EMBEDDED - DATA MODUL · EMBEDDED SOLUTIONS DATA MODUL offers perfectly coordinated embedded...

EMBEDDED

EMBEDDED SOLUTIONS

DATA MODUL offers perfectly coordinated embedded computer systems based on x86

and ARM architectures. From pre-configured kits, complete custom baseboard design

to professional embedded computing design – DATA MODUL provides the full range of

embedded solutions. Display control technology is offered in a wide variety of building

blocks and solutions based on DATA MODUL’s proprietary know-how.

› CPU boards

› Embedded box PCs › eMotion LCD controller boards

› Embedded computing design

INDEX

Competencies .......................................................... 4

Technologies and Brands ....................................... 8

Markets and References ....................................... 10

Products ................................................................. 12

2 | www.data-modul.com [email protected] 3


› Large product portfolio of x86 and ARM

based embedded boards

› Various form-factors and performance

levels

› Long-term partnership with world-leading

manufacturers of embedded products

› Intel based COM Express® Modules

› Single board computers & baseboard

designs

› Compact and rough housing concepts

› Extensive distribution portfolio of leading

box PC manufacturers

› Available with IP protection classes IP20

to IP65

› Extended temperature range

› With different certifications available

› Configurable on customer demands

(Memory, SSD, OS, interfaces)

› High-end board solutions for displays

up to UHD/4k resolution

› Latest display interfaces and inputs

› Fully configured plug & play kits with

converter, power supply, cables and

OSD board

› For outstanding image quality

CPU BOARDS EMBEDDED BOX PCseMotion LCD CONTROLLER BOARDS

DATA MODUL embedded solutions comprise CPU modules, baseboards, single board computers

and LCD controller boards developed entirely in-house.

› Pre-configured kits consisting of embedded

board, display and fitting cable set

› Adaption and integration of all available

displays (TFT-LVDS, TFT-TTL, eDP) incl.

inverters, tested cables and adapted

power ON/OFF timing

› Customized images for embedded

operating systems

› Custom embedded OS services

EASYKIT-SOLUTIONS

COMPETENCIES


› Long-term availability of at least 5 years

› Professional PCN/EOL processes

› In-house FAE team and worldwide sales offices to

quickly and flexibly meet even major challenges

and deadlines

› Long-term partnership with world-leading

manufacturers of embedded products

› Adaption and integration of TFTs including video

BIOS (certified settings for each TFT available)

› Accessories like memory modules, mass-storage

and extension modules

› Customization based on standard products

› Programmable logic

› BIOS/UEFI support

› Bootloader support

› Driver development, APIs

› Board support packages

› Mainline based Yocto Linux OS

SOFTWARE DEVELOPMENTEMBEDDED COMPUTING DESIGN SERVICES & SUPPORT CUSTOMER ADVANTAGES

DATA MODUL is greatly expanding its display control expertise. An experienced engineering team

dedicated to developing professional embedded computing designs now supports high quality

product development for industrial use. Customers benefit from the modular concept resulting in

validated core components, reduced development time and less time for validation.

› Schematic and layout review

› Design validation

› Comprehensive technical support

› Compliance measurements

› Custom embedded OS services

(WES8, WES7, WinXPe, WinCE6,

WinEC7, WinEC2013, Win10IoT,

Embedded Linux)

› Standard and customized computer-on-modules,

baseboard designs and single board computers

› Latest CPU platforms

› Latest professional measuring equipment

› Failure mode and effects analysis

› R & D sites in Germany

› System integration with all other key technologies

including display, touch sensor and certifications

› From low power single-core designs up to high end

multi-core solutions

› Part selection in consideration of cost and quality

COMPETENCIES

› Form factors, e.g. ATX, Micro-ATX, Mini

ITX, Pico ITX, 3.5” and more

› No carrier board needed

› “Off-the-shelf” solutions

› Proven reference design based on

Computer-On-Modules

› Building blocks for reduced

development time and cost

› All performance levels

› Form Factors, e.g. COM Express, Qseven,

SMARC, Colibri and more

› Customer-specific carrier board

› x86-based modules

› ARM-based modules

EBX 146 x 203 mm / 5.75” x 8.0”

EPIC 115 x 165 mm / 4.5” x 6.5”

3.5” 102 x 145 mm / 4.02” x 5.71”

PC/104 90 x 96 mm / 3.575” x 3.775”

Pico-ITX 100 x 72 mm / 3.9” x 2.8”

COM Express mini 84 x 55 mm

COM Express compact 95 x 95 mm

COM Express basic 125 x 95 mm

› Avalue

› congatec › MSI

› F&S › Toradex

› ASRock


In addition to the product portfolios of all major embedded manufacturers, DATA MODUL offers

a wide range of professionally designed embedded solutions, developed and designed by the

in-house development team based in Deggendorf.

TECHNOLOGIES & BRANDS

FULL-CUSTOM DESIGN DISTRIBUTION PARTNERSSINGLE BOARD COMPUTER (SBC) COMPUTER-ON-MODULES (COM)


DATA MODUL understands that embedded technology is a rapidly growing market. Its aim is to further consolidate this market growth through its innovative product portfolio. The following applications are just an example.

› Dedicated certifications

› Particular electromagnetic

compatibility (EMC)

› Long-term availability

› High performance CPU boards

› Embedded solution with

custom dimensions

› Independent driving of

several displays

› Ultrasonic devices

› Computer tomography

› Non-invasive ventilation

› Slot machines

› Player tracking systems

› Kiosk

› Long life solutions

› Shock resistance

› Obsolescence management

› Computer numeric control

› Diagnostic systems

› Machine control

› Low power consumption

› Vibration resistance

› High signal-to-noise-ratio

› Passenger information system

› Ticket vending machines

› Control stand applications

› Reliable operation

› High durability

› Extended temperature range

› Human machine interfaces

› Sensors

› Motion control

› IOT-ready embedded

solutions

› Driving solutions for high

resolution displays

› Low power consumption

› Building automation

› Security

› Access control systems

MARKET DEMANDS MARKET DEMANDS

REFERENCE APPLICATIONS REFERENCE APPLICATIONS

MEDICINE & HEALTHCARE

MECHANICAL ENGINEERING

AUTOMATION & ROBOTICS

BUILDING TECHNOLOGY

TRANSPORTATIONDIGITAL SIGNAGE & GAMING

MARKETS & REFERENCES

Mechanical Engineering

Gam

ing

Ou

tdo

or MaritimeAutomotive

Transportation

Point of Sales

Digital Signage

Automation & Robotics

MedicineBuilding Technology

Wh

ite Go

od

s Portable Application


eDM-COMB-KL6 eDM-COMB-SL6

Formfactor COM Express Basic Type 6 COM Express Basic Type 6

Processor 7th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E36th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E3, Celeron® G3900E/G3902E

Chipset Mobile Intel® 100 series, QM175, HM175 and CM238 Mobile Intel® 100 series, QM170, HM170 and CM236

DRAM2x DDR4 SO-DIMMs up to 2400MT/s and 32 Gbyte, Intel® Xeon® and Intel® i3 with ECC support

2x DDR4 SO-DIMMs up to 2133MT/s and 32 GByte, Intel® Xeon® with ECC support

Mass storage 4x SATA 3 4x SATA 3

Bus 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO

Ethernet 10/100/1000BaseT 10/100/1000BaseT

I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)

Panel Interface LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.) LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.)

Audio HD audio HD audio

OthersDMEC board controller, TPM 1.2/TPM 2.0, Intel® Optane memory

DMEC board controller, TPM 1.2/TPM 2.0

eDM-COMB-BW6 eDM-COMB-HW6


Processor 5th Gen Intel® Core™ i7/Intel® Xeon® E34th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E3, Celeron® 2000E/2002E

Chipset Mobile Intel® 8 Series QM87 and HM86 Mobile Intel® 8 Series QM87 and HM86

DRAM 2x DDR3L SO-DIMMs up to 1600MT/s and 32 GByte 2x DDR3L SO-DIMMs up to 1600MT/s and 32 GByte

Mass storage 4x SATA 3 4x SATA 3

Bus 7x PCIe Gen 2, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO 7x PCIe Gen 2, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO


I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2)

Panel Interface LVDS 2x 24/eDP, 3 x DDI (DP++, HDMI, DVI), 1x VGA (opt.) LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.)


Others DMEC board controller, TPM 1.2/TPM 2.0 DMEC board controller, TPM 1.2/TPM 2.0

COMPUTER-ON-MODULES

KABYLAKE

› 7th Gen Intel®

Core™ processor

SKYLAKE

› 6th Gen Intel® Core™

processor

BROADWELL


processor

HASWELL


processor

BRASWELL

› 4th Gen Intel®

AtomTM processor

APOLLO LAKE

› 5th Gen Intel® Atom™

SoC processor

eDM-COMC-BS6 eDM-COMB-AL6


Processor

Intel® Pentium® N3710, QC 2.56 GHzCeleron® N3160 QC 2.24 GHzCeleron® N3060 DC 2.48 GHzCeleron® N3010 DC 2.24 GHzAtom™ X5-E8000 QC 2.00 GHz

Intel® Pentium® N4200, QC 2.50 GHzCeleron® N3350 DC 2.40 GHzAtomTM x5-E3950 QC 2.00 GHzAtomTM x5-E3940 QC 1.80 GHzAtomTM x5-E3930 DC 1.80 GHz

Chipset Integrated in SOC Integrated in SoC

DRAM 2x DDR3L SO-DIMMs up to 1600MT/s and 8 GByte 2x DDR3L SO-DIMMs up to 1866MT/s and 8 GByte

Mass storage2x SATA 3, 1x microSD card socket (opt.)max. 64 Gbyte eMMC onboard

2x SATA 3, 1x microSD card socket (opt.) max. 64 Gbyte eMMC onboard

Bus 3x PCIe Gen 2, LPC, SPI, I²C, GPIO 5x PCIe Gen 2, LPC, SPI, I²C, GPIO


I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)

Panel Interface LVDS 2x 24/eDP, 2x DDI (DP++, HDMI, DVI), 1 x VGA (opt.) LVDS 2x 24/eDP 1.3, 2x DDI (DP++, HDMI, DVI), 1x VGA (opt.)


Others DMEC board controller, MIPI-CSI 2.0, TPM 1.2 / TPM 2.0b DMEC board controller, TPM 1.2/TPM 2.0

FLEXIBLE SOLUTION FOR ARM BASED PANEL PCS

eDM-CB-Colibri

Formfactor 115 mm x 76 mm

Processormodules Entire Colibri family (SO-DIMM)

Mass Storage microSD card slot

Ethernet RJ45 ethernet connector

USB3x USB 2.0 Type-A host, 2x USB 2.0 host pin header (1x shared), 1x USB OTG Micro

Panel Interface 24 bit TTL-RGB, 2x 24 bit LVDS, HDMI, VGA

Internal I/OSPI, UART, PWM, GPIO, analog input, I²C, CAN, RS232/485/422

Supply Voltage 9 to 24 VDC

On-Board Power Supplies 12 VDC Max. 1A, 5 VDC max. 6A, 3.3 VDC max. 3A

› ARM baseboard for Toradex

Colibri module (115 x 76mm)

› 24 Bit TTL RGB & LVDS to WXGA

› 4x USB 2.0 host and 1x USB OTG

› Interfaces: LAN, RS232/485/422,

CAN,I²C, SPI, RTC, GPIO

› Wide power input:

9 VDC to 24 VDC

› Power supply to drive

panels up to 10.4”


conga-TS170 conga-TS175 conga-TCA5

Formfactor COM Express Type 6 COM Express Basic Type 6 COM Express Mini Type 10

Processor6th Gen Intel® Core™/Celeron® processors („Skylake“)

7th Gen Intel® Core™/Intel® Xeon® E3 processors („Kabylake“)

5th Gen Intel® Atom™/Celeron®/Pentium® processors („Apollo Lake“)

Chipset Mobile Intel® 100 Series Mobile Intel® 100 Series Integrated Intel® SoC

DRAM2x DDR4 SO-DIMMs up to 2133MT/s and 32 Gbyte

2x DDR4 SO-DIMMs up to 2400MT/s and 32 GByte

2x DDR3L SO-DIMMs up to 1687MT/s and 8 GByte

Mass storage

4x SATA Gen 3 4x SATA Gen 32x SATA 3.0, up to 64 GByte eMMC onboard

Bus8x PCIe Gen 3, LPC, I²C, 2x UART

8x PCIe Gen 3, LPC, I²C, 2x UART 5x PCIe, LPC, SPI, I²C, 2x UART

Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT

I/O 8x USB 2.0, 4x USB 3.0 8x USB 2.0, 4x USB 3.0 4x USB 3.0, 8x USB 2.0

Panel Interface

3x DP 1.2/HDMI, LVDS 2x 24bit 3x DP 1.2/HDMI, LVDS 2x 24bit2x DP/HDMI/LVDS 2x 24 bit, 1x eDP optional

Audio HD audio HD audio HD audio

Others ACPI 4.0 with battery support ACPI 4.0 with battery supportACPI 5.0 with battery support, ext. temp. -versions available

conga-MA3 conga-MA4 conga-MA5

Formfactor COM Express Basic Type 10

Processor3rd Gen Intel® Atom™/Celeron® processors („Bay Trail)

4th Gen Intel® Atom™/Celeron®/ Pentium® processors („Braswell“)


Chipset Intel® SoC integrated Intel® SoC integrated Integrated in SoC

DRAMMax. 8 Gbyte DDR3 onboard DDR3

max. 4 GByte DDR3L 1600 Up to 8 GByte DDR3L onboard

Mass storage

2x SATA, eMMC up to 64 GByte, SDIO

2x SATA 3.0, SDIO, up to 32 GByte eMMC

2x SATA 3.0, up to 64 Gbyte eMMC onboard

Bus 4x PCIe, LPC, I²C, SMBus, SPI 3x PCIe, I²C, 2x UART, SMBus 3x/4x PCIe, I²C, 2x UART, SMBus

Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT

I/O 7x USB 2.0, 1x USB 3.0 8x USB 2.0, 2x USB 3.0 6x USB 2.0, 2x USB 3.0/2.0

Panel Interface

LVDS 1x 24, 1x HDMI/DPLVDS 1x 18 bit/1x 24 bit, 2x DP/HDMI/DVI, 1x eDP

LVDS 1x 18 bit/1x 24 bit or eDP, 1x DP/HDMI

Audio HD audio HD audio HD audio

OthersACPI 5.0 with battery support, ext. temp. -versions -40°C to 85°C

ACPI 5.0 with battery support ACPI 5.0 with battery support

conga-QA3 conga-QA4 conga-QA5 conga-SA5

Formfactor Qseven™ (70 x 70 mm) Qseven™ (70 x 70 mm) μQseven™ (70 x 70 mm) SMARC 2.0 (82 x 50 mm)

Processor3rd Gen Intel® Atom™/Celeron®/Pentium® processors („Bay Trail“)

4th Gen Intel® Atom™/Celeron®/Pentium® processors („Braswell“)



Chipset Integrated in SOC Integrated in SOC Integrated in SOC Integrated in SOC

DRAM Up to 8 GByte DDR3 onboard Up to 8 GByte DDR3L onboard Up to 8 GByte DDR3L onboard up to 8 GByte DDR3L onboard

Mass storage2x SATA, 1x SDIO, up to 32 GByte eMMC onboard

2x SATA 3.0, 1x SDIO, up to 64 Gbyte eMMC onboard

1x SATA 3.0, up to 64 GByte eMMC onboard

1x SATA 3.0,up to 64 Gbyte eMMC onboard

Bus LPC, SPI, I²C, 3x PCIe LPC, SPI, I²C, 3x PCIe SPI, I²C, 1x PCIe, LPC 4x PCIe, 2x I²C, , 2x SPI

Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT 10/100/1000 BaseT

I/O6x USB 2.0 or 1x USB 3.0 and 5x USB 2.0

8x USB 2.0 or 1x USB 3.0 and 5x USB 2.0

5x USB 2.0, 1x USB 3.0/2.0 4x USB 2.0, 2x USB 3.0

Panel Interface LVDS 2x 24/HDMI or DP LVDS or 2x eDP, DP or HDMILVDS (single/dual channel)/eDP, HDMI or DP

LVDS 2x 24 /eDP, HDMI or DP

Audio HD audio HD audio HD audioHD audio/integrated audio DSP

OthersACPI 5.0 compliant, smart battery management, ext. temp. -versions available

MIPI-CSI 2.0 for up to 2x HD-cameras, hardware accelerating video decoding

1x MIPI-CSI x4/1x MIPI-CSI x2, smart battery management, ext. temp. -versions available

1x MIPI-CSI x4/1x MIPI-CSI x2, smart battery management, ext. temp. -versions available

COMPUTER-ON-MODULE ADVANTAGES COMPARED TO FULL CUSTOM DESIGNS

CONCEPT

› CPU module with standard PC core

functions

› Carrier board with customer specific

functions & size

› Logical alternative to a chip-down

design effort

BENEFITS

› Faster time to market

› Reduced development costs

› Scalable product range

› Allows customer focus on system

features

› Faster reaction to market trends

› Second source philosophy

› Minimize inventory cost

COMPUTER-ON-MODULES


Apalis T30 Apalis i.MX6 Apalis TK1

Formfactor MXM3 (82.0 x 45.0 x 6.0 mm)

OSLinux or Win EC7, Win EC 2013 incl. runtime license

Linux or Win EC7, Win EC 2013 incl. runtime license

Linux

ProcessorNVIDIA®Tegra 3 CortexA9 Quad-Core up to 1.4 GHz

NXP® i.MX 6 Cortex-A9 (Dual-/ Quad-Core) up to 1.0 GHz

NVIDIA®Tegra K1 CortexA15 Quad-Core up to 2.2 GHz

RAM 1 GByte/2 GByte RAM onboard512 MByte/1 GByte/2 GByte RAM onboard

2 GByte RAM onboard

Mass storage

4 GByte/8 GB eMMC flash onboard 4 GByte eMMC flash onboard 16 GByte eMMC flash onboard

Ethernet 10/100/1000 MBit

I/O2x CAN, 4x UART, 3x USB, 3x I²C, 2x SPI, PCIe, SATA, 4-wire res. touch

2x CAN, 5x UART, 5x USB, 3x I²C, 3x SPI, PCIe, SATA, 4-wire res. touch

2x CAN, 10x UART, 3x USB 3.0, 7x I²C, 5x SPI, 1 x USB 2.0, PCIe, 1 x SATA 2, 4-wire res. touch

Graphics NVIDIA GPU up to Full HD (1080p) Vivante up to Full HD (1080p) NVIDIA GPU up to Ultra-HD (4k)

Panel Interface

24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI

24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI

1 x 24 Bit LVDS, HDMI

Audio In/Out/Mic

OthersMax. 127 GPIOs, 4x ADC, temp. 0°C to 70°C (-40°C to 85°C)

Max. 135 GPIOs, 4x ADC, temp. 0°C to 70° C (-40°C to 85°C)

Max. 92 GPIOs, 21 x AI (12Bit), temp. -20°C to 85°C

APALIS

The latest SOM product family Toradex integrates high performance ARM® embedded processors from Nvidia®

and NXP®. This offers solution for a numerous of multimedia / industrial applications with long-term availability.

Apalis 82.0 x 45.0 mm / 3.22” x 1.77”

Colibri 67.6 x 36.7 mm / 2.66“ x 1.44“

ARM BASED COM-MODULES

Colibri VF50 Colibri VF61 Colibri iMX7D / 7S

Formfactor SO-DIMM, (67.6 x 36.7 mm)

OSLinux or Win CE6, Win EC7 incl. runtime license

Linux or Win CE6, Win EC7 incl. runtime license


ProcessorNXP® Vybrid™ ARM Cortex™-A5 400MHz

NXP® Vybrid™ ARM Cortex™-A5 500MHz, Cortex™-M4 167 MHz

NXP® i.MX 7Solo /Dual ARM Cor-tex™-A7800MHz/1.0GHz, Cortex™-M4 200MHz

RAM 128 MByte DDR3 256 MByte DDR3 256 MByte/512 MByte/1 GByte DDR3

Mass storage 128 MByte NAND 512 MByte SLC NAND 512 MByte SLC NAND

Touch interfaces

4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/UART

Ethernet 10/100Mbit IEEE1588 + 2nd RGMI 10/100Mbit IEEE1588 + 2nd RGMI 10/100Mbit IEEE1588 + 2nd RGMI

I/O2x CAN, 5x UART, 2x USB, 4x I²C, 17x PWM

2x CAN, 5x UART, 2x USB, 4x I²C, 17x PWM

2x CAN, UART, 2x USB, I²C, SPI, PWM

Graphics 2D acceleration max. 1024 x 768 pixel 2D acceleration max. 1024 x 768 pixel 2D acceleration max. 1920 x 1080 pixel

Panel Interface

24Bit TTL-RGB 24Bit TTL-RGB 24Bit TTL-RGB

Audio In/Out/Mic In/Out/Mic

OthersMax. 101 GPIOs, 2x analog input, 1x camera interface, temp. 0°C to 70°C (-40°C to 85° C)

Max. 101 GPIOs, 2x analog input, 1x camera interface, temp. 0°C to 70°C (-20°C to 85° C)

External bus: 16 Bit temp. -20°C to 85°C

Colibri iMX6DL / 6S Colibri T20 Colibri T30

Formfactor SO-DIMM, (67.6 x 36.7 mm)

OSLinux or Win EC7, Win EC 2013 incl. runtime license

Linux or Win CE6, Win EC7 incl. runtime license


ProcessorNXP® i.MX6 Solo /I.MX6 DualLite 1x Cortex-A9 1.0 GHz / 2x Cortex-A9 1.0 GHz

NVIDIA® Tegra 2 Cortex-A9 Dual 1.0 GHz

NVIDIA® Tegra 3 CortexA9 Quad 1.4 GHz

RAM 512 MByte/256 MByte DDR3 512 MByte/256 MByte DDR3 1 GByte DDR3

Mass storage 4 GByte eMMC 512 MByte/1 GByte NAND 4 GByte eMMC

Touch interfaces

4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C /USB/UART

Ethernet 10/100 Mbit IEEE1588 10/100 Mbit 10/100 Mbit

I/O 2x CAN, UART, 2x USB, I²C, SPI, PWM 5x UART, 2x USB, 2x I²C, 4x SPI, 4x PWM 5x UART, 2x USB, 3x I²C, 5x SPI, 4x PWM

Graphics Vivante up to Full HD (1080p) Nvidia up to Full HD (1080p) Nvidia up to Full HD (1080p)

Panel Interface

24 Bit TTL-RGB, HDMI 24 Bit TTL-RGB, HDMI , VGA 24 Bit TTL-RGB, HDMI , VGA

Audio In/Out/Mic In/Out/Mic In/Out/Mic

OthersExternal bus 32Bit, max. 110 GPIOs, 4x ADC, temp. 0°C to 70°C (-40°C to 85°C)

Max. 110 GPIOs, 4x analog input, temp. 0°C to 70°C (-20°C to 85°C)

External bus 16Bit, max. 110 GPIOs, 4x analog input, temp. 0°C to 70°C (-40°C to 85° C)

COLIBRI

The Colibri product family ARM® envelop currently twenty scalable boards from low power to high performance.

Toradex integrates embedded SoC from Nvidia®/ NXP® and Marvell.



EFUS™/QSEVEN™ The new small “efus™” SOM product family with the latest scalable NXP® I.MX processors, offers solution for

every application.

ARMSTONE™ armStone™ SBC product family is the fastest way to start a project, an addition carrier board is not required.

efus™A9 efus™A9X efus™A7UL efus™A53LS

Form factor efus™ (47 x 62,1 mm)

OS Android, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license

ProcessorNXP® i.MX 6 Cortex-A9 (Solo-/DualLite/Quad) up to 1.2 GHz

NXP® i.MX 6 Cortex-A9 SolX max. 1.0 GHz u. Cortex M4 200 Mhz

NXP® i.MX 6 Cortex-A7 UltraLite max. 696 MHz

NXP® QorIQ®LS1012A Cortex®-A53-800 MHz (Layerscape)

DRAM Max. 2 GByte onboard Max. 2 GByte onboard Max. 1 GByte onboard 512MB onboard

Mass storageMax. 32 GByte eMMC, 1 GByte NAND, SATA

Max. 32GByte eMMC, 1 GByte NAND

Max. 32GByte eMMC, 1 GByte NAND

64 MB QSPI NOR Flash

Ethernet 10/100/1000 MBit 2x 10/100/1000 MBit 2x 10/100/1000 MBit 2x 10/100/1000 MBit

I/O2x CAN, 4x UART, 2x USB, I²C, 2x SPI, PCIe

2x CAN, 4x UART, 2x USB, I²C, SPI


1x CAN, 1x UART, 1x USB 3.0 OTG, 1x PCIe, 1x SATA, 1x SDIO

GraphicsVivante GPU up to Full HD (1080p)

Integrated up to 1280 x 1024 pixel (WXGA)

Integrated up to 1280 x 1024 pixel (WXGA)

N/a

Panel Interface 18bit TTL-RGB, 2x 24Bit LVDS 18 bit TTL-RGB, 24Bit LVDS 18 bit TTL-RGB N/a

Audio I²S I²S I²S N/a

OthersTemp. 0°C to 70° C (-20°C to 85° C)

Optional: IEEE802.11b/g/n, BT3.0, temp. 0°C to 70°C (-20°C to 85°C)

Optional: IEEE802.11b/g/n, BT3.0, temp. 0°C to 70°C (-20°C to 85°C)

Bluetooth 4.0, WLAN, temp. 0°C to 70°C (-20°C to 85° C)

armStoneA5 armStoneA8 armStoneA9 armStoneA9r2

Formfactor Pico-ITX (100 x 72 mm)

OS Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license

ProcessorNXP® Vybrid Cortex-A5 500 MHz/Cortex-M4 167 MHz

Samsung S5PV210 Cortex-A8 800 MHz 1.0 Ghz

NXP® i.MX 6 Cortex-A9 (Solo-/ Dual-/Quad), 800 Mhz up to 1.0 GHz

NXP® i.MX 6 Cortex-A9 (Solo/ DualLite / QuadPlus) 1.0 GHz

DRAM Max. 1 GByte onboard Max. 1 GByte onboard Max. 4 GByte onboard Max. 4 GByte onboard

Mass storage Max. 512 MByte onboard Max. 512 MByte onboard Max.1 GByte NANDMax. 32 GByte eMMC, 1 GByte NAND

Ethernet 1-2 ETH 10/100 MBit 1-2 ETH 10/100 MBit 10/100/1000 MBit 10/100/1000 MBit

I/O1-2x CAN, 3x UART, 2x USB, I²C, SPI


1-2x CAN, 3x UART, 5x USB, I²C,SPI, mPCIe, SATA

2x CAN, 5x UART, 5x USB, I²C, SPI, mPCIe, SATA

GraphicsIntegrated up to 1024 x 768 pixel

Integrated up to Full HD (1080p)

Vivante GPU up to Full HD (1080p)

Vivante GPU up to Full HD (1080p)

Panel Interface

18 Bit TTL-RGB, 18Bit LVDS 18 Bit LVDS, HDMI18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI

18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI

Audio In/Out/MIC

OthersMax. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)

Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)

Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)

Bluetooth BT3.0 IEEE 802.11a/b/g/n


› LCD-controllers especially designed for the

needs of industrial customers

› Long term availability and product stability

› Fully configured plug & play kits

› Outstanding image quality

eMotion UHD eMotion USB

Input/s 2x DP (1.2)/HDMI (1.4)/DVI (Dual-Link) 1x USB Type C with Alternate Mode

Display Support V-BY-One 8 lanes, eDP 8 lanes 2 channel LVDS interface

Color Depth 24/30 Bit (1,07 Mrd) 6/8 Bit

Max. Resolution Up to 3840 x 2160 pixel @60Hz (UHD) Up to 1920 x 1200 pixel

Dimming Support Analog and PWM Analog and PWM

Power 12/24V USB-PD (5 to 20 VDC)

Mechanical Dimensions

140 x 140mm 80 x 100mm

Special Features DDC/CI support, OSD keyboard or IR commanderUSB Type C Input (DP-signals with USB-PD), 1x USB 2.0 (external for e.g. keyboard/mouse), 1x USB 2.0 (internal for e.g. touch controller), 1x stereo audio out

Summary High-end board for UHD/4k displaysThe new cost effective "one cable solution" for compact & slim monitor designs

eMotion ST2:2/eMotion ST2:3 eMotion ST1:3

Input/s RGB/DVI on ST2:2, DP(1.1)/DVI-I on ST2:3 DP (1.1)/RGB/DVI

Display Support 2 channel LVDS interface 2 channel LVDS interface

Color Depth 6/8 Bit 6/8 Bit

Max. Resolution Up to 1920 x 1200 pixel Up to 1920 x 1200 pixel


Power 12/24V 12/24V


96 x 96mm 149.9 x 110mm

Special Features DDC/CI support, OSD via RS232DDC/CI support, OSD via RS232, large screen support, 24V->12V DC/DC converter for 12V backlight

Summary Entry level board with attractive price Midrange board, especially for large screen applications

eMotion ST5:3 eMotion ST3:4

Input/s DP (1.1)/RGB/DVI (via special connector) DP (1.2)/HDMI (1.4)/DVI/RGB/CVBS / YC

Display Support 2 channel LVDS interface 4 channel LVDS interface and DisplayPort output

Color Depth 6/8 Bit 8/10 Bit

Max. Resolution Up to 1920 x 1200 pixel Up to 2560 x 1600 pixel


Power 12/24V 5/12V


120 x 100 x 8.5mm 155 x 115mm

Special FeaturesDDC/CI support, OSD via RS232, low profile for special applications

DDC/CI support, OSD via RS232, IR option, onboard memory, DP daisy chaining, support for large screens and ambient light sensor, PIP, PBP, 10bit support, FRC (60->120Hz), up- /downscaling

SummaryEntry level board for low profile or DisplayPort only applications

High-end board for all possible requirements

LCD CONTROLLER BOARDS


3.5” SBC-210 MS-98F6 / MS-98G6 MS-98I8 ECM-BSW

Formfactor 3.5“

ProcessorIntel® Celeron® N2930 1.83 GHz/J1900 2.0 GHz

Intel® Celeron® N2930 1.83 GHz/J1900 2.0 GHz

Intel® Celeron® N3160 1.6 GHz/N3010 1.04 GHz

Intel® Celeron® N3160 1.6 GHz

Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated

DRAM Max. 8 GByte DDR3L 1333 Max. 8 GByte DDR3L 1333 Max. 8 GByte DDR3L 1600 Max. 8 GByte DDR3L 1600

Mass storage2x SATA, 1x mSATA

1x SATA 1x mSATA

1x SATA 1x mSATA

1x SATA 1x mSATA

Bus 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe (one-half-size)

Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT

I/O2x USB 3.0, 6x USB 2.0, 4x COM

1x USB 3.0, 7x USB 2.0, 6x COM


4x USB 3.0, 2 x USB 2.0, 5x COM

Panel Interface CRT/LVDS 2x24/HDMICRT/LVDS 2x24/HDMI (MS-98G6: DVI)

LVDS 2x24/HDMI/DPLVDS 2x24/HDMI (VGA optional)

Audio HD audio HD audio with amplifier HD audio HD audio

Others 8x GPIO 8x GPIO 8x GPIO16x GPIO, touch controller (optional)

Power Requirement 9 to 36 VDC 12/19/24 VDC 9 to 36 VDC 12 to 26 VDC

SINGLE BOARD COMPUTERS

Pico-ITX eDM-pITX-BT MS-98H6 EPX-APL SOM-P101

Formfactor Pico-ITX

ProcessorIntel® Celeron® J1900 2.0 GHz

Intel® Celeron®/ Pentium® N3010/N3160/N3710

Intel® Celeron® N3350 (Apollo Lake)

Intel® Celeron® N3350/ Pentium® N4200 (Apollo Lake)


DRAMMax. 4 GByte DDR3L 1600 onboard

2 GByte DDR3L 1600 onboard

Max. 8 GByte DDR3L 1600 Max. 8 GByte DDR3L 1600

Mass storage1x SATA 1x mSATA (half-size)

1x SATA 1x mSATA

1x SATA 1x M.2

1x SATA 1x mSATA

Bus 2x Mini PCIe (half-size) 1x Mini PCIe (one half-size) 2x M.2 1x Mini PCIe, 1x M.2

Ethernet 10/100/1000BaseT 10/100/1000BaseT Dual 10/100/1000BaseT 10/100/1000BaseT





Panel Interface LVDS 2x 24/DP LVDS 2x 24/HDMI/DP LVDS 2x 24/HDMI/DP LVDS 2x 24/HDMI

Audio HD audio HD audio HD audio with amplifier HD audio

Others CAN 2.0, 8x GPIO, SMB, I²C 16x GPIO 8x GPIO 8x GPIO, MIOe extension

Power Requirement 12 VDC 12 VDC 12 VDC 12 VDC

Small-sized and fully-integrated single board computers with a wide range of performance levels.

3.5” ECM-APL MS-98E6 SBC-230 MS-98F3

Formfactor 3.5”

ProcessorIntel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)

Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)


Intel® Broadwell ULT, i3-5010U 2.1 GHz/ i5-5350U 1.8 GHz/ i7-5650U 2.2 GHz



Mass storage1x SATA 1x M.2

1x SATA 1x mSATA

1x SATA 1x mSATA

2x SATA 1x mSATA

Bus 1x Mini PCIe, 1x M.2 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe (one-half-size)






Panel Interface LVDS 2x 24/2x HDMI2x LVDS 2x 24/eDP/HDMI/DP

CRT/LVDS (eDP)/HDMICRT or DP/LVDS 2x 24/HDMI

Audio HD audio HD audio HD audio HD audio

Others8x GPIO, ext. temp. -40°C to 85°C

16x GPIO, ext. temp. -40°C to 85°C (optional), MIPI-CSI

8x GPIO, ext. temp (optional)

8x GPIO

Power Requirement 12 to 26 VDC 12 to 24 VDC 9 to 36 VDC 12/19/24 VDC

3.5” MS-98H3 ECM-SKLU SBC-330 ECM-KBLH

Formfactor 3.5”

ProcessorIntel® Skylake/Kabylake ULT Celeron®/i3/i5/i7 processors

Intel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz

Intel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz

Intel® Kabylake-H, i3-7100E 2.9 GHz/ i5-7440EQ 2.9 GHz/ i7-7820EQ 3.0 GHz

Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® QM175 integrated

DRAM Max.16 GByte DDR4 2133 Max. 16 GByte DDR4 2133 Max. 32 GByte DDR4 2133 Max. 16 GByte DDR4 2133

Mass storage 2x SATA, 1x mSATA 1x SATA, 1x mSATA 2x SATA, 1x mSATA 2x SATA, 1x mSATA

Bus 2x Mini PCIe 1x Mini PCIe, 1x M.2 2x Mini PCIe 1x Mini PCIe, 1x M.2






Graphics eDP/LVDS/HDMI/DP LVDS 2x 24/2x HDMI LVDS 2x 24/2x DP LVDS 2x24/2x HDMI

Audio HD audio HD audio HD audio HD audio

Others 16x GPIO, Nano SIM holder 8x GPIO 8x GPIO 8x GPIO

Power Requirement 12 to 24 VDC 12 to 26 VDC 12 to 36 VDC 12 VDC


Mini-ITX MS-98F1 MS-9892 EMX-APLP IMB-157

Formfactor Mini-ITX (170 x 170mm)

ProcessorIntel® Celeron®/Pentium® N3060/N3160/N3710


Intel® Celeron® N4200 (Apollo Lake)




Mass storage 1x SATA, 1x mSATA 2x SATA, 1x mSATA2x SATA, 1x mSATA, SD card slot

1x SATA, 1x M.2

Bus 2x Mini PCIe 2x Mini PCIe, 1x PCIe x1 1x Mini PCIe, 1x M.21x Mini PCIe, 2x M.2, 1x PCIe x1

EthernetSingle/dual 10/100/1000BaseT

Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT

I/O4x USB 3.0, 4x USB 2.0, 4-7x COM (depending on SKU)




Panel Interface1 or 2x LVDS 2x24/1 or 2x DP (eDP optional)

LVDS 2x 24/eDP/HDMI/DP LVDS 2x24/HDMI/2x DP CRT/eDP(LVDS)/HDMI

Audio HD audio HD audio with amplifier HD audio with amplifier HD audio

Others 8x GPIO16x GPIO, ext. temp. -40° to 85° C (optional)

8x GPIO, eMMC (optional) 16x GPIO

Power Requirement

12/19/24 VDC or ATX 12 to 24VDC 12 to 24 VDC 12 VDC or 19 to 24 VDC

Mini-ITX EMX-SKLUP IMB-191 MS-98E1 MS-98K1

Formfactor Mini-ITX (170 x 170mm)

ProcessorIntel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz

Intel® Socket LGA1151 for 6th Gen i3/i5/i7 processors (Skylake-S)

Intel® Socket LGA1151 for 6th/7th Gen i3/i5/i7 processors (Skylake/Kabylake-S)

Intel® Socket LGA1151 for 6th/7th Gen i3/i5/i7 processors (Skylake/Kabylake-S)

Chipset Intel® SoC integrated Intel® H110 Intel® C236/H110 Intel® H110/Q170

DRAM Max. 32 GByte DDR4 2133 Max. 16 GByte DDR4 2133 Max. 32 GByte DDR4 2133 Max. 32 GByte DDR4 2133

Mass storage 2x SATA, 1x M.2, SD card 2x SATA, 1x mSATA 3/4x SATA, 1x mSATA 3/4x SATA, 1x mSATA

Bus 2x M.2, 1x PCIe x1 1x Mini PCIe, 1x PCIe x4 1x Mini PCIe, 1x PCIe x16, 1x M.2 (C236 Version)

2x Mini PCIe, 1x PCIe x16

Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT 2 or 4x 10/100/1000BaseT




4/8x USB 3.0, 8x USB 2.0, 6/10x COM

Panel Interface LVDS 2x 24/HDMI/DP LVDS 2x 24/2x HDMI CRT/LVDS 2x24/HDMI/DVI LVDS/eDP/HDMI/DP/2xDVI

Audio HD audio with amplifier HD audio HD audio with amplifier HD audio

Others 16x GPIO, SIM card 8x GPIO 8x GPIO 16x GPIO

Power Requirement

12 to 24 VDC 12 VDC or 19 to 24 VDC ATX 12 to 24 VDC

Embedded motherboards for industrial applications that require competitive pricing,

long-term support (5+ years), proven reliability and strict revision control.

INDUSTRIAL MOTHERBOARDS

Box PCs MS-9A89 MS-9A95 EMS-SKLU EPS-KBLHE

ProcessorIntel® Atom™ E3950 (Apollo Lake)

Intel® Kabylake ULT i3/i5/i7 processors

Intel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz

Intel® Kabylake-H, i3-7100E 2.9 GHz/i5-7440EQ 2.9 GHz/i7-7820EQ 3.0 GHz

Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® QM175 Express

DRAM Max. 8 GByte DDR3L 1600 Max. 32 GByte DDR4 2133Max. 16 GByte DDR4 2133

Max. 16 GByte DDR4 2400

Display1x HDMI, 1x DP, DVI/LVDS (optional)

1x DVI, 1x HDMI, 2x DP 1x DP 2x HDMI

External I/O2x LAN (4x LAN optional), 4x USB 3.0, 2x USB 2.0, 6x COM, 16x GPIO, audio

2x LAN, 4x USB 3.0, 2x USB 2.0, 1x COM, Audio

2x LAN, 4x USB 3.0, 2x COM, Audio, 12x GPIO

2x LAN, 4x USB 3.0, 2x USB 2.0, 2x COM, audio

Expansion Interface 2x Mini PCIe 2x Mini PCIe 1x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2

Storage mSATA, 1x 2.5“ Drive Bay mSATA, 1x 2.5“ Drive Bay 1x M.2, 1x 2.5 Drive Bay 1x M.2, 1x 2.5“ Drive Bay

Power Requirement 12 to 24 VDC 19 VDC 9 to 32 VDC 12 VDC

Dimension (W x H x D)

215 x 155 x 55 mm 196 x 285 x 29 mm 240 x 170 x 45 mm 250 x 220 x 60 mm

Weight 1.50 kg 2.60 kg 2.0 kg N/a

Operating Temp.-20° to 70° C with HDD -10° to 50° C with SSD

-10° to 40° C with HDD -10° to 50° C with SSD

-20° to 60° C with SSD -10° to 50° C with SSD

Fanless Operation Yes Yes Yes Yes

MountingWall mount, VESA mount, DIN rail mount

Wall mount, VESA mount, DIN rail mount

Wall mount, DIN rail mount Wall mount

Options Wifi Wifi, 3G/4GExpandable via IET interface, marine certification

Wifi

Box PCs MS-9A65 (Windbox II) NUC BOX 3000 MS-9A59 EPC-APL

ProcessorIntel® Celeron® J1900 2.0 GHz

Intel® Celeron® N3010 / N3160

Intel® Celeron® N3160Intel® Celeron® N3350/Pentium® N4200 (Apollo Lake)


DRAM Max. 8 GByte DDR3L 1333Max. 16 GByte DDR3L 1066/1333

2 GByte DDR3L 1600 Max. 8 GByte DDR3L 1600

Display 1x HDMI, 1x DVI 2x HDMI, 1x DP1x HDMI, 1x DP, LVDS/DVI (optional)

1x VGA, 2x HDMI

External I/O2x LAN, 2x USB 2.0, 1x USB 3.0, 1x COM, audio

1x LAN, 4x USB 3.0, audio1x LAN, 2x USB 2.0, 2x USB 3.0, 2x COM, audio

2x LAN, 4x USB 3.0, 1x COM

Expansion Interface 2x Mini PCIe 1x M.2 1x Mini PCIe 2x Mini PCIe

Storage mSATA, 1x 2.5 Drive Bay mSATA, 1x 2.5 Drive Bay mSATA, 1x 2.5 Drive Bay mSATA, 1x 2.5“ Drive Bay

Power Requirement 19 VDC 12 VDC 12 VDC 12 to 26 VDC

Dimension (W x H x D)

180 x 255 x 19 mm 118.5 x 110 x 46 mm 155 x 105 x 55 mm 177 x 123 x 43.5 mm

Weight 1.30 kg 0.51 kg 0.9 kg 1.20 kg

Operating Temp.-10° to 50° C with HDD -10° to 60° C with SSD

0° to 40° C-10° to 45° C with HDD -10° to 55° C with SSD

0° to 45° C with HDD -10° to 50° C with SSD

Fanless Operation Yes Yes Yes Yes

Mounting VESA mount VESA mountVESA mount, wall mount, DIN rail

Stand, VESA mount, DIN rail mount

Options Wifi Wifi, metal housing Wifi Wifi

EMBEDDED BOX PCS

A L L T E C H N O LO G I E S . A L L CO M P E T E N C I E S . O N E S P E C I A L I S T.

www.data-modul.com

More information and worldwide locations can be found at

DATA MODUL AG

Landsberger Straße 322 DE-80687 Munich Phone: +49 89 56017 0

DATA MODUL WEIKERSHEIM GMBH

Lindenstraße 8 DE-97990 Weikersheim Phone: +49 7934 101 0

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