www.EVGroup.com

EV Group

Corporate Overview

Dr. Thomas Uhrmann, Director of Business Development, t.uhrmann@evgroup.com

SEMI Packaging Tech Seminar – Vila do Conde, June 18th, 2015

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Equipment supplier for the semiconductor and MEMS industry

2000+ equipment installations

Privately held company founded in 1980

Headquartered in Austria - subsidiaries in USA, JP, KR, CN and TW

Worldwide Sales and Customer Support Network

Internal process development

20% of revenue is invested into R&D annually

Our philosophy Our mission

st

in serving next generation application

in semiconductor technology

Quick Introduction to EV Group

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Product Categories

EVG is a global supplier of:

Wafer Bonders

Aligners

Coaters / Developers

Temporary Bonders / Debonders

Cleaners

Inspection / Metrology Systems

EV Group holds the dominant share of the market for wafer bonding equipment

and is a technology leader in lithography for advanced packaging and

nanotechnology.

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EV Group Vision and Mission: Triple i

Enabling our customers to successfully commercialize their

new product ideas Invent With our equipment and processes, we constantly

bring to market emerging applications and

develop new technologies in partnership

with our customers.

Innovate Faster than others, we develop new technologies

and processes through constant innovation and

continuous improvement.

Implement Our equipment is designed for high volume

industrial production. We implement cost efficient

large-scale manufacturing technologies for

new value-added products to supply our

customers’ industries.

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EV Group Global Presence

Fully owned subsidiaries

Representatives

EV Group Inc. Tempe, AZ

EV Group Inc. Albany, NY

EV Group Korea Ltd.

Seoul EV Group Japan KK

Yokohama

EV Group Japan KK

Fukuoka

EV Group Taiwan Ltd.

EVG-Jointech Corp.

Chung-Li

EV Group China Ltd.

Shanghai

EVG Headquarters

St. Florian / Inn, Austria

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Manufacturing Solutions

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3D IC CMOS Image Sensors High Brightness LEDs

Logic / Memory MEMS Devices Microfluidics

SAW Devices SOI Wafers Photonics

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EV Group Process Support and Development

Customer demonstrations

Process development

Joint R&D with partners

Small volume pilot line production

IP management

Process technology licenses

Process training

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Platform Example for JDP with Customers

NILPhotonicsTM Competence Center

Competence

NILPhotonicsTM

Center

Master Templates

• SU-8 Mastering

• Wide network of stamp

suppliers

• S&R Mastering Metrology Infrastructure

• SEM, AFM,

• Interferometry

• Wide network of

metrology providers

Process Development

Definition and development

of customized processes

• UV-NIL

• Hot Embossing

• Micro-contact Printing

Sample Processing

EVG offers:

• Manufacturability

Demonstrations

• Small production run imprint

services

• Scale-up to pilot line

production

Pilot Line Production

For seamless transition from R&D

to production, EVG offers pilot line

production services as well as

process transfer to customer

designated volume manufacturing

sites

Materials Know-How

Based on its extensive process

related know-how, EVG offers

optimization of soft-stamp and

imprint resin interaction to meet:

• Applications requirements

• Layout requirements

• Productivity and low Cost of

Ownership (CoO)

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Technological Highlights for Packaging

Temporary Bonding for Advanced Packaging

Mature and optimized high-volume-manufacturing platform for Temporary Bonding

Open Adhesive Platform – multiple

adhesives, multiple sources

Material evaluation program for adhesive

performance qualification

Lithography Solutions for Advanced Packaging

Thick photoresist processing for bumping

applications (10 – 200 µm)

Permanent dielectric passivation layers

(BCB, PI coating)

Thin resist layers for lithographic RDL

patterning (conformal coating)

TSV processing (Via insulation /

passivation, polymer via-filling)

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Technological Highlights Te

ch

no

log

ica

l H

igh

lig

hts

Fusion & Hybrid Bonding 3x improvement in wafer-to-wafer alignment

New SmartView®NT2 with better than 200nm (3σ) alignment

accuracy

50% increased throughput NanoFill™ / NanoSpray™ Technology

Joint developments with customers enabling new devices with nano

imprint technology

EVG®580 ComBOND® Room temperature covalent bonding

Conductive / oxide-free interfaces

Minimum bulk lattice damage

NILPhotonics Competence Center

Joint development platform with customers enabling new devices

with imprint technologies

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Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to

change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof,

as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpinTM, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®,

HERCULES®, HyperIntegration®, IQ Aligner®, LowTempTM, NanoAlign®, NanoFillTM, NanoSprayTM, NIL-COM®, NILPhotonicsTM, OmniSpray®, SmartEdge®, SmartView®, The Triple "i" Company Invent-

Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.

Thank you for your attention!