Ensemble® 6000 Series OpenVPX™ Intel® Xeon® D-15xx Processor FamilyLDS6526 Low Density Server Blade with embedded I/O

• 6U OpenVPX single server blade

• Intel® Xeon® D (Broadwell microarchitecture) server-class processing

• 40 Gigabit Ethernet high bandwidth SW defined fabrics

• Four channels built-in sensor I/O

• Dual XMC mezzanine sites

• 16 GB DDR4-2400 SDRAM

• PCIe connectivity to OpenVPX expansion plane

Broadwell DE-Based Xeon D EcosystemThe Ensemble LDS6526 features a 64-bit Xeon D family processor which is protected and cooled by Mercury’s fifth generation of high-performance packaging, which has previously been deployed in prior generations of 6U OpenVPX LDS and HDS processing modules. The Xeon D family of processors includes a System on Chip (SoC) approach, combining the processor and the Intel platform controller hub (PCH) function within a single device. As a solderable BGA, the Xeon D family extends the capability of the LDS architecture. As an example, the D-1559 device delivers up to 576 GFLOPS of processing power, which is a significant performance boost for the LDS architecture. With two high-speed DDR4-2400 memory controllers, the Xeon D processor is able to support up to 16 GB of DRAM, with future capabilities of up to 32 GB per module. Significant PCIe interface capabilities are built in to the chip, which enable data interfaces both on and off-board.

The on-device PCH functionality enables the Ensemble LDS6526 to access additional I/O, including USB and SATA on the backplane. The Xeon D family of processors have dual 10 Gigabit Ethernet interfaces, enabling backplane access for sensor data or additional inter-processor communication and support for the AVX 2.0 instruction set that boosts floating-point algorithm performance and is portable to future Intel architectures.

Xeon D processing performance, mezzanine sites, and built-in sensor I/O routed directly to the fabric via open architecture POET interface

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The Ensemble LDS6526 is a 6U, OpenVPX™ processing blade that seamlessly integrates the latest Intel® Xeon® D server-class, general purpose processing capability with configurable data plane and built-in sensor I/O pipes to form an ultra-wide-band, powerful ingestion processing engine.

The Ensemble LDS6526 is an innovative integration of the best general processing capability, configurable mezzanine sites, built-in and SW defined I/O and data plane interfaces which are efficiently managed by FPGA-based Processing Packet Offload Engine Technol-ogy (POET™). POET enables these interfaces to be bonded directly to the Intel processor or to remote endpoints connected to the data plane fabric.

The Ensemble LDS6526 is part of Mercury’s Xeon server-class eco-system of building blocks that includes Xeon D-based high density servers (HDS), high-speed switch modules, and FPGA- or GPU-based pre-processing modules. The inclusion of Xeon D based low-density servers (LDS) brings additional processing resources to bear, enabling processing and I/O on the module to remain balanced, avoiding data starvation or processor overload.

Mercury Systems is a leading commercial provider of secure processing subsystems designed and made in the USA. Optimized for customer and

mission success, Mercury’s solutions power a wide variety of critical defense and intelligence programs.

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor-dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers

to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

Integrated FPGA Resources

The Ensemble LDS6526 integrates an Altera Arria 10 FPGA device with the Intel Xeon D processor to provide Mercury’s POET integrated data plane functionality and sensor I/O capabilities. The FPGA resources support the full OpenVPX data plane for flexible 40 Gigabit Ether-net configurations, with the ability to support additional protocols, integrated switching, and high-speed DMA engines in a single device. In addition to the data plane, the Ethernet control plane is integrated with the Altera device to allow for additional flexibility in configuration and capability. By offloading traditional ASIC-based functionality in a FPGA, the Ensemble LDS6526 blade reduces DMS/EOL concerns for long-term support of program requirements.

In addition to the data plane interfaces, the Ensemble LDS6526 deliv-ers four channels of protocol-configurable sensor I/O to the P6 user I/O connector. These high-speed sensor interfaces are interfaced with the POET FPGA-based switch and DMA functionality such that incoming sensor data can be routed to the local Intel processor, or to remotely connected fabric endpoints over the OpenVPX data plane. This elimi-nates the need for XMC-based sensor data feeds for many applica-tions, providing a significant cost advantage over similar OpenVPX products.

High Speed Fabric InterfacesThe Ensemble LDS6526 continues the Mercury tradition of combining the processing power of Intel processors with high speed switched fabric interfaces. By scaling the data plane bandwidth to match the increase in processing performance, the Ensemble LDS6526 architec-ture ensures that the processor is never starved for data.

By utilizing the Altera Arria 10 FPGA and innovative OpenVPX in-terconnect technology; the Ensemble LDS6526 is a model for open architecture high performance computing throughout the embedded industry. Mercury OpenVPX subsystems feature robust signal rates that comfortably exceed the margin of the channel to surpass the rate of modern fabrics, delivering the fastest compute solution in the industry with future proof performance headroom.

PCIe ArchitectureThe Ensemble LDS6526 provides on-board Gen3 PCIe switches for both on-board switching and off-board expansion. This switch complex pro-vides an x8 PCIe interface to each of the two XMC sites, as well as an x4 connection to a PCIe to PCI-X® bridge for the single PMC site. This allows mezzanines to operate at full bandwidth, optimizing the flow of I/O into the processing subsystem. Externally, the Ensemble LDS6526

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Figure 1 - LDS6525 functional block diagram

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor-dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers

to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

PCH

DDR4 SDRAMDDR4

SDRAM

8GB+ECC

DDR42600

DDR4 SDRAMDDR4

SDRAM

8GB+ECC

DDR4 2600

Intel Xeon D-15xx (8-16 Cores)

IPMC

x16 PCIe3

x8 PCIe3

x8 PCIe3

NAND Flash

MUX

1000BASE-T-Enet1

1000BASE-T-Enet2

1000BASE-BX – CP1

1000BASE-BX – CP2

x4 PCIe

SATA

x8 PCIe3

x8 PCIe3

x16 PCIe3

P4

P3

P5

P2

P6

X12d + X8d to Mezz

P64S/X38s to Mezz

RS-232/422/485

USB2.0

USB 2.0

4x - SerDes

P1

P0

4x - SerDes

4x - SerDes

4x - SerDes

AUX_CLK

REF_CLK

System Signals (P0/P1)

IPMB-A / IPMB-B

16 SERDES to POET FPGA

USB 2.0SATASATA

USB 2.0SATASATA

Thermal, Voltage, Current Sensors

TPM LPC

x8 PCIe3

x8 PCIe3

PCIe to PCIxBridge

P255 P255 P23P21

P26 P24P22

PM

C/X

MC

PMC2/XMC2

XMC1

P64s/X38s to Mezz.I/O on P3

X12d+X8d to Mezz.I/O on P4

P16

XM

C

X38s to Mezz.I/O on P5

X12d+X8d to Mezz.I/O on P6

P15

USB

SubsystemRTO

SATA

DDP

RJ-45

eSAT

ApDD

P

USB

uDB-

9 RS-232

Air-cooledonly

FRONT

PANEL

LDS6526

RJ-45

USB

uDB-

9

Air-cooledonly

eSAT

ApDD

P

Optional A

ccessory – air-cooled only

USB 3.0

PCIe Switch Gen3

MUX

Arria 10POET FPGA

USB 3.0

16 SERDES to P6

Ethernet interfaces to processor

10GBASE-KR from Xeon D

10GBASE-KR from Xeon D

Additional FeaturesThe Ensemble LDS6526 module provides all the features typically found on an avionics-class single-board computer. In addition to the sophisticated management subsystem and fabric interconnect, the En-semble LDS6526 module provides users with a toolkit enabling many different application features including:

• Thermal and voltage sensors integrated on-board

• Real-time clock with accuracy better than 10ppm<1second per day

• General purpose timers

• Global clock synchronization capabilities via utility plane clock signals

• Watchdog timer to support interrupt or reset

• Multiple boot paths, include netboot, USB boot, boot from SATA, or from the on-board SATA flash device

Open Software EnvironmentMercury leverages over 30 years of multi-computing software exper-tise, including multicore processor expertise, across its many plat-forms. This strategy is fully applied to the Ensemble LDS6526 module. The same Linux® development and run-time environment is implement-ed on the Ensemble LDS6526 module as on other Intel based Mercury modules across the Ensemble 3000 and 6000 Series. Off-the-shelf open software products such as OFED and OpenMPI are fully supported by the open Ethernet-based POET data plane.

Mercury Sensor Processing EcosystemSensor chain awareness is having the technical expertise and resourc-es to design and build capable, compatible solutions along the whole sensor processor chain. From RF/microwave, digital/analog signal manipulation to dense, size, weight, and power (SWaP) optimized pro-cessing resources to actionable intelligence dissemination; Mercury’s rugged compute subassemblies leverage the best commercial-item technology, enabling prime contractors to win more business.

Modern sensor compute subassemblies are customized assemblies of interoperable building blocks built to open standards. Mercury’s hardware and software portfolio of building blocks are physically and electrically interoperable as defined by international industrial stan-dards, including VITA’s OpenVPX standards.

implements a full Gen3 x16 PCIe connection to the OpenVPX expan-sion plane on the P2 VPX connector. This expansion plane interface enables the Ensemble LDS6526’s compatibility with Mercury’s GPU or FPGA based co-processing modules. These configuration options let the module effectively act as an upstream/downstream PCIe switch to allow the “chaining” of PCIe devices.

System ManagementThe Ensemble LDS6526 module implements the advanced system man-agement functionality inherent to the VITA 46.11 standard to enable remote monitoring, alarm management, hardware revision and health status. Using the standard IPMI-A and IPMI-B bus, intelligent platform management controller (IPMC), and IPMI protocol, the on-board system management block implementation is designed to comply with the VITA 46.11 standard. This allows the Ensemble LDS6526 module to:

• Read sensor values

• Read and write sensor thresholds, allowing an application to react to thermal, voltage, or current variations that exceed those thresholds

• Reset the entire module

• Power up/down the entire module

• Retrieve module field replaceable unit (FRU) information

Mezzanine ConfigurabilityThe Ensemble LDS6526 provides two mezzanine sites: one PMC/XMC and one XMC-only. Each of the standard mezzanine sites on the Ensemble LDS6526 module can be configured with off-the-shelf mezzanine cards to bring additional I/O into the system for processing or control. PMC cards are supported with a 32-bit or 64-bit PCI/PCI-X interface at up to 133 MHz on the PMC/XMC site, with PMC user-de-fined I/O mapped to the backplane. XMCs are supported with x8 PCIe on the J15/J25 connector per the VITA 42.3 standard. There are 16 differential pairs and 38 single-ended signals of XMC user I/O mapped to the backplane via the J16/J26 connector.

The Ensemble LDS6526 supports configuration with either VITA 42 or VITA 61 XMC connectors. By default, the Ensemble LDS6526 will be configured with VITA 61 XMC connectors for the best rugged and sig-nal integrity performance. The VITA 61 connector offers superior signal integrity characteristics and is a more rugged design, appropriate for high-end XMC modules utilizing Gen3 PCIe interfaces in environmen-tally challenging applications.

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor-dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers

to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

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WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor-dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers

to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

Mercury subsystems are designed from a suite of sophisticated open architecture building blocks that are combined and scaled to meet a broad range of advanced sensor chain processing requirements. Mercury subsystems may include analog, digital and mixed-signal receiver modules, single-board computers and signal processing pay-load modules. Payloads may have acquisition, digitization, processing, and exploitation and dissemination elements and include FPGA, CPU, GPU or ADC/DAC technology, and be made up of multiple subsystems developed to multiple standards, including OpenVPX and others such as ATCA or VME/VXS.

VPX-REDIThe VPX (VITA 46) standard defines 6U and 3U board formats with a modern high-performance connector set capable of supporting today’s high-speed fabric interfaces. VPX is most attractive when paired with the Ruggedized Enhanced Design Implementation standard – REDI (VITA 48). The Ensemble LDS6526 blade is a 6U implementation of VPX-REDI, with air and conduction-cooled and Air and Liquid Flow-By variants in the same VPX form factor available for less rugged environ-ments.

Targeted primarily for harsh-environment embedded applications, VPX-REDI offers extended mechanical configurations supporting higher functional density, such as two-level maintenance (2LM). 2LM allows relatively unskilled maintenance personnel to replace a failed module and restore the system to an operational state in a limited time period, minimizing potential damage to the module.

Rugged air cooling, Air Flow-ByAir- and conduction-cooled subsystems rely on filtration to remove contaminants from their cooling air streams. Mercury’s Air Flow-By™ technology eliminates filtration with the most elegant cooling solution available within a sealed and rugged package. Fully compliant to VITA standards (including VITA 48.7), Air Flow-By maintains OpenVPX’s 1-inch pitch requirement, is highly resilient to liquid and particle contamination, boosts SWaP, reduces operating temperature, extends MTBF by an order of magnitude and enables embedded deployment of the most powerful and reliable processing solutions.

System bandwidth – the effect of interconnect performanceBandwidth is critical and especially applicable to switch fabric re-sources which dictate the responsiveness of the entire subsystem.

All modular solutions, including OpenVPX, are to some degree interconnect-bound; they are restricted by the limitations of the best industry interconnect technology. To address this, Mercury fabricates system interconnections with innovative technology which mitigates insertion-loss and cross-talk while maintaining full OpenVPX compli-ance. The resulting and significant system performance boost is espe-cially discernible as subsystems scale larger and data rates increase.

Specifications

Main processor

Intel, 1.5GHz, 8-16 core, 64 bit, Xeon D-15xxWith AVX 2.0576 GLOPS peak performance when configured with D-1559 processor

FPGA

Arria 10Four x4 ports to OpenVPX data planeFour x4 ports to P6 for sensor I/OTwo x8 PCIe ports to Intel processor

System Memory

16 GB DDR4-2400 (32 GB planned)

Mechanical

6U OpenVPX, single width (1-inch)Module packages:

Air-cooledConduction-cooledAir Flow-By™Liquid Flow-By™

Compliance

OpenVPX System Specification (VITA 65) encompasses:VITA 46.0, 46.3, 46.4, 46.6, 46.11, and VITA 48.1, 48.2 (REDI) and48.7 (Air Flow-By)

OpenVPX profileModule - MOD6-PAY-4F1Q2U2T-12.2.1-n, where n is based on the POET fabric configurationChassis - SLT6-PAY-4F1Q2U2T-10.2.1

Corporate Headquarters

201 Riverneck RoadChelmsford, MA 01824-2820 USA(978) 967-1401 • (866) 627-6951Fax (978) 256-3599www.mrcy.com

EuropE MerCury systeMs, Ltd.Unit 1 - Easter Park, Benyon RoadSilchester, Reading RG7 2PQ United Kingdom+ 44 0 1189 702050 • Fax + 44 0 1189 702321www.mrcy.com

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INNOVATION THAT MATTERS ™

Ensemble, is a registered trademark and Air Flow-By, Liquid flow-By, Innovation That Matters, and Mercury Systems are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or registered trademarks of their respective holders. Mercury Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein is subject to change without notice.Copyright © 2016 Mercury Systems, Inc. 3161.01E-0516-ds-LDS6525

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United States in accor-dance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations (EAR). Transfers

to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

Additional ServicesOptional Environmental Screening and Analysis Services Standard Module, Optional Services

• Cold Start Testing• Cold Soak Testing• Custom Vibration• CFD Thermal Analysis• Finite Element Analysis

• Safety Margin Analysis• Temperature Cycling• Power Cycling• Environmental Stress Screening

• Engineering Change Order (ECO) Notification• ECO Control• Custom Certificate of Conformity (CofC)• Custom UID Labeling

• Alternate Mean Time Between Failure (MTBF) Calculations• Hazmat Analysis• Diminished Manufacturing Sources (DMS) Management• Longevity of Suppy (LOS)• Longevity of Repair (LOR)

Contact factory for additional information

Environmental

* Customer must maintain required cfm level. Consult factory for the required flow rates.** Card edge should be maintained below 71ºCStorage Temperature is defined per MIL-STD-810F, Method 502.4, para 4.5.2, where the product under non-operational test is brought to an initial high temperature cycle to remove moisture. Then the unit under non-operational test will be brought to the low storage temperature. The low temperature test is maintained for 2 hours. The product is then brought to the high storage temperature and is maintained for 2 hours. The product is then brought back to ambient temperature. All temperature transitions are at a maximum rate of 10ºC/min. One cold/hot cycle constitutes the complete non-operational storage temperature test. This assumes that the board level products are individually packaged in accordance with ASTM-D-3951 approved storage containers. These tests are not performed in Mercury shipping containers, but in an unrestrained condition. Please consult the factory if you would like additional test details.All products manufactured by Mercury meet elements of the following specifications: MIL-STD-454, MIL-STD-883, MIL-HDBK-217F, and MIL-I-46058 or IPC-CC-830, and various IPC standards. Mercury’s inspection system has been certified in accordance with MIL-I-45208A.

Environmental Qualification Levels

Air-cooled Air Flow-By Conduction-cooled Liquid Flow-By

Commercial L0 Rugged L1 Rugged L2 Rugged L4 Rugged L3 Rugged L5

Ruggedness • • • • • • • • • • • • • •

Moisture/dust protection • • • • • • • • • • • • • •

Typical cooling performance ~140W* ~140W* ~150W* ~200W* ~150W** 300W+***

Temperature Operating* 0ºC to +40ºC -25ºC to +55ºC -45ºC to +70ºC -40ºC to +60ºC -40ºC to +71ºC -40ºC to +71ºC***

Operating temperature maximum rate of change

N/A 5ºC/min 10ºC/min 10ºC/min 10ºC/min

Temperature Storage -40ºC to +85ºC -55ºC to +85ºC -55ºC to +125ºC -55ºC to +125ºC -55ºC to +125ºC

Humidity

Operating*10-90%,

non-condensing5-95%,

non-condensing5-95%,

non-condensing5-95%, non-condensing

100% condensing

5-95%, non-condensing100% condensing

Storage10-90%,

non-condensing5-95%,

non-condensing5-95%,

non-condensing5-95%, non-condensing

100% condensing5-95%, non-condensing

100% condensing

AltitudeOperating* 0-10,000ft 0-30,000ft 0-30,000ft 0-30,000ft 0-70,000ft

Storage 0-30,000ft 0-50,000ft 0-70,000ft 0-70,000ft 0-70,000ft

Vibration

Random0.003 g2/Hz;

20-2000 Hz, 1 hr/axis0.04 g2/Hz;

20-2000 Hz, 1 hr/axis0.04 g2/Hz;

20-2000 Hz, 1 hr/axis0.1 g2/Hz;

5-2000 Hz, 1 hr/axis0.1 g2/Hz;

5-2000 Hz, 1 hr/axis

Sine N/A N/A N/A10G peak;

5-2000 Hz, 1 hr/axis10G peak;

5-2000 Hz, 1 hr/axis

Shock

z-axis: 20g; x and y-axes: 32g;

(11ms 1/2-sine pulse, 3 positive, 3 negative)

z-axis: 50g;x and y-axes: 80g;

(11ms 1/2-sine pulse,3 positive, 3 negative)

z-axis: 50g;x and y-axes: 80g;

(11ms 1/2-sine pulse,3 positive, 3 negative)

z-axis: 50g;x and y-axes: 80g;

(11ms 1/2-sine pulse, 3 positive, 3 negative)

z-axis: 50g;x and y-axes: 80g;

(11ms 1/2-sine pulse, 3 positive, 3 negative)

Salt/Fog N/A Contact Factory Contact Factory 10% NaCl 10% NaCl

VITA 47 Contact Factory