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Introduction

Dr. Mashiur Rahman

Lecture 1

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The history

The Vision: In 1959, Caltech physicist Richard Feynmangives his famed talk Theres Plenty of Room at theBottom, outlining the prospects for atomic engineering.

Seeing is Believing: In 1981, Gerd Binnig and HeinrichRohrer of IBMs Zurich Research Laboratory create thescanning tunneling microscope, enabling researchers toboth see and manipulate atoms for the first time.

Nanostructures: In 1985, Robert F. Curl Jr., Harold W.Kroto, and Richard E. Smalley discoverbuckminsterfullerenes (buckyballs refer to Figure 1-1),

soccer-ball-shaped molecules made of carbon andmeasuring roughly 0.7nm wide.

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Theres Plenty of Room at the Bottom

Richard FeynmanCal Tech, 1959

People tell me about miniaturization, and how far ithas progressed today. They tell me about electricmotors that are the size of the nail on your smallfinger. And there is a device on the market, they tellme, by which you can write the Lord's Prayer on

the head of a pin.But that's nothing; that's the mostprimitive, halting step in the direction I intend todiscuss. It is a staggeringly small world that isbelow. In the year 2000, when they look back atthis age, they will wonder why it was not until theyear 1960 that anybody began seriously to move inthis direction. Why cannot we write the entire 24volumes of the Encyclopedia Brittanica on the headof a pin?

This goal requires patterning at the 10 nanometer scale.

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Invention of the Transistor

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The first planar integrated circuit, 1961

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2001: A Nanotechnology Odyssey

Mark C. Hersam: Northwestern University

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Red Herring, May 2002

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Funding innanotechnology industry

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The nanotech industry

Source: Nanotechnology For Dummies

2005: Federal $980 million

2015: Estimated $1.2 trillion

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Total number of patent applications in nanotechnology between1995 and 2003, and (inset) the proportion of applications in 2003 insix subfields defined by the European Patent Office. b, Number ofpatent applications from the Americas, Asia and Europe.

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The world according to nano

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Market Analysis - Major Results

Nanopnrticde world market by application area. Total 2000 market was S492.5million. Total 2005 market expected to be $900.1 milliort. (a) energy, curtalytic andstntctitml applicwtiotts; (b) biomedical, phannacerttical and cosmetic applications;

and (c) elecwonic, magnetic and optoelectronic applications).

Source: Business Communication Co. Inc.

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A FEW TARGETS FORNANOSCIENCE/TECHNOLOGY

ADVANCED MATERIALS FIVE-MINUTE HEALTH SWAB TEST INTERACTIVE GLUCOSE SENSING, DOSING HUMAN REPAIR

OPTICAL COMPUTERS GREASELESS SUNTAN LOTION NONFREEZING WINDSHIELDS STAINLESS TIES FOR SOUP SPILLERS SELF-MONITORING FOOD PACKAGING

NEURONAL INTERFACES FULLY TARGETED DRUG DELIVERY HEATLESS LIGHT TRULY EFFICIENT SOLAR RADIATION CAPTURE

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We should close this office.. Everything thatneeds to be invented, is already.. Director, US Patent Office, 1929

A few computers should be enoughfor the society!Watson (IBM Watson Center fame)

640k should be enough for everyone!Bill Gates, 1982

Infectious diseases is now history..Surgeon General, 1959

True or False?

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Technology Outlook

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Introduction to Nano-scale systems

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DhakaBangladesh

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Dhaka city National Parliament

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Lake Tree top

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Oak branch and leaves Oak leaf (actual size)

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Leaf surface, 10x enlargedOak leaf (actual size)

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Leaf surface, 100x enlarged Many cells

HUMAN HAIR

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Individual cells Cell nucleus

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Chromatin structure DNA double strands

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Individual molecules and atoms

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The Interesting Length Scale

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size-dependent behaviors

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Size-Dependent Properties

At the nanometer scale, properties become size-dependent. For example,

(1) Thermal properties melting temperature

(2) Mechanical properties adhesion, capillary forces(3) Optical properties absorption and scattering of light

(4) Electrical properties tunneling current

(5) Magnetic properties superparamagnetic effect

New properties enable new applications

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At the nanoscale

Properties can become

SIZE-DEPENDENT

EXAMPLES STAINED GLASSMELTING POINTS OF METAL NANODOTS

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Melting Temperature

e.g., 3 nm CdSe nanocrystal melts at 700 Kcompared to bulk CdSe at 1678 K

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Mechanical Properties

At the nanoscale, surface and interface forcesbecome dominant. For example,

(1) Adhesion forces(2) Capillary forces

(3) Strain forces

Surface coatings are extremely important toprevent sticking in nanoscale electro-mechanicalsystems (NEMS)

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Optical Absorption

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Modern Use of Nanoparticles: Biosensors

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Electrical Properties:Tunneling Current

At the nanometer scale, electrical insulatorsbegin to fail to block current flow.

Quantum mechanical effect known as tunneling. Tunneling current increases exponentially as the

thickness of the insulator is decreased.

Tunneling is the basis of the scanning tunneling

microscope and covalent chemical bonding.

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Why Nano

The discovery of novel materials, processes,and phenomena at the nanoscale, as well as thedevelopment of new experimental andtheoretical techniques for research provide fresh

opportunities for the development of innovativenanosystems and nanostructured materials.Nanosystems are expected to find variousunique applications. Nanostructured materials

can be made with unique nanostructures andproperties. This field is expected to open newvenues in science and technology

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A chip or an integrated circuit (IC) is a small electronic device made out of asemiconductormaterial. The integrated circuit consists of elementsinseparably associated and formed on or within a single SUBSTRATE(mounting surface). In other words, the circuit components and allinterconnections are formed as a unit. The first integrated circuit wasdeveloped in the 1950s by Jack Kilby ofTexas Instruments and RobertNoyce of Fairchild Semiconductor. Integrated circuits are used for a variety

of devices, including microprocessors, audio and video equipment, andautomobiles. Integrated circuits are often classified by the number oftransistors and other electronic components they contain:

* SSI (small-scale integration): Up to 100 electronic components per chip* MSI (medium-scale integration): From 100 to 3,000 electronic

components per chip* LSI(large-scale integration): From 3,000 to 100,000 electronic

components per chip* VLSI(very large-scale integration): From 100,000 to 1,000,000 electronic

components per chip* ULSI(ultra large-scale integration): More than 1 million electronic

components per chip

Definitions of ICs

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Definition of MEMS

Micro electromechanical systems(MEMS), or micromachining (also micro-manufacturing and microfabrication), inthe narrow sense, comprises the use of aset of manufacturing tools based on batch

thin and thick film fabrication techniquescommonly used in the integrated circuitindustry or IC industry. This involvedoriginally mainly Si based mechanicaldevices.

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Why miniaturization?

Minimizing energy and materials use inmanufacturing

Redundancy and arrays

Integration with electronics, simplifyingsystems (e.g., single point vs. multipointmeasurement)

Reduction of power budget

Faster devices

Increased selectivity and sensitivity

Wider dynamic range

Exploitation of new effects through the

breakdown of continuum theory in themicrodomain

Cost/performance advantages

Improved reproducibility (batchconcept)

Improved accuracyand reliability

Minimal invasive ( e.g. mosquitoproject)

Do we have a choice? (see nextviewgraph- - the Law of AcceleratingReturns)

probiscus is about 75 m

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Evolution (sophistication) of life-forms ortechnology speeds up because they are buildon their own recorded degree of order. RayKurzweil calls this The Law of AcceleratingReturns*

This Law of Accelerating Returns gave us evergreater order in technology which led to

computation -- the essence of order. For life-forms DNA provides the record. In thecase of technology it is the ever improvingmethods to record information.

Moores law ** (based on a temporarymethodology i.e., lithography) is only anexample of the Law of Accelerating Returns.

Beyond lithography we may expect furtherprogress in miniaturization based on DNA,quantum devices, AFM lithography, nanotubes,etc.

*Ray Kurzweil in The Age of Spiritual

Machines

** See next viewgraph

Why miniaturization?

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Why miniaturization?

Moores Law: The observation that the logic densityof silicon integrated circuits (ICs) has followed a curve(bits per square inch/transistors) = 2(t - 1962) where t isthe year. The amounts of information storable on a

given amount of silicon roughly doubled every yearsince the technology was invented. This relation, firstmentioned in 1964 by semiconductor engineerGordon Moore (who co-founded Intel four years later)

held until the late 1970s, at which point the doublingperiod slowed to 18 months. The doubling periodremained at that value up to late 1999. Moore's Lawis apparently self-fulfilling.

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Summery