Sep 20, 2017

Emerging Highly Compact Amplification Solutions for Coherent Transmission

Market Focus – ECOC 2017

Dr. Sanjai Parthasarathi

Vice President, Product Marketing & Strategy

II-VI Photonics

Page 2

Outline

1. High Bit Rate Transmission (100 Gb/s and beyond...)

• End Drivers, Market Trends and Projections

2. The Need for Amplification

3. Key Requirements & Desired Features

4. Enabling Components

5. Innovative Integration Platforms

6. Prognosis

7. Summary

Page 3

Bandwidth Drivers

Augmented &

Virtual Reality

5G

Peer to Peer sharing

Video traffic:

VoD, Surveillance…

IOT/IOE

Cloud, Analytics,

Business Tools

Industry 4.0

HD Video

Page 4

Towards a More Connected World

More connected People

More connected World >27 B devices by 2021* *Source: The Zettabyte Era-Trends and Analysis – Cisco, June 2017

+

=

More connected Machines

Page 5

IP Traffic Trends IP Traffic Growth

DATA migration:

Text Pictures Voice Video Augmented

Reality Virtual Reality

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The Optical Network

Submarine Line Terminal

Long Haul & Ultra-Long Haul

Submarine Link Hyper-scale Datacenters

DCI DCI

Metro Core

Datacenter Interconnect

Common Antenna TV

(CATV)

Fixed Broadband Access

Mobile Fronthaul/Backhaul

Metro Access

Enterprise Access

Cloud Services Social Networks

High-Frequency

Trading

400G

200G

100G

Coherent Transceivers

ROADM

Metro Aggregation

5G

Focus of this Talk

Optical Switching

Optical Amplification

Optical Monitoring

Legend :

WSS, MCS

Pump Lasers, Micro-optics

OCM, OTDR

Page 7

High Bit Rate Transmission Market

* Source: Dell’Oro – July 2017

100+ Gbits/s

coherent ~90% of the WDM equipment

market by 2021*

Demand for coherent wavelengths running at speeds of 100 Gbps and higher are expected to grow at a solid pace for the next five years*

Source: Ovum - Jan 2017

WDM linecard revenue comparison, 2014–21

CAGR: 7.8%

Page 8

Increasing Front Panel Capacity*

CFP2: 107.5 x 41.5 x 12.4 mm = 55 cm3

iPhone 5S: 123.8 x 58.6 x 7.6 mm = 55 cm3

iPhone X: 143.6 x 70.9 x 7.7 mm = 78 cm3

* 1RU Face plate

800 Gb/s

400 Gb/s

3.2 Tb/s

3.6 Tb/s CFP8

QSFP-DD

OSFP

6,4 Tb/s

14.4 Tb/s

12.8 Tb/s

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High Bit Rate Transmission Technologies

100 G Technologies

10 40 80 1000

IEEE SR4, LR4, ER4

PAM4 QSFP28

OIF Coherent CFP/CFP2

Distance, km 600

QPSK/16-QAM 100G/200G DWDM

QPSK/16-QAM 100G/200G/400G DWDM

Source: 2016 AGC Research and Inphi

Source: Ovum-2017

COHERENT IS THE DOMINANT INCUMBENT

Direct Detect

DWDM

Sep-2017

Page 10

Direct Detect DWDM Growing as a Viable Alternative for < 80 km

Advantages:

70% lower total cost of ownership

Plugs directly into switch

Small, QSFP-28 form factor

No separate muxponder needed

Higher capacity (4X)

Lower power consumption (5X)

Direct Detect DWDM vs. Coherent

Amplification critical to overcome mux/demux loss Direct detect - may need dispersion management

Opportunity to integrate OTDR for fiber integrity and OCM for Signal integrity

~60% of Links < 80 km

INPHI ColorZ

DWDM PAM4

100G Switch 100G Switch

DWDM PAM4 QSFP-28

40x

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Need for Amplification 1. Modulation losses

• Especially important with Silicon photonics • Complex modulation formats

2. Losses from polarization combiners and other optical elements 3. Passive coupling losses from ROADM/MCS 4. Tunable Filter losses 5. High Optical Output Power needed for Backward compatibility with legacy equipment

Erbium Doped Fiber Amplifiers (EDFAs) is the technology of choice (over SOAs) Low power consumption No cooling required with uncooled 980nm pumps More efficient Slow gain dynamics, so no penalty Only solution in Silicon Photonics approaches BUT • Need to be physically accomodated in the transciever • Additional cost

SOA EDFA

OOK DPSK DP-QPSK DC- DP-QPSK

10G 40G 100G 400G

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Need for Wavelength Tunable Filtering OSNR requirements drive ultra-compact low cost filtering

Transceiver Module (Ex: 100G CFP)

Transponder line card

1

2

Before Rx Non-adjacent Channel isolation Improvement

After Tx Amplified Spontaneous Emission (ASE) Noise filtering GFF & VOA substitution

Tx

Rx

Source: «Path to 400G» - Fujitsu 2013

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EDFAs for Coherent Transcievers

EDFA Low Noise

Compact

Low Cost

Easy to Integrate

Low Power

Key Requirements & Desired Features

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Enabling Components for EDFA

Requirements for Coherent Transceiver Integration

1. Small form factor

2. Combine multiple functions – hybrids 3. Easy to integrate over high density electronics/actives skyline 4. Thin and flat (over cylindrical) 5. Low power consumption 6. Low loss 7. Customizability (flexible design and process), C & L Band capability

Isolator

Isolator

EDF

PD

Tap Coupler Tap

Coupler

PD

WDM GFF

Signal In

Amplified Signal Out

Pump

Pump Laser

EDF

VOA

Page 15

Pump Technology Evolution

Uncooled

High Power

Dual Chip

Mini DIL

Micro

Nano

Dual-Chip Pumps Enabling Low Cost, Compact Arrayed Amps

Enabling Next Gen Coherent Amplification

Butterfly Cooled

Page 16

EDFA: Pump Trends

Pumps • Small

• Uncooled

• Low profile

• Fiber Bragg Grating in package

• Low power consumption

• Flat packages preferred over cylindrical for thermals

Micro Pump Mini Pump Thin and Flat

Relative size comparison of typical CFP2, CFP4 & micro-pump

11.1 x 4.4 x 3.1 mm

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• From Cylindrical to Thin and Flat packages

• Shrinking Tunable Filters (MEMS and Etalon)

• Single sided devices for easy fiber handling

• Multi-function Hybrids (WDM/Isolator/GFF/Tap/PD)

Passives EDFA: Passive Component Trends

Tap/PD/VOA

Isolator Tap Coupler

PD

GFF

Polarization Combiners VOA

Dual sided

Single sided

Mini MEMS Tunable Filter w/ VOA • Wide band width, continuous tuning

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Need for Flexible Integration Platforms

EDFAs have been integrated the same way for 15 years 1. Bulk Optics in free space Packaged in Cylindrical Packages Pigtailed using

Collimating Optics 2. Spliced together with other optical components

These integration approaches are inadequate • Unable to keep up with the demands from emerging coherent transceivers

Innovative components are necessary but not sufficient…

NEW INTEGRATION PLATFORMS ARE A MUST !

19 Company Confidential

Innovative Integration Platforms Emerging

Clever Conventional Packaging Layout, use of fiber guides, fixtures...

Innovative Substrates & Platforms Flexible Substrates* to hold components, fiber

management (incl. Er) to custom fit in 3-D

* II-VI FlexSOM What’s Next ? Highly Integrated Micro-optics ?

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Summary and Prognosis

1. High Bit Rate Coherent Transmission will continue to remain one of the strongest growing

market segments within Optical Networks

2. Complex modulation formats and Silicon Photonics based integration platforms will need

loss compensation

3. Erbium Doped Fiber Amplifier is the technology of choice

4. Innovative Enabling Components becoming available for EDFA transcievers

5. Innovative Integration Platforms Emerging

Page 21

Thanks!

Acknowledgements: Sara Gabba & Ian McClean