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PO-Yupia, Dist: PapumPare, Arunachal Pradesh,Pin–791112 PhNo:0360-2284801/2001582

FaxNo:0360-2284972 Email–[email protected]

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NATIONAL INSTITUTE OF TECHNOLOGY, ARUNACHAL PRADESH (Established by Ministry of Human Resources Development, Govt. Of India)

Yupia, District Papum Pare, Arunachal Pradesh – 791112 Fax: 0360 – 2284927, E-mail: [email protected]

Syllabus for MS in Electronic Science

1

Professor Chandan Tilak Bhunia, Ph.D [Engg.], FIETE, FIE (I), SMIEEE

DIRECTOR

FORWARD

To achieve the target of being a global leader in the field of Technical and Science

Education, there is some sort of time bound urgency to work quickly, massively and strongly, in

respect of National Institute of Technology, Arunachal Pradesh being an “Institute of National

Importance” (by an Act of Parliament) and being established only in Five years back in 2010. I

have therefore adopted a „B‟ formula as stated below to achieve the primary goal of producing world

class visionary Engineers and Exceptionally brilliant Researchers and Innovators:

B- FORMULA

Best for Teaching

Best for Research

Best for Entrepreneurship & Innovation

Best for Services to Society

In implementing the „B‟ formula in letter and spirit, the framing of syllabi has been taken as

important legitimate parameter. Therefore, extraordinary efforts and dedications were directed

for the last one year to frame a syllabi in a framework perhaps not available in the country as

of today.

Besides attention on „B‟ formula institute has given considerable importance to the major faults of current Technical Education while framing the syllabus. The major stumbling blocks in Technical Education today are:

I. The present system is producing “Academic Engineers” rather than “Practical Engineers”. II. The present system of education makes the students to run after jobs rather than making

them competent to create jobs. III. There is lack of initiative to implement the reality of “Imagination is more important than

knowledge”.

Taking due consideration of the findings made above, to my mind a credible syllabi has been framed in the institute in which the major innovations are introduction of:

I. I-Course (Industrial Course) one in each semester at least one, which is targeted

to be taught by the Industrial Expert at least up to 50% of its component.




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II. Man making and service to society oriented compulsory credit courses of NCC/NSS,

values & ethics.

III. Compulsory audit course on Entrepreneurship for all branches. I. Many add-on courses, those are (non-credit courses), to be offered in vacation to

enhance the employability of the students. II. Many audit courses like French, German, and Chinese to enhance the communication

skill in global scale for the students. III. Research and imagination building courses such as Research Paper Communication. IV. Design Course as “Creative Design”.

Further, the syllabi have been framed not to fit in a given structure as we believe, structure is

for syllabus and syllabus is not for structure. Therefore, as per requirement of the courses, the

structure, the credit and the contact hours has been made available in case to case.

The syllabus is also innovative as it includes:

I. In addition to the list of text and reference books, a list of journals and magazines for giving students a flexibility of open learning.

II. System of examination in each course is conventional examination, open book examination and online examination.

Each course has been framed with definite objectives and learning outcomes. Syllabus has also

identified the courses to be taught either of two models of teaching:

I. J. C. Bose model of teaching where practice is the first theory. II. S. N. Bose model of teaching where theory is the first practice.

Besides the National Institute of Technology, Arunachal Pradesh has initiated a scheme of

simple and best teaching in which for example:

I. Instead of teaching RL, RC and RLC circuit separately, only RLC circuit will be taught and with given conditions on RLC circuits, RL and RC circuits will be derived and left to the students as interest building exercise.

II. Instead of teaching separately High Pass Filter, Band Pass Filter and Low Pass Filter etc.; one circuit will be taught to derive out other circuits, on conditions by the students.

I am firmly confident that the framed syllabus will result in incredible achievements,

accelerated growth and pretty emphatic win over any other systems and therefore, my students

will not run after jobs rather jobs will run after them.

For the framing of this excellent piece of syllabus, I like to congratulate all members of

faculty, Deans and HODs in no other terms but “Sabash!”.

Prof. Dr. C.T. Bhunia Director, NIT, (A.P.)




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SEM-I Course Code

Course name L T P Credit

ELS-101 Mathematical Methods and Computer Programming (C++ )

3 6 3+3

ELS-102 Analog and Digital Electronics 3 6 3+3

ELS-103 Physics of Semiconductor Devices 3 6 3+3

ELS-104 Quantum Electronics 3 3

ELS-105 Materials for Electronics 3 3

ELS-P106

Practice on Analog Circuit Design A. Analog circuit Design using PSpice with

OrCAD Capture B. Circuit Fault Diagnostics

8 4

15 26 28 SEM-II

ELS-201 Digital System Design 3 3

ELS-202 Electronic and Optical Communication 3 3

ELS-203 Instrumentation and Measurement Techniques

3 6 3+3

ELS-204 Applied Electromagnetics, RF and Microwaves

3 3

ELS-205 Nano-Electronics 3 3

ELS-206 Microelectronics Fabrication Technology 3 3

ELS-P206

Practice on Digital Circuit Design A. Digital Circuit Design B. VHDL Based Practicals

8 4

ELS-P207

Practice on Interfacing A. Microcontroller and Interfacing B. Virtual Instrumentation and

Programming in LabVIEW

8 4

15 22 29 SEM-III

ELS-301 Industrial Training 2 ELS-302 Communication Skill and Seminars 3 4 ELS-303 Entrepreneurship Practice and Ethics 2 3 ELS-304 Elective (any one) 4 13

SEM-IV

ELS-401 Research Project and Presentation 25 25

Total 95




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List of Electives: 1. Java and Web-based Design 2. Material Growth and Characterization 3. Bio Electronics 4. Mobile Communication 5. Medical Instrumentation 6. Green Energy

Note: Eligibility- B.Sc (Electronics Hons)

B. Sc (Physics Hons) B.E./B.Tech. (ECE, EEE)




5

SEMESTER-I

SEM-I Course Code

Course name L T P Credit

ELS-101 Mathematical Methods and Computer Programming(C++ )

3 6 3+3

ELS-102 Analog and Digital Electronics 3 6 3+3

ELS-103 Physics of Semiconductor Devices 3 6 3+3

ELS-104 Quantum Electronics 3 3

ELS-105 Materials for Electronics 3 3

ELS-P106

Practice on Analog Circuit Design C. Analog circuit Design using PSpice

with OrCAD Capture A. Circuit Fault Diagnostics

8 4

15 26 28




6

Name of the Module: Mathematical Methods and Computer Programming (C++) Module Code: ELS 101

Semester: 1st

Credit Value: 6 [P=6, T=0, L=3]

Module Leader:

A. Objectives:

The course is designed to meet with the objectives of:

1. To understand basic probabilistic inequalities and limit results and to be able to apply them to

commonly arising models;

2. To be familiar with the fundamental properties and uses of discrete-time Markov chains;

3. To understand the fundamental properties of inner product spaces and orthonormal systems;

4. To grasp key properties and uses of Fourier series and transforms, and wavelets;

5. To understand discrete transform techniques, algorithms, and applications.

B. Subject Matter:

UNIT I:

Differential equations and their solutions, Bessel functions of first and second kind.

Inequalities and limit theorems: Bounds on tail probabilities, moment generating functions,

notions of convergence, laws of large numbers, the central limit theorem, statistical applications,

Monte Carlo simulation.

UNIT II:

Markov chains: Discrete-time Markov chains, Chapman-Kolmogorov equations, classifications

of states, limiting and stationary behaviour, time -reversible Markov chains. Examples and

applications.

Fourier representations, Inner product spaces and orthonormal systems, Periodic functions and

Fourier series, Results and applications, The Fourier transform and its properties.

Discrete Fourier methods: The Discrete Fourier transform, efficient algorithms implementing it,

and applications. UNIT III:

Introduction to object oriented programming, comparison with structured programming object

oriented terminology data abstraction , Inheritance , polymorphism. New keywords, type

compatibility, scope operator, function in C++, function prototype, In line function, Default

argument, Overloading, Operator overloading, Unary operator, Binary operator.

UNIT IV: Class: definition, Object, Data member and instance variable methods, Implicit object, class

scope, Access specifier, Operator method, Constructor, Copy constructor, Destructor,

Assignment calls, Static member, Dynamic objects, Array of objects, Friend functions, Pointer to

member. Inheritance and polymorphism: simple inheritance, constructor and destructor in

inheritance, protected access specifier, class conversions, multiple inheritance, multiple

base classes, and virtual base classes. Polymorphism: Virtual function, abstract base classes,

Using polymorphism with example, Generic function, generic classes. Stream in C++: Inserter,

Extractor, Formatting, Manipulator, Error handling, user defined streams, defining Insertion and

extractor operator.

C. Teaching/ Learning/ Practice Pattern: Teaching: 70%

Learning: 30%

Practice: 0%

D. Examination Pattern: 1. Theoretical Examination: Written




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E. Reading Lists:

BOOKS:

1. Pinkus, A. & Zafrany, S. “Fourier series and integral transforms”, Cambridge University

Press, 1997.

2. Mitzenmacher, M. & Upfal, E. “Probability and computing: randomized algorithms and

probabilistic analysis” Cambridge University Press, 2005.

3. A.V. & Willsky, A.S. “Signals and systems” ,Prentice Hall, 1997.

4. Sahay “Object oriented Programming with C++”, Oxford University Press.

5. Trivedi, ”Programming with ANSI C++”, Oxford University Press

MAGAZINES:

1. Mathematics for Students and Teachers

2. Mathematics Today

3. Mathematics of Life

JOURNALS:

1. Journal of Mathematical Physics

2. Journal of Online Mathematics and its Applications

3. Journal of Computational Physics

4. Journal of Mathematics Research




8

Name of the Module: Analog and Digital Electronics Module Code: ELS 102

Semester: 1st


Module Leader:

A. Objectives:


1. Understand basic analog and digital electronics, including semiconductor properties, operational

amplifiers, combinational and sequential logic and analog-to-digital digital-to-analog conversion

techniques. 2. Finally, students will gain experience in with the design of analog amplifiers, power supplies and

logic devices

B. Subject Matter:

UNIT I:

Operational Amplifiers: DC performance - The operational amplifier. Input resistance, Output

resistance, Open loop gain, Bias currents, Offset currents, Offset voltage, Differential mode gain.

Common mode gain, Common mode rejection ratio, Negative feedback, Open loop gain and

closed loop gain, Inverter amplifier, Addition amplifier, Non-inverter amplifier, Voltage follower,

Transimpedance amplifier (Current to voltage converter), Howland pump, Differential amplifier.

UNIT II:

Operational Amplifiers: AC and transient performance - Frequency response, Bode Plot,

Stability, Barkhausen’s criteria, Phase margin and amplitude margin, Differentiator amplifier,

Integrator amplifier, Logarithmic amplifier, Transient response, Compensation, Poles and zeros

cancelation. Power Supplies- Rectification, Half wave and full wave, Filters, Ripple band, Linear

regulator, The 78XX and 79XX family, Switching regulators.

UNIT III: Digital Techniques: Numbering systems, Binary, octal and hexadecimal numbers, Boolean

algebra, Conversion and operations, AND gate, OR gate, Inverter, NAND gate, NOR gate,

Exclusive OR gate, de Morgan’s laws, Logic families, TTL and CMOS. Combinational circuits -

Truth tables, Karnaugh’s diagram, Miniterm addition, Maxiterm product, Synthesis of

combinational circuits, Logic comparators, Codifiers, Decodifiers, Multiplexers. Sequencial

circuits - Monostable oscillator, Bistable oscillator, Astable oscillator, The MC555, The‘Flip-

Flop’: Flip Flop (FF) types: RS type, JK FF, JK FF Master slave, D FF, T FF, Level detector

and slope detector, Counters, Shift registers.

UNIT IV: Memories: Structure: address and data bus, ROM, PROM, EPROM and flash RAM,

Volatiles Memories: RAM, SRAM, DRAM, Addressing modes.

DA Converters: Input latch, Binary Weighted Resistor Network, R-2R Ladder Resistor Network.

Pulse Width Modulation – Resolution, Accuracy, Linearity, Zero Offset, Settling Time,

Glitches.

AD Converters: Sampling, Real time sampling and equivalent time sampling, Sampling

frequency, Sampling theorem (Nyquist), Anti–aliasing filtering, Sampling and holding,

Conversion. Quantification - Information unit (Bit), Discretization noise, Integrative Analog to

Digital (A/D) conversion, The linear counting method, The successive approximation method,

Flash conversion.


Learning: 30%

Practice: 0%




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E. Reading Lists:

BOOKS:

1. Paul Horowitz and Winfield Hill “The art of electronics”, 2e, Cambridge University Press, 1998.

2. Millman and Halkias “Integrated Electronic: Analog and digital Circuits and Systems” Tata

McGraw-Hill Education, 2002.

3. Morris Manno “Logic and Computer Design Fundamentals” Prentice-Hall, 2007.

MAGAZINES:

1. IEEE Circuits Magazine

2. Electronics for you.

JOURNALS:

1. IEEE Journal of Solid State Circuits

2. IETE Journal of Research

3. IETE Technical Review




10

Name of the Module: Physics of Semiconductor Devices Module Code: ELS 103

Semester: 1st


Module Leader:

A. Objectives:


1. To know different kinds of semiconductors that are changing the way we live i.e. in our cell

phones, in our optical-fiber communications systems, in our CD and DVD players, and soon in our

home and office lights.

2. Imparting theoretical knowledge and to develop computing skills to the students in the area of

semiconductor science and technology

B. Subject Matter:

UNIT I:

Review of Semiconductor Physics, Properties, and Devices: Band structure, Electrons, holes,

and Phonons; Occupation Statistics; Phonon Dispersion in Semiconductors, Scattering of

Carriers, Carrier Transport, Some Effects Related to Energy Bands: Avalanche Breakdown, Zener

Breakdown, Density of States and related considerations, Limiting and operational velocities of

transport, Tunneling Effects.

Mathematical Treatments: Kinetic Approach, Boltzmann transport Approach, Monte Carlo

transport Approach, Drift-Diffusion transport.

UNIT II:

Transport Across Junctions: Metal–Semiconductor Junctions, Heterojunctions, Ohmic

Contacts, p–n Junctions, Metal–Semiconductor Field Effect Transistors- Analytic Quasi-Static

Models, Constant Mobility with Saturated Velocity Model, Accumulation–Depletion of Carriers,

Sub-Threshold and Substrate Injection Effects, Sidegating Effects, Injection and Conduction

Effects, Bulk-dominated Behavior, Surface-dominated Behavior, Piezoelectric effects, Signal

delay along the Gate, Small-Signal High Frequency Models, Limit frequencies, Transient

Analysis, Off-equilibrium Effects. UNIT III:

Insulator and Heterostructure Field Effect Transistors: Heterostructures, Strained

Heterostructures, Band Discontinuities, Band Bending and Sub-band Formation, Channel Control

in HFETs, Quasi-Static MISFET Theory Using Boltzmann Approximation, Quasi-Static HFET

Theory Using Analytic Approximation, Quasi-Static Equivalent Circuit Refinements, Small-

Signal Analysis, Transient Analysis, Hot Carrier Injection Effects, Effects Due to DX Centers,

Off-Equilibrium Effects, p-channel Field Effect Transistors. UNIT IV:

Heterostructure Bipolar Transistors: Quasi-Static Analysis, Implications of Heterostructures

and Alloy Grading, High Current Considerations of the Base–Collector Junction, Generation and

Recombination Effects, Small-Signal Analysis, Small-Signal Effects of Alloy Grading, Transit

Time Resonance Effects, Transient Analysis; Hot Carrier and Tunneling Structures- Quantum-

Mechanical Reflections, Hot Carrier Structures, Resonant and Sequential Tunneling, Resonant

Tunneling Transistors with Coupled Barrier Tunneling.


Learning: 30%

Practice: 0%




11


E. Reading Lists:

BOOKS:

1. Sandip Tiwari, “Compound Semiconductor Device Physics”, ACADEMIC PRESS.

2. Streetman and Benerjee, “Solid State Electronic Devices”, Pearson Prentice Hall

3. S. M. Sze and Kwok K. Ng, “Physics of Semiconductor Devices”, John Wiley& Sons

4. S. O. Kasap “Principles of Electronic Materials and Devices”3e, TATA McGrow Hill(2007)

MAGAZINES:

1. Physics Today

2. Semiconductor Today

3. Silicon Semiconductor

JOURNALS:

1. Semiconductor Science and Technology

2. Physical Review B.

3. IEEE Electron Devices Letter

4. IEEE Transactions on Device and Materials Reliability

5. Semiconductors

6. Journal of Applied Physics




12

Name of the Module: Quantum Electronics Module Code: ELS 104

Semester: 1st


Module Leader:

A. Objectives:

The course is designed to meet the objectives of:

1. Understand the basics of Quantum Mechanics and behavior of electrons in confined potentials

2. Understand the Quantum Theory of Solids and electronic properties

3. Understand the nature of light and light-matter interaction

4. Familiarity with modern Quantum Electron Devices

5. Follow the scientific literature to recognize new trends

B. Subject Matter:

UNIT I:

Basic Quantum Mechanics: Wave - particle duality; basic postulates of Wave Mechanics;

Schrödinger equation; Wave function and its interpretation; Time independent Schrödinger

equation; Wave packet and uncertainty principle.

Operators and their role in QM; Eigenvalues and eigenfunctions; Hermitian operators; Potential

wells; Rectangular potential well, triangular potential well; parabolic potential well; harmonic

oscillators; creation and annihilation operators.

Hydrogen atom problem. Time dependent perturbation theory. Maxwell-Boltzmann, Bose and

Fermi distributions.

UNIT II:

Quantum Theory of Solids: Motion of electrons in a periodic potential; Kronig-Penney model;

E-k diagram; Brillouin zone; Concept of effective mass and of hole; Density-of-states function;

Distinction between metals, insulators and semiconductors.

Transport in solids; Boltzmann equation; Conductivity; Mobility; Diffusion constant; Thermal

properties of electron gas.

Thermal properties; lattice vibrations; phonons; heat capacity; thermal conductivity.

UNIT III:

Light Propagation and Light-matter Interaction: Maxwell and Helmholtz equations; Light

propagation in a dielectric and a conducting media; Susceptibility; Absorption.

Interaction of light and a two-level atomic system; Absorption, spontaneous and stimulated

emission; Einstein’s A and B coefficients; Population inversion and amplification of light waves.

Condition for laser oscillation.

Different types of Lasers: Gas, Solid, Semiconductor and Dye lasers. Properties of Semiconductor

Lasers.

Guided Light; Waveguides; Examples of planar and rectangular guides; Cylindrical guides:

optical fibres; Introduction to Photonic Crystals. Introduction to non-linear optics.

UNIT IV:

Quantum Electronic Devices: Review of Quantum Nanostructures: Quantum Wells, Wires and

Dots; Tunneling phenomena; Resonant Tunneling; Electron Devices: HEMTs, Resonant

Tunneling Diodes; Single Electron Transistors; Various forms of Lasers; Quantum Cascade

Lasers; Photodetectors; QW and QD Infrared Photodetectors.

Emerging Areas: Carbon Nanotubes, Graphene, Nanophotonics


Learning: 30%

Practice: 0%




13


E. Reading Lists:

BOOKS:

1. A. Yariv “Quantum Electronics”, John-Wiley, NY,

2. G. W. Hanson “Fundamentals of Nanoelectronics”, Pearson, India, (2009).

3. S. Wang “Fundamentals of Semiconductor Theory and Device Physics”, Prentice-Hall, Englewood

Cliffs, (1989).

4. J. Singh “Electronic and Optoelectronic Properties of Semiconductor Structures”, Cambridge

Univ. Press, New York, (2003).

5. A. Yariv “An Introduction to the Theory and Applications of Quantum Mechanics”, John Wiley &

Sons, New York, 1982; Dover edition 2013

MAGAZINES:

1. 21st century Science and Technology

2. Discover

JOURNALS:

1. IEEE J. Quantum Electronics

2. IEEE J. Selected Topics in Quantum Electronics

3. IEEE J. Nanotechnology


5. Applied Physics Letters




14

Name of the Module: Materials for Electronics Module Code: ELS 105

Semester: 1st

Credit Value: 3[P=0, T=0, L=3]

Module Leader:

A. Objectives:


1. To impart knowledge of different electronics materials and various components used in electronic

industries

2. To describe the suitability and characteristics of various electronics components

for different applications

B. Subject Matter:

UNIT I:

Semiconductor materials: Classification of semiconductors- Elemental, compound and alloy

semiconductors, Crystal structure, Intrinsic and extrinsic semiconductors, Fermi level, Equivalent

carrier concentration in semiconductors, Doped semiconductors, Carrier compensation, Kronig-

Penny model, Effective mass, Recombination and generation in semiconductors, Shockley-Read-

Hall (SRH) statistics.

UNIT II:

Special Materials in Electronics: Composite materials - Composites of glasses, polymers,

metals and ceramics; properties and applications;

Polymers - Mechanism of polymerization, conducting polymers, application of polymers in

electronics and optoelectronics.

Metallic materials - Functional gradient materials, shape memory alloys, amorphous materials, IC

package materials.

Liquid crystals- Nematic, Cholesteric and Smectic liquid crystals, liquid crystal displays; Optical

fibre materials.

UNIT III: Dielectric and Ferroelectric Materials: Dielectric materials as capacitive elements, polar

dielectrics, properties and applications in electronics. Ferroelectrics - physical properties and

classification, properties modifications, non-linearities, applications in electronic devices.

Magnetic materials: Ferromagnetic materials and their applications, Transition metals and alloys

as ferromagnets, hard and soft magnetic materials. Ferrites - Elementary idea of spinels. Garnets

and Hexagonal ferrites, application of ferrites in electronics, magnetic bubbles.

UNIT IV: Organic Semiconductors: Introduction, Organic versus Inorganic solids, Molecular materials ,

Electronic states in conjugated molecules, Polymer fundamentals, Conjugated polymers.

Electronic transport in crystalline organic materials and conductive polymers.

Transport properties: Basic device structure of Organic Electronic Devices. OLEDs and PLEDs,

Flexible displays, Organic transistors, Organic field effect transistors, Organic solar cells – device

architecture and characterization.

Essential characteristic of the electrode materials for organic electronic devices, R&D for new

electrode materials, Organic electronic materials and their processing techniques.


Learning: 30%

Practice: 0%




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E. Reading Lists:

BOOKS:

1. V. Raghavan “Material science in engineering” PHI Learning, 2004

2. L. H. Van Vlanck “Element of material science and Engineering”, Addison-Wesley Pub. Co.,

1980

3. L.F. Pease, R.M. Rose and J. Wulff “Structure and Properties of Materials: Electronic

properties” Wiley, University of Minnesota, 1967.

4. Sam-Shajing Sun and Larry R. Dalton “Introduction to Organic Electronic and Optoelectronic

Materials and Devices”, Eds., CRC Press, 2008.

5. Pope and Swenburg, “Electronic Processes in organic crystals and polymers”, 2e, Oxford

University Press, 1999

6. S. O. Kasap “Principles of Electrical Engineering Materials and Devices”,3e, Tata McGraw-

Hill

MAGAZINES:

1. Materials R & D News

2. Physics Today

JOURNALS:

1. Physica E

2. Physical Review Letters

3. Material Chemistry and Physics

4. Material Science in Semiconductor Processing

5. Science

6. Semiconductors




16

Name of the Module: Practice on Analog Circuit Design

Module Code: ELS-P106

Semester: 1st


Module Leader:

A. Analog Circuit Design using PSpice with OrCAD Capture

1. Circuit Creation with Capture

Create a new Analog,

mixed AD project

Place circuit parts

Connect the parts

Specify values and names

2. Specify type of simulation

Create a simulation profile

Select type of analysis: Bias, DC sweep, Transient, AC sweep

Run PSpice

3. View the results

Add traces to the probe window

Use cursors to analyze waveforms

Check the output file, if needed

Save or print the results

B. Circuit Fault Diagnostics

Fault location techniques

I. Fault dictionary techniques

II. Approximation techniques

III. Fault verification techniques

IV. Parameter identification techniques

V. Artificial intelligence techniques

DC Approach Technique

Frequency-Domain Approach:

Books:

1. Zbar, Malvino and Miller “Basic Electronics Text- Lab Manual” Tata McGraw Hill

2. Rashid “Microelectronics Circuits” PWS Publication

3. S. Franko “Opamp & Analog integrated circuits” Tata McGraw Hill

4. M. H. Rashid “Introduction to PSpice using OrCAD for circuits and electronics” Pearson/Prentice

Hall, 2004




17

SEM-II

Course Code Course name L T P Credit

ELS-201 Digital System Design 3 3

ELS-202 Electronic and Optical Communication 3 3

ELS-203 Instrumentation and Measurement Techniques

3 6 3+3

ELS-204 Applied Electromagnetics, RF and Microwaves

3 3

ELS-205 Nano-Electronics 3 3

ELS-206 Microelectronics Fabrication Technology 3 3

ELS-P206 Practice on Digital Circuit Design A. Digital Circuit Design B. VHDL Based Practicals

8 4

ELS-P207 Practice on Interfacing A. Microcontroller and Interfacing B. Virtual Instrumentation and

Programming in LabVIEW

8 4

15 22 29




18

Name of the Module: Digital System Design Module Code: ELS 201

Semester: 2nd


Module Leader:

A. Objectives:


1. To understand sequential & combinational logic design techniques

2. To learn various digital circuits using VHDL

3. To learn PLD, CPLD, FPGA & their application......

B. Subject Matter:

UNIT I:

Introduction: Introduction to Computer-aided design tools for digital systems. Hardware

description languages; introduction to VHDL, data objects, classes and data types, Operators,

Overloading, logical operators, Types of delays, Entity and Architecture declaration, Introduction

to behavioral, dataflow and structural models.

UNIT II:

VHDL Statements: Assignment statements, sequential statements and process, conditional

statements, case statement Array and loops, resolution functions, Packages and Libraries,

concurrent statements. Subprograms: Application of Functions and Procedures, Structural

Modelling, component declaration, structural layout and generics.

UNIT III: Sequential and Combinational Circuit Design: VHDL Models and Simulation of

combinational circuits such as Multiplexers, Demultiplexers, encoders, decoders, code converters,

comparators, implementation of Boolean functions etc.

Sequential Circuits Design - VHDL Models and Simulation of Sequential Circuits Shift

Registers, Counters etc.

UNIT IV: Prototyping and case studies: Design with CPLDs and FPGAs - Programmable logic devices :

ROM, PLAs, PALs, GAL, PEEL, CPLDs and FPGA. Design implementation using CPLDs and

FPGAs Design of Microcomputer: Basic components of a computer, specifications, architecture

of a simple microcomputer system, implementation of a simple microcomputer system using

VHDL.


Learning: 30%

Practice: 0%


E. Reading Lists:

BOOKS:

1. Charles. H. Roth, “Digital System Design using VHDL”, PWS Publishing Company, 1998.

2. Navabi Z, “VHDL-Analysis & Modelling of Digital Systems”McGraw Hill.

3. Douglas L. Perry “VHDL”, McGraw Hill

4. Zainalabedin Navabi“VHDL: Analysis and Modeling of Digital Systems”, McGraw-Hill




19

MAGAZINES:

1. Newelectronics (Digital Magazine)

JOURNALS:

1. Digital Creativity

2. Digital Investigation

3. International Journal of Design




20

Name of the Module: Electronic and Optical Communication Module Code: ELS 202

Semester: 2nd


Module Leader:

A. Objectives:


1. To introduce the student about Optical Fiber, Wave propagation, Detectors and its structures and

functions.

2. To study different circuits used in communication

3. To study different transmission & reception systems

B. Subject Matter:

UNIT I:

Fundamentals of signal transmission and signal processing, Signals and systems, Fourier trans-

form, FFT, Z-transformer, Laplace transform, Filters

UNIT II:

Analog transmission: Modulation, Amplitude modulation, DSB-SC, SSB-SC, QAM, VSB,

TDM, FDM, Sampling, PAM, PWM, PPM, ∆-Module.

UNIT III: Linear and non-linear signal quantizing: Compander and expander, ASK, PSK, FSK, Modem,

Channel band width, Shanon`s theorem (channel capacity).

UNIT IV: Optical Communication: Optical fibers, Dispersion and loss in optical fibers, Optical couplers

and modulators, Semiconductor detectors for optical communications, basic requirements of

characteristics, Semiconductor lasers for optical communication.

Basic optical communication systems- Intensity modulation, Direct detection system,

Regenaration, Signal to noise ratio and Bit error rate, Optical amplification, Wavelength division

multiplexing, Coherent detection.


Learning: 30%

Practice: 0%


E. Reading Lists:

BOOKS:

1. Rajiv Ramaswami and Kumar N. Sivarajan “Optical Networks: A Practical Perspective”, 2e.,

2004, Elsevier Morgan Kaufmann Publishers (An Imprint of Elsevier).

2. Gerd Keiser “Optical Fiber Communications “, 3e., 2000, Tata McGraw Hill

3. John. M. Senior “Optical Fiber Communications: Principles and Practice “, 2e., 2000,

Pearson Education Ltd.

4. R.P.Khare, "Fiber Optics and Opto Electronics" Oxford Publication

5. A. Ghatak, K. Thyagarajan, “An Introduction to Fiber Optics”, Cambridge University Press

6. Pallab Bhattacharya, “Semiconductor Optoelectronic Devices”, 2e, Prentice-Hall, 1997

7. J. C. Polaris “Optical fiber communication”,5e , Prentice-Hall




21

MAGAZINES:

1. IEEE Communications Magazine

JOURNALS:

1. IEEE Journal of Lightwave Technology

2. IEEE Journal of Selected Areas of Communication

3. Journal of Optical Networking




22

Name of the Module: Instrumentation and Measurement Techniques Module Code: ELS 203

Semester: 2nd


Module Leader:

A. Objectives:


1. To understand the application of basic electronics assumptions and circuits.

2. To understand the basic working principle of transducers and actuators and further signal

conditioning, data processing circuits.

3. To understand instrumentation required and needed in different disciplines.

4. To understand the correlation of electronics with other disciplines.

B. Subject Matter:

UNIT I:

Measurement Instrumentation: Introduction and definitions, Measurement Instrumentation-

Metrology, Instrument modeling, Model of a measurement instrument, Dynamic characteristics,

Instrument performance, Implementing measurement acquisition, Principles and methodology of

measurements, Analyzing measurements obtained by an instrument, Base definitions, Electronic

instrumentation, Electronic instrumentation functionality ,The role of instrumentation in quality

control.

General Principles of Sensors: Basic definitions, Metrological characteristics of sensors,

Systematic errors, Analyzing random errors and uncertainties, Standard deviations, Variances,

Decisions about random uncertainties. Reliability, accuracy, Precision sensor calibration. Simple

calibration, Linking international measurement systems, Band pass and response time, Harmonic

response, Passive sensor conditioners, Conditioners for active sensors, Direct reading, Use of

operational amplifiers. UNIT II:

Physical Principles of Optical, Thermal and Mechanical Sensors: Optical sensors, Luminous

flux, The relative luminous efficiency curve of the human eye, Black body as a

reference for optical sensors, Black body radiation, Dark currents, Spectral and total sensitivities,

Sources of fundamental noise sources in optical sensors, Photoconductive sensors, Principle of

photodiodes, fabrication, Photodiode equation, Force and deformation sensors,

Resistive gauges, Piezoelectric effect,. Piezoelectricity and pyroelectricity, Construction of

piezoelectric sensors, Thermal sensors, Concepts related to temperature and thermometry,

Contact temperature measurement of solids, Thermistor and Resistance thermometers. UNIT III:

Real-time Data Acquisition and Processing Systems: Electronic devices for signal sampling

and quantification, Nyquist sampling, Quantification noise, Over-sampling and

reconstruction, Under-sampling, Analog-to-digital converters, Real-time digital analysis by a

specialized processor, Fixed point and floating point analysis, General structure of a DSP,

Multiplication/accumulation structure, Using standard filtering Algorithms. General structure of a

real-time filtering program, FIR filter and simple Convolutions, IIR filters. UNIT IV:

Instrument and Measurement Chains: Measurement devices : Intensity measurements, Oscilloscopes, Spectrum analyzers, Sweeping

analyzers, FFT analyzers, Network analyzers, Impedance analyzers, Measurement with a network

analyzer, The parallel bus IEEE488 Serial buses, Description of PC buses External acquisition

cards: the VXI system, Functions of the VXI bus, Description of the VXI bus




23


Learning: 30%

Practice: 0%


E. Reading Lists:

BOOKS:

1. Wayne Tomasi, “Electronics Communication Systems: Fundamental through advanced”,

Pearson Education Asia.

2. J. P. Bentley “Principles of Measurement Systems”, Longman

3. Dieter K. Schroder “Semiconductor Material and Device Characterization”,3e, Wiley & Sons

(2006)

MAGAZINES:

1. Electronics For You

2. Electrical Design News(EDN)

JOURNALS:

1. IEEE Transaction on Instrumentation and Measurement

2. Journal of Advanced Research in Instrumentation and Control Engineering

3. Measurement Science and Technology




24

Name of the Module: Applied Electromagnetics, RF and Microwaves Module Code: ELS 204

Semester: 2nd


Module Leader:

A. Objectives:


1. To be able to analyze and design various RF transmission line media

2. To get the ability to analyze and design RF matching networks for complex impedances.

3. To get the ability to design RF/Microwave passive and active components

4. To be able to analyze various parameters of antenna & antenna systems

5. To be able to create and present a report on a design project

B. Subject Matter:

UNIT I:

Electromagnetic waves: Revision: Maxwell equations, wave prorogation in conducting and non

conducting media, reflection and refraction of polarised electromagnetic waves at an interference

of non-conducting media, EM frequency spectrum, electromagnetic sources and detectors.

UNIT II:

Principles of transport of electromagnetic energy: Transmission Lines: Different types of transmission lines, two wire transmission line, lumped and

distributed parameters, transmission line equations for voltages and currents using circuit theory

and field theory, characteristic impedance, propagation constants, attenuation and phase

constants, phase velocity, reflection and transmission coefficient, SWR, line impedance,

normalized impedance and admittance, Numerical exercises using circuit and Phasor theory,

Smith-chart, construction and applications, single stub and double stub matching, shielding of

transmission lines.

Microstripline – Introduction to striplines, characteristic impedance, effective dielectric constant,

dielectric ohmic and radiation losses in microstripline, Q-factor of microstripline, different types

of microstriplines such as parallel, coplanar, shielded striplines

Waveguides – concept of cut-off frequency, guide impedance, phase velocity, guide wavelength

for TE and TM modes, Applications to TE mode in rectangular waveguide, power losses in a

rectangular waveguide, circular waveguide.

UNIT III: Electromagnetic radiation: Potentials of electromagnetic fields, gauge transformations, Lorentz

gauge and Coulomb gauge condition, Retarded potential, radiation from oscillating dipoles,

concept of near zone and radiation zone, radiation resistance , Role of Antenna in exciting

different TE, TM modes in wave guides.

Antenna parameters- Gain, directivity, power, aperture, different types, radiation pattern and

application areas of antennas; Basic antennas, small loop, short dipoles and slot antennas,

Reflector antennas – open out two conductor antenna, conical and horn antennas Aperture

antennas – parabolic dish antennas, dielectric lens antennas End fire antenna – yagi-uda and axial

mode helix antennas, stripline feed antennas Microstrip antennas.

UNIT IV: Applications of Electromagnetics in Electronic system: Electromagnetic effects in high speed

digital systems e.g. reset signal on a PC card, CD player on air plane interface with the navigation

system, ECL technology on a fiber-glass circuit board, EMI/EMC, shielding, Global positioning

satellite.





25

Learning: 30%

Practice: 0%


E. Reading Lists:

BOOKS:

1. David M. Pozar “Microwave Engineering”, 3e, John Wiley and Sons, 2005.

2. F. T. Ulaby “Fundamentals of Applied Electromagnetics”,5e, Prentice Hall, Inc., Upper

Saddle River, NJ, 2007.

3. Matthew N. O. Sadiku and S. V. Kulkarni “Principles of Electromagnetics”,6e,Oxford

University Press

4. N. N. Rao “Fundamentals of Electromagnetics for Electrical and Computer Engineering”,1e,

Prentice Hall, Inc

5. Samuel Y. Liao “Microwave devices and circuits”,3e, Pearson Education India,2002. 6. J. D. Kraus “Antennas & Wave Propagation”, 4e. Tata McGrow Hill

MAGAZINES:

1. Microwaves & RF

2. Antenna systems & Technology

JOURNALS:

1. IET Microwaves, Antennas & Propagation

2. Microwave Journal

3. Microwaves and Optical Technology Letters

4. Electromagnetics




26

Name of the Module: Nano-Electronics Module Code: ELS 205

Semester: 2nd


Module Leader:

A. Objectives:


1. introduce the students to nanoelectronics, nanodevices, spintronics and molecular electronics

2. identify quantum mechanics behind nanoelectronics

3. describe the principle and the operation of nanoelectronic devices

4. explain the principle and application of spintronic devices

B. Subject Matter:

UNIT I:

Fundamental physics and quantum mechanics: Electrons in one atom, Photoelectric effect, the

uncertainty principle, wave function, Schrödinger equation, Eigenfunctions, Quantum numbers,

Superposition of eigenfunctions, Probability densities, Angular momentum, Spins, Hermitean

operators, two particle system, Nanocluster with tens of atoms, Quantum well and tunneling.

UNIT II

Nanoscale CMOS devices: Scaling of CMOS, Short channel effects, Technologies to combat

short channel effects, Gate Engineering, Strain Engineering, Gate all around MOSFET, Nanowire

FETs.

UNIT III:

Nanoelectronic devices: Nanowires, quantum dots, nanopillars, quantum transport and tunneling

effects, spin-dependent electron transport, molecular electronics, and single electron transistors,

Graphene and carbon nanotube transistors.

UNIT III: Sprintronics: Basics of magnetism and the origin of magnetism at the atomic scale, magnetic

properties of thin flims and nanostructures, Giant magnetoresistance (GMR) and tunnel

magnetoresistance (TMR), Oparation principle of magnetic nano-oscillators, Operation principle

of spin transistor.


Learning: 30%

Practice: 0%


E. Reading Lists:

BOOKS:

1. Robert Eisberg and Robert Resnick, “Quantum Physics,” Wiley, 1985.

2. Karl Goser, “Nanoelectronics and Nanosystems,” Springer, 2004.

3. Vladimir V. Mitin, Viatcheslav A. Kochelap, Michael A. Stroscio, “Introduction to

Nanoelectronics”, Cambridge University Press, 2008

4. George W. Hanson, “Fundamentals of nanoelectronics”, Pearson/Prentice,2008 (for

nanoelectronics);

5. D. J. Griffiths, “Introduction to quantum mechanics”,2e, Prentice Hall, 2005 (for quantum

mechanics)




27

MAGAZINES:

1. Nano

2. Nano Today

JOURNALS:

1. Journal of Nano Research

2. Journal of Nanomaterials

3. Journal of Nanoparticle Research

4. Journal of Nanoscience and Technology

5. NanoScale Research Letters

6. Nanoscience and Nanotechnology Letters




28

Name of the Module: Microelectronics Fabrication Technology Module Code: ELS 206

Semester: 2nd


Module Leader:

A. Objectives:


1. To understand how a silicon wafer is turned into an operating chip

2. Ability to evaluate and analyze concepts in lithography, etch, and fabrication flow

3. Ability to evaluate and analyze concepts in surface modification: doping and oxidation.

4. Ability to evaluate and analyze concepts in film deposition,interconnections, contacts, packaging

B. Subject Matter:

UNIT I:

Materials for microelectronics technology: Czochralski growth of silicon crystals, Silicon

wafers shaping, lapping and polishing, LEC growth of GaAs and InP crystyals, Basics of epitaxial

growth techniques. Lithography: Historical Origin, Photolithography Overview, Critical Dimension, Overall

Resolution, Line-Width , Lithographic Sensitivity and Intrinsic Resist Sensitivity (Photochemical

Quantum Efficiency), Resist Profiles, Contrast and Experimental Determination of Lithographic

Sensitivity, Resolution in Photolithography Photolithography Resolution Enhancement

Technology Beyond Moore's Law-Next Generation Lithographies, Nanolithography.

UNIT II:

Pattern Transfer with Dry etching Techniques: Introduction, Dry Etching: Definitions and

Jargon, Plasmas or Discharges Physical Etching: Ion Etching or Sputtering and Ion-Beam

Milling, Plasma Etching (Radical Etching) Physical/Chemical Etching.

Doping of Si , Oxidation of Silicon, Deposition of thin films- Physical Vapor Deposition ,

Chemical Vapor Deposition, Sol-Gel Deposition Technique; Doctors' Blade or Tape Casting,

Plasma Spraying, Deposition and Arraying Methods of Organic Layers in BIOMEMS, Thin

versus Thick Film Deposition, Selection Criteria for Deposition Method.

UNIT III: Microelectronic Fabrication: Fabrication of monolithic diodes, Fabrication of integrated

transistors, idea of burried layer fabrication, Monolithic circuit layout and design rule, Isolation

methods, MOSFET, MOS integrated circuit, Large and medium scale integration, Hybrid

Integrated circuits

UNIT IV: Surface Micromachining: Mechanical Properties of Thin Films, Surface Micromachining

Processes, Poly-Si Surface Micromachining Modifications, Non-Poly-Si Surface Micromachining

Modifications, Materials Case Studies

Liga and Micromolding: LIGA-Background, LIGA and LIGA-Like Process Steps.

Miniaturization Techniques: Top-down &Bottam-up manufacturing: Introduction, Absolute and

Relative Tolerance in Manufacturing ,

Historical Note: Human Manufacturing,

Section I: Top-Down Manufacturing Methods, Section II: Bottom-Up Approaches


Learning: 30%

Practice: 0%

D. Examination Pattern:




29

1. Theoretical Examination: Written

E. Reading Lists:

BOOKS:

1. Marc J. Madou “Fundamentals of Microfabrication: The Science of Miniaturization”2e,CRC

Press,2002

2. Stanley Middleman and Arthur k. kochberg “Process engineering analysis in semiconductor

device fabrication”, McGraw Hill, 1993.

3. Michael Kohler “Etching in Microsystem technology”,Wiley-VCH,1999

4. IC Fabrication : J.A. Ellcott

5. R. C. Jaeger, “Introduction to Microelectronic Fabrication”, 2e, Prentice Hall, 2002

6. G. S. May and S. M. Sze “Fundamentals of semiconductor fabrication”, John Wiley & Sons

7. Stephen A. Campbell “The science and engineering of microelectrnic fabrication”, Oxford

University Press

MAGAZINES:

1. Physics Today 2. Chip Scale Review

JOURNALS:

1. Microelectronics Journal

2. Journal of Vacuum Science and Technology

3. Material Science in Semiconductor Processing

4. Thin Solid Films

5. Journal of Micro/Nanolithography, MEMS and MOEMS




30

Name of the Module: Practice on Digital Circuit Design


Semester: 2nd


Module Leader:

A. Digital Circuit Design:

1. Frequency Counter using CMOS IC’s (Battery Operated)

2. 3 digit combinational lock design

3. Design and implementation of logic level converters (CMOS to TTL and TTL to CMOS)

4. Keyboard encoder

5. Practical based on state machine (Vending Machine, Washing Machine)

6. Stepper Motor Control (Sequence Generator)

7. Adder using Carry Look Ahead

8. Function Generator using EPROM and DAC

B. VHDL based practical:

1. Practical Based on VHDL Programming (Combinational Logic)

a. Parity Generator and checker

b. Hamming Code Generator

c. Manchester code Generator

2. Designing of 4 × 2 bit Multiplier using VHDL

3. Practical Based on VHDL Programming (Sequential)

a. 8 bit binary counter

b. Universal shift register

4. Four bit ALU design using VHDL

5. Design of Simple Memory (RAM) model using VHDL.

6. Keyboard Scanning (Counter Method) using VHDL

7. Designing of Traffic light Controller using VHDL.

8. Implementation of 8-bit multiplexer on FPGA Board.

9. Designing of Digital logic for RPM Measurement using VHDL.

10. Code Converter (BCD to seven Segment)

Books:

1. D. Perry “VHDL”,MaGraw Hill Int. Edition.

2. N.H.E. Weste, K. Eshranghian “Principles of CMOS VLSI design: a systems perspective”, Addison

Wesley, 1985.

3. J. Wakerley “Digital Design Principles”, Prentice Hall of India

4. Miron Abromovici, Melvin Breuer, Arthur Freedman “Digital Systems testing and testable

design”, Jaico Publishing House




31

Name of the Module: Practice on Interfacing


Semester: 2nd


Module Leader:

A. Microcontroller and Interfacing:

1. Flashing an LED (use a PIC16F688 microcontrolar to flash an LED on and off)

2. Basic digital input and output (Learn how to read digital inputs from a push button switch)

Every time the push button is pressed, the LED will be toggled on and off. You will also

learn about the bouncing characteristic of a switch, and how to take care of that.

3. Four bit binary counter

4. Interfacing a character LCD

5. Analog-to-digital conversion(ADC)

6. Interfacing a seven segment display

7. Timers and Counters

8. Asynchronous serial communication

9. Pulse width modulation(PWM) using CCP model

10. DC motor control

11. Multiplexing seven segment LED displays

12. Basics of LED dor matrix display

13. Read and write to internal EEPROM

14. Inter-Integrated circuit(I2C) communication

15. Scrolling text messege on LED dot matrix display

16. Sleep and Wake PIC microcontrollers

17. Matrix keypad interfacing

18. Servo motor control

19. Interfacing a Graphical LCD(GLCD)

Reference:http://embedded-lab.com/blog/?page_id=26

B. Virtual Instrumentation and Programming in LaVIEW:

LabView a software platform for Integration of hardware and software for measuring

and control purposes

1. Convert C to F

Create VI that take a numeric value representing degrees Celsius and Convert it to degrees

Fahrenheit.

2. Create a simple Calculator

3. Create a Thermometer with using a Selector (VI)

Create a simple LabVIEW application (VI) with a Front Panel with some Controls and

Indicators.

Create the logic by connecting the Terminals on the Block Diagram.

4. Create a Temperature History monitoring using with While loop

5. Create below VI

Create a VI which its output is random number between 0-100 when a selector key is on

and 0 when the selector key is off

Books:

1. Gary Johnson, “Lab VIEW Graphical Programming”, 2e,McGraw Hill, Network, 1997

2. Lisa K wells & Jeffrey Travis, “Lab VIEW for everyone”, Prentice Hall, New Jersey,1997




32

SEM-III

Course code Course name L T P Credit

ELS-301 Industrial Training 2

ELS-302 Communication Skill and Seminar 3 4

ELS-303 Entrepreneurship Practice and Ethics 2 3

ELS-304X Elective(any one) 4

13

Name of the Module: Industrial Training

Module Code: ELS-301

Semester: 3rd


Module Leader:

After visiting electronics/instrumentation/allied industry, every student shall have to submit a detailed

report to the department, based on his/her observations about the organization, working, major equipments,

software, engineering/technology involved, raw materials/components, products and deliverables, research

and development, etc.

Name of the Module: Communication Skill and Seminar


Semester: 3rd


Module Leader:

-To be allowed by HOD




33

Name of the Module: Entrepreneurship Practice and Ethics


Semester: 3rd


Module Leader:

Objectives:

Upon completion of this module, students will be able to:

1. Describe and explain the concept of entrepreneurship and the types and characteristics of small

businesses

2. Recognise and recall the psychological theories of entrepreneurship and analyse how entrepreneurs

acquire resources and persuade others to invest in their novel venture.

3. In doing so, the module will allow students to develop their critical skills and to analyse the

internal and external factors that impact on entrepreneurship and how they intertwine to create

success.

4. Students will be able to develop understanding of how entrepreneurs use their social skills to

acquire resources and the characteristics of ventures which are ethically and socially oriented.

5. Through the assessments, they will be able to demonstrate how entrepreneurship connects to the

development and performance of larger organisations and, through a series of examples of "real-

life" entrepreneurs, how entrepreneurship theory relates to practice.

6. Outline how entrepreneurship connects to innovation in large businesses

Introduction:

Experience in emerging economies has shown that the development of the private sector of the economy is

a vital part of the restructuring needed to move from a command economy to a social market economy. As

jobs disappear in the traditional state-owned sector, the key dynamic force in market economies, and more

generally in economic development, will be entrepreneurs. Throughout the world - in India as well as in

North East Region and other developing economies - a large percentage of the new jobs are created in new

enterprises and in rapidly expanding firms.

If it is so evident that the creation of small and medium sized companies is vital to the creation of

jobs and wealth in developing countries, why is it so difficult to stimulate private enterprise in areas like

India? One of the reasons frequently given is the poor image of entrepreneurs in many of these countries.

They are too often seen as gangsters, villains, and thieves rather than heroes and champions of economic

development. So there is an important link between ethics and entrepreneurship.

In this paper we would like to explain first what entrepreneurship is and refute some of the myths

which have grown up about entrepreneurs. The second part of this paper discusses what may be a more

controversial proposition: that business ethics is important to entrepreneurial success.




34

List of Electives:

1. Java and Web-based Design 2. Material Growth and Characterization 3. Bio Electronics 4. Mobile Communication 5. Medical Instrumentation 6. Green Energy




35

Name of the Module: Java and Web-based Design Module Code: ELS 304A

Semester: 3rd


Module Leader:

A. Objectives:


1. understanding the concept of object oriented programming approach

2. understanding java programming language

3. Ability to design the web pages

B. Subject Matter:

UNIT I:

Introduction to Java and Web design: Introduction, World Wide Web, Web Browsers, Web

Page, Introduction to java and its Web applications, search Engines.

Basic Web Page Development: HTML Basics- creating HTML document, Building a Webpage-

text and Image formatting-adding links, web Development Tools.

Web Page Development with HTML: Introduction, HTML table structure-Basic HTML table

tags-formatting the table, Multimedia files on Web page, Using a form –creating formatted lists,

Using frames in Web page.

UNIT II:

Using CSS for Web Designing: Introduction to CSS-benefits of CSS-Working with CSS, Web

page editing with CSS-the text-using colours with CSS-positioning elements with CSS, page

layout with CSS.

Web Servers: Introduction, Basic of Web server, introduction to Apache Web server, Installing

the apache web server, Virtual host, monitor the usability of the web server using log files,

securing a web server, server errors-performance of a web server.

Using JavaScript: Overview of JavaScript, using JavaScript in a Web page, Event handlers,

benefits and drawbacks of JavaScript.

UNIT III:

Script Language for Web Development: Overview of script languages, comparison between

script language and programming language, the Perl programming language- features and

benefits, the PHP programming language-features, benefits and drawbacks of PHP programming

language, the Python programming language.

The LAMP Stack: Overview of a LAMP stack-origin-benefits and drawbacks of LAMP stack,

Installing and using the LAMP stack, managing LAMP with PHPMyAdmin.

Search Engines: Overview, working of a search engine, getting higher ranking for your site on a

search engine; Web Design Tools: HTML Editors, Adobe Photoshop, Adobe flash, Firebug

Browser.

UNIT IV: Java Basics: Java-features, working with java, java classes, control statements in java; Classes

and Objects: Object oriented programming language, Basic concept, advantages-disadvantages,

Applications of OOP, object oriented software development in java, methods, Inheritance:

Multiple Inheritance and Interfaces, Inner Classes, Sample programs.

Core Java API: Introduction to API, Installing and using the Java development kit, handling

exceptions, Threads-creating a thread, swing- the swing packages; Servlets and JSP: overview of

Servlets and JSP, working of Servlets-life cycle of a servlet, comparison of servlets with other

script languages, Handling client requests and sending a response, usage of JSP.

Java Development Tools: JDK development environment, Java web Technologies, Integrated

development environment.




36


Learning: 30%

Practice: 0%

D. Examination Pattern: 1. Theoretical Examination: Open book/ Regular examination.

E. Reading Lists:

BOOKS:

1. Marty Hall and Larry Brown “Core Web Programming”, 2e, Prentice Hall.

2. Vishal Layka “Learn Java for Web Development”, Apress

3. Nicholas S. Williams “Professional Java for Web Applications”, Wiley India

MAGAZINES & Web site:

1. Developing Java Applications

2. http://www.onjava.com

3. http://www.java.net

4. https://www.ibm.com/developerworks/java/

JOURNALS:

1. ACM Transactions on Computing Education

2. Automated Software Engineering

3. Applied Soft Computing

4. Advances in Engineering Software

5. ACM Transactions on the Web

http://www.java.net/

https://www.ibm.com/developerworks/java/




37

Name of the Module: Materials Growth and Characterization Module Code: ELS 304B

Semester: 3rd


Module Leader:

A. Objectives:


1. To get an overview of the various materials used in today`s electronics

2. To familiarize with the state-of-art techniques for materials growth

3. To familiarize with state-of-art materials characterization procedures.

B. Subject Matter:

UNIT I:

Growth of crystalline materials: nucleation and crystallization, Czochralski and floating zone

growth of Si, LEC and Bridgemann growth of compound semiconductors, Epitaxial growth- LPE,

MBE, MOVPE and MBE.

UNIT II:

Deposition of thin films: physical vapour deposition-evaporation, sputtering, laser processing,

plasma and ion beam processing, chemical vapour deposition-CVD, LPCVD, PECVD. Solution

growth- hydrothermal, co-precipitation, Sol-gel technique, Vapor-liquid-solid (VLS) growth,

spray pyrolysis, Dip print coating, Growth of quantum sized structures.

UNIT III:

Electron beam instruments: Transmission electron and scanning electron microscopes, Auger

electron spectroscope, x-ray spectrometers, electron microprobe, electron spectrometers.

Interpretation of different information: selected area and convergent beam electron diffraction

patterns. Analysis of micrographs in TEM, SEM and HRTEM: theories of diffraction contrast in

TEM, analysis of images in TEM and SEM. Interpretation of analytical data: EDS, WDS, Auger,

EELS, ESCA, SIMS.

Optical Spectroscopy: Atomic absorption spectroscopy, infrared spectroscopy and Raman

spectroscopy, Photoluminescence; scanning Tunneling and Atomic Force Microscopy;

NMR: Principles and applications; Electrical Characterization: I-V, C-V, Hall effect, Low and

high temperature effect.

UNIT IV: Structural Characterization: classification of techniques for characterization, micro and nano

structure of solids. Introduction to X-ray and electron beam analysis of materials. Properties of x-

rays: continuous and characteristics x-rays, absorption, filter, production and detection of x-ray,

Diffraction of x-rays, Experimental methods in x-ray analysis, Applications.

Electron-specimen interactions: scattered electron, X-rays, Auger electrons, electron beam

induced currents, cathodoluminescence.


Learning: 30%

Practice: 0%


E. Reading Lists:




38

BOOKS:

1. Klaus-Werner Benz, Wolfgang Neumann, “Introduction to Crystal Growth and

Characterization” Wiley & Sons.

2. Yang Leng, “Materials Characterization: Introduction to Microscopic and Spectroscopic

Methods” Wiley and Sons, 2008.

3. Sam Zhang, Lin Li, Ashok Kumar, “Materials Characterization Techniques”, CRC Press,2008

4. Vitaly Shchukin, Nikolai N. Ledentsov, Dieter Bimberg, “Epitaxy of Nanostructures”,1e,

Springer,2004

5. Tom Kuech, “Handbook of Crystal Growth: Thin Films and Epitaxy”, Elsevier,2015

6. Rohit P. Prasankumar, Antoinette J. Taylor, “Optical Techniques for Solid-State Materials

Characterization”, CRC Press,2012

MAGAZINES:

1. Physics Today 2. Materials Today 3. Photonics Spectra 4. MRS Bulletin

JOURNALS:

1. Applied Surface Science

2. Materials Characterization

3. Thin Solid Films

4. Materials Science in Semiconductor Processing

5. Journal of Crystal Growth


7. Nature Nanotechnology

8. Chemistry of materials

9. Japanese Journal of Applied Physics

10. Nano Letters




39

Name of the Module: Bio-Electronics

Module Code: ELS 304C

Semester: 3rd


Module Leader:

A. Objectives:


1. Understating of the basic physic-chemical properties of Proteins and DNA and physiological

properties of membranes.

2. understanding of the electrical properties of membranes,

3. Understanding of the design and use of bioelectrodes.

B. Subject matter:

UNIT I:

Introduction: Structure, properties and functions of biopolymers, Thermodynamics and kinetics

processes of molecular self-organization, Neurobiophysics: excitation and propagation of nerve

signals, sensory centres.

UNIT II:

Membrain: Introduction, Water shortages and need for membrane technology composition,

Classification of membranes, Membrane processes, Principle of membrane filtration,

Microfiltration membranes: introduction to frontal and cross flow filtration, development of

knowledge and understanding of solid liquid separations and cake filtration, general

membrane equations and adaptation to cake filtration, calculation of cake properties, time of

filtration, bed depth and process optimisation, case studies,

UNIT III:

Biomechanics: Introduction, Human Motion: Linear and Angular Motion, Discrete and

Continuous Motion, Planes of Motion, Axes of Rotation, Body Segment Anatomical Terminology,

Body Segment Motion Terminology, Biomechanical Model, Real World Applications,

molecularbases of contractility and mobility, biostatics.

UNIT IV:

Biosensors: technology and applications, Evolution processes in living matter. Biosensors as

Precursors of Bioelectronics, Functionalization of Sensing Substrates, Biochip,

Nanosensors-Miniaturization of Biosensors, Nanomaterial Based Biosensors. Electron Transfer of

Biomolecules, Nanoparticle Biomaterial Hybrid Systems for Sensing and Electronic Devices,

Effect of Biosensor in biological and physicochemical techniques. DNA Templated Electronics,

Sequence –specific molecular lithography, Single Biomolecule Manipulation for Bioelectronics,

DNA as a semiconductor.

C. Teaching/Learning/Practice Pattern:

Teaching : 70%

Learning : 30%

Practice : 00%


1. Theoretical Examination: Open book/ Regular examination.

E. Reading List:

BOOKS:

1. Claudio Nicolini, Nanobiotechnology & Nanobiosciences Pan Stanford Publishing Pte. Ltd,

2009




40

2. Jain, K. K, “Nanobiotechnology in molecular diagnostics: current techniques and

applications”, Taylor & Francis, 2005.

3. W. Hoppe “Biophysics”, Springer-Verlag, 1983.

4. A. Grosberg “Giant Molecules”, Academic Press,1997

5. N. Hilal, M. Khayet and C. J. Wright “Membrane Modification: Technology and Applications”

CRC Press, 2012

6. M. Khayet and T. Matsuura “Membrane Distillation: Principles and Applications”

Elsevier, 2011

7. Kao, J. C. “Real-World Biomechanics”, 3e, Electronic Book, 2013.

8. Gordon Robertson, Graham Caldwell, Joseph Hamill, Gary Kamen, Saunders Whittlesey,

“Research Methods in Biomechanics”, 2e, Human Kinetics,2013

MAGAZINES:

1. Science Digest

2. BioMechanics

JOURNALS:

1. Journal of Applied Biomechanics 2. Journal of Biomechanics 3. Biomechanics Journal 4. Journal of Applied Biomaterials and Biomechanics 5. Nature Scientific Reports




41

Name of the Module: Mobile Communication

Module Code: ELS 304D

Semester: 3rd


Module Leader:

A. Objectives:


4. To make the students to understand modern mobile communication systems such as 2G, 2.5G, 3G,

4G, and Bluetooth.

5. To make students familiarization about Co-channel and Adjacent channel interferences, Improving

Coverage and System capacity Techniques,

6. To make the students to Propagation Models for Wireless Networks, Multipath Effects in Mobile

Communication, Models for Multipath Reception, Mobile antenna system, Multiple Access

Techniques.

B. Subject matter:

UNIT I:

Introduction: Evolution of Mobile Radio Communications, Fundamental Radio Transmission

Techniques, Mobile call Procedure, Cellular Concept, Operational Channels.

The Cellular Engineering Fundamentals: Introduction, Cell, Frequency Re-use, Channel

Assignment Strategies, Fixed and Dynamic Channel Assignment Strategies, Handoff Process,

Factors affecting Handoff Process, Handoff Strategies, Few practical cases of Handoff Scenario,

Interference and System Capacity, Co-channel Interference (CCI), Adjacent Channel Interference

(ACI), Cell Splitting, Sectoring, Microcell Zone concept, Repeaters, Trunked Radio System.

UNIT II:

Free Space Radio Wave propagation: Free Space Propagation Model, Basic methods of

Propagation, Outdoor Propagation Models, Indoor Propagation Models.

Multipath Wave Propagation and Fading: Multipath Propagation, Multipath & Small-Scale

Fading, Statistical models for multipath propagation.

UNIT III:

Modulation Techniques for mobile communication: Choice of modulation scheme, Linear and

Non-Linear modulation scheme, Amplitude and Angle modulation (FM & PM), Analog and

Digital modulation Techniques, BPSK, QPSK, Line coding, GMSK scheme, Receiver performance

in multipath channels, Example of a Multicarrier Modulation: OFDM.

Multiple Access Techniques for wireless communication: Narrowband Systems, Wideband

Systems, Frequency Division Multiple Access, Time Division Multiple Access, Spread Spectrum

Multiple Access, Space Division Multiple Access.

Modern Wireless Communication Systems: 1G: First Generation Networks. 2G: Second

Generation Networks Global System for Mobile Communication (GSM, CDMA 1x network). 2.5G

General Packet Radio Services, 3G: Third Generation Networks,3G Standards and Access

Technologies, 3G W-CDMA (UMTS), 3G CDMA2000. Beyond 3G Networks: LTE (4G network).

UNIT IV:

Wireless access protocols: IEEE 802.11 standard, WLAN Family, WLAN transmission

technology, WLAN system architecture, Collision Sense Multiple Access with Collision

Detection(CSMA/CD) and CSMA Collision avoidance ( CSMA/CA), 802.11 PHY and MAC

layers, IEEE 802.11 Distributed Co-ordinate System (DCF) and Point Co-ordination Function

(PCF), WLAN family, HyperLAN, Bluetooth, Brief overview of WiMAX for wireless broadband

communication.

Basic Mobile IP operations: types, concepts, Four basic entities for MIPv4, Mobile IPv4

Registration, Tunneling, MIPv4 Reverse Tunneling, MIPv4 Triangular Routing.Mobile Network

Layer Considerations: Limitations of MIPv4, MIPv6 and HMIPv6, Dynamic Host Configuration




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protocol, Micromobility solutions to the host mobility problem, Routing in Mobile ad-hoc network,

DSDV, DSR, AODV, Alternative metrics.Transport Layer Considerations: Traditional TCP,

Classical TCP improvements- WAP, WAP 2.0.

Mobile Operating Systems: PalmOS, Pocket PC and Windows CE, Embedded Linux and other

Mobile Operating Systems.

Application Layer Considerations: Adaptation, Disconnected operations, Mobile Agents,

Business implications and mobile commerce. Emerging Technologies such as Wearable

Computing- challenges and concerns.


Teaching : 70%

Learning : 30%

Practice : 0%


1. Theoretical Examination: Open book/ Regular examination

E. Reading List:

BOOKS:

1. T. S. Rappaport, "Wireless Communications: Principles and Practice", Pearson Education,

Inc.,.

2. K. Feher, “Wireless Digital Communications: Modulation and Spread Spectrum

Applications”, NJ: Prentice Hall, Delhi

3. J. G. Proakis, “Digital Communications”, 4e. NY: McGraw Hill.

4. W. C. Lee, “Mobile Communications Engineering”, 2e, New Delhi Tata McGraw-Hill,.

5. R. Pandya, “Mobile and Personal Communication Systems and Services”, New Delhi PHI

6. S. Haykin and M. Moher, “Modern Wireless Communications”. Singapore: Pearson

Education, Inc.

7. J. W. Mark and W. Zhuang, “Wireless Communications and Networking”. New Delhi PHI

8. D. P. Agarwal and Q-A. Zeng, “Introduction to Wireless and Mobile Systems”. Nelson, India:

Thomson Learning

9. R. Blake, “Wireless Communications Technology”. Delmar, Singapore: Thomson Asia Pvt Ltd

10. B. P. Lathi and Z. Ding, “Modern Digital and Analog Communication Systems”, NY: Oxford

University Press

11. J. G. Proakis and M. Salehi, “Communication Systems Engineering”, Latest ed. Singapore:

Pearson Education, Inc.

12. Raj Kamal, “Mobile Computing”, Oxford Higher Education University Press, New Delhi.

13. Pejman Roshan & Jonathan Leay, “802.11 Wireless LAN Fundamentals”, Pearson Education,

New Delhi.

14. Geoff Sanders, “GPRS Networks”, John Wiley and sons, England

MAGAZINES:

1. IEEE Communication Magazine

JOURNALS:

1. IEEE Transactions on Wireless Communication 2. International Journal of Mobile Communication




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Name of the Module: Medical Instrumentation

Module Code: ELS 304E

Semester: 3rd


Module Leader:

A. Objectives:


1. Students will be able to know basics of human biology, concepts of medical instrumentation.

2. Knowledge about sensors and working principle will be introduced to the students.

B. Subject matter:

UNIT I:

Human Biology: Basic concepts of Quantitative Physiology, Microbiology and Immunology,

Notion of nervous system, respiratory system, circulatory system and excretory system with special

emphasis on origin and alteration of physiological potentials for measurement of different

pathophysiological parameters in these systems.

UNIT II:

Basic Concepts of Medical Instrumentation: Medical measurements and their associated

constraints, classification of biomedical instruments, interfering and modifying inputs,

compensation techniques, generalized static and dynamic characteristics commercial medical

instrumentation development process, regulation of medical devices.

UNIT III:

Basic Sensors and Principles: Inertial sensors for measurement of pressure and flow, optical

sensors for measurement of oxygen content, vitreo-retinal functions, thermal sensors, biosensors

for bacteria detection, electrochemical sensors, Origin of biopotentials and their measurements like

ENG, EMG, ECG, ERG, EEG, Principles of construction and operation of biopotential measuring

equipments, Signal processing of Biopotentials, Analysis of non-stationary data with special

emphasis on electroencephalographic data processing.

UNIT IV:

Measurements of physiological parameters: Description and principles of operation of analog

and digital circuits for signal conditioning of biomedical sensor outputs with special emphasis to

signal modulation, encoding and interfacing and electrical safety, blood pressure measurement,

flow measurements and analyses by Brookfield cone-plate viscometer, Cahn surface tension

balance and electronetics bubble pulsating surfactometer, measurement of respiratory parameters

by spirometer, blood glucose measurement by Doppler Ultrasonography; medical imaging systems

like CAT Scan, MRI, USG etc.

C. List of Experiments: NIL

D. Teaching/Learning/Practice Pattern:

Teaching : 70%

Learning : 30%

Practice : 0%

E. Examination Pattern:


F. Reading List:

BOOKS:

1. Metin Akay, "Time frequency and wavelets in biomedical signal processing", IEEE Press.




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2. Leslie Cromwell, Fred J. Weibell and Erich A. Pfeiffer, “Biomedical Instrumentation and

Measurements”, Prentice-Hall.

3. John G. Webster, “Medical Instrumentation-Application and Design”, Wiley India Pvt Ltd.

4. Michael C K Khoo, “Physiological Control Systems: Analysis, Simulation and Estimation”,

John Wiley & Sons, Inc.

MAGAZINES:

1. Biomedical Sciences Instrumentations

2. IEEE Engineering in Medicine and Biology

JOURNALS:

1. IEEE Transactions on Biomedical Engineering 2. IEEE Transactions on biomedical Circuits 3. Bioprocess and Biosystems Engineering




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Name of the Module: Green Energy

Module Code: ELS 304F

Semester: 3rd


Module Leader:

A. Objectives:


1. Understating include concentrated solar power (CSP), solar photovoltaic (solar PV), wind,

biofuels, hydropower, geothermal, nuclear power, ocean thermal energy conversion (OTEC),

harvesting tidal and wave power.

2. understading of life cycle impact of assessment (LCIA) of renewable energy sources, energy

storage technologies capable of overcoming the intermittency of solar and wind energy sources,

role of the smart-grids and distributed energy generation in reducing CO2 emissions from the

electricity generation sector, main CO2 capture technologies (both pre-combustion and post

combustion), carbon capture and storage (CCS), and role of the hydrogen economy in reducing

greenhouse gas emissions from the transportation sector,

B. Subject matter:

UNIT I:

Introduction: Energy: Past, Today, and Future. A brief history of energy consumption.

Energy & Environment; Non-renewable energies.

UNIT II:

Solar Energy: Sun and its Energy: Basics of Solar Energy; Solar Energy in the Past; Solar thermal

energy; Solar Photovoltaics, Storage of generated power.

UNIT III:

Wind Energy: Historical Background; Wind Resources; Wind Turbines; Environmental Impact.

UNIT IV:

Ocean Energy: Ocean Energy, Potential against Wind and Solar; Wave Characteristics and

Statistics; Wave Energy Devices; Tide characteristics and Statistics; Tide Energy Technologies; Ocean Thermal Energy; Osmotic Power; Ocean Bio-mass.

Geothermal Energy: Geothermal Resources; Geothermal Technologies.


Teaching : 70%

Learning : 30%

Practice : 00%



E. Reading List:

BOOKS:

1. Godfrey Boyle (Editor), Renewable Energy: Power for Sustainable Future, 2e, Oxford

University Press, UK.

2. Aldo V. da Rosa, “Fundamentals of Renewable Energy Processes”, Academic Press, 2005.

3. Gilbert M. Masters, “Renewable and Efficient Electric Power Systems”, Wiley IEEE Press,

2004.




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4. Bent Sorensen, “Renewable energy :its physics, engineering, use, environmental impacts,

economy, and planning aspects” Elsevier Academic Press, 2004,

MAGAZINES:

1. Renewable Energy World

2. Renewable Energy

JOURNALS:

1. International Journal of Green Energy

2. Journal in Green and Renewable Energy

3. International Journal of Sustainable and Green Energy

4. Renewable Energy




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SEM-IV

ELS-401 Research Project and Presentation 25 25

Name of the Module: Research Project and Presentation


Semester: 4th


Module Leader:

Students will be able to decide their Research Project in any of the following fields:

A. Electronic- Devices & Material Development

B. Photovoltaics/ Optoelectronics

C. Device Simulation

D. Theoretical Modelling

E. Others (depending on the availability of guide)

Each research project will be written up as a thesis and should be submitted in four copies.

Electronic Science

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