Embedded broadband connectivity for tomorrow’s connected …€¦ · Qualcomm MDM9215™...
Transcript of Embedded broadband connectivity for tomorrow’s connected …€¦ · Qualcomm MDM9215™...
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•WideportfolioofLGAandPCIemodulesfor2G,3GandLTEnetworks.
•AllmodulesallowhighspeeddataconnectionandhighlysensitiveGPSwithoptionalPCMvoicecapability
•½sizeandfullsizePCIemodulesofferoptionalWiFiconnectionandoptionalSIMcard/μSDcardholder
•Worldwide2G/3G/4G/LTEcoverage,supportingbothWCDMAandCDMAnetworktechnologies
Embedded broadband connectivityfortomorrow’sconnecteddevices
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LGA
PCI Express M.2 type 3042
1stgeneration 2ndgeneration 3rdgeneration•30×25×2.3mm•BasedonIcera®8040chipset•10.2MbpsDL/5.76MbpsUL•2G/W-CDMAdataonly
•31.8×26.8×2mm•BasedonMDM6200/6600™chipset•14.4MbpsDL/5.76MbpsUL•2G/W-CDMA/EVDOdata&voice,GPS
•37×29.8×2mm•BasedonMDM9215/9615™chipset•100MbpsDL/50MbpsUL•2G/W-CDMA/EVDO/LTEdataandvoice,GPS
501 601 801
The pioneer for LGA modules
Option was the industry pioneer in 2009, introducing the concept ofmodulesthataresoldereddirectlyonthebaseboard.Duetoitsultra-thin form factor and excellent heat dissipation characteristics an LGAmoduleisperfectforintegrationinsmallconsumerelectronicsdevicesor
broadbandM2Mapplications.TheadditionalGPSandvoicecapabilitiesin the last generations give these modules a unique position in theembeddedmodulemarket.Thenewandimprovedfootprintinthe2ndand3rdgenerationfacilitatessoldering.
Duetoitsreducedthickness,shorterformfactorandmoreadvancedinterfacingpossibilities(comparedtoaPCIExpressMinicard),thenewPCI ExpressM.2module is quickly becoming a standard connector-basedmoduleformatfortabletandnotebookdevices.
By soldering our LGA modules on a carrier board, Option can veryquicklysupportthesenewstandards.Thecarrierboarddesignisavailabletoourcustomersforfreesoitcanbeproducedandstuffedtogetherwiththerestofthedevice,maintainingallbenefitsofthewiderangeofapprovalsoftheLGAmodule.ThecarrierboardsarecompatiblefortheGTM60xandGTM80xsothesamedesigncanbeusedforbothLGAmodules.
601W 609W/Physical specifications •MCMinLGApackage,basedonQualcommMDM6200™(GTM601W)orMDM6600™(GTM609W)
•31.8×26.8×2mm,5g•Operatingtemperature:-30°Cto+80°C
Electrical interface•LGAwith70signalcontactpads&25ground/heatdissipationpads• USB2.0Hi-Speed•DCpowersupply3.2-4.2V(singlecellbattery)
•USIM/SIMconnection–ClassBand
ClassC•W_DISABLE,WAKEandLED_WWANsignals
•Primary,diversityandGPSantennacontactpads
•PCMdigitalaudiointerfacepads Supported frequency bands and connectivity speeds•GSM/GPRS/EDGE:850/900/1800/1900MHz
•UMTS/HSDPA/HSUPA:800-850/900/1900/2100MHz(B1,B2,B5,B6,B8)at14.4MbpsDL/5.76MbpsUL
maxspeed• (GTM609Wonly)CDMA1xRTT/EV-DORevA:800/1900MHz(BC0,BC1)at3.1MbpsFL/1.8MbpsRLmaxspeed
•gpsOneGen8,supportingS-GPS,A-GPS,gpsOneXtra™concurrentwithGlonass
Operator support•AT&T,Verizon,Docomo,VodafoneandOrangeapproval
• MemberofAT&TMobileBroadbandAcceleratorProgram
801U 809U/Physical specifications•MCMinLGApackage,basedonQualcommMDM9215™(GTM801U)orMDM9615™(GTM809U)
•37×29.8×2mm,6g•Operatingtemperature:-30°Cto+65°C(3.0Vto4.2V)-40°Cto+85°C(3.3Vto4.2V)
Electrical interface•LGAwith89signalcontactpads&25ground/heatdissipationpads•USB2.0HSandHSIC•DCpowersupply3.0-4.2V•DualUSIM/SIMconnection–classBandclassCforoneconnection,embeddedMFFSIMforotherconnection
•W_DISABLE,WAKEandLED_WWANsignals
• Primaryanddiversity/MIMOantennaandGPSantennacontactpads
• AntennatuningandWiFicoexistencepads•PCM/Slimbusforaudio
•GTM801footprintallowstomountGTM601Waswell
Supported frequency bands and connectivity speeds•GSM/GPRS/EDGE:850/900/1800/1900MHz
•UMTS/HSDPA/HSUPA/HSPA+/DC-HSPA+:•800-850/1900/2100/AWSMHz(B1/B2/B4/B5/B6)at42MbpsDL/5.76MbpsULmaxspeed
• (GTM809Uonly)also900MHz(B8)•FDD-LTE:•700/850/1900/AWSMHz(B2/B4/B5/B17)at100MbpsDL/50MbpsUL
• (GTM809Uonly)also700/1900MHz(B13/B25)
• (GTM809Uonly)CDMA1xRTT/CDMA1xAdv/EV-DORevA/EV-DORevB:
800/1900/2100MHz(BC0,BC1,BC6,BC10)at9.3MbpsFL/5.4MbpsRLmaxspeed
•gpsOneGen8A,supportingS-GPS,A-GPS,gpsOneXtra™concurrentwithGlonass
Other planned variants(2013 – preliminary specification)•GTM801E(Europe/Australia/Asia):FDD-LTE800/900/1800/2100/2600MHz(B1,B3,B7,B8,B20)TDD-LTE2600MHZ(B38)
•GTM801J(Japan):FDD-LTE800/1500/1800/2100MHz(B1,B3,B19,B21)
•GTM801C(China):FDD-LTE900/2100(B1,B8)andTDD-LTE1900/2000/2400/2600MHz(B34,B38,B39,B40,B41)
•42×30×2.9mm(withGTM60x)•45×30×2.9mm(withGTM80x) (lengthnotcompliantwithspecifications)
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PCI Express MiniCard
ThisistheoriginalGobi™3000designthatwasmadebyQualcomm.Option is a Gobi licensee and offers this module to its customers,
customizedandbundledwithoptionalsoftwareand/orserviceofferings.
Physical specifications•PCIExpressMiniCardformfactor,version1.2,typeF2(fullsize,singlesided),basedonQualcommMDM6200™(GTM681W)orMDM6600™(GTM689W)
•51×30×3.1mm,7g•Operatingtemperature:-30°Cto+70°C
Electrical interfaces•52-pinedgeconnectorwith:•USB2.0Hi-Speed•DCpowersupply:3.2-3.6V(CDMA/
W-CDMA)and3.0-3.6V(GSM)•USIM/SIMconnection–ClassBandClassC
•W_DISABLE,WAKEandLED_WWANsignals
•PrimaryandDiversity/GPSantenna,U.FLcoaxconnector(primaryonbottom)
Supported frequency bands and connectivity speeds•GSM/GPRS/EDGE:850/900/1800/1900MHz•GPRS:85.6KbpsDL/42.8KbpsUL(class10)
•EDGE:236.8KbpsDL/118.4KbpsUL(class10)
•UMTS/HSDPA/HSUPA:800-850/900/1900/2100MHzandAWSband(1700/2100MHz)(B1,B2,B4,B5,B6,B8)at14.4MbpsDL/5.76MbpsULmaxspeed
• (GTM689Wonly)CDMA1xRTT/EV-DORev0/EV-DORevAat3.1MbpsFL/1.8MbpsRLmaxspeed
•gpsOneGen8,supportingS-GPS,A-GPS,gpsOneXtra™
681W 689W/
881x 889x/By soldering one of our GTM801x/809x module variants on a PCIeMinicardcarrierboard,OptioncanofferanLTEmoduleinPCIeMiniCardformfactorinthemosttimeefficientway.Thecarrierboarddesignis
availabletoourcustomersforfreesoitcanbeproducedandstuffedtogetherwiththerestofthedevice,benefittingfromallapprovalsoftheGTM801x/809xmodules.
Physical specifications •PCIExpressMiniCardformfactor,version1.2,typeF2(fullsize,single-sided)
•50.95×30×3.0mm,7g•Operatingtemperature:-20to+65°C
Interfaces•52-pinedgeconnectorwith•USB2.0Hi-Speed•DCpowersupply:3.0V–4.2V•USIM/SIMconnection–ClassBandClassC
•W_DISABLE,RESET,WAKEandLED_WWANsignals
•4tuneableantennacontroland3coexistencesignals
•Primaryanddiversity/MIMOantenna•GPSantenna
Supported frequency bands and connectivity speeds (for GTM881U/GTM889U)•GSM/GPRS/EDGE:850/900/1800/1900MHz
•UMTS/HSDPA/HSUPA/HSPA+/DC-HSPA+:•800-850/1900/2100/AWSMHz(B1/B2/B4/B5/B6)at42MbpsDL/5.76MbpsULmaxspeed
• (GTM889Uonly)also900MHz(B8)•FDD-LTE:•700/850/1900/AWSMHz(B2/B4/B5/B17)at100MbpsDL/50MbpsUL
• (GTM889Uonly)also700/1900MHz(B13/B25)
• (GTM889Uonly)CDMA1xRTT/CDMA1xAdv/EV-DORevA/EV-DORevB:800/1900/2100MHz(BC0,BC1,BC6,BC10)at9.3MbpsFL/5.4MbpsRLmaxspeed
ByaddinganoptionalWiFicomponentonthe3GPCIeMiniCard,onlyonePCIeminicardslotisneededtointegratebothWiFiand3Gconnectivitytoyourdevice,henceloweringoveralldevicecost.Thismoduleisavailable
in½size form factoror fullsize form factor.For the full-sizemodule,anoptionalSIMcardholderandmicroSDcardholdercanbemountedwhichallowsanall-in-oneconnectivitysolutiononasinglePCIecard.
Physical specifications •PCIExpressMiniCardformfactor,version1.2typeH1(halfsize)/typeF1(fullsize)
•26.8/51×30×4.2mm,5.5/8g•Operatingtemperature:-10°Cto+55°Ccertified(-30°Cto+70°Cextendedrange)
Electrical interfaces•52-pinedgeconnectorwith•USB2.0Hi-Speed•DCpowersupply3.3V+/-9%•USIM/SIMconnection–ClassBandClassC
•W_DISABLE,WAKEandLED_WWANsignals
•PCMvoicesignalpins•WiFisignalpins(PCIinterface),LED_WLANandCOEXsignals(GTM67xonly)
•PrimaryandDiversity/GPSantenna,U.FLcoaxconnector
•PrimaryandDiversityWiFiantenna,U.FLcoaxconnector(GTM67xonly)
•OptionalSIMcardholder(antennaside)andµSDcardholder(backside)(GTM6xxWFSonly)
Supported frequency bands and connectivity speed•GSM/GPRS/EDGE:850/900/1800/1900MHz
•GPRS:85.6KbpsDL/85.6KbpsUL(class12)
•EDGE:236.8KbpsDL/236.8KbpsUL(class12)
•UMTS/HSDPA/HSUPA:800-850/900/1900/2100(B1,B2,B5,B6,B8)at14.4MbpsDL/5.76MbpsULmaxspeed
• (GTM669xandGTM679xonly)CDMA1xRTT/EV-DORev0/EV-DORevAat3.1MbpsFL/1.8MbpsRLmaxspeed
• (GTM67xonly)WiFiIEEE802.11b/g/nin2.4GHzbandwithaccesspointcapability
•gpsOneGen8,supportingS-GPS,A-GPS,gpsOneXtra™concurrentwithGlonass
661W(FS) 669W(FS)/ /671W(FS) 679W(FS)/
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2. Module integration assistance
3. Device certification assistance
1. Additional module certifications
StandardcertificationstypicallyincludeGCF/PTCRB,countriescoveredbyCE/FCCandsomeofthemajoroperatorsinEUandUS.Extracertificationsinothercountriesorwithotheroperatorscanbedoneonrequest.
Standardservicesincludethedetailedintegrationmanual,driversandemailsupport.ExtraservicesthatOptioncanofferarepre-integrationdesignreviewandpost-integrationmeasurements.Premiumservicesareantennadesign,firmware/softwarecustomizationsandadvancedtestservices.
Standard servicesprovideyouwith theneces-sarymodulecertificationdocumentsanddocu-mentation on the device certification process.Extraservicesassistyouwiththecertificationpro-cessforyourdevice.Premiumservicesareneededforpre-certification testingoracquiringdevice re-gulatory/operatorapprovalsonyourbehalf.
* Standard services are available free of charge to all customers, extra services are free of charge for large customers only, premium services are always chargeable.As part of the continual product improvement process, OPTION reserves the right to alter the specifications of this product.© 2013 OPTION. Option and the Option logo are registered trademarks of OPTION. All third-party trademarks are the property of the respective owners.Option nv - Gaston Geenslaan 14 - 3001 Leuven Belgium - T +32 16 317 411 - F +32 16 207 164 - www.option.com Da
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v1.5
Software
Services
Fromembedded firmware to a full-featured connectionmanager,Optionsupports the entire software chain for embedded modules. Being aQualcommandGobilicensee,OptionhasfullaccesstothefirmwarethatisrunningontheQualcommbasebandprocessor.ThisallowsOptiontomakecustomizations for its customers to support certain features or operator
requirements.Driversareavailableforthemostpopularoperatingsystems.ForsomeplatformssuchasAndroid™andWindows®Mobile,aRIL(RadioInterfaceLayer)canbeprovided.ForotherplatformsOptioncandelivertheSDKoracustomizableconnectionmanager.
Option offers two categories of services:• For new customer devices,Option can perform full device PCB designfrom scratch, perform the necessary certifications and assist with themanufacturing/testing/RF calibration of the device. For more detailedinformation about full-custom device development, please [email protected].
• ForexistingOptionmodules,Optionoffers3groupsofembedded module
services* :additionalmodulecertifications,assistancewiththedetailsofmoduleintegrationandhelpwithyourdevicecertification.Theseservicesfacilitate wireless 3G integration in a wide range ofmobile broadbandenableddevicessuchasthetraditionallaptopsandtablets,butalsoportablenavigationdevices,industrialhandhelds,smartphonesandcameras.SomeoftheseservicesarestandardandofferedfreeofchargewhenpurchasingmodulesfromOption,otherservicescanbeofferedagainstacertainfee.
Windows® XP 32 bits (SP3)/64
bits (SP2)
Windows® Vista 32/64 bits
(SP2)
Windows® 7 32/64 bits
(SP1)
Windows® 8 32/64 bits
Linux® (kernel version 2.6.26
or higher)
Android™ (2.3/3.2/4.0)
Google Chrome™
Windows® CE 5.2
Windows® Mobile 6.5
Windows® Embedded Compact 7
uCAN Connect 3.0 (data)
✓ ✓ ✓ ✓ ✓
GTM Connect (data, for GTM68x)
✓ ✓ ✓ ✓
RIL (WCDMA data) ✓ ✓ ✓
RIL (CDMA data) ✓ ✓ ✓
RIL (GSM voice) ✓ ✓ ✓
RIL (CDMA voice) ✓ ✓
HAL (GPS) ✓
HAL (voice) ✓
SDK (WCDMA data) ✓ ✓ ✓ ✓ ✓ ✓
SDK (GSM voice) ✓ ✓ ✓ ✓ ✓ ✓
Sensor/location driver
✓ ✓
Mobile broadband driver
✓
GPS intermediate driver
✓ ✓
Legacy driver ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
FOR MORE INFORMATIONaboutOptionandourproducts
PLEASE [email protected]