EPC9149: 36 - 60 V Input, 9 - 15 V, 83 A Output Fixed ...

Revision 3.2

EPC9149: 36 - 60 V Input, 9 - 15 V, 83 A Output Fixed Conversion Ratio1 kW LLC, 1/8

th Brick Size ModuleQuick Start GuideEPC2218 and EPC2024

http://epc-co.com/epc

QUICK START GUIDE EPC9149 1 kW LLC 1/8th Brick Module

EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2021 | | 2

DESCRIPTION The EPC9149 demonstration board is a 1 kW, 48 V input to 12 V output LLC converter that operates as a DC transformer with fixed conversion ratio of 4:1. The simplified schematic diagram is shown in Figure 1. It features the 100 V rated EPC2218 and 40 V rated EPC2024 GaN FETs, the uP1966E and LMG1020 gate drivers as well as the Microchip dsPIC33CK32MP102 16-bit digital controller. Other features include:

• Peak efficiency: 97.5 % at 400 W• High full-load efficiency: 96.7% @

12 V delivering 83.3 A output• 22.9 × 58.4 mm (0.90 × 2.30 inches)• Low profile: 10 mm total converter

thickness without heatsink• Temperature rise: 70°C @ 12 V with

83.3 A output (with heatsink kit installed)

• Fixed switching frequency: 1 MHz• Soft startup into full resistive load• High power density: 1227 W/in3

(excluding pins)

REGULATORY INFORMATIONThis converter is intended for evaluation purposes only. It is not a full-featured converter and cannot be used in final products. No EMI test was conducted. It is not FCC approved.

FIRMWARE UPDATESEvery effort has been made to ensure all control features function as specified. It may be necessary to provide updates to the firmware. Please check the EPC website for the latest firmware updates.

EPC9149 board

Figure 1: Simplified schematic diagram of the EPC9149 LLC Module

Housekeepingpower supply

3.3 V 5 V

PWM’s

Measure Measure

Gate drive signals

CIN COUT

Q1

CrTR1

SR2

SR6

SR1

SR5

SR4

SR8

SR3

SR7

Lr 2:1:1

TR22:1:1

Lm

Lm

Q3

Q2

Q4

VIN

VOUT

VINVOUT

Digitalcontroller

Gate drivers

Power stage

Table 1: Electrical Characteristics (Ta = 25 °C unless specified otherwise)Symbol Parameter Conditions Min Typ Max Units

VIN Input Voltage 36 48 60V

VOUT Output Voltage Fixed ratio of 4:1 based on VIN 12

IOUT Output Current Continuous* 0 83.3 A

fS Switching Frequency 1 MHz

Trise Temperature RiseVIN = 48 V, IOUT = 83.3 A, thermal system installed, 400 LFM forced air, measured at heat-spreader

70 °C

VIN,on Input UVLO turn on voltage 7.5V

VIN,off Input UVLO turn off voltage 5.5

tOUT,rise Output voltage rise time 3 ms

* Requires adequate cooling

https://epc-co.com/epc/Products/eGaNFETsandICs/EPC2218.aspx

https://epc-co.com/epc/Products/eGaNFETsandICs/EPC2024.aspx



HIGHLIGHTED PARTSThis converter is intended for evaluation purposes only. It is not a full-featured converter and cannot be used in final products. No EMI test was conducted. It is not FCC approved.

Power StageThe EPC9149 features a primary side full bridge and a dual secondary side center tapped half bridge configuration based on EPC2218 and EPC2024 eGaN fets. Available from EPC’s website (epc-co.com) are EPC2218’s datasheet and EPC2024’s datasheet.

Onboard power supplyThe EPC9149 board includes logic and gate driver house-keeping power supplies that are powered from the main input supply voltage to the LLC board.

Input and output voltage senseInput and output voltages are measured by resistor dividers and fed back to the microcontroller to be used for control purposes.

Transformer coreThis module uses a customized transformer core with ML91S material from Hitachi metals (part number: U-36-4.57-12.2) which offers low core loss at high frequency operation. The drawing and dimensions of this core is shown in Figure 12. Two half core sections are inserted from top and bottom side of the board as shown in Figure 2 below. Proper spacers are also added in between to achieve the required magnetizing inductance.

Three layers of 2.5mils Kapton tap adding up to 7.5mils total thickness was used as spacer on each center pillar as shown in Figure 12. Very thin straps help to wrap the cores tightly together.

MECHANICAL SPECIFICATIONS

Top view

10 mm

22.9 mm

58.4 mm

3.5 mm

Figure 2: EPC9149 mechanical dimensions

https://epc-co.com

https://epc-co.com/epc/Portals/0/epc/documents/datasheets/epc2218_datasheet.pdf

https://epc-co.com/epc/Portals/0/epc/documents/datasheets/epc2024_datasheet.pdf



Stando�s (4x)

Input voltage measurement Output voltage measurement

Inputvoltage Output

voltage

QUICK START PROCEDURE The EPC9149 LLC converter module is easy to set up for evaluation. Refer to Figures 3-4 and follow the procedure below for proper connection and measurement setup:

1. EPC9533 is the motherboard for EPC9149 where the main input and output power connections are located.

2. Attach the standoffs for EPC9533.

3. With power off, connect the input power supply to VIN+ and VIN- as shown in Figure 3.

4. With power off, connect the load to VOUT+ and VOUT- as shown in Figure 3.

5. Connect the input and output kelvin connections shown in Figure 3 to the respective measurement instruments.

6. Apply the input voltage and once operational, adjust the load within the operating range and observe the efficiency, temperature and other characteristics.

7. For shutdown, please follow the above steps in reverse. (The input supply can be turned off as well)

In order to measure the input and output currents, proper shunts can be connected in series with the corresponding connections. (input supply and load, respectively)

Figure 3: EPC9149 and motherboard assembly showing the input and output connections

Top view



ELECTRICAL and THERMAL PERFORMANCE

Figure 4: Total system efficiency and loss @ 12V output, 48V input voltage, 400LFM forced air cooling.

0

98

97

96

95

94

93

92

91

40

35

30

25

20

15

10

550 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 972

POUT (W)

E�cie

ncy (

%)

Loss

(W)

The module provides maximum efficiency of 97.5% and full load efficiency of 96.7%.

Thermal performance The measured thermal performance of the EPC9149 is shown in Figure 7, with the heatsink kit installed. The temperature rise for the hottest portion of the board is 70 °C when operating at full load with 400 LFM forced air cooling.

Figure 5: Thermal image of the EPC9149 operating at 48 VIN , 12 V and 83.3 A output, thermal steady state reached after 10 minutes, Top: primary FET junction temperature and

Bottom: highest board temperature.

969492908886848280

0 2 4 6 8 10

Time (minutes)

Tem

pera

ture

(°C)



THERMAL DERATINGWithout sufficient thermal management, the output current capability is reduced. If the user decides to uninstall the heatsink, the module temperature should be monitored to ensure the maximum temperature does not exceed the rating.

THERMAL MANAGEMENT Thermal management is very important to ensure proper and reliable operation. The EPC9149 is intended for bench evaluation at normal ambient temperature. The addition of a heat-spreader or heatsink and forced air cooling can significantly increase the current rating of the power devices, but care must be taken to not exceed the absolute maximum die temperature of 150°C.

A combination of custom shape heat spreaders and a finned heatsink for the top and bottom side of the EPC9149 board are designed. The thermal solution assembly is shown in Figure 6. Copper heat spreaders (item 1 and 3) are placed on top of both primary and secondary side FETs to spread their heat to the outer structure. Two 1 mm height copper shims (item 2) are used to fill the gaps and help with cooling the board surface. It only requires a gap filler TIM to be added underneath of the heat spreader pieces to provide insulation and high thermal conductivity between the components and the metal surface of heat spreaders. Several mechanical shims help mounting the heat spreader on the PCB surface and maintaining required clearance between the heat spreader and component surfaces. Mechanical screws are inserted on the board to hold the entire mechanical structure together.

A step-by-step assembly guideline are presented. The needed parts are listed below.

– 2x heatsinks for top and bottom side (not identical)

– 2x Copper (Cu) heat spreaders for primary FETs (item #1)

– 2x M1.4 16 mm screws and 2x M1.4 nuts

– 2x M2 10 mm screws

– TIM pads TG-A1780 0.5 mm

– TIM pads TG-A6300 0.5 mm

– TIM gap filler Bergquist GF4000

Drawings and dimensions of these parts are provided in the Mechanical Bill of Materials (BOM) and in Figures 10, 11 and 12.

Bottom side

Figure 6: Thermal solution assembly process for the EPC9149 module

M2 x 10 mm screws (2x)

Top heatsink

Heatsink TIM

(3)

Secondary FET TIM (8x)

Secondary FETs

M1.4 x 16 mm screws (2x)M1.4 nuts (2x)

(1)

(2)Primary FET TIM (2x)

Primary FETs

Top side

M2 x 10 mm screws (2x)Top heatsink

Heatsink TIM

(3)

Secondary FET TIM (8x)

Secondary FETs

M1.4 x 16 mm screws (2x)M1.4 nuts (2x)

Copper heat spreader(topside)

(1)

(2)Primary FET TIM (2x)

Primary FETs



THERMAL SOLUTION ASSEMBLY GUIDELINES

1. Beginning at the top face of the PCB, note the position of the primary and secondary FETs

2. Add a small amount of TIM gap filler (Bergquist GF4000) on PCB next to Primary FETs

3. Place TIM pads (TG-A1780) on the primary and secondary FETs (Figure 12)

4. Place heat spreaders on the FETs, making sure the holes align with the drill holes on the PCB

Note: The two Cu heat spreaders for top and bottom sides are not identical (Figure 11)

5. Place TIM pad (TG-A6200) on the backside of the heatsink (flat side) and align it to PCB holes (Figure 12)

6. Use M1.4 and M2 screws for assembly as shown in schematic; M2 is connected to threaded flange on PCB, do not fully tighten the M2 screw yet

Primary FETsSecondary FETs

TIM gap filler

TIM pads

Cu heat spreader

M1.4 screws

M2 screws

TIM pad



7. Turn the PCB to the backside and note the place-ment of the FETs

8. Add a small amount of TIM gap filler (Bergquist GF4000) next to Primary FETs

9. Place TIM pad (TG-A1780) cutouts to cover primary and secondary FETs (Figure 12)

10. Place copper heat spreader on FETs, holes must align with PCB holes and the M1.4 screws

Note: The two Cu heat spreaders for top and bottom sides are not identical (Figure 11)

12. Use M1.4 nuts and an M2 screw to assemble heatsink to the PCB as shown; M2 can be con-nected to threaded flange on PCB

M1.4 nuts

M2 screw

Cu heat spreader

TIM gap filler

TIM pads

Primary FETsSecondary FETs

TIM pad

11. Place TIM (TG-A6200) on backside of heatsink and align it to screw holes (Figure 12)



13. Tighten screws in sequence while keeping heatsink parallel to PCB

The choice of TIM needs to consider the following characteristics:

• Mechanical compliance – The TIM becomes compressed during heatsink attachment and exerts a force on the FETs. A maximum compression of 2:1 is recommended for maximum thermal performance and to constrain the mechanical force that maximizes thermal mechanical reliability.

• Electrical insulation – The backside of the eGaN FETs are substrate that are connected to source and the upper FET will thus be connected to the switch-node. The TIM must therefore provide insulation to prevent short-circuiting the upper FET to the ground.

• Thermal performance – The choice of thermal material will affect the thermal performance. Higher thermal conductivity materials will result in higher thermal performance.

EPC recommends T-Global: A1780- 500 µm for the thermal interface material between FETs and heat spreaders and T-Global: A6200 for heatsinks. The gap filler TIM recommended is Bergquist GF4000.



CONTROLLER The EPC9149 LLC power module features a Microchip dsPIC33CK32MP102 Digital Signal Controller DSC. This 100 MHz single core device is equipped with dedicated peripheral modules for Switched-Mode Power Supply (SMPS) applications, such as a feature-rich 4-channel (8x output), 250 ps resolution pulse width modulation (PWM) logic, three 3.5 Msps Analog-To-Digital Converters (ADC), three 15 ns propagation delay analog comparators with integrated Digital-To-Analog Converters (DAC) supporting ramp signal generation, three operational amplifiers as well as Digital Signal Processing (DSP) core with tightly coupled data paths for high performance real-time control applications. The device used is the smallest derivative of the dsPIC33CK single core and dsPIC33CH dual core DSC families. The device used in this design comes in a 28 pin 4x4 mm UQFN package, specified for ambient temperatures from -40 to +125° C.

The dsPIC33CK device is used to drive the converter in a fully digital fashion. Input voltage and output voltage measurements are fed back to the dsPIC and read using two independent core ADCs.

PROGRAMMING The Microchip dsPIC33CK controller can be re-programmed using the MPLAB ICD4 or other Microchip programmer tools and through the 5-pin header on EPC9149 board shown below. RJ11 to ICSP adapter 02-10310-R1 from microchip is used to interface programmer and the main board (Fig. 11(b)). (Please refer to www.microchip.com for available options)

EPC9997 board is designed to be specifically used as an ICSP adapter as shown in Fig. 9(a) as well.

Please make sure the programming is performed only when the module is not running and no input voltage is applied.

Figure 9: Programming connection options

(a) (b)

EPC9997 Microchip adapter 02-10310-R1

https://www.microchip.com/



Programming with HEX fileDownload the latest MPLAB® X IPE from Microchip website and follow the five steps below:

https://www.microchip.com/mplab/mplab-integrated-programming-environment

1. Enable Advanced Mode: 5. Erase device, and then program device:

2. Select Device: dsPIC33CK32MP102 and then apply:

dsPIC33EP256MC506

3. Select programming tool and then connect:

4. Click ‘Browse’ to select the provided .hex file:

Optional: Enable ‘Power target circuit from programming tool’ from left panel ‘Power’ tab so that no additional power supply is necessary during programming:

dsPIC33CK32MP102

dsPIC33CK32MP102



2.11

3.89 27.18

50.00

AA

15.7

0

6.00

21.0

0

11.8

23.

14

Ø1.60

Ø2.50

THERMAL MECHANICAL DRAWINGS

All units in mm

Table 2: Bill of Materials - Thermal-Mechanical components Item Qty Part Description Manufacturer Part #

1 1 Heat Sink Top Side Fischer Elektrik SK 476 50 SA2 1 Heat Sink Bottom Side Fischer Elektrik SK 476 50 SA3 1 Integrated Heat Spreader (Top) Prototype-Shortrun Custom part 4 1 Integrated Heat Spreader (Bottom) Prototype-Shortrun Custom part 5 2 Primary TIM pad T-Global TG-A1780 X 0.5 mm6 8 Secondary TIM pad T-Global TG-A1780 X 0.5 mm7 2 Heat Sink TIM pad T-Global TG-A6200 X 0.5 mm8 2 M2-0.40x10mm Screws Metric Screws US 100479 2 M1.4x16mm Screws Metric Screws US 21856

10 2 M1.4 Hex Nuts Metric Screws US 20680

3.8927.18

50.00

AA

5.80

15.7

0

21.0

0

11.8

23.

28

Ø1.60

Ø1.60

Ø2.50

All units in mm

Item Qty Part Description Manufacturer Part #1 1 Heat Sink Top Side Fischer Elektrik SK 476 50 SA

Item Qty Part Description Manufacturer Part #2 1 Heat Sink Bottom Side Fischer Elektrik SK 476 50 SA

Figure 10: (a) Top side heatsink drawing, (b) Bottom side heatsink

(b)

(a)



Item Qty Part Description Part #3 1 Integrated Heat Spreader (Top) Custom part

Item Qty Part Description Part #4 1 Integrated Heat Spreader (Bottom) Custom part

36.61

47.61

3x R1 inner �llet

29.49

8.58

11.00

11.9

3

14.9

0

3.08

3.00

1.00

8.27

17.6

5

4.38

4.50

2.00

29.571.00

3.00

2.00

2x R1 inner �llet 2x Ø1.50 THRU

2.40

3.38 7.62

11.00

36.33

47.33

15.8

018

.76

3.99 3.42

4.78

4.50

12.8

7

All units in mm

All units in mm

Figure 11. Integrated heat spreader drawing for (a) top-side and (b) bottom-side

(b)

(a)



Item Qty Part Description Manufacturer Part #5 2 Primary TIM pad T-Global TG-A1780 X 0.5 mm6 8 Secondary TIM pad T-Global TG-A1780 X 0.5 mm7 2 Heat Sink TIM pad T-Global TG-A6200 X 0.5 mm

Item Qty Part Description Manufacturer Part #8 2 M2-0.40x10mm Screws Metric Screws US 100479 2 M1.4x16mm Screws Metric Screws US 21856

10 2 M1.4 Hex Nuts Metric Screws US 20680

CORE DRAWING AND DIMENSIONS

Figure 13: Drawing with dimensions of the transformer core

Figure 12: Drawings and dimensions of TIM pad cutouts for primary FETs, secondary FETs and heatsinks.

7.6 ± 0.2

4.57 ± 0.2

1.57 ± 0.2(7.5)(3)

(7.5)4 – C2.5

8 - R1Ra1.6

Core

Straps

7.5 mils spacer

Ra1.

6

12.2 ± 0.3

36 ±

0.5

(9)

(9)

10.4

± 0

.4

1

Core material: ML91S, Manufacturer: Hitachi Metals

PrimaryFETs TIM (2x)

Heatsink TIM pad (2x)

SecondaryFETs TIM (8x)

7.5 mm

7 mm

5 mm

4.5 mm

18 mm

48 mm

All units in mm



Table 3: Bill of Materials - EPC9149 module electrical Item Qty Reference Part Description Manufacturer Part #

1 2 C1, C6 CAP CER 0402 10 nF 25 V X7R 5% Kemet C0402C103J3REC

2 8 C2, C4, C5, C7, C58, C63, C65, C66 22 µF ±20% 25 V Ceramic Capacitor X5R 0805 Murata GRT21BR61E226ME13L

3 1 C10 10000 pF ±10% 16 V Ceramic Capacitor X7R 0402 Kemet C0402C103K4RECAUTO

4 5 C11, C12, C13, C81_GP1, C81_GP2 0.1 µF, 25 V, 0402, X7R Yageo CC0402KRX7R8BB104

5 64

C14_PS1, C14_PS2, C15_PS1, C15_PS2, C16_PS1, C16_PS2, C17_PS1, C17_PS2, C18_PS1, C18_PS2, C19_PS1, C19_PS2, C20_PS1, C20_PS2, C24_PS1, C24_PS2, C25_PS1, C25_PS2, C26_PS1, C26_PS2, C27_PS1, C27_PS2, C28_PS1, C28_PS2, C29_PS1, C29_PS2, C30_PS1, C30_PS2, C31_PS1, C31_PS2, C32_PS1, C32_PS2, C33_PS1, C33_PS2, C34_PS1, C34_PS2, C35_PS1, C35_PS2, C36_PS1, C36_PS2, C44_PS1, C44_PS2, C45_PS1, C45_PS2, C46_PS1, C46_PS2, C47_PS1, C47_PS2, C48_PS1, C48_PS2, C49_PS1, C49_PS2, C50_PS1, C50_PS2, C51_PS1, C51_PS2, C52_PS1, C52_PS2, C53_PS1, C53_PS2, C54_PS1, C54_PS2, C55_PS1, C55_PS2

2.2 µF ±10% 25 V Ceramic Capacitor JB 0402 TDK C1005JB1E225K050BC

6 2 C21, C22 CAP CER 1 µF 25 V X5R 0402 Murata GRT155R61E105ME01D

7 1 C23 CAP CER 22 µF 6.3 V 0402 Samsung CL05A226MQ5N6J8

8 4 C40_GS11, C40_GS12, C40_GS21, C40_GS22 CAP CER 4.7 μF 6.3 V X5R 0201 Murata GRM035R60J475ME15D

9 4 C41_GS11, C41_GS12, C41_GS21, C41_GS22 CAP CER 33 pF 25 V C0G/NP0 0201 Murata GRM0335C1E330JA01D

10 2 C80_GP1, C80_GP2 CAP CER 1 µF 25 V X5R 0402 TDK C1005X5R1A475K050BC

11 1 C90 CAP CER 22 µF 6.3 V 0402 Taiyo Yuden HMK107C7224KAHTE

12 1 C91 CAP CER 4.7 µF 6.3 V X5R 0201 TDK C1005X6S1C105K050BC

13 1 C92 CAP CER 33PF 25 V C0G/NP0 0201 TDK C1005X7S2A103K050BB

14 1 C93 CAP CER 4.7 µF 10 V X5R 0402 TDK CGA2B3X7S2A332M050BB

15 1 C94 CAP CER 0.22 µF 100 V X7S 0603 Murata GRM188R61E106MA73D

16 1 C95 1 µF ±10% 16 V Ceramic Capacitor X6S 0402 Murata GRM155R71H103KA88D

17 14 Ci1_PP1, Ci1_PP2, Ci2_PP1, Ci2_PP2, Ci3_PP1, Ci3_PP2, Ci4_PP1, Ci4_PP2, Ci5_PP1, Ci5_PP2, Ci6_PP1, Ci6_PP2, Ci7_PP1, Ci7_PP2 CAP CER 10000 pF 100 V X7S 0402 Taiyo Yuden HMK107C7224

18 10 Cm1, Cm2, Cm3, Cm4, Cm5, Cm6, Cm7, Cm8, Cm9, Cm10 750 pF ±5% 50 V Ceramic Capacitor C0G, NP0 0402 TDK C2012X7S2A105M125AB

19 22 Cr1, Cr2, Cr3, Cr4, Cr5, Cr6, Cr7, Cr8, Cr9, Cr10, Cr11, Cr12, Cr13, Cr14, Cr15, Cr16, Cr17, Cr18, Cr19, Cr20, Cr21, Cr22 CAP CER 10 µF 25 V X5R 0603 Kemet C1206C224K3JAC7800

20 4 FB_GS11, FB_GS12, FB_GS21, FB_GS22 FERRITE BEAD 240 Ω 0201 0.35 A 380 mΩ Murata BLM03AX241SN1D

21 1 J10 5 pin header

22 1 L90 120 µH Shielded Wirewound Inductor 950 mA 100 mΩ Bourns SRR4828A-121M

23 4 Q1_PP1, Q1_PP2, Q2_PP1, Q2_PP2 100 V 60 A 3.2 mΩ EPC EPC2218

24 8 Q1_PS1, Q1_PS2, Q2_PS1, Q2_PS2, Q3_PS1, Q3_PS2, Q4_PS1, Q4_PS2 40 V 60 A 1.5mE EPC EPC2024

25 1 R1 39 kΩs ±0.1% 0.2 W, 1/5 W Chip Resistor 0603 Panasonic RC0603FR-07110KL

26 1 R2 4.87 kΩs ±0.1% 0.063 W, 1/16 W Chip Resistor 0402 Panasonic ERA-2AEB4871X

27 1 R3 RES SMD 20 Ω 1% 1/16 W 0402 Yageo RC0402FR-0720RL

28 1 R4 RES SMD 48.7 KΩ 0.1% 1/16 W 0402 Panasonic ERA-2AEB183X

29 1 R5 RES SMD 3.48 KΩ 0.1% 1/16 W 0402 Panasonic ERA-2AEB4751X

30 1 R11 FERRITE BEAD 180 Ω 0603 1LN Murata BLM18PG181SN1D

31 1 R16 10K 0402 Yageo RC0402JR-0710KL

32 1 R21 0 Ωs Jumper 1/16 W Chip Resistor 0402 Yageo RC0402JR-070RL

33 4 R40_GS11_Off, R40_GS12_Off, R40_GS21_Off, R40_GS22_Off RES 0.47 Ω 1% 1/10 W 0201 ROHM UCR006YVPFLR470

34 4 R40_GS11_On, R40_GS12_On, R40_GS21_On, R40_GS22_On RES SMD 2 Ω 5% 1/20 W 0201 Panasonic ERJ-1GNJ2R0C

35 4 R41_GS11, R41_GS12, R41_GS21, R41_GS22 RES 10K Ω 1% 1/20 W 0201 Panasonic RMCF0201FT10K0

36 4 R80_GP1, R80_GP2, R82_GP1, R82_GP2 RES SMD 1 Ω 5% 1/10 W 0402 Yageo RC0402FR-071RL

37 1 R90 0 Ωs Jumper 0.1 W, 1/10 W Chip Resistor 0603 Panasonic ERJ-3GEY0R00V

38 1 R91 86.6 k 0603 Yageo RC0603FR-0786K6L

39 1 R92 16.5 k 0402 Yageo RC0402FR-0716K5L

40 1 R93 RES SMD 1 Ω 1% 1/16 W 0402 Yageo RC0402JR-0768KL

41 1 R94 11.3 kΩs ±0.5% 0.063 W, 1/16 W Chip Resistor 0402 Yageo RT0402DRD0711K3L

42 1 R95 3.65 k 0603 Yageo RC0402FR-073K65L

43 1 R96 127 k 0603 Yageo RC0603FR-07127KL

44 2 SOB, SOT Round Standoff Threaded M2x0.4 Steel 0.039" (1.00 mm) Wurth 9774010243R

45 1 U10 dsPIC Automotive, AEC-Q100, dsPIC™ 33CK Microcontroller IC 16-Bit 100 MHz 32KB (32K x 8) FLASH 28-UQFN (4x4) Microchip DSPIC33CK32MP102T-I/M6

46 1 U20 Linear Voltage Regulator IC 1 Output 500 mA 6-WSON (2x2) TI TLV75533PDRVR

47 4 U40_GS11, U40_GS12, U40_GS21, U40_GS22 LMG1020 Low side GaN driver Texas Instruments LMG1020YFF

48 2 U80_GP1, U80_GP2 eGaN 100 V Half Bridge Gate Driver uPI uP1966E

49 1 U90 Buck Regulator 100 V, 300 mA Texas Instruments LM5018SD/NOPB

QUICK START GUIDEEPC9149 1 kW

LLC 1/8 th Brick Module

EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM

| ©2021 |

| 16

Figure 14: Control stage: Microcontroller, input and output voltage sensing, 5V bias supply for the drivers and 3.3V regulator for the dSPIC supply

LDO based 3.3 V power supply

10 nF, 25 VC6

110 kR1

4.87 kR2

10 nF, 25 VC1

VIN_SNS

VIN

4.75 kR5

18 kR4

20 ΩR3

VOUT_SNS

VOUTS

VOUT

GND

GND

V ins

0.22 μF, 100 VC90

GND

VinsVins

0 Ω

R90

PSU disconnect

86.6 kR91

8 Vmin. to 80 Vmax. 1 μF, 16 VC91

GND

16.5 kR92

5 V 300mA max.

GND

10 nF, 100 V

C92

V ins

127 k

R96

120 μH 300 mA

L 90

fs: 440 kHz 3300 pF, 100 VC93

10 μF, 25 VC94

68 k

R93UVLO Setting: 8 V on, 1.7 V hystersis

GND10 nF, 50 VC95

11.3 kR94

GND

1

Reg

Timer

7

UVLO

Logic

2

Gnd

Vin

Ilim

8

6

SD

RonSW

3

4

FB5

1.225V

1.62V OV

1.225V

VCC

BST0.66V

20µA

U90L M5018SD/NOPB

3.65 kR95

GND

VCC

PSU disconnect

IN

EN GND

OUT

NCNC

U20

TLV75533PDRVR

VCC 3V30 Ω

R21

1 μF, 25 VC22

22 μF, 6.3 VC231 μF, 25 V

C21

GND GND

5 V power supply

Programming Port

PWM2LPWM2H 3V3

MCLRMCL RVOUT_S NS 3V3

GND3V3

10k

12

R16

GND

PGDVI N_S NSPWM1L PGCPWM1H

AVDD

GND MCLRPGCPGD3V3

GND

3V33V3 AVDD3V3

1 2Ferrite Bead 180 Ω1 LN

R1

10 nF, 25 VC10

0.1 μF, 25 VC11

0.1 μF, 25 VC12 0.1 μF, 25 V

C13

GNDGNDGND GND

dsPIC controller

Voltage sensing

VIN

MCL R1

VDD2

GND3

PGD4

PGC5

J10

RP46/PWM1H/RB14RP47/PWM1L/RB15/MCLROA1OUT/AN0/CMP1A/IBIAS0/RA0OA1IN-/ANA1/RA1OA1N+/AN9/RA2DACOUT/AN3/CMP1C/RA3AN4/CMP3B/IBIAS3/RA4AVDDAVSSVDDVSSOSCI/CLKI/AN5/RP32/RB0

123456789

10111213

OSCO/CLKO/AN6/RP33/RB1OA2OUT/AN1/AN7/ANA0/CMP1D/CMP2D/CMP3D/RP34/INT0/RB214 15161718192021222324252627RP45/PWM2L/RB13

TDI/RP44/PWM2H/RB12TCK/RP43/PWM3L/RB11

TMS/RP42/PWM3H/RB10VDDVSS

PGC1/AN11/RP41/SDA1/RB9PGD1/AN10/RP40/SCL1/RB8TDO/AN2/CMP3A/RP39/RB7

PGC3/RP38/SCL2/RB6PGD3/RP37/SDA2/RB5

PGC2/OA2IN+/RP36/RB4PGD2/OA2IN-/AN8/RP35/RB3

28U10

DSPIC33CK32MP102T-I/M6

9774010243R

SOT

9774010243R

SOB

GND GND




| ©2021 |

| 17

VCC

4.7 μF, 10 VC80_GP1

GND

0.1 μF, 25 VC81_GP1

SN1

1 Ω

R80_GP1

SN1

VCC

1 ΩR82_GP1

U80_GP1

uP1966A

GND

Primary-side Gate Drivers

PWM1H

PWM1LVGl1

VGu1

0.1 μF, 25 VC81_GP2

SN2

1 Ω

R80_GP2 VGu2

VCCPWM1L SN2

4.7 μF, 10 VC80_GP2 VCC

GND

1 ΩR82_GP2

VGl2PWM1H

U80_GP2

uP1966A

GND

PWM2L

Secondary-side Gate Drivers

1

6

54

3

2

VDD

GNDIN-

IN+

U40_GS 11

L MG1020YFF

VGB1

VCC

GND GND GND GND GND

020110 k 1/20 W

R41_GS1102014.7 μF6.3 V

C40_GS11

1

6

54

3

2

VDD

GNDIN-

IN+

U40_GS 12

L MG1020YFF

1

6

54

3

2

VDD

GNDIN-

IN+

U40_GS 21

L MG1020YFF

1

6

54

3

2

VDD

GNDIN-

IN+

U40_GS 22

L MG1020YFF

020133 pF25 V

C41_GS11

020110 k 1/20 W

R41_GS1202014.7 μF6.3 V

C40_GS12

020133 pF25 V

C41_GS12

020110 k 1/20 W

R41_GS2102014.7 μF6.3 V

C40_GS21

020133 pF25 V

C41_GS21

020110 k 1/20 W

R41_GS2202014.7 μF6.3 V

C40_GS22

020133 pF25 V

C41_GS22

02010.47 Ω 1/10W

R40_GS 11_Off

02010.47 Ω 1/10W

R40_GS 12_Off

02010.47 Ω 1/10W

R40_GS 21_Off

02010.47 Ω 1/10W

R40_GS 22_Off

0201 2 1/20W

R40_GS 11_On

0201 2 1/20W

R40_GS 12_On

0201 2 1/20W

R40_GS 22_On

0201 2 1/20W

R40_GS 21_On

VGA 1

VGA 2

VGB2

240 Ω @100 MHz 0.35 A

240 Ω @100 MHz 0.35 A

240 Ω @100 MHz 0.35 A

240 Ω @100 MHz 0.35 A

FB_GS 11

FB_GS 12

FB_GS 21

FB_GS 22

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

PWM2H

PWM2H

PWM2L

VCC

VCC

VCC

Figure 15: Driver stage: For the primary and secondary side FETs




| ©2021 |

| 18

DC Input8 Vmin. to 60 Vmax.

Input Capacitors

Cm7 Cm8 Cm9 Cm10

GND

VIN

VINVINVINVIN VIN VIN VIN VIN VIN VIN VIN VIN VIN VIN

VIN VIN VIN VIN VIN VIN VIN VIN VIN

GND

1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 V 1 μF, 100 VCm1 Cm2

GND

Cm3

GND

Cm4

GND

Cm5

GND

Cm6

GND GND GND GND

220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 V 220 nF, 100 VCi1_PP1 Ci2_PP1 Ci3_PP1 Ci4_PP1 Ci5_PP1 Ci6_PP1 Ci7_PP1

GNDGNDGND GND GNDGNDGND

HF Input loop Capacitors

Ci1_PP2 Ci2_PP2 Ci3_PP2 Ci4_PP2 Ci5_PP2 Ci6_PP2 Ci7_PP2

GND GND GND GND GND GND GND

VIN

VGu1

VGl1

GND

Power Stage

VGu2

VGl2

SN1

SN2

Q1_PS1 EPC2024

VG

B1

Q2_PS1 EPC2024

VG

B1

Q3_PS1 EPC2024

VG

A1

Q4_PS1 EPC2024

GND

VG

A1

Q1_PS2 EPC2024

VG

B2

Q2_PS2 EPC2024

VG

B2

Q3_PS2 EPC2024

VG

A2

Q4_PS2 EPC2024

VG

A2

GND

VOUT

VOUT

VOUTVOUTVOUT VOUT VOUTVOUTVOUTVOUTVOUT

C14_PS 1 C15_PS 1 C16_PS 1 C17_PS 1 C18_PS 1 C19_PS 1 C20_PS 1 C24_PS 1 C25_PS 1

GNDGND GNDGNDGNDGND GND GNDGND

VOUTVOUT VOUTVOUTVOUT VOUTVOUTVOUT VOUT


GNDGNDGND GND GND GNDGNDGND GND

VOUTVOUT VOUTVOUTVOUTVOUTVOUT VOUTVOUT


GND GNDGNDGND GNDGNDGNDGNDGND

VOUT VOUTVOUT VOUT VOUT

C35_PS 1 C52_PS 1C53_PS 1 C54_PS 1 C55_PS 1

GNDGNDGND GND GND

VOUT VOUTVOUT VOUT VOUTVOUT VOUT VOUTVOUT


GNDGNDGNDGNDGND GNDGNDGND GND

VOUTVOUT VOUTVOUTVOUT VOUTVOUT VOUTVOUT


GND GNDGNDGNDGND GND GNDGNDGND

VOUTVOUTVOUTVOUTVOUTVOUTVOUTVOUTVOUT


GND GNDGND GND GNDGNDGND GND GND

VOUT VOUTVOUT VOUTVOUT

C35_PS 2 C52_PS 2C53_PS 2 C54_PS 2 C55_PS 2

GND GND GNDGNDGND

Cr1-Cr220.22 μF 25 V

DC Output

VOUT VOUTVOUT VOUTVOUT

22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V

22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V

22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V22 μF, 25 V

22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V


22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V

22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V 22 μF, 25 V




22 μF, 25 V 22 μF, 25 VC2 C4 C5 C7 C58

GND GNDGND GNDGND

VOUTVOUT VOUT

C63 C65 C66

GND GNDGND

VIN1

GND2

VOUT5,6

GND

11,12

3,4,7,89,10,13,14

J1

VI N

GND GND

VOUT

40mil

TP_D_Q1 1

ProbePad

40mil

TP_D_Q12ProbePad

40mil

TP_D_Q21

ProbePad

40mil

TP_D_Q22ProbePad

100 V 60 A

EPC2218

Q1_PP1EPC2218

100 V 60 A

EPC2218

Q1_PP2EPC2218

100 V 60 A

3.2 mΩ 3.2 mΩ

3.2 mΩ 3.2 mΩEPC2218

Q2_PP1EPC2218

100 V 60 A

EPC2218

Q2_PP2EPC2218

Figure 16: Power stage: Topology including FETs, transformer and input, output and resonant capacitors




| ©2021 |

| 19

FD1

PCB Fiducial

FD2 FD3

Nylon standof fs

J3

J6

VIN

GND J5

J4

J2

J7

Input Capacitors

+47 μF 80 VCb2

VIN

+47 μF 80 VCb1

VIN

+47 μF 80 VCb8

VIN

+47 μF 80 VCb7

VIN

+47 μF 80 VCb4

VIN

+47 μF 80 VCb3

VIN

+47 μF 80 VCb10

VIN

+47 μF 80 VCb9

VIN

Output Capacitors

+390 μF 20 VCb5

VOUT

+390 μF 20 VCb6

VOUT

+390 μF 20 VCb11

VOUT

+390 μF 20 VCb12

VOUT

22 μF, 25 VC4

22 μF, 25 VC5

22 μF, 25 VC3

22 μF, 25 VC1

22 μF, 25 VC2

22 μF, 25 VC8

22 μF, 25 VC7

22 μF, 25 VC6

VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT

GND GND GND GND GND GND GND GND

22 μF, 25 VC12

22 μF, 25 VC13

22 μF, 25 VC11

22 μF, 25 VC9

22 μF, 25 VC10

22 μF, 25 VC16

22 μF, 25 VC15

22 μF, 25 VC14

VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT

GND GND GND GND GND GND GND GND

GND GND GND GND

GNDGNDGNDGND

GND GND

GND GND

TX

RX

GN

D3V

3

GP0

GP1

GP2

GP3

GN

DF

USB

AP1018_Rev1_2_IsoMicroUSBinterface.SCHDOC

3V3

Micro USB Interface

GND

VIN

GND

Keystone5010

1TP1

Keystone5011

1TP3

GND

VOUT

Keystone5010

1TP2

Keystone5011

1TP4

3V3

GND PGD_TXPGC_RX

Output Voltage Measurement

PGD_TX

PGC_RX

GND

VOUT

Communications header

Input Connection Output Connection

MCLR1

VDD2

GND3

PGD4

PGC5

J1

VIN1

GND2

VOUT5,6

GND

11,12

3,4,7,89,10,13,14

PCB2

EPC9149_Rev2_0

VIN

GND GND

VOUT

1 μF, 100 VCm1

1 μF, 100 VCm2

1 μF, 100 VCm3

1 μF, 100 VCm4

GND

VIN

GND

VIN

GND

VIN

GND

VIN

1 μF, 100 VCm5

1 μF, 100 VCm6

GND

VIN

GND

VIN

EPC9149 Rev2_0 LLC resonant converter

Input Voltage Measurement

HIGH VOLTAGE

HIGH VOLTAGE

ATTENTIONHOT SURFACE

Figure 17: EPC9533 power circuit schematic




| ©2021 |

| 20

Figure 18: Isolated USB circuit on the EPC9533 motherboard

1 2FB 502

12

34

50

IDD

+D

-+5

VG

ND

J500

USB 2.0 Mini

47 pF, 50 VC503

25

TVS Diode Array 6V

1,63,4

D500

3

1

4

2

90 Ω 550 mA 50 V

L 500

Line Filter 0603

180 Ω @ 100 MHz

180 Ω @ 100 MHz

1 2

FB501

USB_D-

USB_D+

USBinterface

BusMatrix

UARTinterface

G IO

16

1 23

4

5

6 7

8

9

10

11

12

13 17

SCL

SDA

RX

TX

E P

R S T

GP

3

V S S

D-

D+

V DD V US B

GP

2

GP

1

GP

0

interfaceI C2

U510MCP2221A-I/ML

10 kR 510

4.7 kR 534

E MPT Y

0.1 μF, 25 VC501

GNDF

GNDFGNDF

GND

10 μF, 10 VC510

0.1 μF, 25 VC500

15 Ω R 502

15 ΩR 503

270 ΩR 530

270 ΩR 531

4.7 kR 535

E MPT Y

TX

R X

GND

3V 3

GNDF GNDF

4.7 kR 501

GNDF

GNDF

47 pF, 50 VC502

470 nF, 6.3 V C511

5V

GNDF GNDF

3V 3

5 V

I2CUART

DNP

Do Not Connect

5

7

63

2

41 8

VDDA VDDB

GNDA GNDBU520

ADuM1201CR/ADuM1250ARZTX

R X

SDA

SCL 0 ΩR 532 E MPT Y

0 ΩR 533 E MPT Y

GNDGNDF

3V 3

5 VV USB

VUSB

Data type selector

0 ΩR 551

0 ΩR 552

E MPT Y

Default set to UART using 5 V

0.1uF, 25VC520

GND

3V 3

Use ADuM1201 for UART (Default)

for I2C only

4.7 kR 520

E MPT Y4.7 kR 521

E MPT Y

Use ADuM1250 for I2C

3V 3 3V 3

3V3F3V3F

5 V 3.3 V

Install

R532R533R534R535R520R521R552

R532R533R534R535R520R521R552

DNPInstall

R530R531R551

R530R531R551

GP0

GP1

GP2

GP3Shield

GNDF

GNDF



EPC would like to acknowledge Microchip Technology Inc. (www.microchip.com) for their support of this project.

Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company’s solutions serve customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets.

The EPC9149 system features the dsPIC33CK32MP102 16-Bit Digital Signal Controller with High-Speed ADC, Op Amps, Comparators and High-Resolution PWM. Learn more at www.microchip.com.


https://www.microchip.com/wwwproducts/en/dsPIC33CK32MP102


EPC Products are distributed through Digi-Key.www.digikey.com

For More Information:

Please contact [email protected] your local sales representative

Visit our website: www.epc-co.com

Sign-up to receive EPC updates atbit.ly/EPCupdates or text “EPC” to 22828

Demonstration Board NotificationThe EPC9149 board is intended for product evaluation purposes only. It is not intended for commercial use nor is it FCC approved for resale. Replace components on the Evaluation Board only with those parts shown on the parts list (or Bill of Materials) in the Quick Start Guide. Contact an authorized EPC representative with any questions. This board is intended to be used by certified professionals, in a lab environment, following proper safety procedures. Use at your own risk. As an evaluation tool, this board is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corpora-tion (EPC) makes no guarantee that the purchased board is 100% RoHS compliant.The Evaluation board (or kit) is for demonstration purposes only and neither the Board nor this Quick Start Guide constitute a sales contract or create any kind of warranty, whether express or implied, as to the applications or products involved. Disclaimer: EPC reserves the right at any time, without notice, to make changes to any products described herein to improve reliability, function, or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, or other intellectual property whatsoever, nor the rights of others.

https://www.digikey.com


mailto:[email protected]


bit.ly/EPCupdates

EPC9149: 36 - 60 V Input, 9 - 15 V, 83 A Output Fixed ...

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