EXHT-G1 EXH-AL00(01)

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EXHT-G1EXHT-G1 EXH-AL00(01)EXH-AL00(01)

EXHT-S1EXHT-S1 EXH-AL00(02)EXH-AL00(02)

Gel Type SeriesGel Type Series Sheet Type SeriesSheet Type Series

Total EMC ProductsTotal EMC Products

is the trademark of AMICis the trademark of AMICAAMMICIC AdvancedAdvanced MaterialsMaterials & Integration Co., Ltd.& Integration Co., Ltd.http : / / WWW . Ahttp : / / WWW . AMMIC . Co . KrIC . Co . Kr

ISO 9001 / 14001ISO 9001 / 14001

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® Introduction

In these days, a lot of electronic devices demand very high levels of thermal management. The objective of all thermal control programs in electronic packaging is the efficient removal of heat from device junctions to the ambient environment. And packaging of portable electronics is slim, which means that components are more closely packed together, so the amount of heat is increased. Clock speed of processor and overall power density are increasing, which means that more heat must be dissipated per volume of electronic equipment than ever before.

EX-Therm is AMIC’s trademark, thermal management materials combine high thermal conductivity and superior flame-retardancy with specific organic properties of heat resistance and electrical insulation.If you focus to maximizing the heat transfer, EH-Therm suits the purpose. It has got UL approval for 94V-0 and/or 94V-1 flame class.

Achieving this goal is required a thorough understanding of heat transfer fundamentals as well as knowledge of available interface materials, and how their key physical properties affect the heat transfer process.Attaching heat sink to a semiconductor package surface requires that two commercial grade surfaces to be brought into intimate contact. These surfaces are usually characterized by a microscopic surface roughness superimposed macroscopic non-planarity that can give the surfaces a concave, convex or twist shape. When two such surfaces are joined, contact occurs only at the high points. The low points form air-filled voids. Typical contact area can consist of more than 90percent air voids, which represents a significant resistance to heat flow. EX-Therm is used to eliminate these interstitial air gaps from the interfaces. Because the material has a greater thermal conductivity than through air it replaces, the resistance across the joints decreases, while the component junction temperature will be reduced.

Thermal impedance is the measure of the total resistance to the flow of heat from a hot surface through an interface material into a cold surface. It is measured according to the ASTM D5470 test method. Although the current version of this method is specific to high durometer insulating pad materials tested at high clamping forces, the method has been successfully adapted for use with low durometer materials as well as fluid compounds.

• Why is Heat Transfer important?

• Properties of Thermal Interface Materials


is the trademark of AMICis the trademark of AMIC AAMMICIC AdvancedAdvanced MaterialsMaterials & Integration Co., Ltd.& Integration Co., Ltd.http : / / WWW . Ahttp : / / WWW . AMMIC . Co . KrIC . Co . Kr

ISO 9001 / 14001ISO 9001 / 14001

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®Gel Type Gel Type TIMTIM

Characteristics

EXHT-G1EXHT-G1

Applications• Cooling Components to the Chassis or FrameCooling Components to the Chassis or Frame

• High Speed Mass Storage DrivesHigh Speed Mass Storage Drives• RDRAM ModulesRDRAM Modules• Micro Processors, Memory Chips and ChipsetsMicro Processors, Memory Chips and Chipsets

• Thermal Solution for Heat PipeThermal Solution for Heat Pipe• Automotive Engine Control UnitsAutomotive Engine Control Units• Telecommunication HardwaresTelecommunication Hardwares

EXHT-G1 Test Method Color Gray -

Thickness (㎜ ) 0.25~10 ASTM D374Hardness (Shore OO) 10 ASTM D2240

Specific Gravity 2.5 ASTM D792Service Temp. (℃) -30 ~ 200 -

Volume Resistivity (Ω·cm) 1.0ⅹ1011 ASTM D257

Voltage Breakdown(kV) > 6 ASTM D149

Thermal Conductivity (W/mK) 2.0 ASTM D5470

• EXHT-G1 is very soft, freestanding gap filler that is more compressible than any other gap filler.• EXHT-G1 has not only good thermal conductivity of 2.0W/mK2.0W/mK but high compressibility, which leads to low thermal impedance.• EXHT-G1 is inherently sticky, so not necessary to use additional adhesive coating which deteriorates thermal performance.• EXHT-G1 is electrically insulated and stable from ––30℃ to 200℃30℃ to 200℃.

Features

EXH-AL00(01)EXH-AL00(01)

Characteristics EXH-AL00(01) Test Method

Color Gray -Thickness (㎜ ) 0.3~10 ASTM D374

Hardness (Shore OO) < 50 ASTM D2240Specific Gravity 2.0 ASTM D792

Service Temp.(℃) -30 ~ 200 -Volume Resistivity (Ω·c

m) 1.0ⅹ1011 ASTM D257



Features • EXH-AL00(01) has not only good thermal conductivity of 1.5W/mK1.5W/mK and high compressibility to produce low thermal impedance.• EXH-AL00(01) is electrically insulating, stable from ––30℃ to 200℃30℃ to 200℃.• Available in various thickness from 0.25mm to 10.0mm.• EXH-AL00(01) does not require reinforcement.



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®Sheet Type Sheet Type TIMTIM Applications• High Speed Mass Storage DrivesHigh Speed Mass Storage Drives

• Power SuppliesPower Supplies• Micro Processors, Memory Chips and ChipsetsMicro Processors, Memory Chips and Chipsets

• Thermal Solution for Heat PipeThermal Solution for Heat Pipe• Automotive Engine Control UnitsAutomotive Engine Control Units• Telecommunication HardwaresTelecommunication Hardwares

EXHT-S1EXHT-S1 EXH-AL00(02)EXH-AL00(02)

Characteristics EXHT-S1 Test Method

Color White -Thickness (㎜ ) 0.1~0.35 ASTM D374

Hardness (Shore A) 70 ASTM D2240Specific Gravity 2.7 ASTM D792

Service Temp.(℃) -30 ~ 200 -Volume Resistivity (Ω·c

m) 1.0ⅹ1011 ASTM D257



Features

Characteristics

Features

EXH-AL00(02) Test Method Color White -

Thickness (㎜ ) 0.1~1.0 ASTM D374Hardness (Shore A) 50 ASTM D2240

Specific Gravity 2.5 ASTM D792Service Temp.(℃) -30 ~ 200 -

Volume Resistivity (Ω·cm) 1.0ⅹ1011 ASTM D257



• EXHT-S1 has high thermal conductivity of 4.0W/mK4.0W/mK to produce low thermal impedance.• EXHT-S1 is electrically insulating, stable from ––30℃ to 200℃30℃ to 200℃.• Available in various thickness from 0.1mm to 0.35mm.• EXHT-S1 does not require reinforcement.• Not only the lowest thermal resistance but the highest dielectric strength are the distinctive characteristics of EXHT-S1.

• EXH-AL00(02) has both good thermal conductivity of 2.0W/mK2.0W/mK and compressibility to produce low thermal impedance.• EXH-AL00(02) is electrically insulating, stable from ––30℃ to 200℃30℃ to 200℃.• Available in various thickness from 0.1mm to 2.0mm• EXH-AL00(02) does not require reinforcement.


is the trademark of AMICis the trademark of AMIC AAMMICIC AdvancedAdvanced MaterialsMaterials & Integration Co., Ltd.& Integration Co., Ltd.http : / / WWW . Ahttp : / / WWW . AMMIC . Co . KrIC . Co . Kr

ISO 9001 / 14001ISO 9001 / 14001

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P/N: EXHT – AAA – BBB – CCC – DDD – EEE (1) Serial Number(2) Thickness (㎜ )(3) Type: Al00(01), Al00(02), G1, S1(4) Width (㎜ )(5) Length (㎜ )(6) Adhesive Tape (Available)

(1) (2) (3) (4) (5) (6)

Chip

Heat sinkEXH-Al00(01)EXH-Al00(01)

Release paperRelease paper

1st 2nd 3rd

Chip

Chip

Thickness(㎜ )

Ther

mal

Res

ista

nce(

℃·in

2 /W)

0.00

0.50

1.00

1.50

2.00

2.50

0.25 0.75 1.25 1.75

EXH-AL00(01)

EXHT-G1EXHT-G1

Thickness(㎜ )

Ther

mal

Res

ista

nce(

℃·in

2 /W)

0

0.10.2

0.30.4

0.50.6

0.70.8

0.9

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

EXH-AL00(02)EXHT-S1EXHT-S1

Thermal Thermal ResistanceResistance

How to Use

How to Order

P/N: EXH – AAA – BBB – CCC – DDD – EEE (1) (2) (3) (4) (5) (6)



ISO 9001 / 14001ISO 9001 / 14001

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EXHT-G1 EXH-AL00(01)

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