Engineering Divisions - System SI/PI Modeling - PCB Layout Routing Services Library Services - Mechanical Design - Thermal Analysis

PCB & Substrate Division - PCB Quick Turn High Mix Low Volume Medium to High Volume Multilayer/Build Up - IC Substrate & Packaging <100um FC Pitch, High I/O High Density CSP Flex + Metal Core

Component Division - High Speed I/O Connectors - Push/Pull Connectors - RJ45 W/ Magnetics - USB, SATA, HDMI Connectors - HDMI/USB Cable Assemblies - Planar Transformers - AOC Assemblies - Diecasting and CNC Metals - Plastic Injection Molding

PCB Design Services

Cloud Library Management

SI/PI Services

Mechanical Engineering

Incubation & Innovation Development

PalPilot offers onsite service, resulting in clear communication between our ex-perienced designers and your team to seamlessly meet your needs. Key Features: Veteran PCB designers Close interaction Anywhere, Anytime Flexible schedule Industry leading software Concurrent engineering collaboration Around-the-clock routing support

PCB Technologies High-speed (>20Gbps/ channel) High Density Highly constrained High-Layer (> 40 layers) 2000+ pin BGA 0.4 mm pitch uBGA Controlled Impedance Backdrill Blind and buried vias HDI Via-in-pad

Industry Applications Rapid I/O Infiniband XAUI PCle Gigabit Ethernet Fibre Channel DDR, DDR2, DDR3 RF and Microwave ATCA & Micro-TCA

Capabilities Schematic Symbol Creation Footprint Creation - IPC-7351 — IPC-7251 - JEDEC Standards - Custom Land Pattern - Z-axis dimension Supported Platform OrCAD CIS Concept HDL DxDesigner Cadence Allegro Mentor Expedition Mentor PADS Power PCB Altium

Integrated High Speed SI/PI Modeling & Measurement

Signal/Power Integrity (SI/PI) Modeling Impedance Optimization Minimize Return Loss Insertion Loss Reduction Cross Talk Reduction Power I/R Drop Characterization

Agilent Joint Laboratory (System Measurement) Simulation Vs Measurement Characterization & Validation

CO-Design From PADORDER to PCB Layout Pinmap RDL routing Critical Signal EM Simulation PCB layout feasibility study Power/Gnd in region for combination

Industrial & Mechanical Design

Development & Prototyping – Soft Tooling

Simulation & Testing

Hard Tooling & Production

Designed in USA

Mechanical Engineers at Tustin, CA location

Latest Design Tools

PCB Fabrication

Quick Turn, 5-10 Days from Asia High Mix Low Volume Medium to High Volume Multilayer/Build up Flex, Rigid-Flex

IC Substrate & Packaging <100um FC Pitch, High I/O High Density CSP Flex + Metal Core

Materials - Standard Tg FR-4 - Mid Tg FR-4 - High Tg FR-4 - High Speed Materials - Mixed Dielectric Constructions - Halogen Free - High CTI - Polyimide (adhesive, adhesiveless) - PET / Polyester - Metal Cores

Surface Finishes - Leaded HASL - Lead Free HASL - Immersion Gold (ENIG) - Immersion Gold (ENEPIG) - Immersion Silver - Immersion Tin - Hard Gold (Fingers) - Selective Hard Gold - Wire Bondable Soft Gold - Flash Gold - OSP - Carbon Ink

Material Suppliers Isola

Sheng Yi ITEQ

Ventec Nelco

Megtron Rogers Taconic

RJ45 With Magnetics - PalNova

Discrete Magnetic Components - PalNova

Nextron High Speed I/O Connectors

Nextron Push-Pull Circular Connectors

PalConn Interconnect Products

Custom Cable & Wire Harness Assembly

Plastic & Metal Injection Molding, Die Casting,

Metal Stamping & CNC Fabrication

Power Cord

- China ROHS directive; Norway PoHS directive - California 65 proposal and HR4040 - PAHS ( polycyclic aromatic hydrocarbons ) control - Adjacent benzene two formic acid salt control

USB - USB 2.0 A to B - USB 3.0 to 3.1 - USB 3.1 Type-C - Custom Design - USB Committee Member

RF -Matches high frequency characteristics - 1.2H/1.5H/2.5H plug and socket series 0.81/1.00/1.13/1.32/ 1.37 wire

HDMI - HMDI 19 Pin Male to Male - HDMI 19 Pin Male to DVI-D - Custom Design - Low Noise - High Volume Manufacturing Capabilities

AOC - 56G QSFP + AOC - 40G QSFP+AOC - 10G SFP+AOC - HDMI + AOC - Hot Pluggable - Fiber to 100M - QSFP+MSA Compliant Form Factor - HDMI Compliant with version 1.4a

QSFP28 Main Features: •Nextron’s QSFP28 series include connectors, 1-by cages and 2-by cages & connectors. •It has style A and style B options. QSFP28 interconnects are designed for high-density applications supporting 25 Gbps or 28Gbps data rate per channel, or 100 Gbps and 112 Gbps full channels.

SFP28 Main Features: •Nextron’s SFP28 series include connectors, 1-by cages and 2-by cages & connectors. •SFP28 interconnects are capable of supporting up to 25 Gbps or 28 Gbps, with downward compatible to current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications.

QSFP+ Main Features: •Nextron’s QSFP+ series include connectors, 1-by cages and 2-by cages & connectors. •QSFP+ solution is designed for high-density applications supporting 10 Gbps or 14Gbps data rate per channel, or 40 Gbps and 56 Gbps full channels.

XFP Main Features: •Nextron’s XFP series include connectors and 1-by cages. •The XFP product line is designed to support 10 Gbps Fibre Channel, 10 Gbps Ethernet where telecom applications adopt mainly.

SFP+ Main Features: •Nextron’s SFP+ series include connectors, 1-by cages and 2-by cages & connectors. •SFP+ interconnects are designed to support applications for 8 Gbps Fibre Channel, 10 Gbps Gigabit Ethernet and capable of data transmission up to 10 Gbps per channel.

SFP Main Features: •Nextron’s SFP series include connectors 1-by cages and 2-by cages & connectors. •SFP interconnects are designed to support applications for 1.125 Gbps Fibre Channel, 2.5 Gbps Gigabit Ethernet and capable of data transmission up to 4G bps per channel.

MiniSAS HD Main Features: •Nextron’s MiniSAS HD series include internal and external connectors. •MiniSAS HD product is the next generation SAS storage interface addressing channel bandwidth requirements of 6 Gbps, 12Gbps and 14 Gbps meeting or exceeding the respective SAS 2.1 and proposed SAS 3.0 specifications.

Metal S Series Main Features:

Push-Pull self-latching 1 size 2 to 6 contacts Solder, print & crimp contacts Temp. range -55°C to 250°C For cable o 1.3 to 4.4 mm Current rating: 1.5 to 30A Dielectric withstanding voltage - 0.6 to 2.4 kV rms Insulation resistance: 1012Ω Durability: >5,000 cycles Shielding: >75dB at 10Mhz >40dB at 1Ghz

Metal K Series Main Features:

Push-Pull self-latching 3 sizes 2 to 32 contacts Solder, print & crimp contacts 8 keying options Temp. range -55°C to 250°C IP66/68 (when mated) For cable o 1.0 to 8.5 mm Current rating: 1.5 to 30A Dielectric withstanding voltage - 0.6 to 2.4 kV rms Insulation resistance: 1012Ω Durability: >5,000 cycles Shielding: >95dB at 10Mhz>80dB at 1Ghz

Metal B Series Main Features:

Push-Pull self-latching 4 Sizes 2 to 32 contacts Solder, print & crimp contacts Multiple keying options Temp. range -55°C to 250°C IP50 For cable o 1.4 to 9.9 mm Current rating: 1.5 to 30A Dielectric withstanding voltage 0.6 to 2.4 kV rms Insulation resistance: 1012Ω Durability: >5,000 cycles Shielding: >75dB at 10Mhz >40dB at 1Ghz

Plastic 1P Series Main Features:

Push-Pull self-latching 2 to 14 contacts Solder & print contacts 6 keying options 7 colour codings Temp. range PSU shell -50°C to 150°C PEI shell -50°C to

170°C Gray or black outershell IP50 For cable o 2.7 to 6.5 mm Current rating: 2 to 10A Dielectric withstanding voltage 0.6 to 1.2kV rms Insulation resistance: 1012Ω Durability: >2,000 cycles

Plastic 1P Fluidic Main Features:

Push-Pull self-latching Max. working pressure: 2 bars 6 keying options 6 colour codings Temp. range PSU shell -20°C to 150°C Gray or black outershell For cable o 2.7 to 6.5 mm Durability: >2,000 cycles

Plastic 2P series Main Features:

Push-Pull self-latching 2 to 34 contacts Solder & print contacts 4 keying options 7 colour codings Temp. range PSU shell -50°C to 150°C PEI shell -50°C to

170°C Gray or black outershell IP50 For cable o 3.2 to 9.2 mm Current rating: 1.5 to 30A Dielectric withstanding voltage 0.7 to 1.5kV rms Insulation resistance: 1012Ω Durability: >1,000 cycles

Micro Series Main Features:

Max.12 contacts Flex-pin Solder contacts Temp. range -55°C to 250°C For cable o 1.3 to 4.4 mm Current rating: 1.5 to 30A Dielectric withstanding voltage 0.6 to 2.4 kV rms Insulation resistance: 1012Ω Durability: >5,000 cycles Shielding: >75dB at 10Mhz>40dB at 1Ghz

USB Connectors - USB 3.1 - USB 3.1 Type-C - USB 3.0 - USB 2.0 - USB Type A - USB Type B - USB Type AB - Mini USB - Micro USB

BTB - 0.4 Pitch. 0.8H/0.9H/1.0H/1.5/H2.0H. - 10 Pin~60 Pin - Designed to Prevent Tin Wicking - Narrow Design to Reduce Space for PCB

HDMI - Type A (1.0 Spec) - Type B (1.0 Spec) - Type C (1.3 Spec) - Type D (1.4 Spec) - Type E (1.4 Spec) - Mini-HDMI - Micro-HDMI

RJ45 - 1x, 2x Series - USB Combo - LED Option - EMI Shield Option - Right Angle, Vertical

RF Connector -1.2H/1.5H/2.5H Plug and Socket Series 0.81/1.00/1.13/1.32/1.37 Wire - Supports Insert Molding Process for Sealing - Strong Chamber for Better Molding and Mating Guide

Custom -Plastic Cover - Stamping Contact - Insert Molding Mechanical Structure

Memory Card - 1.5/1.30H Push Pull Type Micro SD - Locking Feature for the Design - Anti Card Fast Eject Function - Detection Switch Pin Attached - Low Profile Sim Card

FPC - 0.3mm, 0.5mm Pitch 1.0H - 6 Pin ~ 67 Pin - Front and Backflip Lock - Designed to Prevent Tin Wicking - Superior Solder Peg

Types 10/100/1000 Base-T 10GBase-T RJ45 + USB Combo PoE/PoE Plus with Internal Diode Bridge

Packages Single Port Multiple Port Stacked Port Low Profile Vertical Custom Configurations Optional Emi Tabs

Features Integrated Magnetics Tab Up or Tab Down LED Color Options Surge Protection RoHS Compliant

Planar Transformers - Compact Size - Extra low profile - Low leakage inductance (Lk below 2% available) - Low power consumption (DC & AC character) - Wide operation frequency (50KHz-2MHz) - Hight efficiency (about 98~99%)

LAN Magnetics - 10/100/1000 Base-T LAN Magnetic Discrete Modules - PoE/PoE+ Modules - Power Supply

Composite Formed SMD Inductors - Low cost/low profile - High Current - Low Buzz Noise - High Performance - Lowest DCR per mm3 - Rugged Construction - Magnetically shielded - Soft Saturation Characteristics - UL94V-0 Materials

Ferrite Inductors -Power -Signal -Energy Storage -Power Supply

Rev 23.02.2017