MIPI DevCon 2016: How MIPI Debug Specifications Help Me to Develop System SW
Eragon 820 SOM | Development Kit · 2018. 3. 23. · D ev lopm n tKi : EIC -Q8 2 01 |...
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Transcript of Eragon 820 SOM | Development Kit · 2018. 3. 23. · D ev lopm n tKi : EIC -Q8 2 01 |...
eInfochips is a Product Engineering Solutions company recognized for leadership by Gartner, Frost &
Sullivan, NASSCOM and Zinnov. eInfochips has contributed to 500+ products for top global companies, with
more than 10 million deployments across the world. The company is debt-free and profitable since
inception in 1994.
Qualcomm Adreno and Qualcomm Quick Charge are products of Qualcomm Technologies, Inc. Qualcomm, Snapdragon, Adreno and Quick Charge are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Used with permission.
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Connectivity (QCA6174)WiFi + BT Antenna: 802.11ac 2X2 MU-MIMO 2.4GHz/5GHz WiFi & BT 4.1LE WGR7640 GPS/GNSS Gen8C Qualcomm® IZat™ Gen 8C GPS
AudioWWCD9335 Audio Codec 1x Headset2x Stereo Speaker1x Earpiece3x Analog Mic, 3x Digital Mic2x Analog outHDMI audio 7.1
USBUSB1xUSB3.0 (Host/OTG), 1xUSB2.0 (Host)
Ethernet1x 10/100/1000 Mbps Fast Ethernet with RJ45 connector
Camera3x 4-lane MIPI-CSIUUpto 4 cameras can be supported (4:4:2:1 lanes).Maximum 2 cameras can stream concurrentlyDual ISP supports upto 28MP
DisplayMIPI-DSI Two 4-lane DSI i.e. DSI0 and DSI1. Can also be used as Dual DSI (8-lane)3840x2400 or 4096x2160 @ 60FPS using Dual DSI1920x1200 with single 4-lane DSI0/1WiWireless Display – 3840x2160 @ 60FPSHDMI
Upto 4096x2160 @ 60 FPS
VideoEncode
Supported formats: H.265, H.264 BP/MP/SP, MPEG-4 SP/ASP, H.263 P0, VP8, HEVC Main1x in1x instance of 3840x2160 @ 30 FPS or 4096x2160 @ 24 FPS1x instance of 1080p @ 60 FPS2x instance of 720p @ 30 FPS
DecodeSupporSupported formats: H.265, H.264 BP/MP/SP, MPEG-4 SP/ASP, H.263 P0, VC1 SP/MP/AP, MPEG-2 MP, DivX 3.11/4/5/6, VP8, VP9, HEVC Main, HEVC Main103840x2160 @ 60 FPS4096x2160 @ 60 FPS
Memory/StorageMemory: 4GB LPDDR4 RAM (1866MHz )SStorage: 32 GB UFS 2.0 Flash 1-lane, gear 3, eMMC 5.1 16GB (optional)
OthersAccelerometer, Gyroscope and MagnetometerSnapdragon Sensor Interface connector
1x SPI, 1x UART, 2X MI2SLow Speed Expansion Connector 1x SPI / UART / I2C / PCM, 5x GPIO4K HDMI Input using t4K HDMI Input using two CSI 4 lane ports 1x PCIe v2.1 slot for WiGig/PCIe based SATA16KB EEPROM, RGB LEDs, Real time clock, SLIMBUS
System SoftwareAndroid 7 (Nougat)Linux Linaro 16.09WindWindows (Planned)
Mechanical specificationSOM - 53mm x 25mm x 4.8mmCARRIER - 110mmx85mm (Approx.)Weight
SOM Weight : ~15 gm (Approx.)SOM + Carrier : ~65 gm (Approx.)
TTemperature specificationAmbient Temperature Range: -35c to +80c
SOM: EIC-Q820-200Development Kit: EIC-Q820-210
www.eragon.einfochips.com | [email protected]
APQ 8096SOM
MIPI CSI 4-Lane
MIPI DSI 4-Lane
HDMI 2.0
1xSLIMBUS
BLSP8_I2C
2 x MI2S
VBATT+
1 x UART, 1 x SPI
1x UART, 1x I2C, 1x SPI,1x PCM, 5 GPIO
VCC_3.8V
SSC BLSP8_UART
1x USB 3.0 Host/OTG
1x USB2.0 Host
BLSP6_I2CPCIe_2
PCIe-1USB 2.0
PCIe 2
BLSP UART
USB 3.0
JTAG
SSC
Pow
er
GPS
WiF
i+BT
BLSP
SSC
MI2
S
SDC2 VCOIN
MIPICSI0/1/2
MIPIDSI0/1
HDMI 2.0
SLIM BUS
I2C
CSI 0
/1/2
Conn
ecto
r3.
5mm
Head
set J
ack
2x A
udio
Expa
nsio
n Co
nn
DSI 0
/1Co
nnec
tor
HDM
ICo
nn
Audio Codec&
2x SpeakerAmplifier
EEPROM 128kb
I2C-16 BitGPIO Expander
CONN X.FL
U.FL CONNCONN X.FL
ON CHIP ANT
Sensor Core + MI2S,EXP Conn-2
Li-Ion BatteryConnector
Low Speed (BLSP + GPIO)EXP Conn-1 U.FL CONN
PCIe Slot(x1)
RTCCoin Cell
Micro SDConnector
Micro USBDebug Conn
Micro USB3.0 Conn
Accelerometer+ Gyroscope
+ Magnetometer
PCIe to ethernetController
USB Hub2x USB 2.0 and
Gb ethernet stack
