FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch...

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SOT2007-2 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm x 1.96 mm body, customized array 28 May 2019 Package information 1 Package summary Terminal position code B (bottom) Package type descriptive code FBGA388 Package style descriptive code FBGA (fine-pitch ball grid array) Mounting method type S (surface mount) Issue date 01-05-2019 Manufacturer package code 98ASA01394D Table 1. Package summary Parameter Min Nom Max Unit package length - 15 - mm package width - 15 - mm package height - 1.96 - mm nominal pitch - 0.56 - mm actual quantity of termination - 388 -

Transcript of FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch...

Page 1: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

SOT2007-2FBGA388, fine-pitch ball grid array package, 388 terminals,mixed pitch (min = 0.56 mm), 15 mm x 15 mm x 1.96 mm body,customized array28 May 2019 Package information

1 Package summary

Terminal position code B (bottom)

Package type descriptive code FBGA388

Package style descriptive code FBGA (fine-pitch ball grid array)

Mounting method type S (surface mount)

Issue date 01-05-2019

Manufacturer package code 98ASA01394D

Table 1. Package summaryParameter Min Nom Max Unit

package length - 15 - mm

package width - 15 - mm

package height - 1.96 - mm

nominal pitch - 0.56 - mm

actual quantity of termination - 388 -

Page 2: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-2FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15

mm x 1.96 mm body, customized array

SOT2007-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.

Package information 28 May 20192 / 5

2 Package outline

Figure 1. Package outline FBGA388 (SOT2007-2)

Page 3: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-2FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15

mm x 1.96 mm body, customized array

SOT2007-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.

Package information 28 May 20193 / 5

Figure 2. Package outline note FBGA388 (SOT2007-2)

Page 4: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-2FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15

mm x 1.96 mm body, customized array

SOT2007-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.

Package information 28 May 20194 / 5

3 Legal informationDisclaimersLimited warranty and liability — Information in this documentis believed to be accurate and reliable. However, NXPSemiconductors does not give any representations or warranties,expressed or implied, as to the accuracy or completeness of suchinformation and shall have no liability for the consequences of useof such information. NXP Semiconductors takes no responsibility forthe content in this document if provided by an information sourceoutside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect,incidental, punitive, special or consequential damages (including -without limitation - lost profits, lost savings, business interruption,costs related to the removal or replacement of any products orrework charges) whether or not such damages are based on tort(including negligence), warranty, breach of contract or any otherlegal theory.Notwithstanding any damages that customer might incur forany reason whatsoever, NXP Semiconductors’ aggregate andcumulative liability towards customer for the products describedherein shall be limited in accordance with the Terms and conditionsof commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves theright to make changes to information published in this document,including without limitation specifications and product descriptions,at any time and without notice. This document supersedes andreplaces all information supplied prior to the publication hereof.

Page 5: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-2 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-2FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15

mm x 1.96 mm body, customized array

© NXP B.V. 2019. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]

Date of release: 28 May 2019

Contents1 Package summary ...............................................12 Package outline ...................................................23 Legal information ................................................4


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LBGA388, low profile ball grid array package, 388 ... · SOT2007-1 LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x 1.55 mm body,

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