© 2014 88 Equipment 04/15/2023

88

1CONFIDENTIAL

Engineering Expertise Crystal & Substrate

Sili

con • Raw

• Bulk• Ingot

• Poly• Mono

• Wafer• Device

• I.C• Solar• MEM

III-V • Raw

• Bulk• Ingot• Wafer• Device• LED• MESFET• On Silicon• Consume

r• Military

Tech

niq

ues • Czochrals

ki• HB Freeze• V. Freeze• Crop• Shape• Saw• Grind• Polish• Clean• EPI

© 2014 88 Equipment 04/15/2023

88

2CONFIDENTIAL

Engineering Expertise Thin Films ~ Metals ~ Techniques

Th

in F

ilms • Dielectric

• SiO2

• Si3N4

• Low K• High K• SOG• PSG• BSG• BPSG• Diamond

Meta

ls • Aluminum

• Titanium• Tungsten• Copper• Nickel• Silver• Gold• Zirconium• Hafnium• Silicide's

Tech

niq

ues

&

Eq

uip

men

t• Thermal• Diffusio

n• LPCVD

• RTP• APCVD• PECVD• MOCVD• ALD• MBE• PVD

© 2014 88 Equipment 04/15/2023

88

3CONFIDENTIAL

Engineering Expertise Metrology & Analysis

Metr

olo

gy • Particles

• Stress• Thickness• SEM• FTIR• SIMS• RBS• C-V,

“POP”• DLTS• Auger Metr

olo

gy c

onti

nued • HEED

• RHEED• RGA-M.S.• ICP• HF-VPD-

ICP• XRD• XPS• AFM• Profilometr

y Metr

olo

gy c

onti

nued

II• TXRF

• PL• Hall Mobil• I-V Curve• Parametri

c• Ellipsometr

y• Resistivit

y• Leakage• GM• Breakdow

n

© 2014 88 Equipment 04/15/2023

88

4CONFIDENTIAL

Engineering Expertise Etch ~ Cleans ~ Ion ImplantEtc

h:

Pla

sma a

nd

W

et • PPlate

• RIE• ICP• HDP• DSM

(Microwave)

• Ion Mill (FIB)

• All Wet Chemistries

• Batch and Single Waf.

Cle

ans:

Wet

and

Dry • Wet

• Batch and Single Waf.

• Static and Spin

• W/ Ozone• Dry• Ozone• DSM• Cryogenic

Ion Im

pla

nta

tion • Dopant

Incorporation

• Surface Modification& Treatment for III-V on Silicon

© 2014 88 Equipment 04/15/2023

88

5CONFIDENTIAL

Engineering Expertise Litho ~ Technologies ~ Planarize

Patt

ern

ing

&

Lith

ogra

ph

y • Contact

• Proximity• Exposure• Shadow• E-Beam• Resists• Multi-

layer• Treatmen

ts

Tech

nolo

gie

s • Semi• L.E.D.• Solar• Materials• Energy• MEM’s• Device• Process• Equipmen

t• Gases-

Liq.Pla

nari

zati

on &

Th

inn

ing• SOG-Etch

Back• Sacrificial

s• CMP• As-

deposited• Flow

Glass• Grind• Polish• Etch

© 2014 88 Equipment 04/15/2023

88

6CONFIDENTIAL

Renewable Energy-Solar CellS

ola

r &

Rela

ted

• Raw Mat.• Ingots

• Poly• Mono

• Wafer• Cells• Panels• Trackers• Concentra

te• Storage

Mate

rials

&

Tech

niq

ues• Silicon

• CIGS• III-V• Grown• Deposite

d• Implante

d• Treatmen

ts• Nano-Inks• Laminate

s• TSV Etch

Str

uct

ure

s • Wafer• Glass• Foil• Cells

• Single• Hetero• Ternary• Quad

• Panel• Rigid-

Flex.