Fatigue issues. 13 KA INTERCONNECTION ONE LOAD, RESISTANCE SC TO SC.

Fatigue issues

13 KA INTERCONNECTIONONE LOAD, RESISTANCE SC TO SC

EDMS No. 1086056

EDMS No. 1086056

Test ReportOrdernumber:

Description Result

871

Customer: P. Fessia AT/MCS

Material: Cu + supra + brasure

Operator: AG

Testdate: 04/11/2008

Teststandard: EN 10'002

Type of test: Tensile

Sampledesignation: BR2S06RB02

LHC

Load max

Sin

gle-

Eng

lish.

lst

kNFm 5.00mmAgt 2.43Deformation at Fmax

Spare Field

SC joint: combined electrical and mechanical tests

• Aim– Evaluate possible deterioration of the electrical

quality of the joint because of the mechanical efforts• How

– Measure the resistance of standard joint– Submit the same joints to tensile load (500 N, 1000 N, 5000 N)– Re-measure the resistance

EDMS No. 1086056

Results 1.9 KJoint type R before mechanical test R after mechanical test 500 N

Quadrupole 0.1 nΩ 0.1 nΩ

Dipole 0.09 nΩ 0.09 nΩ

Joint type R before mechanical test R after mechanical test 1000 N

Quadrupole 0.13 nΩ 0.13 nΩ


Joint type R before mechanical test R after mechanical test 5000 N

Quadrupole 0.1 5nΩ 0.14 nΩ


13 KA INTERCONNECTIONFATIGUE

EDMS No. 1086056

A fatigue test on a good Cu-Cu connection for tensile efforts

step R8 A [µΩ] R8 B [µΩ]

Initial values 9.6 10.7

After LN shock 9.6 11

After compression 500 N 40 cycles 9.8 10.7

After tension 500 N 40 cycles 9.9 10.7

500 N 9.9 11.6

2000 N 9.9 11.6

4000 N 10 12

6000 N 11 12

8000 N 11 12

13000 N 11.6 12.9

13800 N breakage

13 KA INTERCONNECTIONFATIGUE ON SC TO SC SPLICE

EDMS No. 1086056

Mechanical test procedure and acceptance limits

• At room temperature– Fatigue life cycle: 5000 cycles from 20 N to 240 N– Tensile test: minimum force for joint breakage 900 N

• At 4.2 K– Fatigue life cycle: 5000 cycles from 40 N to 510 N– Tensile test: minimum force for joint breakage 1000 N

• Total number of tests performed: 34 R.T., 46 4.2 K

EDMS No. 1086056

Production samples

The check was performed by the execution, by the same operators using that specific machine, of two production samples. After a visual inspection, the samples were tested electrically at the CERN cryolab and thereafter mechanically at the EIG (Ecole d’Ingénieurs de Genève).

Important: no one of the joints tested was broken during the tests. A test was stopped because

1) An upper test limit due to the test set up was reached ( typically 2 KN for the 4.2 K and 5 KN for the R.T. tests)2) A discontinuity on the loading curve was observed (see case I and case II) and that value was declared the limit of the joint

EDMS No. 1086056

Test equipment EIG

EDMS No. 1086056

Tensile test R.T.

0

1000

2000

3000

4000

5000

6000

1 2 3 4 5 6 7

Forc

e [N

]

soldering machine

Average F R.T. [N]

min F [R.T.]

max F[ [R.T.]

EDMS No. 1086056

Tensile test 4.2 K

0

1000

2000

3000

4000

5000

6000

1 2 3 4 5 6 7

Forc

e [N

]

Soldering machine

Average 4.2 K [N]

min F [R.T.]

max F[ [R.T.]

EDMS No. 1086056

A fatigue test on a good Cu-Cu connection for tensile efforts

step R8 A [µΩ] R8 B [µΩ]

Initial values 9.6 10.7

After LN shock 9.6 11

After compression 500 N 40 cycles 9.8 10.7

After tension 500 N 40 cycles 9.9 10.7

500 N 9.9 11.6

2000 N 9.9 11.6

4000 N 10 12

6000 N 11 12

8000 N 11 12

13000 N 11.6 12.9

13800 N breakage

SHUNT FATIGUE: MECHANICAL FATIGUE, LFM DOMINATED

Effect of fatigue on electrical resistanceCycles at 77K R measurement at RT

14.5

15.0

15.5

16.0

16.5

17.0

17.5

18.0

18.5

before cycling after 100 cycled 1 KN after 100 cycles 5 kN after 100 cycles 6.5 KN

Re

sist

an

ce µ

Ω

F1

F2

F3

R1

R2

R3

F2 broke after 37 cycles at 6.8KN(tensile strenght7-7.9KN-> kept 85% of

strength after 300 cycles )

0

20

40

60

80

100

120

0 1 2 3 4 5 6 7

Stre

ss [M

Pa]

externally apllied forces [KN]

imposed stress

stress from thermal contraction

total stress

yield stress

Sample 2 of fast brazing technique has been cycled in LN2 at 6800 N, rupture occurred after 37 cycles

• FractographyFast brazing, 15 mm brazed length:

Cracks

Fatigue striations

Conclusion on low cycle effect• The performed fatigue tests indicate that

– The soldering should withstand the loads originated from the thermal contraction mismatch without significant increase in the connection resistance

– The possible crack propagation coming from local defect seems to be active only when we go over the yield strength

• We do not have direct estimation of the effect of – Microstructure coarsening – Steady state creep at low temperatureBUT – Coarsening effect: it should be linked to the diffusion coefficient D=D0

exp-(Q/kT) and therefore in our case effect limited– Steady state creep. Creep should strongly decrease at T<0.5THOM (456K-

>T<228K)• Further test with pure thermal cycling will be performed on the final solution

SHUNT FATIGUE: ISOTHERMAL FATIGUE, “CREEP” DOMINATED

22

Tensile-Shear Strength After TC• Tensile-shear strength was tested after thermal cycling for different

shunt samples soldered with Sn60-Pb40

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

Forc

e at

bre

akdo

wn

/ kN

Force at breakdown at RT for MOB 39 and Kester fluxes after thermal cycles

MOB 39 ref

MOB 39_5 TC 4.2K

MOB 39_5 TC 77K

MOB 39_50 TC 77K

Kester ref

Kester_5 TC 4.2K

Kester_5 TC 77K

Kester_50 TC 77KKesterMob 39

Impact of thermal cycling rather limited

Courtesy A. Gerardin

INTERMETALLIC VS. SOLDERING TEMPERATURE

EDMS No. 1086322

Effect soldering temperature on intermetallic thickness(mech. Properties) [19]

EDMS No. 1086322

Effect of intermetallic on mech. Properties III [19]

EDMS No. 1086322

Aging [15,17] • Effect of aging on solder (in function of the Sb content )

• Effect of intermetallic thickness on mech. properties

EDMS No. 1086322

Joint strength vs. intermetallic and thermal aging [2]

Furthermore, the activation energy for growth of Cu3Sn on polycrystalline copper was found to be 1.27 eV and for Cu6Sn5 it was 0.47 eV, thus explaining the slower growth rate of Cu3Sn.

The Cu–Sn intermetallic layer growth behavior can be described by one-dimensional growth parameter, Y, which is related to the square root of the aging time.

Y=[Dt]^0.5where D is the diffusion coefficient and t, the aging time. The diffusion coefficient is given by an Arrhenius expression,D=D0 exp-(Q/kT)where D0 is the diffusion constant; Q, the activationenergy; k, the Boltzmann constant and T, the absolute temperature.

EDMS No. 1086322

Joint strength vs. intermetallic and thermal aging [15]

The formation of inter-metallic is an exothermic reaction therefore it progresses with time.

Aging causes coarsening of the structure that brings to• lower capacity to absorb deformation• fragilization-> crack propagation increase speed• But no decrease of the max load As the coarsening of the structure is dominated by the diffusion

coefficient and by the activation energy the coarsening effect for our use should be limited

EDMS No. 1086322

Properties in function of solder composition vs aging [3]

EDMS No. 1086322

FATIGUE EFFECTS ON JOINT

EDMS No. 1086322

Isothermal fatigue life [15]

EDMS No. 1086322

Isothermal fatigue life II [15]

EDMS No. 1086322

Fatigue and crack growth [2]• For low frequency and high R (σmax/σmin) crack

growth is time dominated-> creep • For high frequency and low R> LFM explain the

behavior

EDMS No. 1086322

Fatigue Vs. soldering process [17,18,20]

It can be obtained by rapid cooling going away from the lamellar eutectic structure towards the fine grain structure. This allows intergranular creep. This structure is not stable evolving towards a coarser structure/ larger grains have lowed free energy but the rate of change is proportional to temperature In the superplastic region larger strain are accepted without fracture [20]In samples quenched after 1 min only Cu6Sn5 was found. In samples quenched after 5 minutes also Cu3Sn was there

EDMS No. 1086322

Fatigue Vs. soldering process [17,18]

EDMS No. 1086322

Fatigue vs. environment [18]

The positive effect of vacuum (no oxygen) on the crack propagation is known and seems to be confirmed for soldering alloys

EDMS No. 1086322

Fracture mode of Sn-Pb/copper joints [17]

• In tensile the fracture happens through the solder bulk

• But in the case of eutectic cooled at slow rate the fracture takes place in the fragile intermetallic

• Tests at 77K show displacement of the fracture line between intermetallic and solder and this seems linked to the effect of the anisotrpic crystal thermal contraction of the metallic Sn (tetragonal)

EDMS No. 1086322

Intermetallic properties [18,21]Cu6Sn5 melts at 415 ⁰ CCuSn3 melts at 670 ⁰ C

EDMS No. 1086322

References1) Measurements of mechanical properties of electronic materials at temperature down to 4.2 K Cryogenics 48 pag 487-5102) [2] fatigue crack growth behavior of Sn-Pb engineering fracture mechanics 70 pag 2187 21973) [3] tensile fracture of tin-lead solder joints in copper material science and engineering A 379 pag. 277-2854) [4] deformation analysis of lap-shear testing of solder joints Acta Materialia 32 2633-26425) Deformation of solder joints under current stressing Solids and structure 41 4959-49736) [6] strengthening of Sn60-Pb40 solder alloy by adding traces of La Materials letters 52 319-3227) [7]Improvement of micro structure stability, mechanical properties and wetting prop of Sn-AG-Cu lead free solder adding rare earth elements

journal of alloy and compounds 376 170-1758) [8] comparative study of wetting behavior of sn-Zn and Sn-Pb microelectronics journal 37 705-7139) [9] tests for tin lead solders and solder joints bureau of mine report of investigation number 696310) [10] tensile and shear properties of several solders at cryogenic temperature national aerospace engineering and manufacturing meeting Los

Angeles oct 8-12 196211) [11]design criteria for solders in cryogenic environments 12) [12] A brief study of soft soldering. The institution of production engineers13) [13] enhancement of wettability and solder joint reliability by AG coating Alloys and compounds 360 217 22414) [14]microstructure and metallic growth effect on shear strength …. Material science and engineering A 307 42-5015) [15]SMT soldering handbook Newness16) [16] ASM welding brazing and soldering handbook17) [17] The mechanics of solder alloy: wetting and spreading Yost, Hosking, Frear18) [18] The mechanics of solder alloy: interconnects Frear, Morgan, Burchett, Lau19) [19] AWS manuel de brasage tendre20) [20] Solder joint creep and stress relaxation dependence on construction and environmental stress parameter 21) [21] solders and soldering Materials, Design, Production and Analysis for reliable bonding. H. Manko McGraw-Hill22) [22] Tin solders: A modern study of the properties of tin solders and soldered joints S.J. Nightingale23) [23]Development of stress strain curves for In80Pb15ag5 journal of electronic materials vol 28 page 1084-108724) [24] Deformation properties of Indium based solders at 294 and 77 K Cryogenics 1991 vol 31 page 159-16325) [25] Mechanical properties of In based Eutectic alloy solders used in Josephson packaging Cryogenics May 1984 pag 261-26526) [26] Measured Performance of Different Solders in Bi2223/Ag Current Leads IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, VOL. 18, NO.

2, JUNE 200827) [27] Magnetoresistance of selected Sn- and Pb-based solders at 4.2 K Material Letters 57 787-79328) [28] Mechanical behavior of microelectronics and power electronics under high current density Hua Ye PhD November 2004 University of Buffalo

Fatigue issues. 13 KA INTERCONNECTION ONE LOAD, RESISTANCE SC TO SC.

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