FHD Camera Module Specification - UP-BOARD camera/CJFGF18 camera spec... · FHD Camera Module...

Chicony Embedded Digital Camera Solution CIFGF18 Camera Target Specification V1.0.0

Page: 1/16 Confidential

FHD Camera Module Specification

Chicony P/N: CJFGF1820005190LH

Version: V1.0.0 Chicony Electronics Co. LTD.

Camera Module Division Date: 2016/05/27



Changes of Each Revision Date Rev. Changes

2016/05/27 V 1.0.0 First release



1. General Description The camera module (CIFGF18) is low voltage FHD fixed focus image sensor camera and lens module designed for mobile application with low power consumption and small size is of utmost importance. The device can be programmed to provide image output in various fully processed and automatic image functions.

2. Major Feature The following is the feature list for this module.

Image/Video Format Support for application program

o 10-bit RGB RAW output

Application o Feature Phone/Smart Phone/PDA Phone o PDA/PC Multimedia o Digital Still Cameras



3. Key Specification Module Specification

Size (LWH/mm) L x W: 18.6±0.2mm x 6.7+0.2mm H: 3.54 ±0.15mm

FPC Thickness 0.1mm Output format 10-bit RAW RGB(MIPI)

Maximum image transfer rate (fps) 1920x1080: 60 fps,

1280x720: 90 fps Input clock frequency 6 ~27 MHz Effective resolution 1920x1080 Scan Mode Progressive Interface MIPI Interface I2C address 0x6c (SID=0)

Sensor Major Specification

Model OV2740 CSP sensor Type/Size 1/6”CMOS Anti-Flicker Manual

Newmax DS-6100A Lens Major Specification

Element 3Plastics+ 1IRF Field of View (Optical Diagonal) 75.0° Field of View (Mechanical Diagonal) 79.5° F No. 2.4 ± 5% Focus Distance 50 cm Focus Range 27.2 cm ~ 306.1 cm Barrel and Holder material PC (BLACK) & PC (BLACK)



Pin Description

Pin Number Name Pin Type Function Description 1 DGND Ground Digital Ground. 2 MDN1 Output MIPI data negative output 3 MDP1 Output MIPI data positive output 4 DGND Ground Digital Ground 5 MCN Output MIPI clock negative output. 6 MCP Output MIPI clock positive output. 7 DGND Ground Digital Ground. 8 MDN0 Output MIPI data negative output 9 MDP0 Output MIPI data positive output

10 DGND Ground Digital Ground. 11 DVDD_1.2V Power Digital Core Power 12 DOVDD_1.8V Power Digital I/O Power 13 DGND Ground Digital Ground. 14 MCLK Input System clock input. 15 DGND Ground Digital Ground. 16 I2C_SCL Input SCCB interface clock input. 17 I2C_SDA I/O SCCB interface data I/O. 18 XSHUTDN Input Reset and PWDN (Active low) 19 XSHUTDN2 Input Reset and PWDN (Active low) 20 AVDD_2.8V Power Analog power supply 21 AGND Ground Analog Ground.

Power Supply & Requirement Min. Typ. Max. Analog (AVDD) 2.6V 2.8V 3.0V I/O (DOVDD) 1.7V 1.8V 3.0V Core (DVDD) 1.1V 1.2V 1.3V

Active current

Analog(AVDD) - 17.2mA - I/O(DOVDD) - 1.1mA - Core(DVDD) - 40.2mA -

Total active current - 58.5mA - Suspend current<note1> - 0.15uA - <Note1>Suspend current is measured by H/W standby mode with external clock off.



4. Reference Drawing



5. Quality Specification

5.1 Environmental & Reliability

Item Specification Test Methods & Conditions

1. Packing Storage -40°C ~ 80°C ( Humidity 80% )

2 Non Packing Storage 25°C ~ 30°C ( Humidity 60% )

3 Operating Temperature ( Installed in the Application side )

-5°C ~ 50°C ( Humidity 80% )

Only guarantee function OK.

4 Packing Vibration 1. 10 ~ 60 Hz, 0.06 inches. 2. 60 minutes for X, Y and

Z axis.

5 Bare Drop

Drop height：150cm. Ground：Steel metal. 1 time per face, edge and corner. For 1 corner, 3 edges and 6 faces.

Specimen must be set on a dummy set of 100g

6 Connect Insertion Directionality

Force <= 0.7 Kg Vertical offset angle = 0°±1

7 FPC Bending Radius 1.2mm 180 degrees. Times: 10 times



5.2 Defect Pixel Specification

Table 1. Defect specification with no Defect Correction (Bayer Format)

Defect Type(s) Tolerance Specifications with Defect pixel Correction”ON”

Defect Pixel(s) – Single 5

Cluster(s) - Cluster 0

Defect row(s) 0

Defect column(s) 0

5.2.1 Test Criteria and Conditions:

( 1 ) Guarantee Temperature : 25 ± 3%° C. ( only camera module ) ( 2 ) Color temperature: 6500K ± 5% ( 3 ) Dark mode register setting: Output format RAW RGB / Auto Off (AGC/AWB/AEC OFF) /

15 fps/ 16x Analog gain / 1x Digital gain / Defect Pixel Correction enabled. ( 4 ) Bright mode register setting: Output format RAW RGB / Auto On (AGC/AWB/AEC OFF) /

15 fps/ 1x Analog gain / 1x Digital gain / Defect Pixel Correction enabled. ( 5 ) Dark defect (bright mode) criteria (8-bit):

A. Image luminance level is between 120 ~ 160 DN. B. Dark / White defect pixel is 30% higher/ lower than the normal mean pixel per color

channel. ( 6 ) Bright defect (dark mode) criteria (8-bit):

A. Whole image luminance level is below 20DN. B. Bright defect pixel is any 1x1 pixel with a value > 40 DN higher than the normal mean

pixels. ( 7 ) These criteria are not for visual test with demo kit.

5.2.2 Defect Pixel Definitions :

( 1 ) Normal mean pixel is defined as 31 pixels x 31 pixels block including the defect pixel. ( 2 ) Defect pixels include black and bright or color pixels. ( 3 ) Dark defect pixels at light mode are 30% lower than the normal mean pixel per color

channel (8-bit). ( 4 ) White pixels at light mode are 30% higher than normal mean pixel per color channel (high

8 bit)



( 5 ) Bright defect pixels at dark mode are 40DN higher than normal mean pixels (8-bit). A defect pixel is defined as 1x1 defect pixel size (RAW).

( 6 ) A defect cluster is defined as a collection of defect pixels that are ≥ 1x2 pixel size. ( 7 ) Defect Row or column is deviated by 4DN from its adjacent row or column value at the

same color plane.



5.3 Particle Specification 5.3.1 Test Conditions :

A. Test Chart: White Card 檢測圖：白卡

B. Distance (Between the camera module and Testing Chart): 5-10 cm 檢測距離(產品至檢測圖)：5-10 公分

C. Color Temperature: 6500。K 色溫：6500。K

D. luminance : 400 Lux 照度：400 Lux

E. Zone definition : Reference table 2.

5.3.2 Procedure & Criterion (檢測流程與結果判定) (1) Procedure (檢測流程)

A. Attach an under testing camera module to PC. Align the lens toward Testing Chart. 將待測攝像模組連接上電腦並對準檢測圖。

B. Activate the Testing Tool, and then inspect the image in the screen. 開啟檢測程式進行檢測。

C. Particle is 50% higher/ lower in luminance than the normal mean pixels.



(2) Criterion (結果判定) We will be judged according to the below table.

Particle Pixel Size Zone 0 / Q’ty Remark

1 * 1 N/A 不計 2 * 2 2 3 * 3 0 4 * 4 0 5 * 5 0 6 * 6 0 7 * 7 0

Table 2：Zone definition Guaranteed Zone: Zone 0 at Max image resolution, The 4 lines on the edge are not included.

.

Zone 0

4 Lines

4 Lines

4 Lines

4 Lines

Figure 1：Definition of Guaranteed Zone in the image (圖 1：保證區域定義)



5.4 Blemish spec 5.4.1 Test Conditions :

A. Test Chart: White Card 檢測圖：白卡

B. Distance (Between the camera module and Testing Chart): 5-10 cm 檢測距離(產品至檢測圖)：10-15 公分

C. Color Temperature: 6500。K 色溫：6500。K

D. luminance : 200 Lux 照度：200 Lux

E. Zone definition : Reference table 2.

5.4.2 Procedure & Criterion (檢測流程與結果判定)

(1) Procedure (檢測流程) A. Attach an under testing camera module to PC. Align the lens toward Testing Chart.

將待測攝像模組連接上電腦並對準檢測圖。

B. Activate the Testing Tool, and then inspect the image in the screen. 開啟檢測程式進行目視檢測。

(2) Criterion (結果判定) A. Definition for Guaranteed Zone and Small/Large Cluster in the image (區域及叢點定義)

(I). Guaranteed Zone: Zone 0 at Max image resolution, please see Figure 2. The 4 lines on the edge are not included. 保證區域：影像最高解析度，Zone 0，不含邊緣內四線之區域，請見圖 2。

(II). Blemish Cluster: Group of Pixels. The size of whole group shall be lager than 10x10 Pixel. Blemish Cluster：大於 10x10 pixels 的叢點



Zone 0

4 Lines

4 Lines

4 Lines

4 Lines

Figure 2：Definition of Guaranteed Zone in the image (圖 2：保證區域定義)

Darkness level Pixels ≧10x10 Zone 0

-4~-6 2 - 7 以上 0



5.5 Appearance 5.5.1 Procedure & Criterion (檢測流程與結果判定)

(1) Procedure (檢測流程) A. Place an under testing camera module on the table under 20~40W fluorescent light source

將待測攝像模組平放在 20~40W 日光燈下。 B. Check this camera module appearance and use Vernier Caliper to measure critical

dimension 使用游標卡尺量測及目視檢查產品外觀。

(2) Criterion (結果判定)

If there is any defective item listed in Table 3, the camera module shall be treated a disqualified one; otherwise, it shall be a qualified one. 產品如有表 3 內任一主要缺點(MAJ)，即判定為不合格品。反之，則為合格品。 A. Major defect: A camera module malfunctions or causes dedicated function failed due to

this defect. Or customer can’t apply the camera module to their system because of this defect. 主要缺點(MAJ)定義：該缺點會使產品之部分功能或特定功能不堪使用，或從而影響到產品

的性能，造成客戶(系統整合者)無法將產品整合至客戶單機上。

B. Minor defect: The defect may not impact system integration on the customer machine, but it is the item which Chicony shall beware for quality improvement. 次要項目(MIN)定義：該缺點雖不造成客戶無法將產品整合至客戶單機上，但仍未達我們產

品規格，需要後續持續改善。



Table 3：The Criteria for Exterior Inspection (表 3：外觀檢驗標準)

項

目 (Item

)

Defect (不良現象)

Checking Method

(檢驗方法)

Pass Criterion (合格條件)

Scope (檢驗範圍)

Classification (缺點等級)

Exterior Inspection (

外觀檢驗)

Parts Missing / Parts Excess (零件缺件/多件)

Visual Check & BOM Check

(目視並核對

BOM)

The quantity for the parts on PCBA un-matching with the one listed in BOM is not allowed (不允許 PCBA 零件數目與 BOM 表不符)

Module MAJ

Component Fracture (零件破裂)

Visual Check (目視)

Not allowed (不允許) Module MAJ

Lens Gluing Redundancy (Lens 溢膠)


The glue is Not allowed on the top of lens 1/3 barrel. Lens 面不可超過 1/3 Bezel 直徑面積(從外圍往中

心計算),且手機組裝後不可見到

Lens MAJ

Holder Gluing Over (Holder 點膠量過多)


The scope of holder gluing exceed module outline is not allowed (Holder 溢膠不能超過 Module 長寬尺寸)

Holder MAJ

Lens Scratch (Lens 劃傷)


The scratch obviously impacts image is not allowed (Lens 劃傷不可影響成像)

Lens MAJ

Steel Plate to change shape.

鋼片變形


Not allowed (不允許)

Steel Plate 鋼片

MAJ

Steel Plate Dirty 鋼片髒污


It not allowed, glue, oxidation, rust and allowed oil sludge, fingerprint. 不允許殘膠、氧化、生鏽，不管控油漬印、

手印

Steel Plate 鋼片 MAJ

FPC Fracture FPC 缺損


Fracture is not greater then 1/2 FPC wide. 不允許板邊撕裂、板邊到線路之寬度有 1/2以上缺損

FPC MAJ

FPC Scratch FPC 刮傷


FPC trace exposure caused by the scratch is not allowed 不允許刮傷後線路可視

FPC MAJ

FPC Gluing Adhesive FPC 沾膠


Gluing is not greater then 3.0mm. 長度不允許超過 3.0mm FPC MAJ

FPC Burr FPC 毛邊


Burr exceeds 0.2mm is not allowed 不允許突出大於 0.2mm FPC MAJ

Poor Text Printing FPC 印刷不良


Text missing, blurry text and wrong text printing are not allowed (不允許文字面漏印刷、印刷模糊、印刷錯誤)

FPC MAJ

Fissure between FPC and Holder

(組裝縫隙)


Fissure under 0.1mm is allowed for those modules. (無雙面膠密封之產品允許縫隙<0.1mm)

FPC, Holder MAJ

UV glue missing 漏點 UV 膠


Not allowed (不允許)

Lens & Holder MAJ

Lens Stain (Lens 髒污)


Not allowed (不允許) Lens MIN



5.6 Other Description

If the application side of the module output image to SW, FW, HW re-produced or adjust the image may result in abnormal phenomenon to avoid the disputes, if application side have any image NG , Chicony will use test fixture as the main diagnostic tools , when Chicony test fixture test is OK , Chicony will not be any long term improvement solution and action.

若客戶應用端的 SW、FW、HW 對於 Module 輸出的影像進行再製或調整，將有可能造成影

像異常的現象，為避免雙方爭議，對於客戶應用端所發現的影像不良，Chicony 將測試治具為做

為主要的覆判工具，當 Chicony 測試治具測試覆判為 OK 時，Chicony 將不會提出任何長短期的

改善對策。

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