Fab Owners Association NewsletterQ1’2017

L.T. Retires as Executive Director of the FOA

L.T. Guttadauro's resignation from his long-standing role as Executive Director ofthe FOA became effective at the Q1'17 meeting. L.T. will still be around to lend hiswisdom and perspective as Executive Director Emeritus but Tom Salmon is taking over the day-to-day activities as new ED. The 2017 Collaborative Forum began with a tribute to L.T., who shepherded the FOA from a tiny consortium over 12 years ago to the 85+ member strong group it is today. At left, Tom presents him with a plaque as a token of appreciation.

Several of L.T.'s friends and colleagues joined in to offer their thanks and provide their perspective on working with L.T. through the years Below we see L.T. with Dan Malinaric of Microchip, Dale Miller of GlobalFoundries, Ariel Meyuhas of MAX International and Guy Gandenberger, formerly of Micrel (left to right). We all thank L.T. for his tremendous achievements on behalf of the FOA throughout the years.

FOA Founding Member Gene Norrett

It is with a heavy heart, we announce the passing of Gene Norrett, founding member and former Corporate Secretary and Treasurer of the Fab Owners Association. Gene passed away on March 29after a long battle with illness. He was a man of integrity and honor. Gene once said “At the end of theday, all you have is your reputation. Protect it.” Gene will be remembered as doing just that. He will be missed. We wish his family peace and wonderful memories in their time of grief.

FOA's 5th Annual Collaborative Forum

The FOA held its 5th annualCollaborative Forum at the MarriottDowntown in San Jose, California onFeb.22-23, 2017. The 1 1/2 day eventfeatured 8 case studies of AM-DMcollaboration and includedpresentations by several respectedanalysts on their perspective of thesemiconductor industry as well astalks by SEMI officers on how thatorganization can provide value toFOA members going forward. RetiringExecutive Director L.T. Guttadauroand his successor Tom Salmon areshown at right.

The Collaborative Forum is one of theFOA's most popular events and wasattended by over 120 people again in2017. That large a group requires alot of preparation and planning. Wethank Christie Baker of the FOA and Robin Guttadauro for their efforts inthose areas.

At left, we see Robin and Christie (left to right) distributing the attendee badges.

The Forum began with atribute to the departing Executive Director L.T. Guttadauro. Then perennial favorite Bill McClean. President of IC Insights, presented his ”IC Market Update and China Impact Analysis for 2017”. Bill once again won the award for most popular analyst presentation for

his talk at the 2016Collaborative Forum. He'sshown at right receiving hisaward from Tom Salmon andL.T.

The other analyst presentationwas by Christian Dieseldorff, Director of Industry Researchand Analysis at SEMI, whogave his 2017 update on“Trends & Forecast of Economy& Fabs”.

The following case studies werepresented on Feb.22-23:

“Improving MicroscopeEfficiency usingEAGLEview's AnalysisSoftware” by Errol

Akomer - Applications Director, Microtronics with Harold Isom - Fab Manager, Qorvo

“Techniques for Handling "Big Data" in the Fab” by Trey Roper - Sales Director, Telit with ASML

“Next Generation Dynamic FaultDetection” by Tom Ho - President,BISTel America with HowardWitham - Senior VP, Qorvo (at left)

“Nuts and Bolts: BringingMaintenance to the Next Level” byDimitry Gurevich, MAXInternational with Ken McAvey –GLOBALFOUNDRIES

“Turbo Molecular PumpReplacement” by JamesRobberstad – Ebara with Cypress

“Rolling Out New LAM OS onAlliance Product Line” by Paul Collura - LAM Research with Steve Olson -Broadcom

“Improving Pump Life on a BTI Furnace” by Bryan Swain - Applications Eng, Edwards Vacuum with Mike Costantino - Infineon Americas

“ROI for UTi's Inventory Sharing Platform” by Matt Ritchie - UTi Inventory Management Solutions with John Spicer - ON Semiconductor

The Forum included a paneldiscussion on legacy equipmentissues chaired by Dan Tracy ofSEMI. Above, we see Dan(standing) with panelists GaryDonaldson of Applied Materials,Tim Tobin of Entrepix, JohnSpicer of ON Semiconductor andSurya Iyer of PolarSemiconductor (left to right).

There were also severalSEMI presentations aboutactivities there that will be ofinterest to FOA members asthe two organizations evolvetoward a closer relationship.

Heidi Hoffman (at right) - Senior Director, FlextechAlliance (a SEMI StrategicAssociation Partner) spokeon “Fulfilling SEMI's MissionThrough StrategicAssociation Partnerships.”

Sanjay Baliga (at left) of SEMI presented on “Activities & Priority Projects of SEMI's EH&S Group”. Last but not least, Tom Salmon donned his SEMI hat to present on SEMI's Smart Manufacturing Initiative.

There were several special awards given out during the 2017 Collaborative Forum in addition toBill McClean's. Lloyd Whetzel of X-Fab was honored as Outstanding Individual DM member ofthe Year. Lloyd is shown receiving his award fromL.T. below.

Microchip won the award for OutstandingDM of the Year. On the next page, we see Kathy Clevenger (left center) and DanMalinaric (right center) of Microchipaccepting the award from Tom Salmon andL.T. Guttadauro.

Inficon won the award for the most popular case studyat the 2016 Collaborative Forum as voted by the DM's while SPTS won it as voted by AM's. Below left, William Conner of Inficon isshown receiving the award from Tom Salmon.

Uti Inventory Management Solutions was honored as outstanding Associate Member contributor for the year. Below right, Henry Larson (left)

and Matt Ritchie (right) from Uti are shown receiving the award from Tom Salmon and L.T. Guttadauro.

We thank all those AM's who supported the FOA by sponsoring this year's Collaborative Forum. Microtronic (Wed. social sponsor), Bistel (Thur. lunch sponsor), Ebara, ePak, Marcy Nanocenter, QuantumClean and TEL helped make the event another great success.

Special thanks to Microtronic for providing major funding for the Wed. night social at the San Jose Museum of Art. As part of their sponsorship, Reiner Fenske - President, Microtronic and Errol Akomer - Applications Director gave a presentation on their product on Wed. afternoon.

The Museum of Art, a convenient, short walkfrom the San Jose Marriott, allowedattendees an opportunity to sample aneclectic collection of art pieces while enjoyingfood and drink with friends andacquaintances. L.T. certainly enjoyed it!

Chihuly glass (left) was one of the display items at the museum.

Below, everyone enjoys the evening.

Everyone had agood time at theThursdayevening "postmeeting" social(shown below),which was heldat the GordonBiersch Breweryin San Jose.

Our thanks to all those who helped make this year's Collaborative Forum a great success: the AM presenters, their DM partners, the analyst and SEMI speakers, the FOA coordinators and, of course, our sponsors. We hope to see you all again in 2018!

Speed Networking 2017The Fab Owners Association will be holding its 8th annual SpeedNetworking event on the afternoon of Thursday July 13th in conjunction with its Q3’17 meeting. As in previous years, the event will be held at SEMICON West in San Francisco. If you're a Device Maker, who hasn't already signed up, please consider doing so. Both DM and AM participants have found it very valuable in the past.

Registration for Associate Members will occur from Mon. May 15 to Fri. June 2. AM's will receive an announcement about details of the registration process soon.

New MembersThe FOA recently added the following new members. Please welcome them.

Cypress Semiconductor Corp.Cypress’ advanced system-level solutions are Embedded in Tomorrow™. We target markets growing faster than the broader semiconductor industry, including automotive, industrial and consumer electronics markets. Our world-class, secure

wireless technology—along with our MCUs, memories, analog ICs and USB controllers - give us an unparalleled competitive advantage in the Internet of Things, and a jump on emerging markets, including connected appliances and autonomous cars.

We focus our technology and capital investments on growth markets and our core semiconductor businesses to relentlessly drive margin improvement and profitable growth. From the entrepreneur building a revolutionary new product in a garage to the Fortune 500 engineering team tasked with making the impossible happen now, Cypress is today’s technology partner for tomorrow’s innovations.

RevasumRevasum provides premiere CMP and grinding technology to critical growth markets such as power, RF communications,LED, MEMS, solar, and other mobile applications. Our mission is built on a designphilosophy of investing in new product development that is specifically targeted at

these global markets, with the purpose of meeting the unique needs of the device makers in this high-tech space.

Tosetz Inc.Tosetz is a venture company developing the state of the art equipment for electric device manufacturing processes. With our management policy of " Continuous

development and application of innovative technologies", we are making every endeavor for getting "More New Customers". Our main products are " Gas abatement systems" and " Automated electroplating stations". We are proud of our excellent supply record for our products to many customers in Japan, USA and other countries resulting from our leading edge technologies. Your contact to Tosetz is always welcome.

Upcoming Meetings

Q2'17 meeting: May 10-11 at Western Digital in Fremont, CA Q3'17 meeting & SpeedNetworking: July 13 at Semicon in San Francisco

If you would like to attend any of our meetings, please contact Tom Salmon - tom@waferfabs.org or Joe Ardini - joe@waferfabs.org and they will gladly send you a personal invitation.

Look forward to seeing you in Fremont!Sincerely, Tom, L.T. & Joe