SSI Zurich-EPoSS

Jean-Luc MATE

> 21-03-2012

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©EURIPIDES 2012

Summary• The Western Europe paradigm: Can More than Moore lead

to Production in Europe. The “high Tech - low cost” recipe.

• Industrial research on a cooperative basis lead to create a competitive value chain in Europe

• EURIPIDES can contribute to market smart systems innovation with its available funding budget in Europe

• EURIPIDES Success stories

• 2012 Graz Forum Rendez Vous

<« HighTech-LowCost », the cornerstone of European competitive manufacturing

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• Huge opportunity for high electronic content companies • Innovation in new products with enhanced features thanks

to more than Moore and advanced packaging and assembly • Target Costing driven innovation for affordable solutions• Successful innovation leads to profitable growth• Price to pay for a competitive more than Moore smart

system manufacturing in Europe is really affordable • Innovation is fun…and better together !

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“High Tech – Low Cost” benefits

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• Innovation in Manufacturing Process for Smart System

• “Low labor” content process for new integration technologies generate immediately very high level of quality mandatory by high performance domain

• Design the “High Tech- Low Cost” factory for large volume of different batches:

1 million pieces /year = 1 000 batches of 1 000 identical pieces

or 5 000 batches of 200 identical pieces

Manufacturing platform with integrated more than Moore technologies can process very large variety of Smart Systems

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“HighTech-LowCost” : the Western Europe Recipe

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• Our EUREKA cluster key words: innovation, collaboration, new products, new markets

• A large amount of research, knowledge, partners and success stories gained in FP6 and FP7.

There must be a huge amount of Smart System products and processes to really bring to the market!

Potentially EPosSS has a huge number of collaborative projects within EURIPIDES scope

Fertilizer is there in most countries with a lot of expectations

EPoSS members and their network should build on their successful FPx results, new EURIPIDES ones.

So, Let us DO it! Our cooperation has no limit

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Food for thoughts in cooperation

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• Power electronics – Packaging and Mechatronics integration : wide range of applications, huge market potential and green tech expectations for Europe in the lead technology position

• Printed electronics: Europe can apply flexible assembly and plastronics in their leading market

• Packaging still a key topic to differentiate in “HighTech-LowCost” for robustness, hot temperature and miniaturization.

Let us DO it!

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Food for thoughts – strategic technologies

< Call calendar

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Food for thoughts

Spring 2012 call

•Full Project Proposal 2 May 2012

Autumn 2012 call

•Project Outline 10 September 2012•Full Project Proposal 15 November 2012

More flexibility in 2012

< Success stories

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©EURIPIDES 2012

CERAMJET: Inket printing technology in ceramic electronics

3,6 M€ R&DOne Sme (leader) , 4 Large Co, 1 University

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Ceramjet-Sme lead and success

• 3 M€ effective turnover

• 100% employment increase for Ceradrop

• New clients (top European aerospace institute)

• Knowledge for all partners

• A full European industrial branch in ink jet printing

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IQ FUEL: Integrated sensor to determine the quality of fuel

• 8,7 M€ R&D• 10 partners: 4 Large Co, 2 Sme’s, 4 research org.

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IQ Fuel – Clean power and greener cars

• A fully integrated program : • Technology screening • From the packaged MOEMS sensor to its integration and actual fuel identification. • Full value chain secured

• In 2012, functional samples of the sensor will be provided to customers

• A breakthrough in automotive sensing

< Graz Forum COWIN market place

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< 16EURIPIDES 2012 GRAZ FORUM | 13-15 JUNE 2012

Your Smart Systems “Rendez-vous” will focus on:

•Smart power technologies: high temperature interconnect, energy harvesting using semiconductors, high temperature substrates, … •Smart power applications: high current components, inverter modules, E-car and smart grids •Medical technology: bio compatible material and packaging, smart sensors, … •RFID applications: flexible substrates, ultra thin semiconductors, printed electronics