F3 Board for CAP3

Project Talk for Physics 476 Fi nal Present ationMay 12th , 2005

J im K enned y

2Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Talk Overview

The B elle exp erim ent at KEK-B Fact ory.V ertex d etect or and the M onolit hic A ctiv e Pix el S ensor (MAPS) technol og y.C ontinu ou s Acqu isition Pix el (CAP): A series of sensors d ev elop ed in H aw aii.The 3rd CA P prot otyp e: CA P3.D ev elopment of a setup for C A P3 testi ng.Plans for the fu tu re & C onclu sion.

3Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

The Belle detector at KEK-B

~1 km in diameter

Mt. Tsukuba

KEKB Belle

µ / KL detection14/15 lyr. RPC+Fe

Central Drift Chamber

Drift Chambersmall cell +He/C2H5

CsI(Tl) 16X0

Aerogel Cherenkov cnt.n=1.015~1.030

Silicon Vertex

TOF counter

SC solenoid1.5T

8 GeV e-

3.5 GeV e+

Belle detectorBelle detector KEK-B: A e+ e- collider to produce ‘B-mesons’

BELLE: The detector to study the production of ‘B-mesons’

4Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Principle of Vertex Detector

Primary interaction point

Production of secondary particles

Decay length

1) Decay length gives a hint at which particle was produced and when.

2) Need accuracy in our extrapolation from recorded hit → Need good hit resolution in layers of detector: small size of detection units, and not so much material

3-layer vertex detector

Error on hit reconstruction

Possible area of decay

5Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

MAPS technologyPrinciple of MAPS

10µm

- Possibility to implement some electronics logicdirectly on the SI die.

- A very small thickness is achievable: the sensor can be ground down to the epilayer.

- No High Voltage needed.

6Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Correlated Double Sampling (CDS)

-Hit candidate!

Frame 1 - Frame 2 =

- Leakage currentCorrection

time

Vreset

∆VtypαIleak

∆VsigαQsignalIntegration time

tfr2tfr1

reset

GND

M1

M2

M3

et

Column

CollectionElectrode

M1

M2

M3

Bus Output

Reset

Collection Electrode

GND

7Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

The CAP series:

928 x 128 pixels = 118,784

Active area

20.88 mm

~4.5M transistors !CAP1 & CAP2: First 2 prototype sensors developed in Hawaii: small size array, tests successful.

CAP3: 2.1cm x 0.3 cm ‘full-size’ prototype.

The F3 board to test the CAP3 sensor.

8Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

System for CAP3

MC1 card

Serialized data out from the MC1 card and control signals to the MC1 card through RJ-45 connectors.

CAP3

F3

BE

MOBCADS

9Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Project Overview

Prot o ev al b oard and system for t he CAP3. M assiv e d at a transfer from S ensor.S end the d ata at hig h sp eed (LVDS).F3 alig nm ent w ith the b eam w ith a m ov ab le p latform.Prep are for a b eam test thi s J u ne at the KEK “B” fact ory.

10Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

System Diagram

PixelData

Bias control

16 pairs of signalsper F3 board,6 F3 boards

PMTs

FPGA

F3

Motherboard

MC1card

Back-endboard

CPUsoftware

RAM

PixelData

PixelData~1.43 millions bits for

each entire readout

11Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

ConclusionSystem integration near completion: tests of hardware, firmware developments (MC1 & BE control).First CAP3 data to be acquired soon.Base evaluation of system to be done in the laboratory.The time schedule is critical: Planning for a beam test with 6 boards in June at KEK test beam.

12Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

BACKUP SLIDES

13Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Silicon Vertex Detector 1 & 2

SVD1 SVD2

• 3 layers → 4 layers

• 23º<θ<139º → 17º<θ<150º

• 1 MRad → >20 MRad

• Rbp = 2.0 cm → 1.5 cm

Better I.P. resolution

SVD1

Summer 2003

SVD2

14Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Hybrid Pixels (CMS example)Pixel size: 150µm x 100µmBaseline for vertexing at LHC.

Complex rad-hard ROC, fast electronics (25ns bc), R&D on sensor, thick structure.

Ladders Modules Chips PixelsBarrel 92 752 ~12k ~50M

3 barrel layers / 2 disks: ‘grand total’: ~66M channels

> T.Rohe et al, ‘Charge collection properties of irradiated CMS Pixel Barrel Sensors’, RSSMDD oct 10-13 2004, Firenze, Italy

> M.B. ‘Design & Test of the CMS pixel readout chip’, NIM A 517 (2004) 349-359