Low Emissions Development Strategies (LEDS) Training Sept 9, 2013
Epitaxy in the development of LEDs
Transcript of Epitaxy in the development of LEDs
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Epitaxy in the development of LEDs
Jean-Yves Duboz CRHEA-CNRS
Valbonne Sophia Antipolis
PULSE SCHOOL, September 14-18, 2015, Porquerolles
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CRHEA
Nice Airport
Antibes
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Epitaxy (GaN, ZnO, SiC, graphene)
Characterization (structural, optical)
Device fabrication (LED, laser, transistors….)
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History of LEDs • LED first discovery : the first known observation of electroluminescence
was made in 1907 by H. J. Round using SiC Schottky diode.
• In 1955, Rubin Braunstein of the Radio Corporation of America reported on infrared emission from gallium arsenide (GaAs) and other semiconductor alloys, patented in 1961
• In 1962, Nick Holonyak Jr., of the General Electric Company developed the first practical visible-spectrum LED. He is seen as the "father of the light-emitting diode”.
• In 1972 first yellow LED and 10x brighter red and red-orange LEDs (by George Craford)
• 1993 Shuji Nakamura of Nichia Corporation of Japan demonstrated the first high-brightness blue LED based on InGaN. Beginning of the quest for white LEDs for solid state lightning. Nobel prize 2014.
http://www.myledpassion.com/History/History-of-leds.htm
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LED
530 630 670 400 450 480 550 580
AlGaInP GaAs
Lambda (nm)
265
AlGaInN
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LED
LED for signaling (traffic light), displays… Monochromatic emission: low tolerance Δλ< few nm Low- medium power 10-50 mW
LED for lighting Color rendering index, white temp.
High power: W High efficiency !
Initial business Current business
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LED Metal contacts
substrate
n-GaN
p-GaN
QWs GaInN/GaN
1 mm x 1mm
few mm
V∼4V
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N type contact
P type contact
hγ
1 electron + 1 hole ⇒ 1 photon : Int. Quantum Eff. = 1 Photon escapes from LED: Extraction Eff. = 1 ⇒ EQE = 1 V~Eg barrier
Pelec= V × I ~ Egb × I Popt= hγ × Φ= hγ × I ⇒ WPE = Popt / Pelec= hγ / Egb ~ 1
V
Ideal world
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n contact
p contact
hγ V> Egb
Raccess n
Raccess p
ηinj < 1
Heat: IQE < 1
Carrier confinement at RT: deep QW Egb > hγ
Real world
V~Eg barrier + Raccess × I
WPE = hγ / V × ηinj × IQE × EE
EQE < 1 < 1
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What can the epitaxy do to address these issues ?
• Almost everything … if processing and design are OK • Nothing if not !
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n contact
p contact
hγ V> Egb
Raccess n
Raccess p
ηinj < 1
Heat: IQE < 1
OUTLINE
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hγ Heat
Radiative transitions described by a radiative time τR
Non radiative recombinations described by τNR
NRR
NR
NRR
RIQEττ
τττ
τ+
=+
=/1/1
/1 Minimize τR
Maximize τNR
NB: some non linear phenomena and non exponential transients in particular at high injection. See later.
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Non radiative recombinations
hγ Heat: IQE < 1
τNR decreases with defect density (point defects, dislocations)
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source: S. Nakamura, Nobel lecture
Nitrides more defect tolerant than other SC !!!
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S. Speck and S.J. Rosner, Physica B274. 24 (1999)
IQE
Dislocations and diffusion length
Mean distance between dislocations = DD-1/2
EH pairs do not see dislocations if Ldif< disloc distance
DD=108 cm-2, distance =1µm
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What can epitaxy do on diffusion length ?
Many studies on In fluctuations, localization, S shape in PL versus T, In spinodal decomposition, In Quantum Dots …
Patent issues: are InGaN LEDs based on Q Dots ?
S. Nakamura, Nobel lecture. Chichibu, Nakamura et al., Appl. Phys. Lett., 69(1996) 4188; Nakamura, Science, 281(1998) 956.
Lateral potential fluctuations in QWs (In fluctuation) limit the diffusion length. QW epitaxy is crucial !
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Exciton localisation and S-shape PL
S. Chichibu, T. Azuhata, T. Sota, and S. Nakamura, APL 69, 4188 (1996)
Y-H Cho, G. H. Gainer, A. J. Fischer, J. J. Song, S. Keller, U. K. Mishra, and S. P. DenBaars, APL 73, 1370 (1998)
<50K 70-120K
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Control on In content
Average wavelength = 527 nm
Standard deviation = 1,2 nm ⇔ 5 meV.
Source INDOT (STREP 2008) final activity report by Aixtron
42x2-inch Planetray Reactor T=300K
InGaN MQW
InGaN now very uniform and high IQE ! Different localization scale ? Still an open question !!
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What can epitaxy do on the dislocation density ? GaN substrates grown at equilibrium (2530 °C, 45 atm) or even close to, are extremely difficult to obtain : efforts by Unipress, Poland for 2 decades have led to cm2 samples
• Heteroepitaxy is unavoidable
• No lattice matched substrate (sapphire lattice mismatch 16%, …)
• Need for a transition layer (buffer)
• Thousands of studies, papers, conferences on dislocation density reduction. Nobel prize !
• High performance LED are currently fabricated on GaN with a DD ∼ 108 cm-2 with IQE >90 %.
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Multi step growth on sapphire Yoshida et al, Akasaki et al. , Hiramatsu et al. , Nakamura et al., ….. 1986 to 2014
Time
Tem
pera
ture
, am
mon
ia fl
ow
Uniform growth
Lateral growth
Island growth
Geometric selection of seeds
Nucleation of LT GaN
AlN buffer layer
From B. Gil, GaN school 2015
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))(1)(()(.2
2
2
22
ωωω !!!!
vn
cm
cm
vng
rvcmn ffEEEHmcnvmrE
heG −−−−=
Carriers in the QW : injection
Energy conservation
Wave function overlap
Transition dipole
Radiative transitions described by a radiative time τR ~ 1 / Gmn
E
n
m
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))(1)(()(.2
2
2
22
ωωω !!!!
vn
cm
cm
vng
rvcmn ffEEEHmcnvmrE
heG −−−−=
Material properties
Epitaxy (and design) can have an impact on transition selection rules: remains limited for visible LEDs
Not a critical issue in ” normal” semiconductors (GaAs) but very critical in GaN !
dzzzmcnv mcnv )(*)( ζζ∫=
Envelope functions
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Polarization in wurzite nitrides
AlN GaN InN
AlN GaN InN Pspont (C/m2) -0.081 -0.029 -0.032
AlN (AlGaN) in tension on GaN
InN (InGaN) in compression on GaN
Psp Psp Psp
Psp Psp Ppiezo
Ppiezo
• Piezoelectric polarisation due to strain:
• Spontaneous polarisation :
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Polarization in heterostructures
zPz
zF
∂
∂−=
∂
∂
εερ 1)(
PFr
Δ−=Δεε 0
1Across an interface along z :
ΔP=PAlN – PGaN ≈ 0.05-0.1 C/m2
ΔF=FAlN – FGaN ≈ ΔP /ε0εr ≈ 6-12 MV/cm
Enormous internal field discontinuity at the interface !
energy
z
PdivFdivεε
ρ 1−=
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Quantum Confined Stark Effect
Polarization in wurzite nitrides In quantum wells:
E E’< E
The energy redshifts and the wavefunction overlap decreases:
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Quantum Confined Stark Effect
Polarization in wurzite nitrides
E’< E
0/)(*)( WWmcnv
QWedzzzmcnv −≈= ∫ ζζ
qweFWEE −= 0
hole wavefunction decreases exponentially towards the electron wavefunctions or vice versa
crude model
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Polarization in wurzite nitrides
Radiative lifetime measured in InGaN QWs
P. Lefebvre et al, APL 78, 1252 (2001)
Exponential decrease in large QWs
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Polarization in wurzite nitrides
M. Crawford, IEEE J. OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 15, 4, (2009)
Stark effect is one of the reasons why green LEDs and lasers are less efficient than blue ones (green gap)
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Non/semi polar materials
Growth along c: polar
Growth ⊥ c: non polar
F = 0
Growth ≠ c: semipolar
F weak
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Non/semi polar materials Approach Result and problems Solutions
Substrates with various cuts (Si, SiC, sapphire…)
Large surface Dislocations (>109 cm-2) and stacking faults (105 cm-1)
Try new substrates. Optimize growth conditions
GaN crystal grown along c and cut in oblique direction
High quality material (Mitsubishi, Sumitomo) High performance LEDs and lasers (UCSB…) Small size
Increase initial thickness
Localized epitaxy on inclined facets
High quality Small size or problems of coalescence
Be smart to filter defects during lateral growth
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SP GaN
Semicond. Sci. Tech. 27 (2012) 024004
Localized + lateral epitaxy
Differents steps with varied growth conditions
Start up project from CRHEA
F. Tendille
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Epitaxy choice • Non/semipolar material
– Short τR is good if τNR remains long • Polar material with thin QWs ⇒ large
confinement energy ⇒deeper QWs needed for the same transition energy ⇒ more Indium ⇒ new problems: – Strain, possible plastic relaxation, dislocations – Spinodal decomposition of InGaN
(thermodynamic instability).
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Decomposition of Ga1-xInxN GaN and InN have very different atomic radii èPhase separation
Calculated GaInN alloy phase diagram
Ho and Stringfellow APL 69 2701 (1996)
unstable
stable Very low solubility of InN in GaN
Dynamics of phase separation is thermally activated : InGaN can be grown at low temperature
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Ultimate problem : droop Reduction of the quantum efficiency at high injection
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Origins of the efficiency droop
rate ~ n2p
Auger recombination processes
J. Iveland, L. Martinelli, J. Peretti, J.S. Speck, and C. Weisbuch, Phys. Rev. Lett. 110, 177406 (2013).
Carrier overshoot
IQE
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Solutions to the droop Auger recombination processes Non radiative rate ~C n3
Reduce n for a constant I
Increase well width
• QCSE
• Strain issues
Increase well number
Strain issues
Epitaxy !!
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))(1)(()(.2
2
2
22
ωωω !!!!
vn
cm
cm
vng
rvcmn ffEEEHmcnvmrE
heG −−−−=
Epitaxy (and design) can have an impact: remains limited for LEDs
Many epitaxial parameters:
• Polar / non polar
• Strain
• Barrier composition and thickness
• QW composition and thickness
Carrier injection
Large hole and electron densities in the QW
Doping
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AlGaInN
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Donors
Si+ e-
yr
e Rmm
E 20
1ε
=
1/µ=1/me + 1/mSi ≈ 1/me
Donor energy renormalized at high concentration
E=E0-βn1/3 with β=10-8 eV/cm
Large donor energies are expected in nitrides (37 meV)
energy
r r
energy
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Donors in GaN - AlGaN
B. Borisov, APL 87,132106 (2005) Taniyasu, APL 81, 1255 (2002)
O : shallow donor in GaN (26 meV) but deep level in AlGaN
Si: shallow donor in GaN (25 meV), deeper in AlGaN (250 meV)
Conclusion: n-doping by Si (Ge for reducing strain, not used for LEDs)
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Acceptors: Mg
Mg- h+
yr
e Rmm
E 20
1ε
=
1/µ=1/mh + 1/mMg ≈ 1/mh
EMg = 220 meV
⇒ Low ionization ratio
⇒ Large Mg densities necessary: 5×1019 cm-3 for p=5 ×1017 cm-3
⇒ Large energy renormalization:
E=E0-βn1/3=180 meV (β=10-8 eVcm)
Very large acceptor binding energies are expected in nitrides (168 meV with mh=1): not hydrogenoid !
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Acceptors: alternatives to Mg ?
Journal of Applied Physics 61, 4589 (1987)
Conclusion: p-doping by Mg
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Yan et Wei phys. stat. sol. (b) 245, No. 4, 641–652 (2008); Zunger 2004
Donor case
Ef (d, q) = E t (d) – E t (0) + µ i d + q E Fermi
Acceptor case
Ef (d, q) = E t (a) – E t (0) + µ i a - q E Fermi
Thermodynamic ionised defect formation energy and compensation mechanism
n-type p-type
Mg acceptor: other problems
In p type materials, the Ga/Mg substitution becomes more difficult: other insertion sites where Mg is not active
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The solution: with H, Mg is not active during epitaxy, better Mg incorporation in Ga substitution. H is eliminated afterwards (LEEBI or annealing)
From Amano Nobel lecture
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Electron and hole densities in GaN Si doping:
n=1017-1020 cm-3
Mg doping
P ~ 5×1017 cm-3 for Mg= 5×1019 cm-3 MOCVD
P ~ 1018 cm-3 MBE : less compensation as less thermodynamic because lower temperature (which is good for InGaN QWs), less H2
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Carrier injection
hγ
ηinj < 1 Under high injection, the carrier densities close to the QW are proportional to the densities in the doped layers: J=e×n×µ×F
Jn=e × n ×µn × Fn
Jp=e × p ×µp × Fp
Smaller than for n
In the barrier: Jn> Jp
In the QW, if recombinations are radiative only, Jn=Jp
⇒ Electrons injected in p side with non useful recombination
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Carrier injection
hγ
ηinj = 1
Electrons are blocked (EBL), accumulate in the QW. The field redistribute, is larger on p side, the hole current increases. The electron current decreases
Finally, Jn=Jp in the whole structure
Jn=e × n ×µn × Fn
Jp=e × p ×µp × Fp
Epitaxy of the EBL with optimized parameters (height, width, doping profile)
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Access resistance n contact
p contact
hγ V> Egb
Raccess n
Raccess p
n type contact: ρ ~ 10-5 Ωcm2
p type contact: ρ ~ 10-3 Ωcm2 (epitaxy optimized close to the surface): @ 100 Acm2, ΔV=0.1V
Crucial for the WPE
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Substrates for LEDs
All major players on sapphire:
• The MOVPE process is now well mastered
• Transparent but is removed sometimes (thermal, backside contact)
• Price is decreasing and size increasing
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LED production
Source: Canaccord, estimate model. Presentation by Semi
• 40 Bmm2=8 soccer fields / year
• 5 Million substrates (4 inch)
• Installed capacity is large enough
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Wafer size increases
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Source: Canaccord, estimate model. Presentation by Semi
Sapphire wafer price forecast ($)
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Substrates for LEDs Some players on Si (111): Plessey (UK), Toshiba (JP), Lattice power (Ch), Samsung (Kr), OSRAM (Ge), LG (Kr), Epistar (Kr), Novagan (Sw) • Large area (lower epitaxy and processing costs) • Easy back process : Si is removed • Epitaxy is more tricky but almost similar performance can be reached
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Substrates for LEDs Si (100): : epitaxy difficult for 2D layers as the square surface symmetry induces two domains of wurzite material twisted by 90°. OK for nanowires ⇒ ALEDIA (Grenoble): Si (100) 8 inch
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Substrates for LEDs
GaN substrate (Soraa): better cristalline quality, higher efficiency, light extraction by simple process (triangular shape)
WPE=84% @ 1 A/cm2
⇒All individual η close to unity !
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Growth technique MBE MOVPE
Point defects Higher Tg
Dislocations Lateral growth
N doping OK OK
P doping Less H problem Lower Tg : less compensation, better for QW grown below
InGaN More localisation ? Less point defects ?
InN
Low Tg (P-MBE)
Throughput Developed large systems
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White from color mixing
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.70.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
B2B1
A3
A2
A1
white
blue
orange
green
y
x
Black body equivalent temperature : warm white (red) = lower T. Cold white (blue) = higher temperature
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Phospors versus RGB
Integrated approach (epitaxy): ideal solution but still less efficient and more complicated
Usual approach: Blue/yellow conversion
Phosphore (Y3Al5O12:Ce3+ )
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400 500 600 700 8000
100
200
300
400
500
600
700
eye
lum
inou
s ef
ficie
ncy
wavelength(nm)
photopic (day)
Eye perception of light and lumen
1 lumen is the luminous flux of a monochromatic source at 555 nm with a power = 1/683 W
Maximum at 555nm (not a coincidence !!)
Average value from 430 to 630 nm : 350 lum / W
∼ Ideal lighting source for humans
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Historical perspective on LED efficacy
Source: Amano Nobel lecture
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1920 1940 1960 1980 2000 20200
50
100
150
200
250
300
FluoCompact
tube fluo
sodium
LED commercial
LED R&D
Effi
caci
té (l
um /W
)
Année
Historical perspective on efficacy for lighting
Revolution rather than evolution !
Best LEDs close to the limit !
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Roland Haitz and Jeffrey Y. Tsao, physica status solidi (a), Volume 208, Issue 1, pages 17–29, (2011)
Haitz’ Law: Cost ↓10x & Performance ↑20x per decade.
About $2/klm in 2015 (1 klum is the output of former 60W incandescent bulbs)
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Source US DOE 201107
Epitaxy is the enabling technology but is only part of the cost
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CONCLUSION
• Tremendous efforts in academic and industrial R&D have been dedicated to epitaxy for LEDs
• But epitaxy is only part of the game: design, process, packaging…and economic issues
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2. vcrE Dipolar matrix element rvc : Intrinsic parameter which
depends on the band structure of the QW material
-35 -30 -25 -20 -15 -10 -5 0
Eg
Valence band
Conduction band
2S
N
4S
Ener
gy (e
V)
2p x,y,z
4p x,y,z
Ga Spherical symmetry
xyz: wurzite symmetry
Let us take the complicated case of GaN:
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Valence band structure of GaN:
• x,y and z not equivalent in wurtzite (crystal field)
• spin orbit coupling small (light atoms) Similar value
wavefunctions
Transition polarisation:
• A (x,y) ⇒ E in x,y plane, ⊥c
• B,C (xyz) ⇒ any E, amplitude depends on z/x,y ratio
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Strain modifies the crystal field and the valence band structure: energy and change
A
B
C
B⇒z C⇒xy
C⇒xy
Wavefunctions:
Wavefunctions:
B⇒xy
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3450 3460 3470 3480 34900.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
raie A
raie B
raie C
raie B
raie C
Forc
e d'
osci
llate
ur e
n po
laris
atio
n σ
et π
Energie de la raie A (meV)
strain extension compression
There is some choice (substrate, buffer layer, growth conditions…) on the strain state during the epitaxy to favor one transition or another.
Not so important for GaN, but more important for AlGaN where the top valence band become A (emitting along z) + B (emitting in the xy plane)
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Another famous example: strained InGaAs laser
The in plane effective mass becomes smaller
⇒ the effective density of states decreases
⇒ the threshold decreases
InGaAs the VB degeneracy is lifted.
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Polarization on the atomic level
θ
θ
u
u 2D
4D
3D
04321 =+++ DDDD
cDand
DDDDD
//4321 =+++
Ideal tetrahedron Real distorted tetrahedron*
u1
θ1
θ2
u2
c 1D
2D4D
3D
D 1D
*picture should include the electron cloud and not the atoms only (not marbles !): the distorsion comes from third neighbours environment
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Wurzite nitrides Spontaneous polarization: distorsion of the cell / ideal structure (c shorter, c/a <1.633)
Growth on a substrate with a larger a
⇒ tensile stress, deformation of the cell, increase of a and decrease of c
⇒ piezoelectric polarization added to the spontaneous polarization
Growth on a substrate with a smaller a
⇒ Compressive stress, deformation of the cell, decrease of a and increase of c
⇒ piezoelectric polarization opposite to the spontaneous polarization
u2
θ1↓
θ2↑
c 1D
2D4D
3D
D↑
c θ1 ↑
θ2 ↓
1D
2D4D
3D
D↓
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0 20 40 60 80 100
-0.14
-0.12
-0.10
-0.08
-0.06
-0.04
-0.02
0.00
AlGaN /GaN substrate
total
spontpiezo
Pol
ariz
atio
n (C
/m2)
Al content (%)
Polarization in wurzite nitrides
0 20 40 60 80 100-0.05
0.00
0.05
0.10
0.15
0.20 InGaN / GaN substrate
total
spont
piezo
Pol
ariz
atio
n (c
/m2)
In content (%)
For strained heterostructures :
P AlGaN < P GaN< P InGaN
Polarization in AlGaN Polarization in InGaN
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Lattice location of hydrogen in Mg doped GaN
Wampler et al, JAP 90, 108 (2001) Measurements by ion channeling to examine the lattice configuration of hydrogen in Mg doped GaN