Fiber-Optic Sensor System Demonstrator for Proba-2 · Xiphos CSA ESA/ESTEC FSD for Proba 2 •...

Xiphos CSA ESA/ESTEC

Fiber-Optic Sensor System Demonstratorfor Proba-2

Roman V. Kruzelecky, Jing Zou, Najeeb Mohammed, Emile Haddad and Wes Jamroz

MPB Communications Inc.,Email: [email protected]

andEric Edawards, Francesco Ricci, Joshua Lamorie

Xiphos

Iain McKenzieESTEC

Darius Nikanpour Canadian Space Agency


Presentation OutlinePresentation Outline

• Introduction

• FSD Central Interrogation System

• FSD Fiber-optic Harness

• FSD FBG Sensors

1. Distributed Temperature

2. Propellant P/T

3. Thruster high-T

• Ground Qualification

• Conclusions


Spacecraft Propulsion SystemsSpacecraft Propulsion Systems

Large number of sensors required:

• Propellant Volume/Pressure

• Propellant Flow

• Propellant leakage detection

• Pipeline temperature distribution

• Thruster temperature

• Valve position status

• Valve temperature

• Propellant tank integrity


The Problem: Current Electronic SensorsThe Problem: Current Electronic Sensors

• Sensitive to EMI, ESD and sparking -requires heavy shielding for sensors and signal lines

• Poor signal integrity - requires close proximity between sensor and the processing electronics

• Low sensor capacity: typically one sensor per twisted wire pair

• Bulky signal harness (kg/m)

• Complex signal routing and ground-loop problems -expensive system integration


MPB MultiMPB Multi--Channel FiberChannel Fiber--Laser Laser Interrogation SystemInterrogation System

• 1 to 2 pm spectral resolution

• parallel multi-channel output

• interrogate FBG or F-P sensors

• high sensor capacity per low-power unit (> 250 fiber-optic sensors)


MPB Fiber Sensor TechnologyMPB Fiber Sensor Technology

• Single, central tunable Fiber-laser Interrogation System for various sensor types

• Parallel, bidirectional signal distribution to multiple sensor lines

• Serial wavelength-division multiplexing of sensors on single fiber strand

• Preliminary Sensor Types:

4 FBG Temperature4 P/T sensor4 Valve Position Status4 Hydrazine Gas Leakage4 High T sensor


FSD for FSD for ProbaProba 22

• Demonstrate the advantages of a low-power multi-channel network of lightweight fiber-optic sensors for the “in situ”monitoring of space subsystems.

• Selection and adaptation of terrestrial fiber-optic technologies to facilitate operation in space

• Provide new sensors that meet specific requirements for space:– P/T sensor for propellant tank– High-T sensor for thruster measurements

• Employ a central, remotely positioned interrogation system for the sensor network.

• Incorporate critical redundancy into the FSD system for reliability in space


Fiber Fiber SSensor Demonstrator (ensor Demonstrator (FSDFSD) for ) for ESA’s ProbaESA’s Proba--2:2:

1. Central Interrogation System1. Central Interrogation System2. Distributed FBG sensors2. Distributed FBG sensors



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T


• Conclusions


Monolithic Interrogation System with Monolithic Interrogation System with Al PCB board stiffener Al PCB board stiffener Integral Optical TrayIntegral Optical Tray


Representative Unit CPU BoardRepresentative Unit CPU Board


Representative Unit DAQ/EO BoardRepresentative Unit DAQ/EO Board


Interrogation System Optical TrayInterrogation System Optical Tray

• Unit power-on Mode “0” safe state for electro-optic components

• Critical optics and electro-optics positioning for maximum radiation shielding.

• Parallel architecture to provide redundant tunable fiber-laser system - can sustain two critical active component failures.

• Laser diode (LD) pumps biased at 50% of power ratings to maximize lifetime

• Internal monitoring of LD power and temperature with T control.

• Internal fiber-optic component mounting with some vibration/shock damping.

• Internal reference FBG for each external fiber-optic sensor line for independent operation.


Rep. Unit spectral scans of 0.4 nmRep. Unit spectral scans of 0.4 nm--spaced reference spaced reference fixed FP and a FBG test line with internal/external sensor.fixed FP and a FBG test line with internal/external sensor.

0

5000

10000

15000

20000

25000

1300 1400 1500 1600 1700

FP Channel

A/D

Cou

nt

1_2100_0.25ms fixed_0.25ms


Interrogation System: Component/PCB Level TestingInterrogation System: Component/PCB Level Testing

CSACSA shakerLow-level randomsine at

20 C.

Validate component mounting using RTV2943 for vibration damping during operation.

Optical tray assembly

CSAVacuum thermal chamber, PCB depowered during pump down/vent.

-40 C to +60 C

Check inrush current, power consumption, operation.

Micro/DAQ ProtoflightPCBs

MPBCDry, N2-purgedEnvironmental Control Chamber.

-30 C to+40C

Validate Operation with Temperature

Tunable FP Filter

MPBCDry, N2-purgedEnvironmental Control Chamber.

-30 C to +40C

Validate optical power output, bias current set-point, thermal control requirements.

FBG-stabilizedLaser Diode Pump

LocationEquipmentTest Condition

Test PurposeComponent



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T

• Conclusions


FSD Optical FiberFSD Optical Fiber

• Vacuum-compatible, high-temperature Cu-coated silica fiber (Cu

melting point of 1080oC).

• Additional Teflon FEP (to 260oC) or polyimide (to 400oC) protective

protective coating/sleeve.

• Protected, fusion-spliced internal joints to minimize mechanical

optical interconnections.


FSD FiberFSD Fiber--Optic HarnessOptic Harness

1. Cu-clad, Ge-doped optical fiber with additional TFE coating.

2. Additional s.s. flexible sheathing at interface points for mechanical protection - based on preliminary mechanical vibration test results.



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T


• Conclusions


MPB ComputerMPB Computer--Controlled Controlled FBG Fabrication FacilityFBG Fabrication Facility



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T


• Conclusions


Development of methodology to integrate FBG TDevelopment of methodology to integrate FBG T--sensors sensors with spacecraft:with spacecraft:

Maintain Temperature CalibrationMaintain Temperature CalibrationSelection of AdhesiveSelection of AdhesiveRepeated Thermal Cycling (Repeated Thermal Cycling (--40 to +75 C)40 to +75 C)Vibration/Shock DampeningVibration/Shock Dampening


Testing of FSD FBG Temperature SensorsTesting of FSD FBG Temperature Sensors

After 15 hrs of thermal cycling ( -40 to 75 C)

y = 2E-05x2 + 0.0279x + 1552.1R2 = 1

1551.5

1552

1552.5

1553

1553.5

1554

1554.5

1555

1555.5

-20 0 20 40 60 80 100 120

Temperature (C)

Cen

ter w

avel

engt

h (n

m)


AnsysAnsys simulations of FBG Tsimulations of FBG T--sensor Transient sensor Transient Response of 1.6 mm O.D. packaged sensor using Response of 1.6 mm O.D. packaged sensor using Selected Adhesive (Rated to 1400Selected Adhesive (Rated to 1400ooC) for sensor C) for sensor attachment.attachment.

S.S capillary

Do Di

θθθθ B H

Wa Ta

Adhesive 270

275

280

285

290

295

300

305

310

315

0 2 4 6 8 10 12

Time (Sec)

Sens

or T

empe

ratu

re (

K)



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T

• Conclusions


Advanced P/T Sensor and Protective CablingAdvanced P/T Sensor and Protective Cabling


P/T FBG P/T FBG HysteresisHysteresis obtained for obtained for Compression/Release of Sensor MembraneCompression/Release of Sensor Membrane

1538

1540

1542

1544

1546

1548

1550

1552

15540 20 40 60 80 100 120 140

PZT actuator displacement (µµµµm)

Cen

ter w

avel

engt

h sh

ift (n

m)

Compression

Release



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T

• Conclusions


FBG Peak Transmission Variation with FBG Peak Transmission Variation with High Temperature Annealing High Temperature Annealing

WDM_hitachi_1545_#3

y = -0.1775t2 + 1.7895t - 8.6245R2 = 0.9998

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

1 1.5 2 2.5 3 3.5 4 4.5 5Process Step

Tran

smis

sion

pea

k (d

B)

1 - After writing the FBG2- Annealing at 425C, 15 min3- Annealing at 425C, 30 min4- Annealing at 425C, 1 hr5- Annealing at 425C, 2 hrs


Change in FBG Center Wavelength with High Change in FBG Center Wavelength with High Temperature Annealing.Temperature Annealing.

WDM_hitachi_1545_#3

1545

1545.1

1545.2

1545.3

1545.4

1545.5

1545.6

1545.7

1545.8

1545.9

1546

1 2 3 4 5Process Step

Cen

ter w

avel

engt

h (n

m)

1 - After writing the FBG2- Annealing at 425C, 15 min3- Annealing at 425C, 30 min4- Annealing at 425C, 1 hr5- Annealing at 425C, 2 hrs



• Introduction



• FSD FBG Sensors


2. Propellant P/T

3. Thruster high-T

• Conclusions


FSD BenefitsFSD Benefits

Space demonstration of key MPB fiber-optic technologies:

• Tunable Fiber Laser• Fiber-optic signal harness• FBG temperature sensor• High-T sensor• Fiber-optic pressure sensor• WDM signal multiplexing

Additional development:

• Compact, low-power (2.0 W) microprocessor and data acquisition system for microsat applications


Sensor Description Range Wavelength Span

Resolution

MEMS/FBG Temperature

Pipeline temperature of propulsion system

-40 to 70 oC 5 nm per sensor, 4 to 5 per fiber line

0.05 oC

0 to 40 Bar

15 nm

2 mbar

Combined pressure/temperature dual FBG/MEMS sensor

Xe tank pressure

-40 to 70 oC 5 nm 0.05 oC

High T FBG/MEMS

Thruster Temperature

-40 to 400 oC

20 nm 0.1 to 0.2 oC

Preliminary Specifications

Fiber-Optic Sensor System Demonstrator for Proba-2 · Xiphos CSA ESA/ESTEC FSD for Proba 2 •...

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