European chance In industry & technologies- …...EUROPEAN CHANCE IN INDUSTRY & TECHNOLOGIES Marie...
Transcript of European chance In industry & technologies- …...EUROPEAN CHANCE IN INDUSTRY & TECHNOLOGIES Marie...
Semicon Europa | Jean-René Lequepeys | 26-10-2016
EUROPEAN CHANCE IN INDUSTRY & TECHNOLOGIES
| 2Marie Semeria | ENF, Dec 2, 2015
20TH : THE “ELECTRICITY” CENTURY
| 3Marie Semeria | ENF, Dec 2, 2015
21ST: THE DIGITAL CENTURY
Report: Digital Transformation of European Industry and Enterprises, March 2015
DISRUPTIVE IMPACT ON MANY INDUSTRIAL SECTORS
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21ST : THE DIGITAL CENTURYF
rees
cale
web
site
Sensing Situation awareness
Data deluge handling
High energy efficiency
Localization Data privacy & security
Virtual Imaging
A DIGITAL SOCIETY NEEDS KEY FUNCTIONALITIES IN SYSTEMS
Connectivity
DIGITAL SOCIETY ENABLED BY ADVANCED NANOELECTRONICS
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EUROPE IS STILL IN THE RACE !
Inside the
From ITRS, Paolo GARGINISEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
EUROPE STRENGTH IN THE SEMICONDUCTOR MARKET
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EUROPE HAS STILL 3 LEADERS IN THE TOP 20
SEMICONDUCTOR SALES LEADER
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EUROPE HAS 37% OF AUTOMOTIVE SEMICONDUCTOR MARKET SHARE AND HAS STRENGTH IN ALL DOMAINS
http://www.eetimes.com/document.asp?doc_id=1329375Source: IHS
Source: Market Realist – Dec 2015
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
| 9Nom événement | Nom Prénom | Date
KEY MARKETS IN EUROPE
Automotive MicroControllers
Analog Power Smart Cards
MEMS
Opportunities
Further electrification of power train
Consumerization of Auto electronics
Vehicle connectivity and enhanced driving
European leadership with 44% of market
share
The three European IC
suppliers accounted for 15 % of the
analog market in
2015
Europe is an
undisputed leader
1.2.11.14.
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Suppliers
(Tier, 2, 3..)
Equipment
suppliers
OEM InfrastructuresSemiconductor Services
2000B$30B$ 150B$(Electronic)
>100B$(2030)
AUTOMOTIVE INDUSTRYEUROPE AT THE CORNERSTONE OF THE VALUE CHAIN
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ADAS and EV fastest growing areas• Sensors Actuators • Power electronics
ADAS and EV fastest growing areas• Sensors Actuators • Power electronics
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SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
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EUROPEAN SEMICONDUCTOR MANUFACTURING
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MANUFACTURING CAPACITY IS VERY WEAK IN EUROPE WITH VERY FEW 300MM FABS
http://evertiq.com/news/38813
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
WEIGHT OF SEMICONDUCTORS IN DIFFERENT COUNTRIES
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HOW WE COULD SUMMARIZE EUROPE'S SITUATION ?
Is well positioned on key promising and fast growing
enabling technologies
Is in leading position for automotive
markets
Europe’s situation in the field of semiconductor :
Has a lack of capacity of
production
SecurityAnalog IC
MEMS
Power Devices
IC for smart card
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
µcontroller
DIGITAL SINGLE MARKET: A GREAT OPPORTUNITY FOR EU
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DIGITISING EUROPEAN INDUSTRY : EUROPEAN COMMISSION PROPOSAL
Source: Digitising European Industry: A key role for Europe'sdigital competence centres Max Lemke, PRACEdays2016 Prague - CZ, 11 May 2016
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DIGITISING EUROPEAN INDUSTRY : EUROPEAN COMMISSION PROPOSAL
Source: Digitising European Industry: A key role for Europe's digital competence centres Max Lemke, PRACEdays2016 Prague - CZ, 11 May 2016
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
40% added value of cars from digital industry
+ 110 B€ annual revenue overs next 5 years
- 600 B€ annually if we don’tact
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DIGITIZING EUROPEAN INDUSTRY STRATEGYPRIORITY OF COMMISSIONER OETTINGER (STRATEGIC PROGRAMMING 2018-2020)
« Europe's future is digital »Hanover Messe, March 25th, 2016
STRATEGIC PROGRAMMING 2018-2020
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IOT BigData
AI
TECHNOLOGIES DRIVING THE CHANGE
Embedded software, sensors, 5G connectivity, actuators, low power ICT, … Data management & exploitation,
storage, Cloud, servers, HPC,..
Robotics, automation, machine learning, self-driving,..
Innovation in
products, processes and business models
Innovation in
products, processes and business models
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"Pervasive fixed and mobile connectivity”5G will become the key infrastructure for several
vertical markets
5G : A STRONG OPPORTUNITY FOR EU
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• 5G PPP is a research program in Horizon 2020 of the EU dedicated to 5G system research
• Budget for 2014 – 2020 time frame– Up to 700 M€ public funding– Matched by private side including leveraging factor of 5 of additional private
investment. Total budget of about 3.5 B€
• Research program is addressing all building blocks of a future communication network and a huge number of scenarios from vertical sectors
• 5G Infrastructure Association vision paper was published at Mobile World Congress 2015 in Barcelonahttp://5g-ppp.eu/wp-content/uploads/2015/02/5G-Vision-Brochure-v1.pdf
• First set of projects started on July 1, 2015
5G PPP in Horizon 2020 of the EU
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"SINGLE MARKET“: TIMING FOR 5G INTRODUCTION
2018 2020 2025
Commercial launches of 5G services in at least one major city in all Member States
Early 5G launchesin selected areas
5G in all urban areasand along main transport paths
Coordinated/quasi-simultaneous launch throughout single market
Aggressive roll-out with geographical and sectorial focus
CHANCE FOR EUROPE AND EXAMPLES COMING FROM LETI
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EUROPEAN CHANCES
Innovation is where the manufacturing is. [A National strategic plan for advanced Manufacturing, USA 2012]
Co-location of IC design centers, manufacturing facilities and RTOs is mandatory for semiconductor and electronics products.
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EU market : 500 M consumers
Key industrial players :Systems : automotive, manufacturing, chemical : 20% of WW productionSemiconductor : 7% of WW production
Growing SMEs : 200 000 in technological sectors
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
ENSURING THE FUTURE (1/2)WHAT ARE EUROPE’S MAIN ASSETS ?
| 25NEED TO STRENGTHEN THE SEMICONDUCTOR INDUSTRY
ENSURING THE FUTURE (2/2)WHAT ARE EUROPE’S MAIN ASSETS ?
World class RTOs, used to collaborate and innovate with Industry
EC Incentives for cooperation and joint innovation
Common cultural beliefs and values, a baseline for innovation, for industry growth and for our society
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STRATEGIC POSITIONING OF
RTOS IN THE INNOVATION CHAIN
EXAMPLE OF LETI AND EXAMPLE OF EUROPEAN INITIATIVES
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LETI TWOFOLD STRATEGY
Big data and cloud computing infrastructureDeep learningArtificial intelligence
Hyperconnectivity
Industry 4.0Connected Health
Mobile
scaling diversification
Automotive, aeronautics, spatial
FOR A DIGITAL SOCIETY
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LETI DRIVERS
Strong set of Platforms
Photonics
Medical Devices
IC Design center
Micro & nano electronics
Nanocharacterization
MINIATURIZATION
DESIGN
ENABLEMENT
LOW POWER
SECURITYSENSING
CONNECTIVITY
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FIRST FDSOI PRODUCT
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| 301980 1990 2000 2010 2020
Rad-hard (PD-SOI-HD) Fully-Depleted (FD-SOI)
1st FDSOItransistor
Rad-hard components
Rad-hard components DMILL for CERN detectors
1st prototype in FDSOI 28nm.
IP SOI: acquired by ARM in 2006
SiliconImpulse
IP FDSOI - MPW
1st 28FDSOI DSP (@ 0.4V, 460 MHz)100x faster than competitors
SOI STORY : EUROPEAN STRENGTH
Components
Silicon On Insultor (SOI)
Substrates
Simox Smart-cut™
Applications
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22FDX – 12FDX
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MICROELECTRONICS ROADMAP
28 nm22 nm
7 nm
NanowiresFDSOI
Quantum
300 MM
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12 nm
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STRUCTURING PARTNERSHIPS
Core business, long term research• MEMS• Photonics
RFSOI• Next generations• Filters
FDSOI 28FD+ to 12FD• Substrates• Epitaxy• Characterization
Bernin
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STRUCTURING PARTNERSHIPS
PassivesµbatteriesGaN/Si Power Diodes
GaN/Si Power Transistors Gas Sensors
FD 28 nmImagersµcontrollers
Assignees WIP
ToursCrolles Catania
5 Eniac Kets projects 2 under construction
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STRUCTURING PARTNERSHIPS
Europe : IPCEI projectUnder construction
Chanel Asic Partner22FDX, 12FDX
Assignees WIP
Dresden
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SILICON IMPULSE
PROTOTYPING• MPW Shuttle• Assembly• Test
DESIGN• IP Development• Circuit Design• System Design
CONSULTING• Feasibility analysis• System architecture• Solution evaluation• Benchmarking• Trainings
PRODUCTIONRAMP-UP
• Qualification• Transfer to foundry• Supply Chain
From concept to production ramp-up
PRODUCTION• (foundry)
CEA tech CEA tech & Partners Partners
Industrials
Help you to access LETI advanced technologiesmainly Ultra Low Power technologies
Easy access to advanced Technologies and R&D skills
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9 RTO PARTNERS9 RTO PARTNERS
H2020 GATEONE PROJECT : A MARKET PLACE TO PUBLICIZE AND TRANSFER TECHNOLOGIES TO SMES
PrototypeGateone–project functionaldemonstrator
Gate 0
The demonstrator enables technology evaluation by SME
50 TECHNOLOGIES IN PORTFOLIO50 TECHNOLOGIES IN PORTFOLIO
TARGET : 50 DEMONSTRATORS
� 29 IN THE PIPELINE
� 9 ALREADY TRANSFERED
TARGET : 50 DEMONSTRATORS
� 29 IN THE PIPELINE
� 9 ALREADY TRANSFERED
OBJECTIVE : TO FACILITATE THE ADOPTION OF SMART TECHNOLOGIES AND
SMART SYSTEMS BY SMES THROUGH DEMONSTRATORS
http://www.gateone-project.eu/
A WINNING FORMULA : 1 RTO +1 SME = 1 DEMONSTRATOR
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Equipment supplier
Design tools
Electronic CMOS drivers
300mm wafer CMOS photonicsfront end & back end fab
Photonics/electronicsintegration
Cmos 3D integrationprocess
Computing systems
S2 datacom systems
IRT NANOELEC :PLATEFORME COLLABORATIVE OUVERTE
Equipment & materialsupplier
IC Design tools
Devices design & manuf.
End usersPHOTONICS
ASSOCIATED PARTNERS
CONSORTIUM MEMBERS
PULSE(case studies with SMEs)
3D INTEGRATION
Laboratories
Fabless IDMs
System houses
IRT NANOELEC : A NEW MODEL OF COLLABORATION IN GRENOBLE ECOSYSTEM
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LETI DRIVERS
Strong asset of Platforms
MINIATURIZATION
DESIGN
ENABLEMENT
ADVANCED
COMPUTING
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ADVANCED COMPUTING3 SHIFTS TOWARD EXASCALE
2016
>2020
• Quantum computing• Neuromorphic architectures
• New non volatile memory• 3D VLSI and 3D high-density• Integrated silicon photonic dies• Neuromorphic for coprocessors
• Advanced FDSOI• Many-core circuits (Chiplets)• 3D Interposer with Chiplets• Integrated photonic links
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ExaNoDe investigates, develops and pilot:
• a highly efficient,
• highly integrated,
compute element aimed towards exascale computing.
Chiplet
Interposer
3D-ICMulti-Chip-
Module
Memory
device
FPGA bare dieTotal budget: 8.6M€
H2020 project coordinated by CEA-Leti,a many cores approach
EXANODE: A EUROPEAN SOLUTION
Results included in this document are CEA’s propert y. They cannot be disclosed without prior authoriza tion.
FOR HIGH PERFORMANCE COMPUTING
• high-performance,
• heterogeneous
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LETI DRIVERS
Strong asset of Platforms
MINIATURIZATION
DESIGN
ENABLEMENT
ADVANCED
COMPUTING
INTERNET
OF THINGS• SENSORS
• WIRELESS LINKS
• SECURITY
• LOW POWER
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SIGNATURE OF INTEL – LETI STRATEGIC PARTNERSHIP IN IO T
May 12, 2016 signature of the cooperation between Leti and Intel
Daniel Verwaerde , CEO CEARaj Hazra, VP Data center Group
Marie Semeria, CEO LETI
Raj Hazra said : “This announcement expands upon our long standing highperformance computing relationship with CEA to drive leading edgeinnovation in IoT, wireless, and security in the European co mmunity . Welook forward to the important innovations and discoveries to come from thiscollaboration.”
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RELIABILITY, SECURITY, PRIVACY: KEYS OF IOT
Internet of things
Internet of Threats
e-healthConnected cars
SCADA
Industrial systems
e-home
Home appliances
50 billions of connected objects
1 trillion of sensors
monitoring
authenticationindustrial systems
reliabilityprivacy
cryptographyHacking
cyber-physical systemstraffic management
plants
biometrics
Source: Mobile Ecosystem Forum (MEF)
Security Interoperability Immaturity of the ecosystem
Obstacles to the development of the market
Source: L’usine digitalehttp://www.usine-digitale.fr/article/objets-connectes-les-chiffres-cles-du-marche-francais.N356834
Integration in advanced technology is required
With security primitives including intrinsic resist ance
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Secured ICs
New protection schemes
Physical UnclonableFunction
Shielding, Sensors, Architectures…
ICs for IoT
Low Power, Low cost, Efficient
protections
Adapted cryptography« Zero Power »
Protections
Secure IPs
Security by Design
Cyberphysicalsystems
System security
Safety, Security & Privacy by design
LETI : A RTO INVOLVED IN SECURITY
HARDWARE SECURITY & SECURITY BY HARDWARE
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LETI DRIVERS
Strong asset of Platforms
DM
MINIATURIZATION
ADVANCED
COMPUTING
INTERNET
OF THINGS
MEDICAL DEVICES
AND PROTOCOLS
DESIGN
ENABLEMENT
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LETI’S GLOBAL APPROACH TO MEDICAL DEVICE R&D
INTERFACE CHEMISTRY
MICROFLUIDICS & BIOLOGY
HETEROGENEOUSPACKAGING
SILICON & PLASTICPLATFORMS
PHOTONICS PLATFORM
CLINICAL PLATFORM
USE CASES PLATFORM NANOSAFETYPLATFORM
NANOCHARACTERIZATIONPLATFORM
Excellence and Expertisein miniaturization and communication
technologies
Multidisciplinary skillsBiology, Engineering, Medicine, ICT
KOL & Medical Partners
Pre-IndustrialPlatforms
TechnologicalInnovation
Clinicalvalidation
PRECLINICAL PLATFORMDATA PROCESSING
BIOINTERFACE CHARACTERIZATION
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LETI: YOUR CONNECTED HEALTH PARTNER FOR S SUCCESSFUL PRODUCT INNOVATION
Technological components
New validated medical functions
System design and integration
• Nanointerfaces with Living Matter
• MEMS/NEMS
• Optical sensors
• Surface functionalization
• ...
• Closed-loop and Automated Functions
• ASIC Design and Data Processing
• Miniaturization and 3D Packaging
• Microfluidics Protocol Integration
• Lensfree microscopy
• User-friendly Device Packaging
• ISO 13485 based processes for MD
• Low Power, Secure transmission
• Clinical validation
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EIT HEALTH : AN H2020 INITIATIVE
https://eithealth.eu/
CORE PARTNERS
140 organisationsspanning key areas of healthcare such as Pharma and MedTech players, RTOs and Universities
2 B€
3 main investment areas
FOR AN INDEPENDENT LIFE AND MORE EFFICIENT HEALTH C ARE SYSTEMS
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LETI DRIVERS
Strong asset of Platforms
DM
MINIATURIZATION
ADVANCED
COMPUTING
INTERNET
OF THINGS
MEDICAL DEVICES
AND PROTOCOLS
TRANSPORTATION
DESIGN
ENABLEMENT
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Met
ers
BMW (2010) Continental (2015) Leti (2016)
Perf 1 x0,47 x1
Conso 204W 95W 0,5 W
HWNvidia GeForce
268GTXIntel Core i5 @3.3 GHz
µC Cortex M7@200 MHz
AUTOMOTIVE : MULTI SENSOR FUSIONSOLUTION FOR A COMPREHENSIVE MONITORING OF CAR DRIV ING
Multi sensor fusionProbabilistic map data fusionFormal approach
100 times less computing needs200 to 400 lower energy consumption
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
CONCLUSION
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EUROPE HAS KEY PLAYERS WHICH ARE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY
With large industrial companies, innovative SMEs and highly skilled RTOs
And the willingness to open the route to
innovation and growth for jobs, industrial leadership and
independence, and a bright future for young people, Europe is well positioned for the new
digital century
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
Strong position in : µcontrollers, smart card, power devices, analog IC, MEMs…European Leadership in automotive semiconductor market
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EUROPE HAS KEY PLAYERS TO BE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY
To maintain European manufacturing capabilities for critical and innovative components
To keep and improve its position and independence in the global competition, Europe needs :
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To promote large scale technological platformsfor pre-industrial validation in Industrial Pilot Lines
and Testbeds
EUROPE HAS KEY PLAYERS TO BE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY
To keep and improve its position and independence in the global competition, Europe needs :
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To set up financial tools supporting necessary investments : CAPEX for industrial leadership and CAPEX for innovation in RTOs
EUROPE HAS KEY PLAYERS TO BE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY
To keep and improve its position and independence in the global competition, Europe needs :
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
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HIGHLY SKILLED
PEOPLE AND RTOS
To keep and improve its position
and independence in the global competition
To maintain European manufacturing capabilities for
critical and innovative components
To promote large scale technological platforms
for pre-industrial validation in pilot lines
To set up financial tools supporting necessary
investments : CAPEX for industrial leadership and
CAPEX for innovation in RTOs
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
EUROPE WILL BE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY
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SAVE THE DATE
2
1
50
LETI DAY AT GRENOBLEJUNE 28-29, 2017
SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016
THANK YOU
FOR YOUR ATTENTION