoff) " -^-^ V, See Figure 1
V c c - 3 0 V, I c - 1 5 0 mA. l B ( i ) - 1 5 m A ,
'8(2) ' — 1 5 ' " A . See Figure 2
2N2218A
2N2221A
MAX
10
25
2.5
225
60
2N2219A
2N2222A
MAX
10
25
2.5
225
60
UNIT
ns
ns
ns
ns
ns
^Voltage and current values thown are nominal; exact values vary slightly with transistor parametert.
t\jnamr the given conditions r A it equal to — . 10
APPENDIX F
SPECIFICATIONS FOR THE BS170 TRANSISTOR
118
BS107HBS170
200V N-Channel Enhancement-Mode
MOSPOWER
119
Siliconix
FEATURES • High Voltage • No Second Breakdown • High Input impedance • internal Drain-Source Diode • Very Rugged: Excellent SOA • Extremely Fast Switching • Reduced Component Count • Improved Performance • Simpler Designs • improved Reliability
APPLICATIONS • Telephone i-landsets • Switching Regulators • Solid State Switching
ABSOLUTE MAXIMUM RATINGS
Product Summary Part
Number
BS107
BS170
B V M . Volts
200
60
''OSION) lOMM)
28
5
Package
TO-92
TO-92
'-^4
PsrsnMlsf
vos VQGR
>0
VQS
P D @ T C - 25*0
T j
T«g
Drain - Souros Voitag*
Drain- Oat* Vottage ( R Q S - 1 Mn)
Continuous Drain Currant
Gala - Sourea Voitaga
Max. Po«*ar Dissipation
Opal aivig and
Storaga Tamparatura Ranga
Laad Tampaniijra
BS170
60
60
500
±2SV
0833
-5510 150
300
BS107
200
200
120
±25V
0500
-5510 150
300
UnKs
V
V
mA
V
w
•c
•c
PACKAGE DIMENSIONS
PINJ —SottfM Hfi't ^ Qate PIN I — Drain
fAu omtrntommmiujiitTam
T 0 «
1 a •
ELECTRICAL CHARACTERISTICS (Tc = 25X unless otherwise noted) ±zo
Paramaiar
- Dram-Sourca Brsakoown "'OSS
vonaga
^os<eii Qata-ThrashoW Vottaga
IQSS Gata-Body Laakaga
IQSS Zaro Gala Vottaga Dram
Currant
>OS>l
V Q 3 ion) Static Drain-Source On-Stats
Vottagel
Rgg^, Static Orain-Sourca On-Stata
Rasotancal
Typ«
BS170
BS107
BS170
BS107
8S17aBSl07
BS170
BS107
BS107
BS170
BS107
BS170
BS107
Mn.
60
200
0-B
Typ.
1-8
Max.
3 0
10
0-5
0O3
1
1
056
5
1
Unlta
V
V
nA
MA
nA
nA
V
V
n n
TMt Conditions
V G S - O . I Q - I O O M A •
Vos-Vas. 'o-• '"»*
V o s - l 5 V . V o s . 0
V O S - 2 S V , V Q S - 0
V o s - 1 » V . V 6 5 - 0
Vos-70V.Vos-0-2V
V O S - 1 0 V . I D - 0 - 2 A
VQS " 2-8V. lo - 20mA
V Q S - ' ' 0 . I O - 0 - 2 A
VQ5-2-8V.I(,-20mA
DYNAMIC
THERMAL RESISTANCE
gls
c*
^{an)
^im
Forward Transductancel
Input Capacitanca
Turn-On Time
Tum-OtfTima
BS170
BS170
BS107
BS170
BS107
BS170
BS107
200
60
58
10
10
10
10
mS(n)
pF
pF
ns
ns
ns
ns
Vos"10^' 'D = 0-2A
Vos- lOV
V0S-20V
IO-0-2A
I O - 0 2 A
V G S - 0
t - i M H z
f^njA Junction-to-Air AH 150 •CW
1. Pulse Test