EXHIBITING FRAUNHOFER INSTITUTE INTEGRATED ELECTRONICS
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electronica, November 8 – 11, 2016, Messe München INTEGRATED ELECTRONICS EFFICIENT, POWERFUL, FLEXIBLE EXHIBITING FRAUNHOFER INSTITUTE Fraunhofer Institute for Integrated Circuits IIS Am Wolfsmantel 33 | 91058 Erlangen, Germany www.iis.fraunhofer.de Fraunhofer Institute for Silicon Technology ISIT Fraunhoferstrasse 1 | 25524 Itzehoe, Germany www.isit.fraunhofer.de Leistungszentrum Elektroniksysteme LZE Office Am Wolfsmantel 33 | 91058 Erlangen, Germany www.lze.bayern Fraunhofer Institute for Physical Measurement Techniques Heidenhofstrasse 8 | 79110 Freiburg, Germany www.ipm.fraunhofer.de Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP Winterbergstraße 28 | 01277 Dresden, Germany www.fep.fraunhofer.de Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25 | 13355 Berlin, Germany www.izm.fra unhofer.de Fraunhofer-Institute for Photonic Microsystems IPMS Maria-Reiche-Strasse 2 | 01109 Dresden, Germany www.ipms.fraunhofer.de Fraunhofer Institute for Production Technology IPT Steinbachstrasse 17 | 52074 Aachen, Germany www.ipt.fraunhofer.de PRESS CONFERENCE INTEGRATED ELECTRONICS – EFFICIENT, POWERFUL, FLEXIBLE Time Tuesday, November 8, 2016 2.30 to 3.30 p.m. Location Joint Fraunhofer booth, Hall A4, Booth 113
Transcript of EXHIBITING FRAUNHOFER INSTITUTE INTEGRATED ELECTRONICS
electronica, November 8 – 11, 2016, Messe München
INTEGRATED ELECTRONICS
EFFICIENT, POWERFUL, FLEXIBLE
EXHIBITING FRAUNHOFER INSTITUTE
Fraunhofer Institute for Integrated Circuits IIS
Am Wolfsmantel 33 | 91058 Erlangen, Germany
www.iis.fraunhofer.de
Fraunhofer Institute for Silicon Technology ISIT
Fraunhoferstrasse 1 | 25524 Itzehoe, Germany
www.isit.fraunhofer.de
Leistungszentrum Elektroniksysteme LZE Office
Am Wolfsmantel 33 | 91058 Erlangen, Germany
www.lze.bayern
Fraunhofer Institute for Physical Measurement Techniques
Heidenhofstrasse 8 | 79110 Freiburg, Germany
www.ipm.fraunhofer.de
Fraunhofer Institute for Organic Electronics,
Electron Beam and Plasma Technology FEP
Winterbergstraße 28 | 01277 Dresden, Germany
www.fep.fraunhofer.de
Fraunhofer Institute for Reliability and
Microintegration IZM
Gustav-Meyer-Allee 25 | 13355 Berlin, Germany
www.izm.fra unhofer.de
Fraunhofer-Institute for Photonic Microsystems IPMS
Maria-Reiche-Strasse 2 | 01109 Dresden, Germany
www.ipms.fraunhofer.de
Fraunhofer Institute for Production Technology IPT
Steinbachstrasse 17 | 52074 Aachen, Germany
www.ipt.fraunhofer.de
PRESS CONFERENCEI N T E G R AT E D E L E C T R O N I C S – E F F I C I E N T, P O W E R F U L , F L E X I B L E
Time
Tuesday, November 8, 2016
2.30 to 3.30 p.m.
Location
Joint Fraunhofer booth, Hall A4, Booth 113
With 67 institutes in Germany and as many years’ experience
in application-oriented research, the Fraunhofer-Gesellschaft
stands for innovation and trailblazing solutions in science and
industry.
At electronica 2016, the world’s leading trade fair for elec-
tronics components, systems and applications, this expertise will
be impressively demonstrated. At the joint Fraunhofer booth
(Hall A4, Booth 113), eight Fraunhofer Research institutions
will present a broad spectrum of research projects and findings.
The topics covered include sensors, RFID, optical wireless
communications, CMOS processes, 3D integration, device and
manufacturing aspects, energy harvesting, OLED on silicon,
organic electronics or human-machine interfaces, large-area
thin-film electronics, discrete (SiC/Si), highly integrated power
electronics as well as wireless sensor networks. This is just a
sample of the energy and electronics expertise within the
Fraunhofer-Gesellschaft, and underlines the close relationship
between industry and applied research.
Fraunhofer researchers are waiting to talk to you personally. We
look forward to welcoming you!
INTEGRATED ELECTRONICS FRAUNHOFER TOPICS
IIS
3D Magnetic field camera | 6D Position measuring | Integrated
color sensor for controlling LED lighting | 10+Gbit Data trans-
mission | High precision charge measurement | Small Volume
ASIC production | Energy Harvesting | Battery Management
| Design for reliability in safety critical applications Advanced
System Integration | Intelligent IP Design
ISIT
Research, development and production of microsystems and
power electronics components | Innovation Cluster Power
Electronics for Renewable Energy | New converter concepts for
wind farms | MEMS component development: optics, inertial
sensors, gas sensors | MEMS foundry production
LZE
WakeUp-Receiver | Low-Power electronics for sports and
fitness applications | Inductive plug | Inductive ball bearing |
DC/DC Converter for +-380 VDC Microgrids | Bendable and
Ultrathin Sensors | Thin-Film Systems
IPM
Imaging fluorescence analysis of residual contaminations and
coatings | Real-time detection of sub-micro deformations of
high-power electronics
FEP
OLED microdisplays for interactive data eye-glasses and
sensorics | Flexible organic electronics | Energy harvesting |
Precision coatings | Processing of ultra-thin flexible glass
IZM
Manufacturing technologies: 3D Integration at wafer level
| Fan-out panel level packaging | Photonic packaging Sys-
tem integration: Sensor nodes | Antennas and RF material
characterization
IPMS
Universal Adapter for RFID Components | GigaDock Real-
Time Li-Fi Communication Module | Li-Fi HotSpot for
Optical Wireless Communication up to 10m | Indoornavi-
gation-App | Capacitive MEMS-Ultrasonic Sensors (CMUTs)
| Shoe-Embedded Polymer Energy Harvester | Customized
High-k Capacitors
IPT
Printed circuits on films | R2R processing for printed elec-
tronics | Manufacturing of optics for optical fibers
