FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch...

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SOT2007-1 LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x 1.55 mm body, bare die 3 August 2020 Package information 1 Package summary Terminal position code B (bottom) Package type descriptive code LBGA388 Package style descriptive code LBGA (low profile ball grid array) Mounting method type S (surface mount) Issue date 07-07-2020 Manufacturer package code 98ASA01377D Table 1. Package summary Parameter Min Nom Max Unit package length 14.85 15 15.15 mm package width 14.85 15 15.15 mm package height 1.4 1.55 1.7 mm nominal pitch - 0.56 - mm actual quantity of termination - 388 -

Transcript of FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch...

Page 1: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

SOT2007-1LBGA388, low profile ball grid array package, 388 terminals,0.56 mm minimum pitch, 15 mm x 15 mm x 1.55 mm body,bare die3 August 2020 Package information

1 Package summary

Terminal position code B (bottom)

Package type descriptive code LBGA388

Package style descriptive code LBGA (low profile ball grid array)

Mounting method type S (surface mount)

Issue date 07-07-2020

Manufacturer package code 98ASA01377D

Table 1. Package summaryParameter Min Nom Max Unit

package length 14.85 15 15.15 mm

package width 14.85 15 15.15 mm

package height 1.4 1.55 1.7 mm

nominal pitch - 0.56 - mm

actual quantity of termination - 388 -

Page 2: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

SOT2007-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Package information 3 August 20202 / 8

2 Package outline

Figure 1. Package outline FBGA388 (SOT2007-1)

Page 3: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

SOT2007-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Package information 3 August 20203 / 8

3 Soldering

Figure 2. Reflow soldering footprint part1 for FBGA388 (SOT2007-1)

Page 4: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

SOT2007-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Package information 3 August 20204 / 8

Figure 3. Reflow soldering footprint part2 for FBGA388 (SOT2007-1)

Page 5: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

SOT2007-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Package information 3 August 20205 / 8

Figure 4. Reflow soldering footprint part3 for FBGA388 (SOT2007-1)

Page 6: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

SOT2007-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Package information 3 August 20206 / 8

Figure 5. Package outline note FBGA388 (SOT2007-1)

Page 7: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

SOT2007-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Package information 3 August 20207 / 8

4 Legal informationDisclaimersLimited warranty and liability — Information in this documentis believed to be accurate and reliable. However, NXPSemiconductors does not give any representations or warranties,expressed or implied, as to the accuracy or completeness of suchinformation and shall have no liability for the consequences of useof such information. NXP Semiconductors takes no responsibility forthe content in this document if provided by an information sourceoutside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect,incidental, punitive, special or consequential damages (including -without limitation - lost profits, lost savings, business interruption,costs related to the removal or replacement of any products orrework charges) whether or not such damages are based on tort(including negligence), warranty, breach of contract or any otherlegal theory.Notwithstanding any damages that customer might incur forany reason whatsoever, NXP Semiconductors’ aggregate andcumulative liability towards customer for the products describedherein shall be limited in accordance with the Terms and conditionsof commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves theright to make changes to information published in this document,including without limitation specifications and product descriptions,at any time and without notice. This document supersedes andreplaces all information supplied prior to the publication hereof.

Page 8: FBGA388, fine-pitch ball grid array package, 388 terminals ... · SOT2007-1 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm

NXP Semiconductors SOT2007-1LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x

1.55 mm body, bare die

© NXP B.V. 2020. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]

Date of release: 3 August 2020

Contents1 Package summary ...............................................12 Package outline ...................................................23 Soldering ..............................................................34 Legal information ................................................7


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