ELECTRONIC RELIABILITY DESIGN HA NDBOOK - … subject index is to provide a means by which specific...
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~ FllCONY SUB JECT INDEX: MIL-HDBK338 ELECTRONIC RELIABILITY DESIGN HA NDBOOK DTIC 'ELECTE APR 17 1990 L A DoD) Information Analysis Center Apvd fm or uk .r. 9004 1$A (0,0
Transcript of ELECTRONIC RELIABILITY DESIGN HA NDBOOK - … subject index is to provide a means by which specific...
~ FllCONY
SUB JECT INDEX:MIL-HDBK338
ELECTRONICRELIABILITYDESIGNHA NDBOOK
DTIC'ELECTEAPR 17 1990 L
A DoD) Information Analysis Center
Apvd fm or uk .r.
9004 1$A (0,0
The information and data contained herein have been compiled from
government and nongovernment technical reports and from materialsupplied by various manufacturers and are intended to be used forreferonce purposes. Neither the United States Government nor lIT
Research Institute warrant the accuracy of this information and data. Theuser is further cautioned that the data contained herein may not be used inlieu of other contractually cited references and specifications.
Publication of this information is not an expression of the opinion of TheUnited States Government or of lIT Research InstitAe as to the quality ordurability of any product mentioned herein and any use for advertising orpromotional purposes of this information in conjunction with the namo ofThe United States Government or lIT Research Institute without writtenpermission is expressly prohibited.
Ordering No. Index-338
SUBJECT INDEXTO
MIL-HDBK-338ELECTRONICRELIABILITY
DESIGN HANDBOOK1989
Prepared by:
il Reliability Analysis Center
PO Box 4700Rome, NY 13440-5700
Under contract to:
Rome Air Development Center
Griffiss AFB, NY 13441-5000
* Reliability Analysis Center
A DoD Information Analysis Center
Approved for Public Release, Distribution Unlimited
The Reliability Analysis Center (RAC) is a Department of Defense Information AnalysisCente? sponsored by the Defense Logistics Agency, managed by the Rome Air DevelopmentCenter (RADC), and operated at RADC by lIT Research Institute (ilTRI). RAC is chartered tocollect, analyze and dioseminate reliability information pertaining to elecironic systems andparts used therein. The present scope includes integrated circuits, hybrids, discretesemiconductors, microwave devices, optoelectronics and non-electronic parts employed inmilitary, space and commercial applications.
Data is collected on a continuous basis from a broad range of sources, including testinglaboratories, device and equipment manufacturers, government laboratories and equipmentusers (government and non-government). Automatic distribution lists, voluntary datasubmitta!s and field failure reporting systems supplement an intensive data solicitationprogram.
Reliability data and analysis documents covering most of the device types mentionedabove are available from the RAC. Also, RAC provides reliability consulting, training, technicaland bibliographic inquiry services which are discussed at the end of this document.
REQUEST FOR TECHNICAL ALL OTHER REQUESTSASSISTANCE AND INFORMATION SHOULD BE DIRECTED TO:ON AVAILABLE RAC SERVICESAND PUBLICATIONS MAY BEDIRECTED TO:
Reliability Analysis Center Rome Air Development CenterP.O. Box 4700 RBE/Preston R. MacDiarmidRome, NY 13440-8200 GrIffiss AFB, NY 13441-5700
Technical Inquiries (315) 337-9933 Telephone: (315) 330-4920Non-TechnIcal Inquiries: (315) 330-4151 Autovon: 587-4920Autovon: 587-4151TeleFax: (315) 337-9932
© 1988, lIT Research Institute
All Rights Reserved
SECURITY CLASSIFICATION OF THIS PAGEE IForm Approved
REPORT DOCUMENTATION PAGE OMB No.0704-0188la7.REPORT SECURITY CLASSIFICATION lb. RESTRICTIVE MARKINGS
Unclassified2a. SECURITY CLASSIFICATION AUTHORITY 3. DISTRIBUTION /AVAILABILITY OF REPORT
Approved for public release; distribution2b. DECLASSIFICATION/DOWNGRADING SCHEDULE unlimited. Available from RAC or DTIC:
Microfiche only available from DTIC.4. PERFORMING ORGANIZATION REPORT NUMBER(S) 5. MONITORING ORGANIZATION REPORT NUMBER(S)
MIL-HDBK-338
6a. NAME OF PERFORMING ORGANIZATION F6b. OFFICE SYMBOL 7a. NAME OF MONITORING ORGANIZATION(If applicable)
Reliability Analysis Center RADC/RBE6c. ADDRESS (City, State, and ZIP Code) 7b. ADDRESS (City, State, and ZIP Code)
P.O. Box 4700 Griffiss AFB, NY 13441-5700Rome, NY 3.3440-8200
8a. NAME OF FUNDING/SPONSORING I8b. OFFICE SYMBOL 9. PROCUREMENT INSTRUMENT IDENTIFICATION NUMBERORGANIZATION (If applicable)
DLA/DTIC I DTIC/DF F30602-87-C-02286c, ADDRESS (City, State, and ZIP Code) 10. SOURCE OF FUNDING NUMBERS
DTI C PROGRAM IPROJECT ITASK WORK UNITCameron Station ELEMENT NO. NO. NO. ACCESSION NO.
Alexandria, VA 22314-6145 65802S 1.011. TITLE (include Security CIassific3tion)
Index to MIL-HDBK-338
12. PERSONAL AUTHOR(S)
13a. TYPE OF REPORT 13b. TIME COVERED 1147 DAE OF REPORT (YearMonthDa 1.PAGE COUNTIFROM TO I7
16.SUPPLEMENTARY NOTATION Hard copies available from: Reliability Analysis Center, P.O. Box4700Rome UPLMNTAY 1340OTATIONene, .. o470
mjRofe, NY 13440-8200. ' ie$25.0)-DTIC wll provide microficthecopies at-tandard17. COSATI CO DES 18. SUBJECT TERMS (Continue on reverse if necessary and identify by block number)
FIELD CROUP SUB-GROUP IndexReliability Design
19. ABSTRACT (Continue on reverse if necessary and identify by block number)
MIL-HDBK-338entitled 'iElectronic Reliability Design Handbook is a very comprehensivehandbook for use Dy design engineers, reliability engineers and managers to design,produce and deploy reliable and maintainable electronic systems. The handbook itselfcontains no subject index and can therefor. be veryawkward to use. The intent ofthis subject index is to provide a means by which specific topics and subjects canbe located within the handbook. Next to each index term is the volume and page thatthe topic appears on. il r f L, A ;K ,;,,_ -f'trr ,- " : ; , :.. ' .
20. DISTRIBUTION /AVAILABILITY OF ABSTRACT 21. ABSTRACT SECURITY CLASSIFICATION0 UNCLASSIFIED/UNLIMITED 0 SAME AS RPT. C DTIC USERS
22a. NAME OF RESPONSIBLE INDIVIDUAL22tT HNqeAraCd)I2cOFCESMLSteven J. Flint, RAC Technical Director 322 H .ic u A ode) 22c. oFFI sYMBL
DD Form 1473, JUN 86 Previous editions are obsolete. SECURITY CLASSIFICATION OF THIS PAGE
iii
PREFACE
MIL-HDBK-338, "Electronic Reliability Design Handbook" is a comprehensive 1500page handbook for use by design engineers, reliability engineers and managers tospecify, design, produce, acquire and deploy reliable and maintainable electronicsystems. The handbook itself contains no subject index and is therefore very awkward
The intent of this subject index is to provide a means by which specific topics canbe located within Volume I (release IA) and Volume I! of the handbook. Next to eachindex term is the volume and page number(s) on which the topic appears.
Accession For
1-iTIS GRA&IDTIC TABUnannounced 0Justification
Distribution/
Availability CodesAvail and/or
Dist Special
godes
0
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A
ACCELERATIONEFFECTS ON SWITCHES 11,5-192
ACCEPT-REJECT CRITERIA 1,11-55ACCEPTABLE QUALITY LEVEL (AQL) II,4-16ACCEPTANCE TEST, SOFTWARE 1,12-73ACCESSIBILITY 11,3-1ACHIEVED AVAILABILITY 1,5-65ACQUISITION COSTS 1,4-2ACQUISITION POLICIES 1,10-97ACTIVE REDUNDANCY 1,7-49ACTIVE TIME 1,3-6, 1,3-9ADMINISTRATIVE DOWN TIME 1,3-10ADMINISTRATIVE TIME 1,3-6, 1,3-10AF REG.800-14 I,10-101AFMAP 1,7-119AGREE 11,1-4AGREE APPORTIONMENT TECHNIQUE 1,6-14AIR FORCE LOGISTICS SUPPORT COST MODEL I,10-111AIR IONIZERS 11,6-20ALERT TIME 1,3-6, 1,3-10ALLOCATIONS, RELIABILITY WITHOUT REPAIR 1,6-18ALPOS 1,10-129AMD 2900 11,5-67ANALOGOUS COST METHOD, LIFE CYCLE COST 1,10-106ANALYTIC METHODOLOGY FOR SYSTEM EVALUATION oD CONTROL (AMSEC) 1,10-130APPORTIONMENT/ALLOCATION (SEE R&M APPORTIONMENT/ALLOCATION)ARC SUPPRESSION TECHNIQUES FOR RELAYS II,5-180ARINC APPORTIONMENT TECHNIQUE 1,6-17AROEF, RELIABILITY GROWTH MODELS I,8B-10ARRHENIUS MODEL II,4-17ASSESSMENTS BASED ON PREDICTION AND TESTING 1,8-102ATTRIBUTES SAMPLING, MIL-STD-105 I,8A-10AVAILABILITY
1,3-3, 1,3-8, 1,4-13, 1,10-1, 1,10-12, 1,10-14, 1,10-15, 1,10-55, 1,10-58,1,10-69, 11,3-1ALLOCATION 1,10-69ACHIEVED 1,5-65AVERAGE AND POINTWISE 1,10-24COSTING 1,10-116FAILURE RATE AND REPAIR RATE 1,10-63oINSTANTANEOUS 1,5-63INTRINSIC 1,3-5, 1,3-8, 1,5-65MISSION 1,5-63MTBF AND MTTR 1,10-61NOMOGRAPH 1,10-62, 1,12-44SINGLE UNIT 1,5-72, 1,10-21STEADY STATE 1,5-64SURFACE 1,10-120
AVAILABILITY BASED ON EXPONENTIAL FAILURE AND REPAIR DISTRIBUTIONS 1,10-32AVAILABILITY COMPUTER PROGRAMS 1,10-57AVAILABILITY DEMONSTRATION 1,10-82
FIXED SAMPLE SIZE PLANS 1,10-82FIXED-TIME SAMPLE PLANS I,10-85
AVAILABILITY MODELING (MARKOV PROCESS) 1,5-65AVAILABILITY MODELS 1,10-19
AVERAGE OR INTERVAL AVAILABILITY 1,10-23
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R&M PARAMETERS NOT DEFINED IN TERMS OF TIME 1,10-38REDUNDANT SYSTEMS 1,10-28SERIES SYSTEM WITH REPAIRABLE/REPLACEABLE UNITS 1,10-25SINGLE UNIT SYSTEM (POINT AVAILABILITY) 1,10-19
AVAILABILITY THEORY 1,5-63AVAILABILITY MODELING (MARKOV PROCESS APPROACH) 1,5-65BASIC CONCEPTS 1,5-63
AVAILABILITY WITH REPAIR 1,5-71AVALANCHE DEGRADATION (THERMAL SECONDARY BREAKDOWN) 11,6-14AVERAGE AND POINTWISE AVAILABILITY 1,10-24AVIONICS FIELD RELIABILITY VERSUS UNIT PRODUCTION COST 1,4-7AVIONICS LABORATORY PREDICTIVE OPERATIONS AND SUPPORT COST MODEL 1,10-129
B
BALANCED DESIGN APPROACH 1,12-8BARLOW AND SCHEUER, RELIABILITY GROWTH MODELS I,8B-2BARLOW, PROSCHAN AND SCHEUER, RELIABILITY GROWTH MODELS I,8B-3BASE FAILURE RATES FOR GROUP I TRANSISTORS (SILICON, NPN) II,6-28BASIC RELIABILITY AND MAINTAINABILITY FUNCTIONS 1,5-39BASIC RELIABILITY CONCEPTS 1,5-6BASIC STEPS IN THE PDR CYCLE 1,7-152, 1,7-156BASIC SYSTEM TERMS 1,3-8BASIC TOPOGRAPHS 1,7-141BASIC TRANSISTOR CIRCUIT 1,7-63BATHTUB (LIFE CHARACTERISTIC) CURVE 11,4-4, 11,7-1BAYES
SEQUENTIAL TESTS I,8A-45SIMPLE POSTERIOR DISTRIBUTION 1,5-35SIMPLE PRIOR DISTRIBUTION 1,5-34THEOREM 1,5-32TREE DIAGRAM EXAMPLE 1,5-36
BAYESIAN INTERACTIVE GRAPHICS RELIABILITY ASSESSMENT PROCEDURE (BIGRAP) 1,6-56BAYESIAN STATISTICS (CONTINUOUS DISTRIBUTION) 1,5-36BAYESIAN STATISTICS (DISCRETE DISTRIBUTION) 1,5-34BAYESIAN STATISTICS 1,5-32BIGRAP 1,6-56BIMODAL REDUNDANCY 1,7-61, i,7A-27BIMODAL REDUNDANCY -- QUAD CONFIGURATION 1,7-61BINOMIAL DISTRIBUTION 1,5-17BINOMIAL MODEL 1,9-21BINOMIAL TEST I,8A-14BINOMIALLY DISTRIBUTION 1,8-45BIPOLAR TRANSISTOR IS CURRENT-DRIVEN, MOSFET IS VOLTAGE-DRIVEN 11,5-84BIT-SLICE PROCESSORS II,5-64BLOCK DIAGRAM OF A SERIES SYSTEM 1,10-67BLOCK DIAGRAM, RELIABILITY 1,6-30, 1,6-31BOARD LAYOUT OF ICS 11,5-24BOOLEAN REDUCTION OF LOGIC ELEMENTS 1,7-17BREAKDOWN VOLTAGE 1,7-37BROWN & LIPOW MODEL 1,9-21BUBBLE MEMORIES II,5-63BUDGETED GROWTH FOR A NON-HOMOGENEOUS PROGRAM 1,8-106BULK BREAKDOWN 11,6-16BURN-IN 1,5-22, 1,11-22, 11,3-1
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CABAPILITY 11,3-1CABLES 11,5-208
APPLICATION 11,5-209COAXIAL (RF) CABLE 11,5-209CONDUCTOR SIZE II,5-209DEFINITIONS II,5-210INTERCONNECTION CABLE AND WIRE II,5-209INTRODUCTION 11,5-208MULTICONDUCTOR CABLE 11,5-209PART SELECTION AND CONTROL II,5-208POLYVINYL CHLORIDE INSULATION 11,5-208SELECTION AND APPLICATION CONSIDERATIONS 11,5-208SELECTION CRITERIA 11,5-208SOLID OR STRANDED CONDUCTOR 11,5-209
CAPACITORS II,A-2, 11,5-144ALTITUDE EFFECTS 11,5-160ALUMINUM ELECTROLYTIC CAPACITORS 11,5-145ALUMINUM ELECTROLYTIC, GENERAL APPLICATION CONSIDERATIONS 11,5-156CAPACITOR SELECTION 11,5-146CERAMIC II,5-144CERAMIC DIELECTRIC, GENERAL APPLICATION CONSIDERATIONS 11,5-154DERATING 11,5-167DERATING FACTORS 11,5-166ELECTROLYTIC 11,5-145ELECTROLYTIC, GENERAL APPLICATION CONSIDERATIONS 11,5-155FAILURE RATES II,A-2GENERAL APPLICATION CONSIDERATIONS 11,5-153GLASS 11,5-144INTRODUCTION 11,5-144MICA DIELECTRIC, GENERAL APPLICATION CONSIDERATIONS 11,5-154MIL-C-10950, SPECIAL CONSIDERATIONS II,5-158MIL-C-11015, SPECIAL CONSIDERATIONS II 5-158MIL-C-14409, SPECIAL CONSIDERATIONS II,5-158MIL-C-19978, SPECIAL CONSIDERATIONS II,5-159MIL-C-20, SPECIAL CONSIDERATIONS 11,5-157MIL-C-23183, SPECIAL CONSIDERATIONS 11,5-160MIL-C-23269, SPECIAL CONSIDERATIONS 11,5-161MIL-C-39001, SPECIAL CONSIDERATIONS II,5-161MIL-C-39003, SPECIAL CONSIDERATIONS II,5-161MIL-C-39006, SPECIAL CONSIDERATIONS II,5-162MIL-C-39014, SPECIAL CONSIDERATIONS 1,5-164MIL-C-39018, SPECIAL CONSIDERATIONS 1,5-164MIL-C-39022, SPECIAL CONSIDERATIONS II,5-165MIL-C-55365, SPECIAL CONSIDERATIONS II,5-165MIL-C-55514, SPECIAL CONSIDERATIONS 11,5-166MIL-C-55681, SPECIAL CONSIDERATIONS 11,5-166MIL-C-81, SPECIAL CONSIDERATIONS 11,5-158NONSOLID TANTALUM 11,5-145OPERATING FREQUENCY LIMITS 11,5-153PAPER/PLASTIC/PAPER-PLASTIC DIELECTRIC,
GENERAL APPLICATION CONSIDERATIONS 11,5-156PARAMETER CHANGE WITH TIME (TYPICAL) 1,7-27PART SELECTION AND CONTROL II,5-144SELECTION AND USAGE GUIDE FOR CAPACITORS 11,5-147SELECTION CRITERIA 11,5-146SOLID TANTALUM 11,5-144
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STANDARD CAPACITORS 11,5-145SWITCHED DATA APPLICATIONS 11,5-30TANTALUM, GENERAL APPLICATION CONSIDERATIONS 11,5-155TANTALUM, RELIABILITY CONSIDERATIONS 11,5-156USAGE FACTORS 11,5-146
CATCHING DIODE REDUCES TRANSIENT STRESS 1,7-38CATHODE RAY TUBE II,B-iCAUSE-CONSEQUENCE CHARTS 1,7-94CDR 1,7-155CFR 1,5-23CHANCE FAILURES 1,5-23CHART FOR 95% CONFIDENCE LIMITS 1,8-46CHECKOUT 11,3-1CHEMICAL EFFECTS, ELECTRICAL CONNECTORS 11,5-203CHI-SQUARE 1,8-59CHI-SQUARE (2) TEST 1,8-54CHI-SQUARE DISTRIBUTION 1,8-40CHIEF PROGRAMMER TEAM ORGANIZATIONAL STRUCTURE 1,9-40CHIP CARRIERS 11,5-17, 11,5-23CIRCUIT ANALYSIS TECHNIQUES 1,7-34CIRCUIT DESIGN WITH DISCRETE COMPONENTS 1,7-37CLASS B DEVICES, SCREENING TEST COSTS 11,7-26CLASS JANS ORDER OF PROCEDURE DIAGRAM 11,7-9CLIMATIC EXTREMES FOR MILITARY EQUIPMENT I,7B-1CLOCK SPIKE PROBLEMS IN P-CHANNEL SHIFT REGISTERS 1,7-36CLOSED LOOP FAILURE REPORTING AND CORRECTIVE ACTION SYSTEM 1,8-3, 11,9-3CLUE APPLICATION , FTA 1,7-140CMOS HANDLING PRECAUTIONS 1,7-23, 11,5-98CMOS PROTECTION 1,7-23, 11,5-98CODED QUALITY INSPECTION LEVELS I,11-82COLDWALL-COOLED CARD MOUNTING 11,6-44COLLECTOR SUPPLY VOLTAGE 1,7-39COMBINATORIAL MODELS 1,9-16COMBINED CONFIGURATION NETWORK MODELING 1,5-28COMPARISON OF CUMULATIVE LIFE CYCLE COSTS 1,8-91COMPARISON OF DESIGN ANALYSIS METHODS 1,7-145COMPARISON OF RELIABILITY GROWTH/RELIABILITY DEMONSTRATION TESTING 1,8-109COMPARISON OF SCREENING METHODS II,7-22COMPARISON OF TEST METHODS 11,7-31COMPARISON OF TEST TYPE WITH HIT RATE 11,7-32COMPARISON OF TWO SOFTWARE SYSTEMS BY "STRUCTUREDNESS" 1,9-6COMPARISON OF VARIABILITY ANALYSIS METHODS 1,7-30COMPUTER AIDED DESIGN 1,7-33
ASTAP 1,7-33BELAC 1,7-33CIRC 1,7-33CIRCUS 2 1,7-33ECAP 1,7-33MARTHA 1,7-33
SCEPTRE 1,7-33SYSCAP 1,7-33
COMPUTER PROGRAM LIFE CYCLE (FROM AF REG. 800-14) 1,10-101COMPUTER PROGRAMS
AVAILABILITY - RELIABILITY ANALYSIS I,10-55COMPUTER SOFTWARE MANAGEMENT 1,10-56FAULT TREE ANALYSIS 1,7-132GENERAL EFFECTIVENESS METHODOLOGY (GEM) 1,10-54LCC 1,10-127
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ORACLE (OPTIMIZED RELIABILITY AND COMPONENT LIFE ESTIMATES) 1,10-54R&M PREDICTION 1,10-55RELIABILITY AREA 1,6-52RELIABILITY,MAINTAINABILITY & AVAILABILiTY TRADE-OFF TOOL (R&MA T) 1,10-54SEE - SYSTEMS EFFECTIVENESS EVALUATION COMPUTER PROGRAM 1,10-55SUMMARY OF PROGRAMS FOR AVAILABILITY/EFFECTIVENESS EVALUATION 1,10-57TIGER 1,10-54
COMPUTER SOFTWARE MANAGEMENT & INFORMATION CENTER (COSMIC) 1,6-53COMPUTERIZED RELIABILITY PREDICTION METHODS 1,6-51CONCEPT OF SYSTEM EFFECTIVENESS 1,10-1CONCEPTUAL PHASE
PLANNING 1,12-4RELIABILITY AND MAINTAINABILITY DECISION POINTS 1,12-55RELIABILITY AND MAINTAINABILITY TASKS 1,12-56TRADEOFF STUDIES 1,12-22
CONDITIONAL PROBABILITY 1,5-65CONDUCTIVE COMPOUND USE TO INCREASE HEAT TRANSFER 11,6-42CONFIDENCE INTERVAL 1,8-34, 1,8-38, 1,8-44, 11,4-12CONFIDENCE INTERVAL CALCULATION FACTORS 1,8-43CONFIDENCE LEVEL 1,8-37, 1,8-44CONFIDENCE LIMITS AND INTERVALS 1,8-32CONFIDENCE LIMITS, EXPONENTIAL DISTRIBUTION 1,8-39CONFIDENCE LIMITS, NORMAL DISTRIBUTION 1,8-35CONFIDENCE-INTERVAL, BINOMIAL 1,8-45CONFIGURATION CONTROL FLOW 1,9-42CONFIGURATION CONTROL, SOFTWARE 1,9-41CONNECTOR II,A-2
DERATING (SEA-LEVEL) 11,5-205FAILURE RATES II,A-2SELECTION CRITERIA 11,5-194SERVICE LIFE VS. HOTSPOT TEMPERATURE 11,5-202VOLTAGE DERATING AT ALTITUDE 11,5-205
CONSTANT FAILURE RATE 1,5-23CONSTANT HAZARD RATE 1,5-13CONSUMERS RISK 1,8-61, 11,4-15CONTINUOUS DISTRIBUTION, BAYES' EXAMPLE 1,5-36CONTINUOUS DISTRIBUTIONS 1,5-7CONTRACTOR SELECTION 1,12-99CONVECTION COOLING Ii,6-39COOLING TECHNIQUES FOR MULTILAYER PC BOARDS 11,6-43CORRECTION OF DEFICIENCIES 1,12-15CORRECTIVE ACTION REQUEST FORM (SAMPLE) 11,9-7CORRECTIVE MAINTENANCE TIME 1,3-6, 1,3-10COSMIC 1,6-54, 1,6-55, 1,6-56COST
CALCULATION FORM, EXAMPLE 1,10-115COMBAT AIRCRAFT 1,4-3COMPARISON OF ALTERNATIVE DESIGN CONFIGURATIONS I,10-65CURVE 1,10-124DOCUMENT PREPARATION (NON-STANDARD PARTS) 11,1-17EFFECTIVENESS INFLUENCES 1,12-40EFFECTIVENESS OF SCREENING 11,7-25ESTIMATING RELATIONSHIPS, EXAMPLES OF I, 10-110FACTORS AND GUIDELINES, R&M PLANNING 1,12-7GROWTH TREND 1,4-2OPTIMIZING SYSTEM TO EVALUATE RELIABILITY (COSTER) 1,10-128QUALIFICATION/TESTING (NON-STANDARD PARTS) II, 1-17REMOVAL AT LEVELS OF PART/CIRCUIT INTEGRATION 11,1-16
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REMOVAL AT LEVELS OF PART/CIRCUIT INTEGRATION 11,1-16COST OF OWNERSHIP 1,4-13COST AND TIME 1,4-13CRITICAL ANALYSIS WORKSHEET FORMAT 7,7-120CRITICAL DESIGN REVIEW (CDR) 1,7-150, 1,7-155, 1,9-27CRITICAL FUNCTIONS APPLICATIONS 11,1-16CRITICAL PARTS 11,5-7CRITICALITY ANALYSIS 1,7-120CROSSED FIELD AMPLIFIER II,B-1CROW, RELIABILITY GROWTH MODELS I,8B-7CUMULATIVE DENSITY FUNCTION 11,4-4CUMULATIVE DISTRIBUTION FUNCTIONS 1,5-2, 1,8-6, 11,4-3CURRENT AMP FEEDBACK LOOP II,5-39CURPENT DENSITY LIMITATIONS 1,7-37CURRENT GAIN LIMITATION 1,7-42CYCLING EFFECTS, ELECTRICAL CONNECTORS II,5-203
D
D/A CONVERTER USING R-2R RESISTOR LADDER NETWORK 11,5-44DATA BASE SPECIFICATION 1,9-36DATA COLLECTION AND ANALYSIS I, 11-93DATA COLLECTION, ANALYSIS, AND CORRECTIVE ACTION SYSTEM 1,12-52DATA COLLECTION, RELIABILITY 1,8-1DP-A ITEMS, R&M T,12-76DA.A ON TIMES TO F,,ILURE OF 20 ITEMS, EXAMPLE OF DATA ON 1,8-7DECOUPLING AND GROUNDING II,,-32DECOUPLING NEGATIVE SUPPLY OPTIMIZED FOR "GROUNDED" LOAD II, 5-33DECOUPLING NEGATIVE SUPPLY CTIMIZED FOR "VIRTUAL GROUND" LOAD 11,5-33DECREASING GAIN TN RELIABILIT: AS NUMBER OF ACTIVE ELEMENTS INCREASES 1,7-52DEFECTS/SCREENS OF MICROCIRCUITS 11,7-19DEFINITIONS 11,3-1
AVAILABILITY 1,3-2BASIC SYSTEM TERMS 1,3-I, 1,3-8DESIGN ADEQUACY 1,3-3INTRINSIC AVAILABILITY 1,3-5MAINTAINABILITY 1,3-4, 1,3-9MISSION RELIABILITY 1,3-2, 1,3-8OPERATIONAL READINESS 1,3-2, 1,3-8PREVENTIVE MAINTENANCr TIME 1,3-10RELIABILITY 1,12-28RELIABILITY 1,6-2RELIABILITY 1,3-2, 1,3-8RELIABILITY THEORY 11,4-1REPAIRABILITY 1,3-4, 1,3-9SERVICEABILITY 1,3-4, 1,3-9SYSTEM EFFECTIVENESS 1,3-I, 1,3-8TIME CATEGORIES 1,3-9TIME CONCEPTS 1,3-5
DEBUGGING 11,3-1DEGRADATION 1,7-20, 1,7-28, 1,7-77DELAY TIME 1,3-6, 1,3-9DEMONSTRATED II,3-1DEMONSTRATION TESTS I,8A-1DEPENDABILITY 1,4-13, 1,10-14, 1,10-15, 1,30-42, 11,3-1DEPENDABILITY MODELS 1,10-41DEPLOYMENT PHASE PLANNING 1,12-7DEPLOYMENT PHASE R&M DECISION POINTS 1,12-6-
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DEPOT MAINTENANCE REQUIREMENT AREAS 1,11-87DERATING 1,7-4, 11,3-1
GRAPH, TYPICAL DERATING 11,6-29CAPACITORS 11,5-166CONNECTORS AT ALTITUDE 11,5-205CONNECTORS AT SEA LEVEL 11,5-205CRITERIA FOR MAGNETIC DEVICES 11,5-173DIGITAL MICROCIRCUITS 11,5-73DIODES 11,5-93DISCRETE SEMICONDUCTOR DEVICES II,5-94ELECTRICAL CONNECTORS 11,5-205HYBRID DEVICES 11,5-73LINEAR MICROCIRCUITS 11,5-72MAGNETIC DEVICES 11,5-173MECHANICAL AND STRUCTURAL COMPONENTS 1,7-8MICROCIRCUITS II,5-73RELAYS II,-178RELAYS 11,5-178SWITCHES 11,5-193SWITCHES II,5-193TRANSISTORS 11,5-94TRANSISTORS 11,5-95WIRE SIZE USED IN MAGNETIC DEVICES 11,5-174
DERATING CURVEIN3263 POWER DIODE 11,6-31MIL-R-1104 RESISTOR II,5-121MIL-R-12934 RESISTOR 11,5-122MIL-R-18546 RESISTOR II,5-123MIL-R-19 RESISTOR 11,5-117MIL-R-22 RESISTOR 11,5-118MIL-R-22097 RESISTOR 11,5-124MIL-R-26 RESISTOR 11,5-119MIL-R-39008 RESISTOR 11,5-131MIL-R-39009 RESISTOR 11,5-132MIL-R-39015 RESISTOR II,5-133MIL-R-39017 RESISTOR 11,5-135MIL-R-39023 RESISTOR II,5-136MIL"-R-39035 RESISTOR 11,5-138MIL-R-55182 RESISTOR II,5-139MIL-R-55342 RESISTOR 11,5-140MIL-R-83401 RESISTOR 11,5-13MIL-R-94 RESISTOR 11,5-120MIL-T-23648 THERMISTOR II,5-143
DERATING OF MECHANICAL AND STRUCTURAL COMPONENTS 1,7-8DERIVATION OF CONTROL LIMITS FOR INTERFACING PARAMETERS 1,11-61DESIGN
ADEQUACY 1,3-3, 1,3-9CONSIDERATIONS 1I,5-1ERRORS, MINIMIZING 1,7-33GUIDELINES 1,7-1GUIDELINES TO REDUCE COMPONENT OVER-HEATING 11,6-8LIMITATIONS 1,7-37REDUNDANCY CONSIDERATIONS 1,7-49RELIABILITY TASKS FOR THE CDR 1,7-155RELIABILITY TASKS FOR THE PDR 1,7-153SIMPLIFICATION 1,7-13SIMPLIFICATION 1,7-13VERIFICATION 1,7-148
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DESIGN REVIEW 1,7-146CHECKLIST 1,7-154CHECKLIST 1,7-158GROUP MEMBERS AND RESPONSIBILITIES 1,7-151GROUP MEMBERS AND RESPONSIBILITIES 1,7-151INTRODUCTION AND GENERAL INFORMATION 1,7-146MAINTAINABILITY PARTICIPATION 1,12-51SOFTWARE RELIABILITY MANAGEMENT 1,9-41SYSTEM ENGINEERIOG CYCLE 1,7-149
DESIGN-TO-COST PROCEDURES 1,12-11DESIGN-TO-COST PROGRAMS 1,12-12DESIGNING FOR THE ENVIRONMENT 1,7-75DETERIORATION CLASSIFICATION OF MATERIAL 1,11-78DETERMINATION OF PREAMPLIFIER CRITICALITY 1,7-116DETERMINING UPPER AND LOWER CONFIDENCE LIMITS 1,8-44DIAGRAM DEPICTING A STANDBY REDUNDANT PAIR I,7A-37DIDS 1,12-78, 1,12-80, 1,12-81
MAINTAINABILITY 1, 12-80R&M 1,12-78RELIABILITY 1,12-78SOFTWARE QUALITY ASSURANCE 1,12-81
DIELECTRIC BREAKDOWN 11,6-15DIDFERENTIAL CONTRACTION 1,7-77DIGITAL MICROCIRCUIT DERATING II,5-73DIODES II,5-79
DERATING II,5-94PROTECTION 1,7-25PROTECTION II,5-1)0
DIPS II,5-17DIRECT SIMULATION METHOD JF FAULT TREE ANALYSIS 1,7-131DISCRETE DISTRIBUTIONS 1,5-9, 1,5-17DISCRETE DISTRIBUTIONS BAYES' EXAMPLE 1,5-34DISCRETE ELECTRONIC PART, EQUIVALENT THERMAL CIRCUIT II,6-36DISCRETE SEMICONDUCTOR BASE FAILURE RATE PARAMETERS II,6-27DISCRETE SEMICONDUCTOR DEVICES
BIPOLAR TRANSISTORS 11,5-83DERATING II,5-94DIODE DERATING 11,5-95DIODES 11,5-78FET (FIELD EFFECT TRANSISTOR) 11,5-83GENERAL APPLICATION DATA II,5-75MICROWAVE SEMICONDUCTOR DEVICES II,5-91MIL-STD-750 TEST METHODS 11,7-9MOSFET CAPACITIVE SPEED-UP CIRCUIT 11,5-87MOSFET CAUTION 11,5-90MOSFET MAXIMUM OPERATING FREQUENCY 11,5-87MOSFET PARALLELING 11,5-90MOSFET SAFE OPERATING AREA 11,5-89MOSFET TEMPERATURE STABILITY II,5-90POWER MOSFET 11,5-84POWER TRANSISTOR SECONDARY BREAKDOWN 11,5-82RECOVERY TIME 11,5-79RECTIFIER JUNCTION MOUNTING 11,5-79RECTIFIERS 11,5-78SCHOTTKY BARRIER RECTIFIERS 11,5-79SILICON CONTROLLED A CTIFIERS (SCRS) 11,5-80THYRISTORS II,5-80TRANSISTOR APPLICATION DATA 11,5-81
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TRANSISTOR DERATINGS 11,5-94TRANSISTOR MAXIMUM POWER DISSIPATION 11,5-81TRANSISTOR MAXIMUM VOLTAGES 11,5-81VARACTORS 11,5-80
DISSIPATION PER UNIT AREA FOR COMMON COOLING TECHNIQUES 11,6-38DISTRIBUTION GRAPHICAL EVALUATION 1,8-17DISTRIBUTION OF MAINTENANCE TASK STEPS 1,11-61
DOD-C-85045 CABLES, FIBER OPTICS, GENERAL SPECIFICATIONS 11,5-212DOD DOLLAR CONVERSION INDICES 1,10-117DOD-HDBK-263 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK 1,7-18DOD-STD-1678 FIBER OPTICS TEST METHODS 11,5-212DOD-STD-1686 ELECTROSTATIC DISCHARGE CONTROL PROGRAM 1,7-18DOWNTIME 1,3-6DRAIN-SOURCE BLOCKING CHARACTERISTIC II,5-85DUAL-IN-LINE PACKAGE 11,5-17DUANE CHART 1,8-73DUANE POSTULATE 1,8-71DUANE, RELIABILITY GROWTH MODELS I,8B-6DUPLICATE PARALLEL REDUNDANCY (OPERATIVE CASE) I,6A-10DYNAMIC PROGRAMMING
APPORTIONMENT FORMULATION I,6A-6APPROACH 1,6-24FORMULATION EXAMPLE I,6A-8REPRESENTATION FOR N-STAGE I,6A-2
EECAP (ELECTRONIC CIRCUIT ANALYSIS PROGRAM) 1,7-119EFFECTIVENESS OF ENVIRONMENTAL SCREENS I, 11-30EIA STANDARD RS-455 11,5-212, 11,5-213ELECTRICAL CHARACTERISTIC TESTS (300 CLASS) II,1-26ELECTRICAL CONNECTORS 11,5-194
ALTITUDE DERATING II,5-204CHEMICAL EFFECTS II,5-203CYCLING EFFECTS 11,5-203DERATING 11,5-204ELECTRICAL EFFECTS 11,5-201ENVIRONMENTAL CONSIDERATIONS II,5-201HIGH TEMPERATURE EFFECTS II,5-201INSERT TEMPERATURE 11,5-204LOW TEMPERATURE EFFECTS II,5-203MAXIMUM OPERATING TEMPERATURES 11,5-201MECHANICAL CONSIDERATIONS 11,5-20.MECHANICAL EFFECTS 11,5-201OPERATION IN PARALLEL II, 5-204PIN CURRENT 11,5-204POTTING II,5-204PROTECTIVE MEASURES 11,5-204SELECTION AND CONTROL 11,5-194THERMAL EFFECTS II,5-201VOLTAGE BETWEEN CONTACTS II,5-204
ELECTRICAL SYMBOLS FOR BIPOLAR AND MOSFET 11,5-83ELECTRO OPTICS, REFERENCES II,5-214ELECTRO OPTICS/FIBER OPTICS II,5-211
INTRODUCTION 11,5-211SPECIFICATIONS AND STANDARDS II,5-212
ELECTRO-OPTICS, SPECIFICATIONS AND STANDARDS RELEVANT TO MILITARYAPPLICATIONS 11,5-212
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ELECTROMAGNETIC RADIATION PROTECTION 1,7-83ELECTRON TUBES 11,5-206
FAILURE MODES AND MECHANISMS 11,5-206FAILURE RATES II,B-1INTRODUCTION II,5-206SELECTION CRITERIA 11,5-206
ELECTRONIC EQUIPMENT RELIABILITY CLASSIFICATIONS 1,6-34ELECTRONIC RELIABILITY DESIGN HANDBOOK
APPLICATION 1,1-1GENERAL STATEMENTS 1,4-1INTRODUCTION AND BACKGROUND 1,4-1ORGANIZATION I,1-1PURPOSE I,1-1SCOPE I,1-1
ELECTRONICS-X PROJECT 1,4-3ELECTROSTATIC DISCHARGE (ESD) 1-6-148, 1,7-18ELECTROSTATIC DETECTORS II,6-20ENVIRONMENT AND SYSTEM USE CONDITIONS CHECK LIST (TYPICAL) I,7B-14ENVIRONMENT REGION, ASSOCIATION OF FACTOR IMPORTANCE WITH I,7B-18ENVIRONMENTAL ANALYSIS I,7B-16ENVIRONMENTAL CONSIDERATIONS
CHECKLIST (TYPICAL) I,7B-2DESIGN I,7B-1ELECTRICAL CONNECTORS 11,5-201ENVIRONMENTAL FACTORS I,7B-1ENVIRONMENTAL STRENGTH I,7B-1MIL-STD-1670 (ENVIRONMENTAL CRITERIA AND GUIDELINES FOR AIR
LAUNCHED WEAPONS I,7B-13MIL-STD-210 (CLIMATIC EXTREMES FOR MILITARY EQUIPMENT) I,7B-1SWITCHES 11,5-191SYSTEM USE CONDITIONS AND ENVIRONMENT I,7B-13
ENVIRONMENTAL COVERAGE CHECKLIST (TYPICAL) I,7B-2ENVIRONMENTAL CRITERIA, AIR-LAUNCHED WEAPON SAMPLE I,7B-19ENVIRONMENTAL DESIGN 1,7-75
ALTITUDE 11,5-160, 11,5-192DESIGNING FOR THE ENVIRONMENT 1,7-75ELECTROMAGNETIC RADIATION PROTECTION 1,7-83EXPLOSION PROOFING 1,7-82INTRODUCTION 1,7-75LOW TEMPERATURE PROTECTION METHODS 1,7-77MOISTURE PROTECTION 1,7-80NUCLEAR RADIATION 1,7-85SAND AND DUST PROTECTION 1,7-81SHOCK AND VIBRATION PROTECTION 1,7-78TEMPERATURE PROTECTION 1,7-76
ENVIRONMENTAL EFFECTS 1,7-87, I,7B-8, 11,6-1ENVIRONMENTAL PAIRS I,7B-4ENVIRONMENTAL SCREENS I,11-30ENVIRONMENTAL STRESS SCREENING (ESS) 1,11-29, 1,12-37ENVIRONMENTAL TEST CYCLE 1,11-53ENVIRONMENTAL TESTS (100 CLASS) II,1-26ELECTRICAL CONNECTORS INTRODUCTION 11,5-194EQUAL APPORTIONMENT TECHNIQUE 1,6-13EQUIPOTENTIAL BONDING 11,6-17EQUIVALENT NON-REDUNDANT UNIT 1,6-68EQUIVALENT THERMAL CIRCUIT OF A DISCRETE ELECTRONIC PART 11,6-36ERROR SEEDING SOFTWARE 1,9-20ERRORS, SOFTWARE SPECIFICATION 1,9-13
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ERSION 3 RELIABILITY GOAL STATUS 1,6-53ESD 1,7-18, 11,6-13ESD, SAMPLE TRIBOELECTRIC SERIES 11,6-19EVALUATION CRITERIA (CONTRACTOR SELECTION) 1,12-99EXAMPLE OF MAINTENANCE RESPONSIBILITY FLOW CHART 1,11-89EXAMPLE OF THE "D" TEST (KOLOMOROV-SMIRNOV TEST) 1,8-51EXAMPLES OF CATEGORIES OF SNEAK CIRCUITS 1,7-138EXPECTED VALUE AVAILABILITY 1,5-63EXPENDITURES DURING LIFE CYCLE 1,12-9EXPLOSION PROOFING 1,7-82EXPLOSION RESISTANCE EFFECTS ON SWITCHES 11,5-192EXPONENTIAL APPROXIMATION 1,5-61EXPONENTIAL APPROXIMATION OF LOGNORMAL MAINTAINABILITY FUNCTIONS 1,5-62EXPONENTIAL DISTRIBUTION 1,5-13, 1,5-23, 1,5-59, 1,6-3, 1,6-29, I,8A-15,
I,8A-23, 11,4-5CONFIDENCE LIMITS 1,8-39, 11,4-14FAILURES IN TIME 1,8-25MIL-STD-781 1,8A-36
EXPONENTIAL FAILURE AND REPAIR DISTRIBUTIONS 1,10-32EXPONENTIAL RELIABILITY FUNCTION 1,8-29EXPONENTIAL RELIABILITY FUNCTION, THEORETICAL 1,8-26EXPONENTIAL SURVIVAL CURVE 1,8-25, 1,8-27EYRING MODEL 11,4-17
F
FACTORS AFFECTING PART FAILURE RATE II,A-1FACTORS EFFECTING UNRELIABILITY 1,7-12FACTORS FOR IC'S II,A-4FACTORS FOR SEMICONDUCTOR DEVICES II,A-3FACTORS INFLUENCING SYSTEM EFFECTIVENESS 1,4-14
INTERRELATIONSHIPS AMONG SYSTEM PROPERTIES 1,4-15OPERATIONAL READINESS 1,4-16SYSTEM PERFORMANCE (DESIGN ADEQUACY) 1,4-15
FAILURE 11,3-2FAILURE ANALYSIS 11,3-2, 11,9-11
APPARATUS 11,9-16APPROACH FLOW DIAGRAM II,9-13FLOW DIAGRAM, GENERALIZED 11,9-15LABORATORY EQUIPMENT REQUIREMENTS II,9-13REPORT FORM (SAMPLE) 11,9-6
FAILURE DATA 1,8-18FAILURE, DEFINITION 1,6-7FAILURE DENSITY AND RELIABILITY FUNCTIONS OF DISCRETE DISTRIBUTIONS 1,5-9FAILURE DENSITY FUNCTIONS 1,5-4, 1,5-8, 1,5-9FAILURE, DEPENDENT 11,3-2FAILURE EFFECTS ANALYSIS FORM 1,7-107FAILURE-FREE CYCLES 1,11-27eAILURE BREQUENCY STABILIZATION 1,5-25FAILURE, INDEPENDENT 11,3-2FAILURE MECHANISM FOR DIGITAL AND LINEAR DEVICES 11,8-7FAILURE MECHANISM ANALYSIS, SOLID TANTALUM CAPACITORS II,8-11FAILURE MECHANISM ANALYSIS, TANTALUM FOIL CAPACITORS II,8-12FAILURE MODE AND EFFECTS ANALYSIS (FMEA) 1,7-94, 1,7-100FAILURE MODES IN THE OPERATIVE REDUNDANT CASE I,7A-16
AFMAP (AUTOMATED FAILURE MODE ANALYSIS PROGRAM) 1,7-119COMPUTER ANALYSIS 1,7-119
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ECAP (ELECTRONIC CIRCUIT ANALYSIS PROGRAM) 1,7-119EXAMPLE 1,7-118IM 045-NAA 1,7-119IM 063-NAAL 1,7-119IM 066-NAA 1,7-119INTRODUCTION 1,7-100NET-i 1,7-119PHASE I PROCEDURES 1,7-103PHASE 2 PROCEDURES 1,7-113SUMMARY 1,7-121
FAILURE MODELING 1,5-22FAILURE MODELING TYPICAL FAILURE RATE CURVE 1,5-22FAILURE MODES 1,11-69
AFFECTED BY VARIOUS USE AND STORAGE CONDITIONS 11,8-13DISTRIBUTION 1,7-108EFFECTS, AND CRITICALITY ANALYSIS (FMECA) 1,12-35ENCOUNTERED WITH ELECTRONIC COMPONENTS DURING STORAGE 11,8-3MECHANISMS OF MOS SSI/MSI DEVICES 11,8-8MECHANISMS, MAGNETIC DEVICES II,5-172PRINTED CIRCUITRY 11,5-220SHIPMENT AND STORAGE 1,11-68
FAILURE MODE ANALYSIS PROGRAM 1,7-119FAILURE, RANDOM 11,3-2FAILURE RATES (SEE PART FAILURE RATES ALSO)FAILURE RATE 1,6-3, 1,12-27, 11,3-2
ACTIVATION ENERGY II,4-18FACTORS FOR MONOLITHIC AND HYBRID MICROCIRCUITS II,A-4FACTORS FOR SEMICONDUCTOR DEVICES II,A-3TEMPERATURE DEPENDENCE ARRHENIUS MODEL 11,4-17TEMPERATURE DEPENDENCE EYRING MODEL XI,4-17TEMPERATURE RELATIONSHIP OF NPN TRANSISTORS 1,7-7
FAILURE RATE VS. DEVELOPMENT TIME FOR WEIBULL FAILURE RATE 1,8-76FAILURE REPORT FORM 1,8-4FAILURE REPORT FORM (SAMPLE) 11,9-5FAILURE REPORTING 1,12-94, 11,9-1FAILURE REPORTING AND ANALYSIS 11,9-1
AIR FORCE DATA REPORTING SYSTEMS 11,9-8ARMY DATA REPORTING SYSTEMS 11,9-8CLOSED LOOP FAILURE REPORTING/CORRECTIVE ACTIONS SYSTEMS 11,9-1COMMON CAUSES OF PARTS FAILURE II,9-18CUSTOMER DATA REPORTING SYSTEMS 11,9-4DATA COLLECTION AND RETENTION 11,9-4DEPARTMENT OF DEFENSE (DOD) 11,9-10FAILURE ANALYSIS II,9-11FAILURE ANALYSIS APPARATUS 11,9-16FAILURE ANALYSIS, INFORMATION OBTAINED FROM 11,9-17FAILURE CATEGORIES 11,9-18FAILURE REPORTING 11,9-1FAILURE REPORTING SYSTEMS 11,9-3FORMS, FAILURE REPORTING 11,9-4GENERAL CONSIDERATIONS II,9-12MARINE CORPS DATA REPORTING SYSTEMS 11,9-9NAVY DATA REPORTING SYSTEMS 11,9-9RELIABILITY IMPROVEMENT WARRANTIES (RIW) 11,9-10
FAILURE REPORTING AND CORRECTIVE ACTION 1,12-50FAILURE REPORTING, AND AND CORRECTIVE ACTION SYSTEMS
(FRACAS) 1,8-1, 1,8-2, 1,8-3, 1,12-34, 11,9-3FAILURE REVIEW BOARD (FRB) 1,12-34
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FAILURE TIMES AND ESTIMATED 1AILURE RATE 1,8-78
FAILURE TRUNCATED TESTS I,8A-24
FAILURE, CLEAR DEFINITION OF 1,6-7FAILURE-NODE PROBABILITIES RELATED TO QUANTITY OF PitRALLEL ELEMENTS I,7A-20
FAILURES, INFANT MORTALITY 1,11-11
FALLOUT FROM MIL-STD-883 TESTS 11,7-26
FARADAY CAGE SHIELDING 11,6-18
FATIGUE FAILURE EXAMPLE 1,5-12
FAULT TREE ANALYSIj 1,7-121
COMPUTER PROGRAMS 1,7-132
DIRECT SIMULATION METHOD 1,7-131
FTA METHODS 1,7-131
MONTE CARLO METHOD 1,7-131
PROCEDURES 1,7-122
PROGRAMS 1,7-133SYMBOLS 1,7-123SYMBOLS 1,7-122
FAULT TREE FOR SIMPLIFIED ROCKET MOTOR FIRING CIRCUIT 1,7-128FAULT TREE LOGIC DIAGRAMS FROM RELIABILITY BLOCK DIAGRAMS 1,7-124, 1,7-125FEASIBILITY-OF-OBJECTIVES TECHNIQUE 1,6-18FET 11,5-83FIBER OPTICS II,5-211
REFERENCES 11,5-214FIELD MTBF 1,4-6FIXED RESISTOR HEAT DISSIPATION IN FREE AIR II,5-110FIXED SAMPLE 1,8-66FLAT PACK 11,5-22FLASH OR PARALLEL A/D CONVERTER II,5-47FLOW CHART OF THERMAL SYSTEMS MANAGEMENT PROGRESS 11,6-44FLOW DIAGRAM FOR A GENERAL OPTIMIZATION PROCESS 1,4-17FMEA (SEE FAILURE MODE AND EFFECTS ANALYSIS) 1,7-100FMEA EXAMPLE 1,7-118FMECA 1,12-35FORCED AIR COOLING TECHNIQUES FOR MICROELECTRONIC PARTS, LIMITATIONS 11,6-38FORCED-CONVECTION-COOLED EQUIPMENT II,6-40FORECAST PRESENTING COST TREND BASED ON HISTORICAL DATA 1,10-108FORMAL DESIGN REVIEWS 1,7-150, 1,9-27
FRACAS MIL-STD-785, TASK 104, FRACAS PROGRAM 1,8-2, 1,12-34, 11,9-1FREE-CONVECTION-COOLED EQUIPMENT II,6-40
FTA (SEE FAULT TREE ANALYSIS) 1,7-121
FUEL SYSTEM FAILURE TIMES 1,8-56
FULL SCALE DEVELOPMENT (FSED),PRODUCTION AND DEPLOYMENT PHASE, TRADEOFFS 1,12-26
FULL SCALE DEVELOPMENT PHASEPLANNING 1,12-6RELIABILITY AND MAINTAINABILITY DECISION POINTS 1,12-61TASKS 1,12-59TASKS, SCHEDULE OF 1,12-59
FUNCTIONAL VIEW OF SOFTWARE 1,9-9FUNDPW'METAL DESIGN LILMITATIONS 1,7-37
FUNDAMENTAL SYSTEM PROCESS CYCLE 1,4-11
FUTURE TRENDS IN MICROCIRCUIT DEVELOPMENT 11,1-29
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GaAs 11,1-31GAMMA DISTRIBUTION 1,5-14, 11,4-13GASEOUS ARC DISCHARGE 11,6-15GATES 11,5-51GATE SPEED-UP CIRCUIT 11,5-86
RELATIONSHIPS BETWEEN SWITCHING TIMES AND DRAIN CURRENT II,5-88VALUES AND SWITCHING TIMES 11,5-87
GEOMETRICAL INTERPRETATION OF A CONFIuv'lCE INTERVAL 1,8-34GOEL NHPP MODEL 1,9-24GOODNESS OF FIT TESTS 1,8-47
GRAPHIC METHOD 1,8-50KOLMOGOROV-SMIRNOV 1,8-49
GOVERNMENT DOCUMENTS 1,2-1GOVERNMENT/INDUSTRY DATA EXCHANGE PROGRAMS (GIDEP) 11,1-5GRAPHICAL EVALUATION 1,8-17GRAPHICAL METHODS 1,8-6, 1,8-10GRAPHICAL POINT ESTIMATION FOR THE NORMAL DISTRIBUTION 1,8-8GRAPHICAL POINT ESTIMATION FOR THE WEIBULL DISTRIBUTION 1,8-15GRAPHICAL SOLUTION OF SEQUENTIAL BINOMIAL TEST I,8A-14GROUND RULES FOR PARTS SELECTION AND CONTROL 1,7-3GROUNDING AND DECOUPLING 11,5-25GROWTH MODELS TAILORING 1,8-104GROWTH POTENTIAL 1,8-100GUARANTEE 1,12-19
AVAILABILITY 1,12-16CHRONICX LINE REPLACEABLE UNIT (LRU) 1,12-17LOGIC SUPPORT COSTS 1,12-16MAXIMUM PARTS COST 1,12-16PLANS 1,12-20RELIABILITY 1,12-16
GUNN 11,5-92
H
HANDLING PRECAUTIONS, CMOS 1,7-23HARDWARE/SOFTWARE SNEAK ANALYSIS INTEGRATION 1,7-143HARDWARE/SOFTWARE SYSTEM LIFE CYCLE RELATIONSHIP 1,9-4, 1,12-66HAZARD AND DENSITY FUNCTIONS 1,8-21HAZARD RATE AS A FUNCTION OF AGE FAILURE 1,5-24HAZARD RATE 1,5-3HAZARD RATE FUNCTIONS 1,5-8, 11,4-4HEAT DISSIPATION FROM FIXED RESISTORS IN FREE AIR 11,5-110HEAT SINK 11,6-37HEAT TRANSFER, CONDUCTIVE COMPOUND 11,6-42HIGH DISSIPATION PARTS, EFFECTS OF CONVECTION ON PARTS 11,6-39HIGH LEVEL HIPO CHART 1,9-30HIGH TEMPERATURE EFFECTS, ELECTRICAL CONNECTORS II,5-201HIGH-POWER PARTS MOUNTING TO INCREASE HEAT TRANSFER 11,6-42HIPO CHART 1,9-30HISTORY OF COMPONENT RELIABILITY
ADVISORY GROUP ON RELIABILITY OF ELECTRONIC EQUIPMENT, AGREE 11,1-4ARMY SIGNAL CORPS MICROMODULE PROGRAM (1958-1963) 11,1-6ARMY'S DIAMOND ORDINANCE FUZE LABORATORIES 2-D PROGRAM (1957-1959) 11,1-6
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EPILOGUE 11,1-12GOVERNMENT/INDUSTRY DATA EXCHANGE PROGRAMS (GIDEP) 11,1-5LARGE SCALE INTEGRATED CIRCUIT (LSI) (1970-1980) 11,1-9NAVY'S PROJECT TINKERTOY (1950-1953) 11,1-6RADC RELIABILITY NOTEBOOK 11,1-5THE DECADE OF THE INTEGRATED CIRCUIT (1960-1970) 11,1-7THE EMERGENCE OF THE TRANSISTOR (1950-1960) 11,1-4THE RELIABILITY DECADE (1950-1960) 11,1-4VACUUM TUBE ERA (1940-1950) 11,1-3VERY HIGH SPEED INTEGRATED CIRCUITS (VHSIC) (1980) II,1-11VERY LARGE SCALE INTEGRATED CIRCUITS (VLSI) (1980) II,1-11
HOTSPOT TEMPERATURE OF CONNECTORS 11,5-202HUMAN ENGINEERING 1,7-90, 11,3-2HUMAN ERROR RATE 1,7-100HUMAN FACTORS 1,7-86, 11,3-2
CHARACTERISTICS OF HUMANS AND MACHINES 1,7-96DESIGN AND PRODUCTION 1,7-89HUMAN ENGINEERING 1,7-90THEORY 1,7-93HUMAN PERFORMANCE RELIABILITY 1,7-91INTERACTIONS AND TRADEOFFS 1,7-99INTRODUCTION 1,7-86LIST OF PREDICTIVE METHODS 1,7-92MAINTAINABILITY METHODS 1,7-92MAN/MACHINE ALLOCATION AND RELIABILITY 1,7-94MIL-H-46855 1,7-90MIL-STD-1472 1,7-90RELIABILITY RELATIONSHIP 1,7-91THEORY 1,7-93THERP (TECHNIQUE FOR HUMAN ERROR RATE PREDICTION) 1,7-100
HUMAN PERFORMANCE PREDICTIVE METHODS 1,7-92HUMAN PERFORMANCE RELIABILITY 1,7-91HUMANS AND MACHINES, CHARACTERISTICS 1,7-96HYBRID DEVICES DERATING ii,5-73HYBRID MICROCIRCUIT MOUNTING TO INCREASE HEAT TRANSFER 11,6-41HYDRAULIC LEAKS 1,7-77HYDRAULIC STIFPENING 1,7-77HYPERGEOMETRIC 1,9-20HYPOTHESIS TEST A 1,8-61HYPOTHESIS TEST A 1,8-61HYPOTHESIS TEST B 1,8-62HYPOTHESIS TEST B 1,8-62HYPOTHETICAL AVAILABILITY SURFACE 1,10-120HYPOTHETICAL BUDGET CURVES 1,10-122HYPOTHETICAL HISTORY OF A MACHINE GUN USAGE i, 10-39
I
IBM MODEL, ROSNER, RELIABILITY GROWTH MODELS 1,8B-7ICE DAMAGE 1,7-77IDEAL OPERATING CHARACTERISTIC CURVE 11,4-15, 1,8-62IMPACT OF DESIGN AND PRODUCTION ACTIVITIES ON EQUIPMENT RELIABILITY I, 11-15IMPATT II,5-92INACTIVE TIME 1,3-6, 1,3-9INDUCTIVE TEST CIRCUIT, CLAMPED 11,5-89INFANT MORTALITY 1,5-22, 11,3-2INFANT MORTALITY, FOUR TYPES OF FAILURES 1,11-11
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INFORMAL RELIABILITY DESIGN VERIFICATION 1,7-148INFORMATION SOURCES THAT TNITIATE RELIABILITY GROWTH 1,8-97INHERENT RELIABILITY 11,3-3INPUT DOMAIN BASED MODELS 1,9-16INSPECTION 1,12-15INSPECTION DURING STORAGE I,11-81INSPECTION FREQUENCY MATRIX 1,11-79INSPECTION OF SUPPLIES AND CORRECTIONS OF DEFECTS 1,12-15INSPECTION SYSTEM REQUIREMENTS 1,11-6INSTANTANEOUS AVAILABILITY 1,5-63INSTANTANEOUS FAILURE RATE 1,5-3INSTANTANEOUS MISSION EVENT 1,5-64INSULATION BREAKDOWN 11,5-172INTEGRATED CIRCUITS,FILM TYPE II, 1-22INTEGRATION ALGORITHM, DUAL-SLOPE II,5-48INTEL 8048/8035/8748 II,5-67INTEL 8086 II,5-68INTERACTIONS AND TRADEOFFS 1,7-99INTERCONNECT CABLE AND WIRE II,5-210INTERFERENCE DEMONSTRATION TESTS I,8A-42INTERNAL REACTION 1,7-93INTERRELATIONSHIP OF REQUIREMENTS AND CONSTRAINTS 1,12-10INTRINSIC AVAILABILITY 1,5-65INTRINSIC DEFECTS I, 11-13INTRODUCTION I,7-1IPC-CF-150 11,5-216IPC-T-50 11,5-216, 11,5-217
IT
JAN, JANTX, AND JANTXV DEVICE TYPES, ALTERNATE ORDER OF PROCEDURE 11,7-8JAN, JANTX, AND JANTXV DEVICE TYPES, ORDER OF SCREENING PROCEDURE 11,7-7JOSEPHSON JUNCTIONS 11,1-33
K
K-OUT-OF-N CONFIGURATION, RELIABILITY MODELING 1,5-30KLYSTRON II,B-2, II,B-23KOLMOROV-SMIRNOV (K-S) TEST 1,8-48KURTOSIS 11,4-3
L
LARGE GROUND BASED RADAR SYSTEM, LCC BREAKDOWN STRUCTURE I, 10-103LARGE LOTS 1,8A-5LCC ,10-127LCC
BREAKDOWN STRUCTURE OF LARGE, GROUND-BASED RADAR SYSTEM I, 10-103BREAKDOWN STRUCTURES 1,10-99, 1,10-104CATEGORIES VS. LIFE CYCLE I.10-91COMPUTERIZED MODELS AN APPRAISAL OF MODELS USED IN LIFE-CYCLE-COST
ESTIMATION FOR USAF AIR CRAFT SYSTEMS 1,10-131COMPUTERIZED MODELS ANALYTIC METHODOLOGY FOR SYSTEM EVALUATION AND
CONTROL (AMSEC) 1,10-130
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COMPUTERIZED MODELS AVIONICS LABORATORY PREDICTIVE OPERATIONS ANDSUPPORT (ALPOS) COST MODEL 1,10-129
COMPUTERIZED MODELS COMPUTER MODEL FOR ANALYSIS OF ARMY AIRCRAFTRAM IMPROVEMENT PROPOSALS 1,10-130
COMPUTERIZED MODELS COST OPTIMIZING SYSTEM TO EVALUATERELIABILITY (COSTER) 1,10-128
COMPUTERIZED MODELS IN CURRENT USE 1,10-127
COMPUTERIZED MODELS LOGISTICS COST ANALYSIS MODEL 5 1,10-130COMPUTERIZED MODELS OPERATING AND SUPPORT COST MODEL 1,10-129
COMPUTERIZED MODELS PERSHING PROJECT OFFICE I, 10-129
COMPUTERIZED MODELS RELIABILITY AND COST MODEL 1,10-128
COMPUTERIZED MODELS SAVE (SYSTEMS AVIONICS VALUE ESTIMATION) MODELFOR LOGISTIC SUPPORT COSTS 1,10-129
COMPUTERIZED MODELS STEP (STANDARDIZATION EVALUATION PROGRAM) 1,10-129
COMPUTERIZED MODELS I, 10-127
GUIDELINES I, 10-97
GUIDELINES I, 10-97
MODELS I, 10-94
LEARNING FACTORS II,A-4LEARNING FACTORS/FAILURE RATE MULTIPLIERS FOR MICROCIRCUITS II,A-4
LEAKAGE CURRENT 1,7-43
LEWIS AND SHEDLER, RELIABILITY GROWTH MODELS I,8B-7
LIFE CHARACTERISTIC (BATHTUB) CURVE 11,7-1
LIFE CHARACTERISTIC CURVE I, 11-12
LIFE CYCLE 1,12-2
RELATIONSHIP, HARDWARE/SOFTWARE SYSTEM 1,9-4LIFE CYCLE COMPONENT COST 11,1-16
LIFE CYCLE COST (LCC) 1,12-9
ACQUISITION POLICIES 1,10-97
ACTIVITIES 1,12-13AIR FORCE LOGISTICS SUPPORT COST MODEL I,10-111
ANALOGOUS COST METHOD 1,10-106
BREAKDOWN 1,10-95
BREAKDOWN STRUCTURE 1,10-99, 1,10-102
CERS WITH DISCOUNTING AND ESCALATING I, 10-113
COMBINED DISCOUNTING AND ESCALATING 1,10-114
COMPUTER PROGRAM LIFE CYCLE (FROM AF REG. 800-14) 1,10-101
COMPUTERIZED MODELS IN CURRENT USE 1,10-127
CONCEPTS 1,12-12
CONCEPTS 1,10-90
COST CALCULATION FORM 1,10-115COST ESTIMATING RELATIONSHIPS (CERS) 1,10-106COSTING SYSTEM AVAILABILITY 1,10-116CUMULATIVE 1,8-91DESIGN ACTIONS 1,10-97DISCOUNTED PRESENT VALUE CALCULATION 1,10--113DOD DOLLAR CONVERSION INDICES 1,10-117DOD LCC BREAKDOWN STRUCTURES (LCCBSS) 1,10-101, 1,10-99EFFECT OF EARLY DECISIONS 1,12-9ELEMENT MATRIX CONCEPT 1,10-99ESCALATING I, 10-114EXAMPLES OF DETAILED COST ESTIMATING RELATIONSHIPS I,10-110GENERAL R&M TRADEOFF METHODOLOGY 1,10-123GENERIC LIFE CYCLE COST BREAKDOWN STRUCTURE 1,10-102LARGE GROUND BASED RADAR SYSTEM LCC BREAKDOWN STRUCTURE 1,10-103LCC BREAKDOWN STRUCTURES 1,10-99LCC GUIDELINES 1,10-97LCC MODELS 1,10-94
17
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LCC REVISITED 1,10-125LCCBSS USED IN THE MILITARY SERVICES 1,10-104LIFE CYCLE COST BREAKDOWN 1,10-95LIFE CYCLE COST ELEMENT MATRIX CONCEPT (REF. 29) 1,10-99OPERATIONS AND SUPPORT 1,10-115PARAMETRIC COST METHOD 1,10-106RELIABILITY GROWTH 1,8-90RESEARCH AND DEVELOPMENT ACTIONS 1,10-97SOFTWARE LIFE CYCLE COST BREAKDOWN STRUCTURE 1,10-105THE GEOMETRY OF SYSTEM R&M TRADEOFFS 1,10-119TYPICAL STANDARD COST FACTORS 1,10-107
LIFE CYCLE COSTS VS. RELIABILITY 1,10-96LIFE CYCLE DEGRADATION 1,11-2LIFE CYCLE EXPENDITURES 1,12-9LIFE SUPPORT 11,3-3LINEAR IC'S 11,5-38LINEAR MICROCIRCUIT DERATING 11,5-72LITTLEWOOD MODELS 1,9-23LLOYD AND LIPOW, RELIABILITY GROWTH MODELS I,8B-1, I,8B-10LOAD-SHARING REDUNDANT CONFIGURAT N 1I,7A-40LOG-NORMAL DISTRIBUTION 11,4-6LOGIC BLOCK DIAGRAM 1,7-104, , 1,7-115
RADAR EXAMPLE 1,7-115SYSTEM 1,7-104UNIT 1,7-105
LOGIC REPRESENTATION OF E=AB+ACD+BCD 1,7-15LOGIC REPRESENTATION OF E=AB+C+D 1,7-15LOGISTIC SUPPORT COST 1,10-12LOGISTIC SUPPORT COSTS (NON-STANDARD PARTS) II, 1-17LOGISTICS COST ANALYSIS MODEL 5 1,10-130LOGISTICS PLANNING 1,12-50LOGNORMAL DISTRIBUTION 1,5-2, 1,5-12, 11,4-6LOGNORMAL MAINTAINABILITY FUNCTIONS 1,5-62LOT TOLERANCE PERCENT DEFECTIVE (LTPDP II,4-17LOW TEMPERATURE EFFECTS, ELECTRICAL CONNECTORS 11,5-203LOW TEMPERATURE PROTECTION METHODS 1,7-77LOWER TEST MTBF 1,6-3LSI MICROCIRCUITS ii,5-61LSI TECHNOLOGY CHARACTERISTICS II,5-21A
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MAGNETIC DEVICES II,5-169CONSTRUCTION GRADE 11,5-173CURRENT DERATING FOR WIRE SIZE USED IN CONSTRUCTION 11,5-174DERATING CRITERIA FOR TRANSFORMERS, INDUCTORS AND COILS 11,5-173DERATING REQUIREMENTS 11,5-173FAILURE MODES AND MECHANISMS II,5-172GENERAL APPLICATION CONSIDERATIONS 11,5-173INSULATION BREAKDOWN 11,5-172INTRODUCTION II,5-169MAGNETIC CORE CHARACTERISTICS 11,5-172OPEN CONDUCTOR 11,5-172PARAMETER VARIATION 11,5-172RESISTANCE CHANGE WITH TEMPERATURE 11,5-173SELECTION AND USAGE GUIDELINES 11,5-170SHIELDING 11,5-173
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TEMPERATURE CLASS II,5-173MAGNETRON II,B-2MAINTAINABILITY 1,3-4, 1,3-9, 1,10-58, 11,3-3
ANALYSIS 1,12-49AVAILABILITY RELATIONSHIPS I,10-60CONTROL 1,12-50CONTROL PARAMETERS 1,11-59DESIGN ATTRIBUTES I, 11-59DESIGN CRITERIA 1,12-51DESIGN REVIEWS 1,12-51DESIGN SUPPORT 1,12-49DESIGN TRADEOFFS 1,12-51DIDS 1,12-80FUNCTION M(T) 1,5-52MEASUREMENT, BASIC METHODS 1,5-41METHODS FOR HUMAN FACTORS 1,7-92MILESTONES, LIFE CYCLE PHASE 1,12-52MODELS, STATISTICAL DISTRIBUTIONS 1,5-40PREDICTION 1,12-51PROGRAM ELEMENTS 1,12-52PROGRAM PLAN 1,12-49PROGRAM TASKS 1,12-48REQUIREMENTS FOR SUBSYSTEM OR EQUIPMENT SPECIFICATIONS, EXAMPLE 1,12-46REQUIREMENTS IN SUBCONTRACTOR AND VENDOR CONTRACT SPECIFICATIONS 1,12-51REQUIREMENTS, EXAMPLE OF SPECIFIED INTERMEDIATE LEVEL 1,12-47SPECIFICATION REQUIREMENTS 1,12-45STATUS REPORTS 1,12-52TASKS IN THE SYSTEM LIFE CYCLE 1,12-53TASKS VS. LIFE CYCLE PHASE 1,12-52TESTING 1,12-50TRADEOFFS 1,5-77
MAINTAINABILITY ASSURANCE TASKS IN THE PRODUCTION PHASE I, 11-60MAINTAINABILITY CONSIDERATIONS 1,12-41
DEMONSTRATE ACHIEVEMENT OF MAINTAINABILITY REQUIREMENTS 1,12-52ESTABLISH DATA COLLECTION, ANALYSIS, AND CORRECTIVE ACTION SYSTEM 1,12-52ESTABLISH MAINTAINABILITY DESIGN CRITERIA 1,12-51EXAMPLE OF A SPECIFICATION FOR A PERMISSIBLE PREVENTIVE
MAINTENANCE DOWNTIME 1,12-47EXAMPLE OF A SPECIFICATION FOR UNINTERRUPTED OPERATIONAL CAPABILITY
WITHOUT MAINTAINABILITY CONSIDERATIONS PREVENTIVE MAINTENANCE 1,12-48EXAMPLE OF A SPECIFIED LIMITATION IN MAINTENANCE MANHOUR
REQUIREMENTS 1,12-48EXAMPLE OF MAINTAINABILITY REQUIREMENTS FOR SUBSYSTEM OR EQUIPMENT
SPECIFICATIONS 1,12-46
EXAMPLE OF SPECIFIED INTERMEDIATE LEVEL MAINTAINABILITYREQUIREMENTS 1,12-47
INCORPORATE AND ENFORCE MAINTAINABILITY REQUIREMENTS IN SUBCONTRACTORAND VENDOR CONTRACT SPECIFICATIONS 1,12-51
INTEGRATE OTHER ITEMS 1,12-51MAINTAINABILITY ANALYSIS 1,12-50MAINTAINABILITY PROGRAM PLAN 1,12-49dAINTAINABILITY PROGRAM TASKS 1,12-48MAINTAINABILITY SPECIFICATION REQUIREMENTS 1,12-45MAINTAINABILITY TASKS VS. LIFE CYCLE PHASE 1,12-52PARTICIPATE IN DESIGN REVIEWS 1,12-51PERFORM DESIGN TRADEOFFS 1,12-51PREDICT MAINTAINABILITY PARAMETER VALUES 1,12-51PREPARE INPUTS TO THE DETAILED MAINTENANCE CONCEPT AND DETAILED
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MAINTENANCE PLAN 1,12-50PREPARE MAINTAINABILITY STATUS REPORTS 1,12-52R&M MILESTONES VS. SYSTEM LIFE CYCLE PHASE 1,12-52RELATIVE EMPHASIS ON MAINTAINABILITY PROGRAM ELEMENTS 1,12-52SCHEDULE OF CONCEPTUAL PHASE RELIABILITY AND MAINTAINABILITY TASKS 1,12-56
SCHEDULE OF FULL-SCALE DEVELOPMENT PHASE TASKS 1,12-59SCHEDULE OF PRODUCTION PHASE TASKS 1,12-62SCHEDULE OF VALIDATION PHASE nELIABILITY AND MAINTAINABILITY TASKS I,12-57
MAINTAINABILITY CONTROL PRODUCTION I,11-58MAINTAINABILITY FUNCTION DERIVED FROM TIME-TO-REPAIR
DISTRIBUTION 1,5-41, 1,12-46MAINTAINABILITY PROGRAM TASKS
CONCEPTUAL PHASE 1,32-52DEVELOPMENT PHASE 1,12-59PRODUCTION PHASE 1,12-62VALIDATION PHASE 1,12-57
MAINTAINABILITY THEORY 1,5-38BASIC CONCEPTS 1,5-38MAXIMUM TIMM TO REPAIR 1,5-40MEAN TIME TO REPAIR, MTTR 1,5-40MEDIAN TIME TO REPAIR 1,5-40STATISTICAL DISTRIBUTIONS USED IN MAINTAINABILITY MODELS 1,5-40
MAINTENANCE 11,3-3CONCEPT 1,12-50CORRECTIVE 11,3-3DEGRADATION CONTROL (DURING DEPOT OPERATIONS) I,11-85DOCUMENTATION REQUIREMENTS I, 11-88MANHOUR REQUIREMENTS, EXAMPLE OF A SPECIFIED LIMITATION IN 1,12-48MANPOWER COST 1,10-12PLAN 1,12-50PLAN FOR DEGRADATION CONTROL, IMPORTANCE 1,11-87PREVENTIVE II,3-3REQUIREMENT AREAS, DEPOT I, 11-87STEPS IN EXAMPLE REPLACEMENT ACTTON 1,11-61
TASK STEPS 1,11-61TIME 1,3-6, 1,3-9
MAINTENANCE-MANHOURS-PER-MAINTENANCE-ACTION, DIRECT (DMMH/MA) 1,10-15MAJORITY VOTE REDUNDANCY (TWO OUT OF THREE) DIVIDE BY 8 COUNTER CIRCUIT 1,7-68MAJORITY VOTING REDUNDANCY 1,7-65, I,7A-35
MAN/MACHINE INTERACTION 1,7-94MAN/MACHINE RELIABILITY PREDICTION 1,7-98MANAGEMENT ACTIVITIES 1,4-10MARKOV GRAPH FOR SINGLE UNIT 1,5-66MARKOV-PROCESS 1,5-63, 11,8-25MATERIALS AND PROCESSES USED IN SEMI-CONDUCTOR FABRICATION II,1-20MAXIMUM POWER DISSIPATION 11,5-36MAXIMUM TIME TO REPAIR 1,5-40MEAN FLIGHT HOURS BETWEEN FAILURES (MFHBF) 1,4-6MEAN LIFE 1,6-1MEAN LIFE ESTIMATION BY USE OF PERCENTILES 11,4-10MEAN TIME BETWEEN FAILURE (MTBF) 1,5-6, 1,12-27. 11,3-3MEAN TIME BETWEEN FAILURE-VERIF±CAITION TEST 1,12-16MEAN-TIME-BETWEEN-DOWNING-EVENTS (MTBDE) I,10-15MEAN-TIME-BETWEEN-MAINTENANCE-ACTIONS (MTBMA) I, 10-15, 11,3-3MEAN TIME TO FAILURE (MTTF) 1,5-5, 11,3-4MEAN TIME TO REPAIR (MTTR) 1,5-40, 11,3-4MEAN-TIME-TO-RESTORE-SYSTEM (MTTRS) I,10-15MECHANICAL EQUIPMENT, STATISTICAL DISTRIBUTIONS USED IN 1,5-11
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MEDIAN TIME TO REPAIR 1,5-40MEMORY/LSI FAILURE MODES AND MECHANISMS 11,8-8METALLIZATION MELT II,6-15MFHBF 1,4-6MICROCIRCUITS 11,5-12
A/D CONVERSION 11,5-46AMD 2900 FAMILY II,5-67APPLICATION CONSIDERATIONS 11,5-17APPLICATION OF LINEAR IC'S 11,5-38APPLICATION OF LSI MICROCIRCUITS 11,5-61BIPOLAR DEVICE TECHNOLOGIES 11,5-13BIT-SLICE PROCESSORS 11,5-64BUBBLE MEMORIES II,5-63CONSIDERATIONS IN THE BOARD LAYOUT OF ICS 11,5-24DECOUPLING AND GROUNDING II,5-32DEFECTS/SCREENS 11,7-18DERATING 11,5-73DIGITAL MICROCIRCUIT APPLICATIONS 11,5-51DIGITAL MICROCIRCUIT DERATING 11,5-72DIGITAL MICROCIRCUITS 11,5-51FABRICATION AND DESIGN 11,5-18HYBRID DEVICES DERATING II,5-73IC PACKAGE TYPES 11,5-17INTEL 8048/8035/8748 11,5-67INTEL 8086 11,5-68LINEAR ICS 11,5-38MAXIMUM POWER DISSIPATION 11,5-36MICROCIRCUIT SELECTION GUIDELINES 11,5-1MICROCOMPUTERS 11,5-66MICROPROCESSORS 11,5-66MIL-STD-883 TEST METHODS 11,7-16MONOLITHIC MICROCIRCUIT TECHNOLOGY 11,5-12MOS TECHNOLOGY FAMILIES II,5-16MOTOROLA 6800 11,5-69MOTOROLA MC 68000 11,5-69MOUNTING AND CONNECTIONS Ii,5-22NOISE TYPE AND DESIGN CONSIDERATIONS II,5-24OPERATING ICS WITH OR WITHOUT HEAT SINKS 11,5-36POWER DISSIPATION IN ICS II,5-34PRINTED CIRCUIT BOARDS 11,5-34RCA CDP 1802 11,5-69SELECTION GUIDELINES 11,5-12SELECTION OF PROCESSING UNITS 1,5-64SPEED AND APPLICATIONS 11,5-21SPEED AND POWER TRADEOFFS 11,5-19TTESTING 11,7-27TEXAS INSTRUMENTS SBP 9989 11,5-70THERMAL RESISTANCE 11,5-36TI 9900A II,5-70ZILOG Z8 FAMILY II,5-71ZILOG Z80 11,5-71ZILOG Z8000 FAMILY 11,5-71
MICROCOMPUTERS 11,5-64, 11,5-66MICROPROCESSORS 11,5-64, 11,5-66MICROWAVE SEMICONDUCTOR DEVICES II,5 - 01
CHARACTERISTICS II,5-91SI VS GAAS FOR MICROWAVE APPLICATIONS II,5-91
THE GUNN OR TRANSFERRED ELECTRON DEVICE (TED) II,5-92
21
THE IMPATT DEVICE 11,5-92LMICROWAVE TUBE 1,5-10MIL SPECIFICATIONS FOR RELAYS 11,5-177MIL SPECIFICATIONS, SEE SPECIFICATIONS AND STANDARDS ALSOMIL-C-10950 11,5-147, 11,5-158MIL-C-11015 11,5-148, 11,5-158MIL-C--11272 11,5-147MIL-C-12889 1I, 5-148MIL-C--14409 11,5-152, 11,5-158, 11,5-167MIL-C-15305 11,5-171MIL-C-17 11, 5-209MIL-C-18312 11, 5-148MIL-C-19547 11, 5-209MIL-C--19978 11,5-148, 11,5-159, 11,5-167, 11,5-160MIL-C-20 11,5-149, 11,5-157, 11,5-167MIL-C-21097 11,5-198, 11,5-215MIL-C-21609 11, 5-209MIL-C-22931 11,5-209MIL-C-22992 11,5-196MIL-C-23183 11,5-160MIL-C-23269 11,5-147, 11,5-18, 11,5-161, 11,5-167MIL-C-23437 11,5-209MIL-C-23806 11,5-209MIL-C-24308 11,5-196MIL-C-25 11, 5-148MIL-C-26482 11, 5-195MIL-C-27072 11, 5-209MIL-C-27500 11, 5-209MIL-C-28731 11,5-197MIL-C-28748 11, 5-197MIL-C-28804 11, 5-197MIL-C-3432 11,5-209MIL-C-3655 11, 5-198MIL-C-3899 11, 5-197MIL-C-38999 1I, 5-195MIL-C-39001 !1,5-147, 11,5-161, 11,5-167MIL-C-39003 11,5-149, 11,5-161, 11,5-167MIL-C-39006 11,5-150, 11,5-162, 11,5-167MIL-C-39010 11,5-169, 11,5-171MIL-C-39012 11, 5-198MIL-C-39014 11,5-149, 11,5-164, 11,5-167MIL-C-39018 11,5-164, 11,5-166MIL-C-39022 11,5-151, 11,3-165, 11,5-167MIL-C-39024 11,5-197MIL-C-3965 11,5-149MIL-C-442 11, 5-209MIL-C-5 11,5-147MIL-C-5015 11,5-195MIL-C-55021 11, 5-209MIL-C-55302 11,5-199, 11,5-216MIL-C-55365 11,5-151, 11,5-165MIL-C-55514 11,5-151, 11,5-166, 11,5-167MIL-C-55681 11,5-151, 11,5-166
* MIL-C-62 11,5-149MIL-C-7078 11,5-209MIL-C-81 11,5-151, 11,5-167MIL-C-81659 11,5-197MIL-C-83421 11, 5-167
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MIL-C-83723 11,5-196, 11,5-197MIL-E-1 II, 5-207MIL-E-16400 1,7-2, 11,5-223MIL-E-4158 1,7-2MIL-E-5086 11,5-209MIL-E-5400 1,7-2, 11,5-223MIL-F-14256 II,5-217MIL-H-46855 1,7-90MIL-HDBK-189 1,8-92MIL-HDBK-217 1,6-37, 1,7-20, 1,7-130, 11,5-10, 11,5-193, 11,5-206MIL-HDBK-217D 1,6-45MIL-HDBK-246 11,5-222MIL-HDBK-251 1,7-78MIL-I-45208 1,11-6MIL-I-46058 II,5-215MIL-L-3890 II,5-209MIL-M-28787 1,7-18, 11,5-222MIL-M-83436 Ii,5-220MIL-P-11268 II,5-194MIL-P-13949 11,5-215MIL-P-28809 II,5-215MIL-P-50884 II,5-215MIL-P-55110 11,5-216, 11,5-220MIL-P-81728 II,5-215MIL-Q-9858 1,11-4MIL-R-10509 11,5-104MIL-R-11 11,5-104MIL-R-11804 11,5-104, 11,5-121MIL-R-12934 II,5-122MIL-R-18546 II,5-123MIL-R-19 11,5-106, 11,5-116, 11,5-117MIL-R-22 11,5-106, 11,5-118MIL-R-22091 11,5-107, 11,5-124MIL-R-22684 II, 5-104MIL-R-23285 11,5-106, 11,5-125, 11,5-126MIL-R-23648 II, 5-143MIL-R-26 11,5-104, 11,5-119MIL-R-27208 11,5-107, 1I,5-127MIL-R-27777 ii,5-177MIL-R-28750 !1,5-177MIL-R-39002 11,5-107, 11,5-128MIL-R-39005 11,5-104, 11,5-129MIL-R-39007 11,5-104, 11,5-130MIL-R-39008 11,5-105, 11,5-131MIL-R-39009 11,5-105, 11,5-123, 11,5-132MIL-R-39015 11,5-107, 11,5-127, 11,5-133MIL-R-39016 II,5-177MIL-R-39017 11,5-105, 11,5-134, 11-135MIL-R-39023 11,5-136MIL-R-39035 11,5-1071 !1,5-124, 11,5-137, 11,5-138MIL-R-55182 11,5-105, 11,5-139MIL-R-55342 11,5-140MIL-R-55432 11,5-105MIL-R-5757 11,5-177MIL-R-6106 11,5-177MIL-R-83401 11,5-106, 11,5-141, 11,5-142MIL-R-83516 11,5-177MIL-R-83726 11,5-177
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MIL-R-93 11,5-104MIL-R-94 II, 5-120MIL-S-12285 iI, 5-186MIL-S-15291 11,5-187MIL-S-15743 II, 5-186MIL-S-18396 II, 5-186MIL-S-19500 1,7-6, 1,7-7, 11,5-76, 11,5-212MIL-S-21604 II, 5-186MIL-S-22710 II, 5-187MIL-S-22885 I, 5-185MIL-S-24236 Ii, 5-185MIL-S-24317 II, 5-185MIL-S-3786 Ii, 5-187MIL-S-3950 11,5-187MIL-S-45743 11,5-217MIL-S-46844 II, 5-217MIL-S-5432 11,5-188MIL-S-55433 II, 5-188MIL-S-6807 II, 5-187MIL-S-83502 11,5-199MIL-S-83505 I, 5-199MIL-S-83734 II, 5-199MIL-S-8805 II, 5-187MIL-S-8834 II, 5-187MIL-S-9395 II, 5-187MIL-STD-105 I, 8A-10MIL-STD-1130 11,5-220MIL-STD-1132 11,5-5, 11,5-186MIL-STD-1286 II, 5-169MIL-STD-1346 11,5-175, 11,5-177MIL-STD-1353 II, 5--194MIL-STD-1378 11,5-222MIL-STD-1389 11,5-222MIL-STD-1472 1,7-90MIL-STD-1547 11,5-76MIL-STD-1562 11,5-5MIL-STD-1634 11,5-222MIL-STD-1670 I,7B-13MIL-STD-198 11,5-5, 11,5-103, 11,5-111, 11,5-146
MIL-STD-200 11,5-207MIL-STD-202 11,5-5, 11,5-191, 11,7-5MIL-STD-2068 1,8-88MIL-STD-210 1,6-5, I,7B-1MIL-STD-275 II, 5-216MIL-STD-414 I, 8A-32MIL-STD-454 11,5-177, 11,5-186, 11,5-194, 11,5-207, 11,5-216, 11,5-217MIL-STD-701 11,5-5MIL-STD-721 1,3-7MIL-STD-750 11,5-5, 11,7-10MIL-STD-756 I 6-61MIL-STD-781 1,6-3MIL-STD-781C I, 11-52MIL-STD-785 1,8-1MIL-STD-785B I, 12-33MIL-STD-883 11,5-4, 11,7-16, 11,7-25
MIL-STD-965 11,5-2MIL-T-21038 11,5-169, 11,5-171MIL-T-23648 11,5-107, 11,5-143
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MIL-T-27 11,5-169, 11,5-170MIL-T-55631 11,5-169, 11,5-171MIL-T-83720 11,5-169MIL-T-83721 11,5-169, 11,5-171MIL-W-16878 11,5-209MIL-W-19150 11,5-209MIL-W-22759 II, 5-209MIL-W-25038 11,5-209MIL-W-7072 11,5-209MIL-W-76 11,5-209MIL-W-81044 II, 5-209MIL-W-81381 11,5-209MIL-W-8777 II, 5-209MILLS MODEL 1,9-22MINIMAL PATH AND MINIMAL CUT TECHNIQUES 1,6-55MINIMIZATION OF EFFORT ALGORITHM 1,6-20MINIMIZING DESIGN ERRORS 1,7-33MISSION 11,3-4
AVAILABILITY 1,5-63OPERAT.TJG TIME 1,5-64PROFII 1,6-7
RELIAI.TLITY 1,3-2, 1,3-8, 1,10-14, 1,10-15, 1,10-42RELIABILITY AND DEPENDABILITY MODELS 1,10-41SUCCESS I, 10-12TIME 1,3-6, 1,3-10
MISSION-TIME-BETWEEN-CRITICAL-FAILURES (MTBCF) 1,10-15MISSION-TIME-TO-RESTORE-FUNCTIONS (MTTRF) I, 10-15MODE 11,4-3MODELS - DETERMINISTIC, MATHMATICAL, PROBABILISTIC, STOCHASTIC 1,5-1MODIFICATION TIME 1,3-6, 1,3-9MOISTURE EFFECTS ON SWITCHES II,,5-192'MOISTURE PROTECTION 1,7-80MOMENT ANALYSIS 1,7-28, 1,7-31MONITOR/CONTROL OF SUBCONTRACTORS AND SUPPLIERS I, 12-34MONTE CARLO ANALYSIS 1,7-28MOS (METAL OXIDE SEMICONDUCTOR) 1,7-35MOS SSI/MSI DEVICE REPORTED FAILURE MODES AND MECHANISMS 11,8-8MOS TECHNOLOGY FAMILIES 11,5-16MOSFET II, 5-84
CAPACITIVE SPEED-UP CIRCUIT 11,5-86CAUTION 11,5-90MAXIMUM OPERATING FREQUENCY 11,5-87PARALLELING 11,5-90SAFE OPERATING AREA 11,5-90TEMPERATURE STABILITY II, 5-90
MOTOROLA 6800 II, 5-69MOUNTING AND CONNECTIONS,MICROCIRCUITS II,5-22MOUNTING TECHNIQUES FOR RESISTORS 11,5-31MOUNTING TO INCREASE HEAT TRANSFER, HIGH POWER PARTS II, 6-41MOUNTING TO INCREASE HEAT TRANSFER, HYBRIDS 11,6-41MPCAG (MILITARY PARTS CONTROL ADVISORY GROUP) 11,5-3MRAP/SRAP IT.5-5MTBF (MEAN TIME BETWEEN FAILURES) 1,4-6, 1,5-6MTBF APPROXIMATION I, 11-17MTBF VERSUS ACTIVE ELEMENTS FOR VARIOUS RELIABILITY CLASSES 1,6-35MTTF (EXPECTED VALUE) 1,5-6MTTR (MEAN TIME TO REPAIR) 1,5-52MULTICONDUCTOR CABLE II, 5-208
25
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MULTILAYER PC BOARD COOLING TECHNIQUES II,6-43MULTILAYER PRINTED WIRING BOARDS II,5-219MULTIPLE REDUNDANCY 1,7A-8MULTIPLE REDUNDANT ARRAY OF M ELEMENTS I,7A-10MUSA MODEL 1,9-21
N
NAC TP-526, SEM MICROPROCESSOR APPLICATION HANDBOOK 11,5-222NAC TP-528, SEM MEMORY APPLICATION HANDBOOK II,5-222NAC TP-529, SEM THERMAL APPLICATION HANDBOOK 11,5-222NAC TP-531, SEM MODULE DESCRIPTIONS HANDBOOK II,5-222NAC TP-532, SEM HARDWARE CATALOG II,5-223NAVY STANDARD ELECTRONIC MODULES (SEM) 1,7-18, 11,5-221NAVY STANDARD ELECTRONIC MODULES (SEM) PROGRAM (MIL-M-28787) 1,7-18NETWORK TREE PRODUCTION 1,7-139NEW TECHNOLOGIES II, 1-31NEW-GENERATION COST PROGRESSION 1,1-4NOISE II,5-24NOISE FIGURE PERFORMANCE OF GAAS LABORATORY DLVICES II,1-34NOISE GENERATION DUE TO POOR TRANSMISSION-LINE RETURNS 11,5-26NOISE TYPE AND DESIGN CONSIDERATIONS ii,5-24NONEXPONENTIAL FAILURE DENSITIES MODIFICATIONS 1,6-47NON-PARAMETRIC AND THEORETICAL NORMAL RELIABILITY FUNCTIONS 1,8-30NONOPERATING FAILURE RATES 1,6-49NON-REDUNDANT UNIT, EQUIVALENT 1,6-68NON-REDUNDANT VOLTAGE SUPPLIES 1,7-62NON-REPAIRABLE EQUIPMENT SITUATIONS II, 1-15NON-STANDARD PARTS DOCUMENT COSTS 11,1-17NONOPERATING FAILURE RATES, MODIFICATION TO INCLUDE 1,6-49NONREDUNDANT RF AMPLIFIER CHANNEL 1,7-71NONREDUNDANT RF RECEIVER CHANNELS 1,7-74NONREDUNDANT TRANSISTOR CIRCUIT, COMPARISON WITH QUAD 1,7-66NONREDUNDANT VS REDUNDANT CONFIGURATION 1,7-70NORMAL (GAUSSIAN) STRESS-STRENGTH DISTRIBUTIONS AND UNRELIABILITY
IN DESIGN 1,7-11NORMAL CURVE I,5A-3NORMAL DISTRIBUTION 1,5-7, 1,5-56, 1,8-61, I,8A-1, I,8A-17, I,8A-26,
I,8A-31, I,8A-38, 11,4-2, 11,4-6CONFIDENCE LIMITS 1,8-35FAILURES IN TIME 1,8-25GRAPHICAL POINT ESTIMATION 1,8-8RELIABILITY CALCULATIONS USING 1,5-10
NORMAL RELIABILITY FUNCTION, COMPUTATION FOR 1,8-28NORMAL RELIABILITY FUNCTIONS 1,8-30NORMAL SURVIVAL CURVE 1,8-25, 1,8-27NOT OPERATING TIME 1,3-6, 1,3-10NTIA-SP-79-4 11,5-212, 11,5-214NUCLEAR RADIATION 1,7-85
0
O&M DOLLAR CONVERSION INDICES, DOD I, 10-117OBSERVED AND THEORETICAL EXPONENTIAL SURVIVAL CURVES 1,8-27OBSERVED AND THEORETICAL NORMAL SURVIVAL CURVES 1,8-27OC CURVE CHARACTERISTICS 1,8-64
26
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OPERABLE 11,3-4OPERATING AND SUPPORT COST MODEL I, 10-129OPERATING CHARACTERISTICS CURVE 1,8-62, 1,8-63, 11,4-15, 11,4-16OPERATING TIME 1,5-64OPERATIONAL 11,3-4OPERATIONAL EFFECTIVENESS 1,4-13OPERATIONAL MAINTAINABILITY 1,10-42OPERATIONAL R&M ASSESSMENT AND IMPROVEMENT 1,11-83
DATA COLLECTION AND ANALYSIS (DURING FIELD DEPLOYMENT) 1,11-93DEPOT MAINTENANCE REQUIREMENT AREAS 1,11-87FACTORS CONTRIBUTING TO R&M DEGRADATION DURING FIELD OPERATION 1,11-84IMPORTANCE OF A MAINTENANCE PLAN FOR DEGRADATION CONTROL I,11-87MAINTENANCE DEGRADATION CONTROL (DURING DEPOT OPERATIONS) I, 11-85MAINTENANCE DOCUMENTATION REQUIREMENTS 1,11-88RELIABILITY CENTERED MAINTENANCE CONCEPT 1,11-91SYSTEM R&M ASSESSMENT 1,11-95SYSTEM R&M IMPROVEMENT I, 11-97SYSTEM R&M IMPROVEMENT PROGRAM I,11-98
OPERATIONAL READINESS 1,3-2, 1,3-8, 1,4-16, 1,10-14, 1,10-15OPERATIONAL READINESS MODELS 1,10-43, 1,10-45, 1,10-46, 1,10-48OPERATIONAL READINESS PROBABILITY i,10-53OPERATIVE REDUNDANCY I,7A-16, I,7A-25, I,7A-44OPTIMIZATION OF SYSTEM EFFECTIVENESS 1,4-16OPTIMIZATION PROCESS 1,4-17OPTIMIZATION TECHNIQUES 1,4-19ORACLE (OPTIMIZED RELIABILITY AND COMPONENT LIFE ESTIMATES) 1,10-54, 1,6-51OUTPUT RESPONSE 1,7-93OVERSTRESS PROTECTION OF ELECTRONIC COMPONENTS 1,7-18
PPACKAGE TYPES II, 5-17PACKAGING 1,11-68, 11,1-24PACKAGING TRADE-OFFS 11,6-10PACKING 1,11-68PARALLEL CONFIGURATION MODELING 1,5-27PARALLEL ELEMENT CIRCUIT I,7A-32PARALLEL ELEMENTS I,7A-18PARALLEL ELEMENTS RELATED TO FAILURE-MODE PROBABILITIES I,7A-20PARALLEL NETWORK 1,7-45PARALLEL REDUNDANCY 1,7-58, I,7A-11PARALLEL REDUNDANCY, DUPLICATE (OPERATIVE CASE) I,7A-10PARALLEL SERIES REDUNDANCY CIRCUIT EXAMPLE 1,7-57PARALLEL SERIES REDUNDANCY RELIABILITY GAIN 1,7-55PARALLEL-SERIES CONFIGURATION I,7A-4, I,7A-26PARALLEL-SERIES ELEMENTS I,7A-24PARAMETER CHANGE WITH STRESS AND TIME , RESISTORS 1,7-29PARAMETER CHANGE WITH TIME, RESISTORS 1,7-26PARAMETER CHANGE WITH TIME, CAPACITORS 1,7-27PARAMETER DEGRADATION 1,7-20PARAMETER DEGRADATION AND ANALYSIS 1,7-20PARAMETER VARIATION ANALYSIS 1,7-28, 1,7-31, 1,7-94PARAMETER VARIATIONS OF MAGNETIC DEVICES DURING USEFUL LIFE 11,5-172PART COUNT TECHNIQUE 1,6-27, 1,6-39PART FAILURE MODE DISTRIBUTION 1,7-108PART FAILURE RATES II,A-1
CAPACITORS II,A-2ELECTRON TUBES II,B-1
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FACTORS AFFECTING FAILURE RATES OF PARTS II,A-1FAILURE RATE FACTORS FOR MONOLITHIC MICROCIRCUITS II,A-4FAILURE RATE FACTORS FOR SEMICONDUCTOR DEVICES II,A-3
LEARNING FACTORS/FAILURE RATE MULTIPLIERS FOR MICROCIRCUITS II,A-4
RELAYS, SWITCHES AND CONNECTORS II,A-2
RESISTORS II,A-2PART SELECTION AND CONTROL 1,7-1, 1,7-3, 1,12-36, 11,5-1, 11,5-3
CABLES 11,5-208CAPACITORS TI, 5-144CRITICAL PARTS 11,5-7
DISCRETE SEMICONDUCTOR DEVICES II, 5-75ELECTRICAL CONNECTORS II, 5-194ELECTRO OPTICS/FIBER OPTICS II,5-211FAILURE RATE PREDICTION 11,5-10
GROUNi RULES 1,7-3GROUND RULES 11,5-1MAGNETIC DEVICES II, 5-169MPCAG 11,5-3MRAP/SRAP 11,5-5PART APPLICATION 11,5-7PART APPROVAL 11,5-6PART AVAILABILITY 11,5-2PART CONTROL 11,5-1
PART CRITICALITY 11,5-2PART JUSTIFICATION 11,5-6
PART PARAMETERS 11,5-7PART SELECTION 11,5-2PART TEST METHODS 11,5-5PARTS SELECTION GUIDELINES II, 5-12PREFERRED PARTS II, 5-5PRINTED CIRCUITRY II, 5-215RELAYS II, 5-175RESISTORS II, 5-103STANDARD ELECTRONIC MODULE (SEM) PROGRAM 11,5-221SWITCHES II, 5-185
PART TYPE VS. SCREENING DESIGNATOR 11,1-14PARTIAL REDUNDANCY 1,5-18, I,7A-9PARTS SELECTION AND CONTROL, GROUND RULES 1,7-3PASSIVE COOLING TECHNIQUES 1,7-76PASSIVE PARTS 11,7-4PCB TEMP-CYCLE ENVIRONMENTAL PROFILE I, 11-37PDR 1,7-152PERCENTILE USED TO ESTIMATE MEAN LIFE II,4-10PERFORMANCE LIMITS I, 6-6PERMISSIBLE FAILURE AND REPAIR RATES I, 10-79PERSHING PROJECT I, 10-129
PHASE LOCK LOOP BLOCK DIAGRAM 11,5-49PHOTOFABRICATION II, 1-20PHOTOLITHOGRAPHY II, 1-22PHYSICAL CHARACTERISTIC TESTS (200 CLASS) 11,1-26PIN RATING, CONNECTORS 11,5-204POISSON DISTRIBUTION 1,5-20POISSON PROCESSES, RELIABILITY GROWTH MODELS I,8B-5
POSITIVE VOLTAGE REGULATOR 11,5-42POSTERIOR DISTRIBUTION 1,5-35POTTING, ELECTRICAL CONNECTORS 11,5-204POWER DISSIPATION IN ICS 11,5-34POWER DISSIPATION LIMITATIONS .1,7-37
28
POWER MOSFET 11,5-84POWER TRANSISTOR SECONDARY BREAKDOWN 11,5-83PREDICTED 11,3-4PREDICTING MAN/MACHINE RELIABILITY 1,7-98PREDICTION BY FUNCTION TECHNIQUE 1,6-27, 1,6-36PREDICTIVE METHODS FOR HUMAN FACTORS 1,7-92PREFERRED PARTS 11,5-5PRELIMINARY DESIGN REVIEW (PDR) 1,7-150, 1,7-152, 1,9-27PREPRODUCTION RELIABILITY DESIGN REVIEW (PRDR) 1,7-154PRESENT STATE OF THE ART 11,1-18PRESERVATION I, 11-68PREVENTIVE MAINTENANCE DOWNTIME 1, 12-47, 1, 3-10PREVENTIVE MAINTENANCE TIME, DEF-INITION 1,3-6, 1,3-10PREVENTIVE MAINTENANCE, PERMISSIBLE DOWNTIME 1,12-47PRINCIPAL FAILURE MECHANISMS FOR DIGITAL AND LINEAR DEVICES 11,8-7PRINTED CIRCUIT BOARD II,5-34
APPLICATION AIDS 11,5-35ELECTRICAL OPPORTUNITIES AND PITFALLS 11,5-35
PRINTED CIRCUIT TECHNIQUES, TYPICAL APPLICATIONS II,5-35PRINTED CIRCUITRY 11,5-215
ALTERNATE TYPES OF INTERCONNECTION 11,5-219COMPONENT MOUNTING (SOLDERING) 11,5-218DESIGN AND TREATMENT CRITERIA II,5-215FAILURE MODES I, 5-220HAND SOLDERING 11,5-218HIGH CIRCUIT OR PACKAGING DENSITY 11,5-219INTRODUCTION 11,5-215MATERIALS AND PROCESSES CRITERIA 11,5-217MULTILAYER PRINTED WIRING BOARDS 11,5-219PART SELECTION AND CONTROL 11,5-215PRINTED WIRING BOARD SELECTION 11,5-219SOLDER AND FLUX 11,5-218VAPOR PHASE SOLDERING II, 5-218WAVE SOLDERING 11,5-218
PRINTED WIRING BOARD SELECTION II,5-219PRIOR DISTRIBUTION 1,5-34PROBABILITY DENSITY FUJNCTION 1,5-46, 11,4-3
CUMULATIVE DISTRIBUTION FUNCTIONS 11,4-3KURTOSIS 11,4-3MEAN 11,4-3MEDIAN 11,4-3MODE 11,4-3SKEW 11,4-3STANDARD DEVIATION 11,4-3VARIANCE -1,4-3
PROBABILITY DISTRIBUTIONS 11,4-4EXPONENTIAL DISTRIBUTION 11,4-5GAMMA DISTRIBUTION 11,4-12HAZARD RATE 11,4-4LOGNORMAL DISTRIBUTION 11,4-6NORMAL DISTRIBUTION 11,4-6PROBABILITY PLOTTING 11,4-7WEIBULL DISTRIBUTION II,4-7
PROBABILITY GRAPH PAPERS 1,8-6PROBABILITY OF SUCCESS I, 6-?, 1, 12-27PROBABILITY OF SURVIVAL 1,6-1, 1,12-27PROBABILITY PLOTTING 11,4-7PROCEDURE FOR PERFORMING RELIABILITY PREDICTION AND ALLOCATION 1,6-57
29
PROCESS-INDUCED DEFECTS 1,11-13PROCESSING UNIT CHARACTERISTICS II, 5-65
PROCUREMENT DOLLAR CONVERSION INDICES, DOD I, 10-117PRODUCERS RISK 1,8-61, 11,415PRODUCT PERFORMANCE AGREEMENTS 1,12-14, 1,12-15PRODUCTION AND USE (DEPLOYMENT) R&M Ill-I
OPERATIONAL R&M ASSESSMENT AND IMPROVEMENT I,11-83PRODUCTION MAINTAINABILITY CONTROL I,11-58PRODUCTION RELIABILITY CONTROL 1,11-3SHIPMENT AND STORAGE 1,11-66
PRODUCTION MAINTAINABILITY CONTROL I, 11-58MAINTAINABILITY ASSURANCE AND THE QUALITY PROGRAM 1,11-63MAINTAINABILITY ASSURANCE TASKS IN THE PRODUCTION PHASE 1,11-60MAINTAINABILITY CONTROL PARAMETERS I, 11-59MAINTAINABILITY DESIGN ATTRIBUTES 1,11-59
PRODUCTION PHASE PLANNING 1,12-7PRODUCTION PHASE RELIABILITY AND MAINTAINABILITY DECISION POINTS 1,12-63PRODUCTION PHASE TASKS 1,12-62PRODUCTION RELIABILITY ACCEPTANCE TEST (PRAT) 1,12-39PRODUCTION RELIABILITY ACCEPTANCE TESTING (MIL-STD-781) I, 11-50PRODUCTION RELIABILITY CONTROL
ACCEPTANCE TESTING (MIL-STD-781) 1,11-50DATA COLLECTION AND ANALYSIS 1,11-57DEGRADATION ASSESSMENT & CONTROLS 1,11-9INTERMEDIATE LEVEL SCREENING 1,11-31MIL-I-45208 INSPECTION SYSTEM REQUIREMENTS I,11-6MIL-Q-9858 QUALITY PROGRAM ELEMENTS 1,11-4PART LEVEL SCREEN TESTING I, 11-24PROCESS RELIABILITY ANALYSIS 1,11-14PRODUCTION FAILURE CATEGORIES I,11-11PRODUCTION SCREENING AND BURN-IN i,11-22QUALITY ENGINEERING & CONTROL TASKS I,11-7RELIABILITY DEGRADATION - INFANT MORTALITY I,11-11SCREEN TEST PLANNING AND EFFECTIVENESS I, 11-42SCREENING AT MODULE AND UNIT/SYSTEM LEVEL 1,11-29SCREENING TEST EFFECTIVENESS I, 11-43STRESS SCREENING GUIDELINES MATRIX 1,11-44, 1,11-46STRESS SCREENING MODEL (SSM) I, 11-44THERMAL AND VIBRATION SCREEN DEFECTS PRECIPITATED 1,11-40UNIT/EQUIPMENT AND SYSTEM LEVEL SCREENS 1,11-40
PRODUCTION SCREENING AND BURN-IN 1,11-22PROGRAM EVALUATION AND SURVEILLANCE I, 12-97PROGRAM EVALUATION CRITERIA (CONTRACTOR SELECTION) I, 12-99PROGRAM FLOW CHART 1,9-7PROGRAM MATRIX
DESIGN EVALUATION I, 12-92
MANAGEMENT I, 12-91
PRODUCTION RELIABILITY AND DATA COLLECTION 1, 12-93
TEST/DEMONSTRATION AND FAILURE REPORTING 1,12-94
PROGRAM PARTS SELECTION LIST (PPSL) 11,5-3
PROGRAM PLAN, SOFTWARE R & M I, 12-73
PROGRAM PROVING 1, 9-11
PROGRAM REQUIREMENTS BASED UPON THE TYPE OF PROCUREMENT I, 12-88
PROGRAM REVIEW, SOFTWARE R & M I, 12-75PROGRAM REVIEWS I, 12-34PROGRAM TESTING 1,9-11PROGRAMS FOR FAULT TREE ANALYSIS 1,7-133, 1,7-132PROGRESSIVE EXPANSION OF RELIABILITY BLOCK DIAGRAM AS DESIGN 1,6-60
30
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PROPERTIES OF SILICON AND GAAS AT 300 0K 11,1-31PROTECTION METHODS
LOW TEMPERATURE 1, 7-77SHIPMENT AND STORAGE I, 11-70TRANSIENTS 1,7-18, 11,5-93
PULSE WAVEFORM, TRANSIENT 11,5-101
QQQ-S-571 SOLDER 11,5-217QUAD REDUNDANT TRANSISTOR CIRCUIT 1,7-64QUALITY CONTROL (QC) 1,5-18, 1,11-3, 11,4-14QUALITY DEFECTS,STORAGE-INDUCED I, 11-74QUALITY ENGINEERING 1,11-3, 1,11-5, 1,11-7QUALITY INSPECTION LEVELS 1,11-82QUALITY PROGRAM ELEMENTS 1,11-4
RR&M ACTIVITIES SYSTEM LIFE CYCLE 1,12-2R&M AND COST METHODS 1,0-93R&M APPORTIONMENT/ALLOCATION 1,6-12
AGREE APPORTIONMENT TECHNIQUE 1,6-14ALLOCATION, STATE OF ART CONSTRAINTS 1,10-78APPORTIONMENT FACTORS 1,6-16APPORTIONMENT FORMULATION 1,6A-6ARINC APPORTIONMENT TECHNIQUE 1,6-17AVAILABILITY, FAILURE AND REPAIR RATES 1,10-61. 1,10-69DYNAMIC PROGRAMMING I,6A-1DYNAMIC PROGRAMMING APPROACH 1,6-24, 1,6A-6EQUAL APPORTIONMENT TECHNIQUE 1,6-13EXAMPLE USING DYNAMIC PROGRAMMING I,6A-5FEASIBILITY-OF-OBJECTIVES TECHNIQUE 1,6-18INTRODUCTION 1,6-12MAN/MACHINE INTERACTION 1,7-94MECHANICAL-ELECTRICAL SYSTEM 1,6-21MINIMIZATION OF EFFORT ALGORITHM 1,6-20PARALLEL REDUNDANT SYSTEMS I,10-76SUBSYSTEMS OPERATING IN SERIES I,6A-3
R&M ASSESSMENT, SYSTEM I, 11-95R&M DATA ITEMS
MAINTAINABILITY DIDS 1,12-80R&M DIDS 1,12-78RELIABILITY DIDS 1,12-78SOFTWARE QUALITY ASSURANCE DIDS 1,12-81
R&M DEGRADATION DURING FIELD OPERATION, CONTRIBUTING FACTORS I,11-84R&M DIDS 1,12-78R&M IMPROVEMENT, SYSTEM 1,11-97R&M MANAGEMENT 1,12-1
COMPUTER SOFTWARE R&M CONSIDERATIONS 1,12-65INTRODUCTION 1,12-1MAINTAINABILITY CONSIDERATIONS 1,12-41R&M DATA ITEMS 1,12-76R&M PLANNING AND BUDGETING 1,12-4R&M PROGRAM EVALUATION AND SURVEILLANCE 1,12-97R&M PROGRAM REQUIREMENTS BASED UPON THE TYPE OF PROCUREMENT 1,12-88RELIABILITY CONSIDERATIONS 1,12-27
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R&M MILESTONES VS. SYSTEM LIFE CYCLE PHASE 1,12-52R&M MANAGEMENT 1,12-1R&M PLANNING 1,12-4
CONCEPTUAL PHASE PLANNING 1,12-4CONCEPTUAL PHASE TRADEOFF STUDIES 1,12-22COST FACTORS AND GUIDELINES 1,12-7DEPLOYMENT PHASE PLANNING 1,12-7DESIGN-TO-COST PROCEDURES 1,12-11FEATURES OF CURRENT WARRANTY-GUARANTEE PLANS 1,12-20FULL SCALE ENGINEERING DEVELOPMENT PHASE PLANNING 1,12-6LIFE CYCLE COST (LCC) CONCEPTS 1,12-12LIFE CYCLE COST ACTIVITIES 1,12-13PRODUCT PERFORMANCE AGREEMENTS 1,12-14PRODUCTION PHASE PLANNING 1,12-7TRADEOFFS 1,12-22, 1,12-26TYPES OF DESIGN-TO-COST PROGRAMS 1,12-12TYPES OF PRODUCT PERFORMANCE AGREEMENTS 1,12-15VALIDATION PHASE PLANNING 1,12-5VALIDATION PHASE TRADEOFF STUDIES 1,12-25WARRANTY APPLICATION CRITERIA 1,12-21WARRANTY/GUAPANTEE PLANS 1,12-19
R&M PROGRAM AND TEST MATRIX 1,12-96R&M PROGRAM EVALUATION CRITERIA (CONTRACTOR SELECTION) 1,12-99R&M PROGRAM EVALUATION GUIDELINES 1,12-101R&M SYSTEM PARAMETERS I,10-15R&M TRADEOFF
ALTERNATIVE DESIGN CONFIGURATIONS I, 10-65GEOMETRY OF 1,10-119METHODOLOGY 1,10-123TECHNIQUES 1,5-73
RADAR SYSTEM HIERARCHY (PARTIAL LISTING) 1,6-28RADC ORACLE (OPTIMIZED RELIABILITY AND COMPONENT LIFE ESTIMATES) 1,6-51RADC RELIABILITY NOTEBOOK 11,1-5RAM - RELIABILITY ANALYSIS MODEL 1,6-55RATING 11,3-4RCA CDP 1802 11,5-69RDT&E DOLLAR CONVERSION INDICES, DOD I,10-117REACTION TIME 1,3-6RECTIFIERS 11,5-78REDUNDANCY 1,7-45, 11,3-4
ACTIVE 1,7-48ADAPTIVE MAJORITY LOGIC 1,7-50BIMODAL PARALLEL/SERIES 1,7-48BIMODAL SERIES/PARALLEL 1,7-48BIMODAL REDUNDANCY -- QUAD CONFIGURATION 1,7-61COMBINATIONS 1,7A-3COMPUTATIONS, PROBABILITY NOTATION FOR I,7A-3CONTINUOUS MONITORING 1,7A-43DEPENDENT FAILURE PROBABILITIES I,7A-36DESIGN EXAMPLES 1,7-58DESIGN, REDUNDANCY CONSIDERATIONS 1,7-49
DUPLEX 1,7-48EQUIPMENTS 1,5-20FAILURE MODES IN THE OPERATIVE REDUNDANT CASE I,7A-16FURTHER REDUNDANCY CONSIDERATIONS 1,7-73GATE CONNECTOR 1,7-50IN TIME DEPENDENT SITUATIONS 1,7-47INTERVAL MONITORING 1,7A-46
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LOAD-SHARING I,7A-7LEVELS I,7A-1MAJORITY VOTE REDUNDANCY 1,7-50, 1,7-65MULTIPLE REDUNDANCY I,7A-8NETWORK, SERIES-PARALLEL 1,7-46OPERATING 1,7-50, I,7A-7OPERATIVE OR ACTIVE REDUNDANT CONFIGURATIONS I,7A-8OPERATIVE REDUNDANCY, SWITCHING REQUIRED I,7A-25OPTIMUM ALLOCATION OF REDUNDANCY I,7A-39OPTIMUM NUMBER OF PARALLEL ELEMENTS I,7A-18PARALLEL ELEMENTS I,7A-18PARALLEL REDUNDANCY 1,7-45PARALLEL-SERIES ELEMENTS I,7A-24PARTIAL REDUNDANCY 1,5-21, 1,7A-9PROBABILITY NOTATION FOR REDUNDANCY COMPUTATIONS I,7A-3REDUNDANCY COMBINATIONS 1,7A-3REDUNDANCY-WITH-REPAIR I,7A-8, I,7A-42SERIES ELEMENTS 1,7A-21SERIES-PARALLEL ELEMENTS I,7A-22SERIES-PARALLEL NETWORK 1,7-46SIMPLE PARALLEL REDUNDANCY 1,7-58STANDBY REDUNDANCY 1,7-48, 1,7-49, 1,7-50, 1,7-69, I,7A-8, I,7A-34STATES OF OPERATION OF A THREE PARALLEL ELEMENT CIRCUIT I,7A-32STATES OF OPERATION OF A THREE PARALLEL ELEMENT CIRCUIT I,7A-32SWITCHING I,7A-7
TECHNIQUES 1,7-48TECHNIQUES 1,7-49THREE PARALLEL ELEMENTS I,7A-30TIME DEPENDENT CONSIDERATIONS I,7A-5TRADE-OFF PROCESS 1,7-56TWO PARALLEL ELEMENTS I,7A-28TYPES AND CLASSIFICATIONS OF REDUNDANCY I,7A-7VOTING REDUNDANCY I,7A-32, I,7A-8WITH REPAIR 1,7-53, I,7A-42WITH REPAIR, OPERATIVE I,7A-44WITH REPAIR, STANDBY I,7A-45WITH SWITCHING 1,7-54WITH SWITCHING I,7A-29
REDUNDANTARRAY I,7A-10, I,7A-14, I,7A-17CIRCUIT SWITCHED GROUND 1,7-137CONFIGURATION OF N = 3 ELEMENTS, WITH K = 2 REQUIRED FOR SUCCESS I,7A-12CONFIGURATION, LOAD-SHARING I,7A-40CONFIGURATIONS 1,7A-12CONFIGURATIONS RESULTING FROM ALLOCATION STUDY I,7A-41CONFIGURATIONS WITH SWITCHING, THREE-ELEMENT I,7A-31RF RECEIVER CHANNELS 1,7-74SYSTEM AVAILABILITY 1,10-32SYSTEMS 1,5-21, 1,10-28TRANSISTOR CIRCUIT, QUAD 1,7-64, 1,7-66VOLTAGE REGULATOR SUPPLY 1,7-60, 1,7-62
REDUNDANT VS NONREDUNDANT CONFIGURATION 1,7-70REFERENCED DOCUMENTS 1,2-1, II,2-1REFERENCES
DESIGN GUIDELINES 1,7-162ELECTRO OPTICS/FIBER OPTICS 11,5-214FAILURE REPORTING AND ANALYSIS II,9-18HISTORY OF COMPONENT RELIABILITY 11,1-12, 11,1-35
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MICROCIRCUITS II,5-74PRINTED CIRCUITRY II,5-220PRODUCTION AND USE (DEPLOYMENT) R&M 1,11-101R&M MANAGEMENT CONSIDERATIONS 1,12-113RELAYS 11,5-184RELIABILITY AND MAINTAINABILITY THEORY 1,5-78RELIABILITY DATA COLLECTION AND ANALYSIS, DEMONSTRATION, AND GROWTH 1,8-111RELIABILITY SPECIFICATION, ALLOCATION AND PREDICTION 1,6-71SOFTWARE RELIABILITY 1,9-43STANDARD ELECTRONIC MODULE (SEM) PROGRAM 11,5-223SYSTEM EFFECTIVENESS 1,4-20SYSTEMS RELIABILITY ENGINEERING 1,10-132
REGULATED VOLTAGE SUPPLY 1,7-59REJECT-ACCEPT CRITERIA 1,11-55RELATIVE FAILURE RATE DIFFERENCES 11,7-6RELAY
DRIVERS 1,7-38FAILURE RATES II,A-2MIL SPECIFICATIONS II,5-177SELECTION CRITERIA 11,5-177
RELAYS II,A-2, 11,5-175APPLICATION CONSIDERATIONS II,5-177DERATING 11,5-178DEVICE SELECTION II,5-175ELECTROMECHANICAL RELAY 11,5-181ENVIRONMENT 11,5-178INTRODUCTION 11,5-175LOADS 11,5-178MECHANICAL, DIRECT CURRENT ARC SUPPRESSION TECHNIQUES 11,5-180MECHANICAL, EFFECT OF CURRENT ON OPERATING LIFE 11,5-179PART SELECTION AND CONTROL 11,5-175REFERENCES 11,5-184RELAY SELECTION CRITERIA 11,5-178, 11,5-176SOLID STATE RELAYS 11,5-181
RELIABILITY 1,3-8, 1,4-I, 1,4-8, 1,10-58, 11,3-4RELIABILITY ACCEPTANCE TESTING I,11-50RELIABILITY ALLOCACATION 1,6-12, I,6A-1RELIABILITY APPORTIONMENT 1,6-12RELIABILITY DEFINITIONS 1,6-2, 1,6-10RELIABILITY DESIGN CHECKLIST I,7C-1RELIABILITY AND MAINTAINABILITY TASKS 1,5-1, 1,12-56, 1,12-57
AVAILABILITY THEORY 1,5-63INTRODUCTION 1,5-1MAINTAINABILITY THEORY 1,5-38R&M TRADE-OFF TECHNIQUES 1,5-73RELIABILITY THEORY 1,5-2
RELIABILITY AND QUALITY DURING SHIPMENT AND STORAGE 1,11-66, 1,11-81COMPONENT FAILURE MODES I, 11-69DATA COLLECTION AND ANALYSIS 1,11-83DEGRADATION I, 11-66FAILURE MODES ENCOUNTERED WITH I, 11-69PROTECTION METHODS 1,11-68STORAGE SERVICEABILITY STANDARDS 1,11-71STORAGE-INDUCED QUALITY DEFECTS I, 11-74
RELIABILITY BLOCK DIAGRAMDEPICTING REDUNDANCY AT VARIOUS LEVELS I,7A-2DEVELOPMENT AS DESIGN BECOMES KNOWN 1,6-30, 1,6-31OF HYPOTHETICAL ROCKET MOTOR FIRING CIRCUIT 1,7-127
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RELIABILITY COMPUTATION FROM 1,6-54TO FAULT TREE LOGIC DIAGRAMS 1,7-124, 1,7-125WITH REDUNDANT ELEMENTS 1,6-68
RELIABILITY CENTERED MAINTENANCE CONCEPT I,11-91RELIABILITY COMPARISON OF REDUNDANT AND NONREDUNDANT
CONFIGURATIONS 1,7-70IRF RECEIVER CHANNELS 1,7-74VOLTAGE SUPPLIES 1,7-62
RELIABILITY CONCEPTS 1,5-6RELIABILITY CONSIDERATIONS
ANALYSIS OF RELIABILITY TASK EMPHASIS 1,12-43COST EFFECTIVENESS INFLUENCES 1,12-40ELECTRONIC PARTS/CIRCUIT TOLERANCE ANALYSIS 1,12-36ENVIRONMENTAL STRESS SCREENING (ESS) 1,12-37FAILURE MODES, EFFECTS, AND CRITICALITY ANALYSIS (FMECA) 1,12-35FAILURE REPORTING, ANALYSES, AND CORRECTIVE ACTION SYSTEMS
(FRACAS) 1,12-34FAILURE REVIEW BOARD (FRB) 1,12-34MONITOR/CONTROL OF SUBCONTRACTORS AND SUPL-LIERS 1,12-34PARTS SELECTION/APPLICATION CRITERIA 1,12-36PRODUCTION RELIABILITY ACCEPTANCE TEST (PRAT) 1,12-39PROGRAM REVIEWS 1,12-34RELIA6ILITY CRITICAL ITEMS 1,12-37RELIABILITY DEVELOPMENT/GROWTH TESTING (RDGT) 1,12-37RELIABILITY MODE7ING 1,12-35RELIABILITY PREDICTION 1,12-35RELIABILITY PROGRAM ELEMENTS I,12-39
RELIABILITY PROGRAM PLAN 1,12-32RELIABILITY PROGRAM TASKS 1,12-31
RELIABILITY QUALIFICATION TEST (RQT) 1,12-39
RELIABILITY SPECIFICATION REQUIREMENTS 1,12-27
SATISFACTORILY PERFORMANCE LIMITS 1,12-30SNEAK CIRCUIT ANALYSES (SCA) 1,12-36
RELIABILITY CONTROL, PRODUCTION 1,11-3
RELIABILITY CRITICAL ITEMS 1,12-37
RELIABILITY DATA ANALYSIS 1,8-5ANALYTICAL METHOD EXAMPLE (WEIBULL DISTRIBUTION) 1,8-52
CENSORED DATA 1,8-28
CHI-SQUARE (2) TEST 1,8-54COMPARISON OF K-S ('D' TEST) AND 2 (CHI-SQUARE) TESTS 1,8-59
COMPUTATION OF EXPONENTIAL RELIABILITY FUNCTION 1,8-26COMPUTATION OF NORMAL RELIABILITY FUNCTION 1,8-28
CONFIDENCE INTERVAL 1,8-38CONFIDENCE LIMITS - EXPONENTIAL DISTRIBUTION 1,8-39
CONFIDENCE LIMITS - NORMAL DISTRIBUTION 1,8-35CONFIDENCE LIMITS AND INTERVALS 1,8-32
CONFIDENCE-INTERVAL ESTIMATES, BINOMIAL DISTRIBUTION 1,8-45
EXAMPLE OF DATA ON TIMES TO FAILURE OF 20 ITEMS 1,8-7
EXAMPLES OF GRAPHICAL METHODS 1,8-10
FAILURE DATA FOR TEN HYPOTHETICAL ELECTRONIC COMPONENTS 1, 8-19
GRAPHICAL METHODS 1,8-10
GRAPHICAL METHODS 1,8-6KOLMOROV-SMIRNOV (K-S) TEST 1,8-48
RANKING OF DATA 1,8-6
RELIABILITY FUNCTION (SURVIVAL CURVES) 1,8-19STATISTICAL ANALYSIS 1,8-16
THEORETICAL RELIABILITY PARAMETER DISTRIBUTION 1,8-47
TREATMENT OF FAILURE DATA 1,8-18
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RELIABILITY DATA COLLECTION AND ANALYSIS 1,8-1
RELIABILITY DEGRADATION DURING PRODUCTION - INFANT MORTALITY Ill-ll
RELIABILITY DEMONSTRATION 1,6-9, 1,8-i, 1,8-60, I,8A-1ACTUAL OPERATING CHARACTERISTIC CURVE 1,8-63
ATTRIBUTES AND VARIABLES 1,8-66
ATTRIBUTES DEMONSTRATION TESTS I,8A-1
ATTRIBUTES PLANS FOR LARGE LOTS I,8A-5
ATTRIBUTES PLANS FOR SMALL LOTS I,8A-1ATTRIBUTES SAMPLING USING MIL-STD-105 I,8A-10
BAYES SEQUENTIAL TESTS I,8A-45
DETERMINANTS OF SAMPLE SIZE 1,8-66
EXPONENTIAL DISTRIBUTION I,8A-36EXPONENTIAL DISTRIBUTION I,8A-15, I,8A-24FAILURE TRUNCATED TESTS I,8A-24FIXED SAMPLE AND SEQUENTIAL TESTS 1,8-66HYPOTHESIS TEST A 1,8-61HYPOTHESIS TEST B 1,8-62IDEAL OPERATING CHARACTERISTIC (OC) CURVE 1,8-62
INTERFERENCE DEMONSTRATION TESTS 1,8A-42
INTRODUCTION 1,8-60METHOD(S) 1,6-9MIL-STD-105 I, 8A-10NORMAL DISTRIBUTION I,8A-27
NORMAL DISTRIBUTION I,8A-32NORMAL DISTRIBUTION I,8A-17, I,8A-39NORMAL DISTRIBUTION 1,8-61OC CURVE CHARACTERISTICS 1,8-64
OPERATING CHARACTERISTIC CURVE 1,8-63PARAMETERIZATION OF RELIABILITY 1,8-67
POISSON APPROXIMATION METHOD 1,8A-7
SAMPLE MEAN 1,8-61SEQUENTIAL BINOMIAL TEST PLANS 1,8A-12
SEQUENTIAL TESTS 1,8A-36
SUMMARY 1,8-67TEST PLANS I,8A-1
TESTS DESIGNED AROUND SAMPLE SIZE 1,8-66TIME TRUNCATED DEMONSTRATION TEST PLANS I,8A-15
VARIABLES DEMONSTRATION TESTS I,8A-15
WEIBULL DISTRIBUTION 1,8A-21WEIBULL DISTRIBUTION I,8A-34
RELIABILITY DEMONSTRATION VS. RELIABILITY GROWTH TEST 1,8-109RELIABILITY DESIGN CHECKLIST I-7C
RELIABILITY DESIGN CONSIDERATIONS 11,5-1RELIABILITY DEVELOPMENT/GROWTH TESTING (RDGT) 1,12-37
RELIABILITY DIDS 1,12-78RELIABILITY ENGINEERING DESIGN GUIDELINES (SEE DESIGN GUIDELINES) 1,7-1
RELIABILITY FOR N STANDBY REDUNDANT ELEMENTS 1,7A-37RELIABILITY FUNCTION AND THEORETICAL EXPONENTIAL RELIABILITY FUNCTION 1,8-29
RELIABILITY FUNCTIONS 1,5-2, 1,5-8, 1,5-9, 1,8-23RELIABILITY FUNCTIONS FOR INTERVAL MONITORING AND REPAIR I,7A-47RELIABILITY FUNCTIONS FOR PARTIAL REDUNDANT ARRAY 1,7A-17RELIABILITY GAIN FOR REPAIR OF SIMPLE PARALLEL ELEMENT AT FAILURE 1,7-54RELIABILITY GROWTH 1,8-I, 1,8-68, 1,8-90, 1,8-97
AERONAUTICAL REQUIREMENTS 1,8-89APPLICATION EXAMPLE 1,8-77ASSESSMENT 1,8-105BASED ON SPECIFIC PROBLEM RESOLUTIONS 1,8-109BUDGET 1,8-101
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COMPARISON OF RELIABILITY GROWTH MODELS 1,8-79CONCEPT 1,8-69CURVE, EXAMPLE 1,8-95DUANE CHART WITH PLOT OF CURRENT MTBF 1,8-73EQUIPMENT CATEGORIES 1,8-81EVALUATING SYSTEM GROWTH POTENTIAL 1,8-100EVALUATING THE RELIABILITY STATUS 1,8-101INFORMATION SOURCES THAT INITIATE RELIABILITY GROWTH 1,8-94, 1,8-97INTRODUCTION 1,8-68, 1,8-90MANAGEMENT MODEL (ASSESSMENT) 1,8-94MANAGEMENT MODEL (MONITORING) 1,8-92MANAGEMENT PROGRAM 1,8-71MANAGEMENT OF THE RELIABILITY GROWTH PROCESS 1,8-92MIL-HDBK-189 1,8-92MODEL TYPES 1,8-99MODELING 1,8-71MODELS UTILIZED IN RELIABILITY GROWTH MANAGEMENT 1,8-98PARTIAL SYSTEM IMPROVEMENT 1,8-106PLANNING 1,8-71PLOT 1,8-72, 1,8-87PROCESS 1,8-70PROJECTIVE ASSESSMENT 1,8-108RELATIONSHIPS AMONG GROWTH INFORMATION SOURCES 1,8-96SYSTEM/EQUIPMENT DESCRIPTION 1,8-80TAILORING GROWTH MODELS 1,8-104
RELIABILITY GROWTH MODELS 1,8-99, I,8B-1
COMPARISON 1,8-79CONTINUOUS I,8B-5DISCRETE I,8B-1INTRODUCTION I,8B-1MODEL 01, LLOYD AND LIPOW (REF. 30) 1,8B-1MODEL 02, LLOYD AND LIPOW (REF. 30) I,8B-1MODEL 03, WOLMAN (REF. 31) 1,8B-2MODEL 04, BARLOW AND SCHEUER (REF. 39) I,8B-2MODEL 05, VIRENE (40) I,8B-2MODEL 06, BARLOW, PROSCHAN AND SCHEUER (REF. 34) I,8B-3MODEL 07, BARLOW, PROSCHAN AND SCHEUER (REF. 34) I,8B-3MODEL 08, SINGPURWALLA (REF. 35) I,8B-4MODEL 09, DUANE (REF. 16) I,8B-6MODEL 10, CROW (REF. 44) I,8B-7MODEL 11, LEWIS AND SHEDLER (45) I,8B-7MODEL 12, IBM MODEL, ROSNER (REF. 39) I,8B-7MODEL 13, EXPONENTIAL-SINGLE TERM POWER SERIES MODEL 1,8B-9MODEL 14, LLOYD AND LIPOW (REF. 30) I,8B-10MODEL 15, AROEF (REF. 41) I,8B-10MODEL 16, SIMPLE EXPONENTIAL MODEL I,8B-11POISSON PROCESSES I,8B-5
RELIABILITY GROWTH TESTING 1,8-85ECONOMICS OF RELIABILITY GROWTH TESTING 1,8-90IN TRODUCT ION I, v-V5MIL- STD-2068 1,8-88RELIABILITY GROWTH APPROACH 1,8-85WHEN RELIABILITY GROWTH TESTING IS PERFORMED 1,8-85
RELIABILITY IMPROVEMENT POTENTIAL AT REDUCED TEMPERATURES 11,6-6RELIABILITY IMPROVEMENT TECHNIQUES IN ELECTRONIC EQUIPMENT 1,7-87RELIABILITY IMPROVEMENT TECHNIQUES FOR ENVIRONMENTAL PROTECTION 11,6-1RELIABILITY IMPROVEMENT WARRANTY (RIW) 1,12-19, 11,9-10RELIABILITY LIFE CYCLE DEGRADATION AND GROWTH CONTROL 1,11-2
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RELIABILITY MAINTAINABILITY AVAILABILITY RELATIONSHIPS 1,10-60RELIABILITY MAINTAINABILITY TRADEOFFS 1,5-77, 1, 10-64RELIABILITY MODELING 1,12-35
COMBINED CONFIGURATION NETWORK 1,5-28
PARALLEL CONFIGURATION 1,5-27SERIES CONFIGURATION 1,5-26
SIMPLE STRUCTURES K-OUT-OF-N CONFIGURATION 1,5-30SIMPLE STRUCTURES PARALLEL CONFIGURATION 1,5-27
SIMPLE STRUCTURES SERIES CONFIGURATION 1,5-26
RELIABILITY PREDICTION 1,6-25, 1,12-35ALLOCATION PROCEDURE 1,6-57
APRDCT (APPORTIONMENT/PREDICTION) 1,6-54BAYESIAN INTERACTIVE GRAPHICS RELIABILITY ASSESSMENT
PROCEDURE (BIGRAP) 1,6-56COMPUTER SOFTWARE MANAGEMENT & INFORMATION CENTER (COSMIC) 1,6-53
COMPUTERIZED RELIABILITY PREDICTION METHODS 1,6-51
COSMIC 1,6-54, 1,6-55, 1,6-56ERSION 3 RELIABILITY GOAL STATUS 1,6-53
INTRODUCTION AND GENERAL INFORMATION 1,6-25
MATHEMATICAL MODELS FOR RELIABILITY PREDICTION 1,6-27MIL-HDBK-217 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT 1,6-37
MIL-STD-756 RELIABILITY MODELING AND PREDICTION 1,6-61
MINIMAL PATH AND MINIMAL CUT TECHNIQUES 1,6-55
NONEXPONENTIAL FAILURE DENSITIES (GENERAL CASE) 1,6-47
NONOPERATING FAILURE RATES 1,6-49
ORACLE 1,6-51PART COUNT TECHNIQUE 1,6-39PREDICTION BY FUNCTION TECHNIQUE 1,6-36
RADC ORACLE 1,6-51RAM - RELIABILITY ANALYSIS MODEL 1,6-55
RELIABILITY COMPUTATION FROM RELIABILITY BLOCK DIAGRAMS 1,6-54
SCOPE 1,6-54
SIMILAR COMPLEXITY TECHNIQUES 1,6-34
SIMILAR EQUIPMENT TECHNIQUES 1,6-33
SPARCS - 2 1,6-53STRESS ANALYSIS TECHNIQUE 1,6-41
SUMMARY OF COMPUTER PROGRAMS 1,6-52WORKSHEET FOR STRESS ANALYSIS 1,6-63
RELIABILITY PROGRAM ELEMENTS 1,12-38
RELIABILITY PROGRAM PLAN 1,12-32
RELIABILITY PROGRAM TASKS 1,12-31RELIABILITY QUALIFICATION TEST (RQT) 1,12-39RELIABILITY REQUIREMENTS 1,6-i, 1,6-3, 1,12-27RELIABILITY SCREENS 11,7-2
RELIABILITY SPECIFICATION 1,6-i, 1,6-4, 1,12-29, 1,12-43ALLOCATION AND PREDICTION 1,6-1
CLEAR DEFINITION OF FAILURE 1,6-7
DESCRIPTION OF METHOD(S) FOR RELIABILITY DEMONSTRATION 1,6-9ENVIRONMENT AND/OR USE CONDITIONS 1,6-5METHODS 1,6-4, i,-12-29
MIL-STD-210 CLIMATIC EXTREMES FOR MILITARY EQUIPMENT 1,6-5MIL-STD-781 RELIABILITY DESIGN QUALIFICATION AND PRODUCTION
ACCEPTANCE TESTS 1,6-3MISSION PROFILE 1,6-7RELIABILITY DEMONSTRATION 1,6-9RELIABILITY REQUIREMENTS 1,6-1REQUIREMENTS 1,12-27SPECIFYING THE RELIABILITY REQUIREMENT 1,6-1
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TIME MEASURE 1,6-7RELIABILITY TASK EMPHASISRELIABILITY TESTING OPTIONS 1,8-110RELIABILITY THEORY 1,5-2, 11,4-1
BASIC CONCEPTS 1,5-2BAYESIAN STATISTICS IN RELIABILITY ANALYSIS 1,5-32FAILURE MODELING 1,5-22MEAN TIME BETWEEN FAILURE (MTBF) 1,5-6MEAN TIME TO FAILURE (MTTF) 1,5-5RELIABILITY MODELING OF SIMPLE STRUCTURES 1,5-25STATISTICAL DISTRIBUTIONS USED IN RELIABILITY MODELS 1,5-7
RELIABLE CIRCUIT DESIGN 1,7-13RELIABLE COMPONENTS, NEED FOR II, 1-14RENEWAL PROCESS IN TERMS OF ROUNDS FIRED 1,10-39REPAIR RATES 1,5-40, 1,10-69REPAIR/EXCHANGE AGREEMENTS 1,12-15REPAIRABILITY 1,3-4, 9REPAIRABLE/REPLACEABLE UNITS 1,10-25REPLACEMENT ACTION 1,11-61REQUIREMENTS DEFINITION, SOFTWARE R & M 1,12-71RESISTORS 11,5-103, II,A-2
COMPARISON CHART 11,5-28COMPOSITION RESISTORS, GENERAL APPLICATION CONSIDERATIONS 11,5-112DERATING CURVES, MIL-SPECIFICATION II,5-119FAILURE RATES II,A-2FILM RESISTOR, GENERAL APPLICATION CONSIDERATIONS II,5-113FORM FACTORS AND PREFERRED RESISTANCE VALUE 11,5-111GENERAL APPLICATION DATA II,5-108INTRODUCTION 11,5-103MIL-R-23285, RESISTANCE TAPERS 11,5-125MIL-R-39017, HIGH FREQUENCY OPERATION 11,5-134MOUNTING II,5-108MOUNTING TECHNIQUES II,5-31PARAMETER CHANGE WITH STRESS AND TIME 1,7-29PARAMETER CHANGE WITH TIME (TYPICAL) 1,7-26PART SELECTION AND CONTROL 11,5-103PRECISION, TEMPERATURE CONSIDERATIONS II,5-31SELECTION XI,5-103SELECTION CRITERIA 11,5-103SPECIAL APPLICATION CONSIDERATIONS 11,5-116TEMPERATURE EFFECTS 11,5-109USAGE AND SELECTION GUIDELINES II,5-104VARIABLE RESISTOR APPLICATIONS II,5-111WIREWOUND RESISTORS, GENERAL APPLICATION CONSIDERATIONS 11,5-114
REVIEW, DESIGN VERIFICATION 1,7-148REVIEW, RELIABILITY VERIFICATION 1,7-148REWARRANTY OF REPAIRED/OVERHAULED EQUIPMENT 1,12-15RIW (RELIABILITY IMPROVEMENT WARRANTY) II,9-10
SAFETY 11,3 4SAFETY, COMPONENT II, 1-14SAMPLE AND HOLD CIRCUIT II,5-41SAMPLE ENVIRONMENTAL TEST CYCLE 1,11-53SAMPLE PROCESS FLOW DIAGRAM 1,11-20SAMPLE RELIABILITY CALCULATION 1,6-43SAMPLE SIZE 1,8-66
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SAMPLING PLANS 11,4-15SAND AND DUST EFFECTS ON SWITCHES !1,5-192SAND AND DUST PROTECTION 1,7-81SATISFACTORY PERFORMANCE LIMITS 1,6-6, 1,12-30SAVE (SYSTEMS AVIONICS VALUE ESTIMATION) MODEL
FOR LOGISTIC SUPPORT COSTS 1,10-129SCHOTTKY BARRIER RECTIFIERS II,5-79SCOPE (SYSTEM FOR COMPUTING OPERATIONAL PROBABILITY EQUATIONS) 1,6-54SCR II,5-80SCR PROTECTION 1,7-22, 11,5-97SCREEN TEST EFFECTIVENESS I, 11-43SCREEN TESTING 1, 11-24, 1,11-25, 1, 11-27SCREEN TESTING WITHIN THE MANUFACTURING PROCESS 1,11-25SCREENING I, 11-22
AT MODULE AND UNIT/SYSTEM LEVEL 1,11-29COST EFFECTIVENESS II,7-25GUIDELINES I,11-31GUIDELINES MATRIX 1,11-44, 1,11-46INTERCONNECTION DEFECTS I,11-40INTERMEDIATE LEVEL I,11-31METHODS COMPARISON 11,7-22MODEL I, 11-44RANDOM VIBRATIONS I, 11-27SEQUENCE-METHOD 5004-MIL-STD"883 11,7-25STRENGTH I, 11-31TEST COST FOR CLASS B DEVICES 11,7-26TEST EFFECTIVENESS I, 11-43TEST PLANNING I, 11-42
SCREENS, UNIT/EQUIPMENT AND SYSTEM LEVEL I, 11-40SECONDARY BREAKDOWN 11,5-82SELECTION AND USAGE GUIDE FOR CAPACITORS 11,5-146SELECTION AND USAGE GUIDE FOR CONNECTORS 11,5-194SELECTION AND USAGE GUIDELINES FOR MAGNETIC DEVICES II,5-170SELECTION CRITERIA
CABLES 11,5-208CAPACITOR 11,5-146CONNECTORS 11,5-194ELECTRON TUBES 11,5-207MAGNETIC DEVICES 11,5-169RELAYS 11,5-177RESISTOR II,5-103SEMICONDUCTORS 11,5-75SWITCHES 11,5-186
SELECTION GUIDELINES FOR SWITCHES II,5-187SELECTION GUIDELINES, MICROCIRCUITS II,5-12SELECTION-FUNCTION GUIDE FOR RELAYS II,5-176SEM PROGRAM 1,7-18, 11,5-222SEMICONDUCTOR
CLASSES 11,1-19DEVICE MATERIALS AND PROCESSING II, 1-20DEVICES,CLASSES II, 1-18FABRICATION II, 1-20SELECTION CRITERIA Ii,5-75TECHNOLOGY AND MATERIALS 11,1-21, 11,1-18
SEMICONDUCTORS (SEE DISCRETE SEMICONDUCTOR DEVICES) ii,5-75SEQUENTIAL BINOMIAL TEST PLANS 1,8A-12SEQUENTIAL TESTS 1,8-66, I,8A-36SERIES
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CONFIGURATION MODELING 1,5--26ELEMENTS I,7A-21SYSTEM BLOCK DIAGRAM 1,5-74SYSTEM BLOCK DIAGRAM 1,10-27SYSTEM BLOCK DIAGRAM 1,10-67
SERIES-PARALLEL CONFIGURATION I,7A-4, I,7A-23SERIES-PARALLEL ELEMENTS I,7A-22SERIES-PARALLEL REDUNDANCY NETWORK 1,7-46SERVICEABILITY 1,3-4,SHIELDING 11,5-25SHIELDING, MAGNETIC DEVICES II,5-173SHIPMENT AND STORAGE RELIABILITY AND QUALITY I, 11-66SHIPMENT AND STORAGE, PROTECTIVE CONTROL 1,11-70SHOCK AND VIBRATION EFFECTS ON SWITCHES 11,5-192SHOCK AND VIBRATION PROTECTION 1,7-8, 1,7-78SIGNATURE GENERATING ALGORITHM, TYPICAL II,7-34SILICON 11, 1-31SILICON CONTROLLED RECTIFIERS II,5-80SIMILAR COMPLEXITY TECHNIQUES 1,6-27, 1,6-34SIMILAR EQUIPMENT TECHNIQUES 1,6-27, 1,6-33SIMPLE EXPONENTIAL MODEL, RELIABILITY GROWTH MODELS I,8B-11SIMPLE PARALLEL REDUNDANCY I,7A-11SIMPLIFIED SPECIFICATION MODEL 1,9-27SINGLE UNIT AVAILABILITY WITH REPAIR 1,5-71SINGPURWALLA, RELIABILITY GROWTH MODELS 1,8B-4SMALL LOTS, ATTRIBUTES DEMONSTRATION TEST PLANS I,8A-1SNEAK CIRCUIT ANALYSES (SCA) 1,7-132, 1,7-137, 1,12-36
CLUE APPLICATION 1,7-140DIGITAL 1,7-134DIGITAL SNEAK CIRCUIT ANALYSIS 1,7-134HARDWARE/SOFTWARE SNEAK ANALYSIS INTEGRATION 1,7-143INTRODUCTION AND GENERAL DESCRIPTION 1,7-132NETWORK TREE PRODUCTION 1,7-139OTHER TECHNIQUES 1,7-134OTHER TECHNIQUES 1,7-134SNEAK CIRCUIT CATEGORIES 1,7-134SNEAK CIRCUIT METHODOLOGY 1,7-139SNEAK INDICATION 1,7-139SNEAK LABEL 1,7-139SNEAK PATH 1,7-136SNEAK PATH ANALYSIS 1,7-134SNEAK PATH, ENABLE 1,7-136SNEAK PATH, INHIBIT 1,7-136SNEAK TIMING 1,7-136SOFTWARE SNEAK PATH ANALYSIS 1,7-134, 1,7-140SUMMARY 1,7-145TOPOLOGICAL PATTERN IDENTIFICATION 1,7-140
SNEAK CIRCUIT CATEGORIES 1,7-134SNEAK CIRCUIT METHODOLOGY 1,7-139SNEAK CIRCUITS 1,7-138SNEAK EXAMPLE, SOFTWARE 1,7-144SNEAK INDICATION 1,7-139SNEAK LABEL 1,7-139SNEAK PATH ANALYSIS 1,7-134SNEAK PATH ANALYSIS OF SOFTWARE 1,7-134, 1,7-140SNEAK PATH ENABLE 1,7-136SNEAK PATH INHIBIT 1,7-136SNEAK PATH 1,7-136
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SNEAK TIMING 1,7-136SOFTWARE DEVELOPMENT PROGRAM ELEMENTS 1,12-70SOFTWARE ERROR 1,9-10SOFTWARE FAILURE DATA 1,9-26SOFTWARE FAILURE DATA ANALYSIS AND DECISION-MAKING FLOWCHART 1,9-38SOFTWARE FAILURE DATA ANALYSIS, PROCEDURE OF 1,9-37SOFTWARE LIFE CYCLE COST BREAKDOWN STRUCTURE 1,10-105SOFTWARE LIFE CYCLE DOCUMENTATION 1,9-34SOFTWARE QUALITY ASSURANCE DIOS 1,12-81SOFTWARE RELIABILITY A GENERAL METHODOLOGY FOR SOFTWARE
FAILURE DATA ANALYSIS 1,9-37SOFTWARE RELIABILITY 1,9-1, 1,9-43, 1,12-65
ACCEPTANCE TEST 1,12-73APPROACHES FOR ENHANCING SOFTWARE RELIABILITY 1,9-27BINOMIAL MODEL 1,9-21BROWN & LIPOW MODEL 1,9-21CHIEF PROGRAMMER TEAM ORGANIZATIONAL STRUCTURE 1,9-40COMBINATORIAL MODELS 1,9-16COMPUTATIONAL ERRORS 1,9-13CONFIGURATION CONTROL 1,9-41DATA BASE SPECIFICATION 1,9-36DATA REQUIREMENTS DOCUMENTS 1,9-35DATA SYSTEM 1,12-75DESIGN REVIEW KIT 1,9-41DESIGN, CODE AND DEBUG 1,12-72DOCUMENTATION WITHIN THE SOFTWARE LIFE CYCLE 1,9-34DOMAIN ERRORS 1,9-12EXAMPLES OF CALCULATIONS USING SOFTWARE RELIABILITY MODELS (REF. 5) 1,9-21FAILURE RATE BASED MODELS, ASSUMPTIONS 1,9-16FAILURE-RATE BASED SOFTWARE RELIABILITY MODELS 1,9-15FUNCTIONAL REQUIREMENTS DOCUMENT 1,9-35GOEL NHPP MODEL (REF. 18) 1,9-24HE MILLS MODEL 1,9-22HIGH LEVEL HIPO CHART 1,9-30INPUT DOMAIN BASED MODELS 1,9-16INTRODUCTION 1,9-i, 1,12-65LITTLEWOOD MODELS 1,9-23LOGIC ERRORS 1,9-13MANAGEMENT 1,9-39MILL'S HYPERGEOMETRIC (ERROR SEEDING) MODEL 1,9-20MODELS 1,9-14MODELS, EXAMPLES OF CALCULATIONS USING 1,9-21MODELS, FAILURE-RATE BASED 1,9-15, 1,9-17MODULAR PROGRAMMING 1,9-31NON-FAILURE RATE BASED MODELS, ASSUMPTIONS 1,9-20NON-TERMINATION ERRORS 1,9-13OPERATIONS MANUAL 1,9-36ORGANIZATION 1,9-39PACKAGE DESIGN 1,12-72PACKAGE INTEGRATION AND TEST 1,12-73PERFORMANCE ERRORS 1,9-14PROGRAM MAINTENANCE MANUAL 1,9-36PROGRAM PLAN 1,12-73PROGRAM PROVING 1, 9-11PROGRAM REVIEW 1,12-75PROGRAM SPECIFICATION 1,9-36PROGRAM TESTING 1,9-i, 1,9-33PROGRAMMING 1,9-31
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PROVISIONS, TECHNIQUES AND TOOLS 1,12-69REQUIREMENTS DEFINITION 1,12-71RUNTIME ERRORS 1,9-2SEMANTIC ERRORS 1 1,9-2SIMPLIFIED SPECIFICATION MODEL 1,9-27SOFTWARE DESIGN 1,9-28SOFTWARE ERROR CLASSIFICATION 1,9-11SOFTWARE ERRORS AND THEIR SOURCES 1,9-8SOFTWARE FAILURE DATA 1,9-26SOFTWARE RELIABILITY PROVISIONS, TECHNIQUES AND TOOLS 1,12-69SOFTWARE RELIABILITY TOOLS AND TECHNIQUES 1,12-68SPECIFICATION ERRORS 1,9-13SPECIFICATIONS 1,9-27, 1,12-74STRUCTURED PROGRAMMING 3 1,9-iSTRUCTURED PROGRAMMING CONSTRUCTS 1,9-32STRUCTURED WORKTHROUGH PROCEDURE 1,9-41SUMMARY OF FAILURE RATE BASED MODELS 1,9-17SYNTAX ERRORS 1,9-11SYSTEM ANALYSIS 1,12-71SYSTEM INTEGRATION AND TEST 1,12-73
SYSTEM/SUBSYSTEM SPECIFICATION 1,9-35TECHNICAL MANUALS 1,12-76TEST ANALYSIS REPORT 1,9-36TEST PATH TRACING 1,9-33TEST PLAN 1,12-75TEST PLAN 1,9-36THE MUSA MODEL 1,9-21THE SOFTWARE PROBLEM 1,9-3USERS MANUAL 1,9-36
SOFTWARE SNEAKANALYSIS 1,7-140EXAMPLE 1,7-144PATH ANALYSIS 1,7-134, 1,7-140INHIBIT 1,7-143MESSAGE 1,7-143OUTPUT 1,7-143TIMING 1,7-143
SOFTWARE TOPOGRAPHS 1,7-142SOLDER AND FLUX II,5-218SOLDERING 11,5-218SOLID TANTALUM CAPACITORS, FAILURE MECHANISM ANALYSIS II,8-11SOWS ELEMENT CONTENT 1,10-100SPARCS - 2 (SIMULATION PROGRAM FOR ASSESSING THE RELIABILITY
OF COMPLEX SYSTEMS) 1,6-53SPARES PROVISIONING
DIGITAL PWB QUANTITIES II,8-19DISTRIBUTION OF TIMES TO REPAIR II,8-24MARKOV-PROCESS II,8-25OVERLAP REGION OF Dl AND D2 11,8-23RADAR M.INT ASSEMBLIES ii,8-19REPAIR LINE COMMITMENTS II,8-22SERVICING POLICY ii,8-20SERVICING POLICY II,8-21SUPPLY PIPELINE II,8-29TRAFFIC PATTERN AND STOCK LEVEL II,8-28TRANSITION MATRIX II,8-26
SPECIFICATION FOR A PERMISSIBLE PREVENTIVE MAINTENANCE DOWNTIME 1,12-47SPECIFICATION FOR UNINTERRUPTED OPERATIONAL CAPABILITY WITHOUT PM 1,12-48
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SPECIFICATIONS AND STANDARDS 1,2-1, 11,2-1DOD-C-85045 CABLES, FIBER OPTICS, GENERAL SPECIFICATIONS 11,5-212DOD-HDBK-263 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK 1,7-18DOD-STD-1678 FIBER OPTICS TEST METHODS !1,5-212DOD-STD-1678 FIBER OPTICS 2EST METHODS AND
INSTRUMENTATION 11,5-212, 11,5-213DOD-STD-1686 ELECTROSTATIC DISCHARGE CONTROL PROGRAM 1,7-18EIA STANDARD RS-455 AND ADDENDUMS 11,5-213FEDERAL 11,2-1HANDBOOKS 11,2-12IPC-CF-150 COPPER FOIL FOR PRINTED WIRING APPLICATION 11,5-216IPC-T-50 TERMS AND DEFINITIONS FOR INTERCONNECTING
AND PACKAGING ELECTRONIC CIRCUITS 11,5-216, 11,5-217MIL-C-10950, CAPACITORS, FIXED, MICA DIELECTRIC, BUTTON STYLE
(STYLE CB) 11,5-147, 11,5-158MIL-C-11015, CAPACITORS, FIXED, CERAMIC DIELECTRIC (GENERAL PURPOSE)
(STYLE CK) 11,5-148, 11,5-158MIL-C-11272 GLASS DIELECTRIC INACTIVE FOR NEW DESIGN.
USE MIL-C-23269 II,5-147MIL-C-12889 BYPASS RADIO-INTERFERENCE II,5-148MIL-C-14409 CAPACITORS, VARIABLE (PISTON TYPE, TABULAR TRIMMER),
(STYLE PC) 11,5-152, 11,5-158MIL-C-15305 COIL, FIXED AND VARIABLE, RF,
GENERAL SPECIFICATION FOR 11,5-171, 11,5-169MIL-C-18312 METALLIZED PAPER II,5-148MIL-C-19978, CAPACITORS, FIXED, PLASTIC (OR PAPER-PLASTIC),
DIELECTRIC 11,5-148, 11,5-159MIL-C-20, CAPACITORS, FIXED, CERAMIC DIELECTRIC 11,5-149, 11,5-157MIL-C-21097 CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD,
GENERAL PURPOSE 11,5-198, 11,5-215MIL-C-22992 NONREMOVAL SOLDER CLASS C CONTACTS 11,5-196MIL-C-23183, CAPACITORS, FIXED OR VARIABLE, GAS OR VACUUM DIELECTRIC,
CERAMIC, CERAMIC OR GLASS ENVELOPE (STYLE CG) II,5-160MIL-C-23269, CAPACITORS, FIXED, GLASS DIELECTRIC, ESTABLISHED
RELIABILITY (STYLE CYR) 11,5-147, 11,5-161MIL-C-24308 MINIATURE RECTANGULAR CONNECTORS 20 OR 22D II,5-196MIL-C-25 CAPACITOR, PAPER, TYPE CP 11,5-148MIL-C-26482 ENVIRONMENT RESISTING, QUICK DISCONNECT,
MINIATURE, CIRCULAR ELECTRIC CONNECTORS 11,5-171, 11,5-195MIL-C-28731 RECTANGULAR ELECTRICAL CONNECTORS 11,5-197MIL-C-28748 STANDARD RECTANGULAR CONNECTORS II,5-197MIL-C-28804 HIGH DENSITY, POLARIZED CENTER JACKSCREW ENVIRONMENT
RESISTING CONNECTORS II,5-197MIL-C-3655 PLUG AND RECEPTACLE,ELECTRICAL COAXIAL,
CONNECTORS WEATHERPROOF 11,5-198MIL-C-38999 ELECTRICAL CONNECTORS 11,5-195MIL-C-39001, CAPACITORS, FIXED, MICA DIELECTRIC, ER (STYLE CMR) 11,5-161MIL-C-39003, CAPACITORS, FIXED(SOLID TANTALUM), ER (STYLE CSR) 11,5-161MIL-C-39006, CAPACITORS, FIXED, ELECTROLYTIC (NON-SOLID ELECTROLYTE)
TANTALUM, ESTABLISHED RELIABILITY(STYLE CLR) 11,5-150, 11,5-162
MIL-C-39010 COILS, RF , ER 11,5-170, 11,5-171MIL-C-39012 FLEXIBLE RADIO FREQUENCY CABLE AND COAXIAL
TRANSMISSION LINE CONNECTORS 11,5-198MIL-C-39014, CAPACITORS, FIXED, CERAMIC DIELECTRIC (GENERAL PURPOSE),
ESTABLISHED RELIABILITY (STYLE CKR) 11,5-149, 11,5-164MIL-C-39018, CAPACITORS, FIXED, (ALUMINUM OXIDE)
(STYLES CU AND CUR) 11,5-150, 11,5-164
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MIL-C-39022, CAPACITORS, FIXED, METALLIZED, PAPER PLASTIC FILM ORPLASTIC DIELECTRIC 11,5-151, 11,5-165
MIL-C-39024 TEST POINT 11,5-197MIL-C-3965 ELECTROLYTIC II,5-149MIL-C-5 MICA DIELECTRIC CM05 CM07 11,5-147MIL-C-5015 CONNECTORS, CYLINDRICAL 11,5-195MIL-C-55302 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND
ACCESSORIES 11,5-199, 11,5-216MIL-C-55363, CAPACITORS, CHIP, FIXED, TANTALUM,
ESTABLISHED RELIABILITY (STYLE CWR) 11,5-151, 11,5-165MIL-C-55514, CAPACITORS, FIXED, PLASTIC (OR METALLIZED PLASTIC)
DIELECTRIC, DC (IN NON-METAL CASES),ESTABLISHED RELIABILITY (STYLE CFR) 11,5-151, 11,5-166
MIL-C-55681, CAPACITORS, CHIP, MULTILAYER, FIXED, CERAMIC DIELECTRIC,ESTABLISHED RELIABILITY (STYLE CDR) 11,5-151, 11,5-166
MIL-C-62 ELECTROLYTIC (DRY) 11,5-149MIL-C-81, CAPACITORS, VARIABLE, CERAMIC DIELECTRIC
(STYLE CV) 11,5-151, 11,5-158MIL-C-81659 RECTANGULAR CONNECTORS SERIES 2 11,5-197MIL-C-83723 ENVIRONMENT RESISTING, CIRCULAR,
ELECTRICAL CONNECTORS II,5-196MIL-C-83733 MINIATURE RECTANGULAR CONNECTORS 11,5-197MIL-E-1, "ELECTRON TUBES, GENERAL SPECIFICATION FOR." 11,5-207MIL-F-14256 FLUX, SOLDERING, LIQUID (ROSIN BASE) II,5-217MIL-HDBK-217 RELIABILITY PREDICTION OF ELECTRONIC
EQUIPMENT 1,6-37, 11,5-9MIL-HDBK-246 PROGRAM MANAGERS' GUIDE FOR THE STANDARD
ELECTRONIC MODULES PROGRAM 11,5-222MIL-I-45208 INSPECTION SYSTEM REQUIREMENTS 1,11-6MIL-I-46058 INSULATING COMPOUND, ELECTRICAL (FOR COATING
PRINTED CIRCUIT ASSEMBLIES) 11,5-215MIL-M-28787 STANDARD ELECTRONIC MODULES,
GENERAL SPECIFICATION FOR 11,5-222MIL-P-11268(EL), "PARTS, MATERIALS AND PROCESSES USED
IN ELECTRONIC EQUIPMENT." 11,5-194MIL-P-13949 PLASTIC SHEET, LAMINATED METAL CLAD FOR
PRINTED WIRING II,5-215MIL-P-28809 PRINTED WIRING ASSEMBLIES 11,5-215MIL-P-50884 PRINTED WIRING FLEXIBLE, GENERAL SPECIFICATION FOR 11,5-215MIL-P-55110 PRINTED WIRING BOARDS 11,5-216MIL-P-81728 PLATING TIN-LEAD (ELECTRODEPOSITED) II,5-215MIL-Q-9859 QUALITY PROGRAM ELEMENTS 1,11-4MIL-R-10509 FILM SEE DATA ON MIL-R-55182 II,:5-104MIL-R-11 COMPOSITION, INACTIVE FOR NEW DESIGN. USE MIL-R-39008 II,5-104MIL-R-11804, RESISTORS, FIXED, FILM (POWER TYPE)
(STYLE RD, UNINSULATED) 11,5-104, 11,5-121MIL-R-12934, RESISTORS, VARIABLE, WIREWOUND, PRECISION
(STYLE RR) 11,5-106, 11,5-122MIL-R-18546, FIXED, WIREWOUND, (POWER TYPE, CHASSIS
MOUNTED) II,5-104, 11,5-123MIL-R-19, RESISTORS, VARIABLE, WIREWOUND (LOW OPERATING
TEMPERATURE) (STYLE RA) 11,5-106, 11,5-116MIL-R-22, RESISTORS, VARIABLE, WIREWOUND (POWER TYPE)
(STYLE RP) (UNENCLOSED) 11,5-106, 11,5-118MIL-R-22097, RE3ISTORS, VARIABLE, NONWIREWOUND (ADJUSTMENT TYPE)
(ST' E RJ) 11,5-107, 11,5-124MIL-R-22684 FIT.M (INSULATED) INACTIVE FOR NEW DESIGN.
USE MIL-R-39017 II,5-104
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MIL-R-23285, RESISTORS, VARIABLE, NONWIREWOUND
(STYLE RVC) 11,5-106, 11,5-125MIL-R-26, RESISTORS, FIXED, WIREWOUND (POWER TYPE)
(STYLE RW) 11,5-104, 11,5-119MIL-R-27208, RESISTORS, VARIABLE, WIREWOUND (ADJUSTMENT TYPE)
(STYLE RT) 11,5-107, 11,5-127
MIL-R-39002, RESISTORS, VARIABLE, WIREWOUND, SEMIPRECISION
(STYLE RK) 11,5-107, 11,5-128MIL-R-39005, RESISTORS, FIXED, WIREWOUND (ACCURATE) ESTABLISHED
RELIABILITY (STYLE RBR) 11,5-104, 11,5-129MIL-R-39007, RESISTORS, FIXED, WIREWOUND (POWER TYPE),
ESTABLISHED RELIABILITY (STYLE RWR) 11,5-104, 11,5-130MIL-R-39008, RESISTORS, FIXED, COMPOSITION (INSULATED)
ESTABLISHED RELIABILITY (STYLE RCR) 11,5-105, 11,5-131MIL-R-39009, RESISTORS, FIXED, WIREWOUND (POWER TYPE,
CHASSIS MOUNTED) ESTABLISHED RELIABILITY
(STYLE RER) 11,5-105, 11,5-132MIL-R-39015, RESISTORS, VARIABLE, WIREWOUND (LEAD SCREW
ACTUATED) ESTABLISHED RELIABILITY
(STYLE RTR) 11,5-107, 11,5-133MIL-R-39016, RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY,
GENERAL SPECIFICATION FOR 11,5-177MIL-R-39017, RESISTORS, FIXED, FILM (INSULATED), ESTABLISHED
RELIABILITY (STYLE RLR) 1,5-105, 11,5-134MIL-R-39023, RESISTORS, VARIABLE, NONWIREWOUND, PRECISION
(STYLE RQ) 11,5-136MIL-R-39035, RESISTORS, VARIABLE, NONWIREWOUND (LEAD-SCREW ACTUATED)
ESTABLISHED RELIABILITY (STYLE RJR) 11,5-107, 11,5-137MIL-R-55182, RESISTORS, FIXED, FILM, ESTABLISHED RELIABILITY
(STYLE RNR) 11,5-105, 11,5-139
MIL-R-55342, RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY 11,5-140
MIL-R-55432 RESISTORS, FILM, CHIP RM0502 II,5-105MIL-R-83401, RESISTOR NETWORKS, FIXED, FILM (STYLE RZ) 11,5-106, 11,5-141
MIL-R-93 RESISTORS, WIRE-WOUND INACTIVE FOR NEW DESIGN.
USE MIL-R-39005 II,5-104MIL-R-94, RESISTORS, VARIABLE, COMPOSITION (STYLE RV) 11,5-106, 11,5-120MIL-S-12285 SWITCH, THERMOSTATIC 11,5-186MIL-S-15291 SNAP ACTION 11,5-187
MIL-S-15743 SWITCHES, ROTARY, ENCLOSED 11,5-186MIL-S-18396 SWITCHES, METER AND CONTROL, NAVAL SHIPYARD 11,5-186
MIL-S-19500 SEMICONDUCTOR DEVICES,
GENERAL SPECIFICATIONS 1,7-6, 11,5-212, 11,5-76MIL-S-21604 SWITCHES, ROTARY, MULTIPOLE AND SELECTOR TYPE II,5-186MIL-S-22710 PRINTED CIRCUIT, THUMBWHEEL, IN-LINE, AND PUSHBUTTON II,5-187MIL-S-22885 PUSH-BUTTON ILLUMINAED II,5-185
MIL-S-24236 THERMOSTATIC 11,5-188MIL-S-24317 MULTISTATION 11,5-188MIL-S-28827 SWITCHES LIQUID, HERMETICALLY SEALED II,5-188MIL-S-3786 ROTARY SWITCHES LOW CURRENT II,5-18714U"-S-3950 TOGGLE SITCHES 11,5-187MIL-S-45743 SOLDERING, MANUAL TYPE, HIGH RELIABILITY,
ELECTRICAL, ELECTRONIC, INSTRUMENT, COMMUNICATIONAND RADAR FOR AEROSPACE 11,5-217
MIL-S-46844 SOLDER BATH SOLDERING OF PRINTED WIRING ASSEMBLIES II,5-217MIL-S-5423 SWITCHES TOGGLE, PUSH-BUTTON AND ROTARY II,5-187MIL-S-55433 REED SWITCHES 11,5-188MIL-S-6807 ROTARY SWITCHES SELECTOR II,5-187MIL-S-83502 ROUND, TO, PLUG-IN SOCKETS 11,5-199
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MIL-S-83505 INDIVIDUAL LEAD SOCKETS 11,5-199MIL-S-83734 PLUG-IN ELECTRONIC COMPONENT SOCKETS 11,5-199MIL-S-8805 PUSH SWITCHES 11,5-187MIL-S-8834 II,5-187MIL-S-9395 PRESSURE SWITCHES 11,5-187MIL-STD-105 SAMPLING PROCEDURES & TABLES FOR INSPECTION
BY ATTRIBUTES I,8A-10MIL-STD-1132, SWITCHES AND ASSOCIATED HARDWARE 11,5-4, 11,5-186MIL-STD-1286 TRANSFORMERS, INDUCTORS AND COILS,
SELECTION AND USE OF 11,5-169MIL-STD-1346, RELAYS, SELECTION AND USE OF 11,5-177MIL-STD-1353, SELECTION AND USE OF ELECTRICAL CONNECTORS 11,5-194MIL-STD-1378 REQUIREMENTS FOR EMPLOYING STANDARD
ELECTRONIC MODULES II,5-222MIL-STD-1389 DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES II,5-222
MIL-STD-1547, PARTS MATERIALS AND PROCESSES FOR SPACE ANDLAUNCH VEHICLES 11,5-76
MIL-STD-1562, STANDARD MICROCIRCUITS, LISTS OF 11,5-4MIL-STD-1634 MODULE DESCRIPTION FOR THE SEM PROGRAM 11,5-222MIL-STD-198 CAPACITORS, SELECTION AND USE OF 11,5-4, 11,5-146MIL-STD-199 RESISTORS, SELECTION AND USE OF 1,5-104, 11,5-4, 11,5-111MIL-STD-200, "ELECTRON TUBES, SELECTION OF." II,5-207MIL-STD-202 TEST METHODS FOR COMPONENT PARTS 11,1-26, 11,5-4MIL-STD-210 CLIMATIC EXTREMES FOR MILITARY EQUIPMENT 1,6-5, 1,7B-1MIL-STD-275 PRINTED WIRING FOR ELECTRONIC EQUIPMENT II,5-216MIL-STD-454, STANDARD GENERAL REQUIREMENTS FOR ELECTRONIC
EQUIPMENT 11,5-177, 11,5-186, 11,5-194, 11,5-207,11,5-208, 11,5-216, 11,5-217
MIL-STD-701, STANDARD SEMICONDUCTOR DEVICES, LISTS OF 11,5-4, 11,5-76
MIL-STD-750 TEST METHODS FOR SEMICONDUCTOR DEVICES 11,1-27, 11,5-76MIL-STD-756 RELIABILITY MODELING AND PREDICTION 1,6-61
MIL-STD-781 QUALIFICATION AND PRODUCTION ACCEPTANCE TESTS 1,6-3MIL-STD-785 RELIABILITY PROGRAM FOR SYSTEMS AND EQUIPMENT 1,12-33MIL-STD-883, TEST METHODS AND PROCEDURES FOR MICROELECTRONIC
DEVICES 11,1-27, 11,5-4MIL-STD-965, PARTS CONTROL PROGRAM 11,5-2MIL-T-21038 TRANSFORMERS, PULSE, LOW POWER, GENERAL
SPECIFICATION FOR 11,5-169, 11,5-171MIL-T-23648, THERMISTOR (THERMALLY SENSITIVE RESISTOR) INSULATED
(STYLE RTH) 11,5-107, 11,5-143MIL-T-27 TRANSFOPMERS AND INDUCTORS, AUDIO, POWER AND HIGH POWER PULSE,
GENERAL SPECIFICATION FOR 11,5-169, 11,5-170MIL-T-55631 TRANSFORMERS, IF, RF, AND DISCRIMINATOR,
GENERAL SPECIFICATION FOR 11,5-169, 11,5-171MIL-T-83720 TRANSFORMERS AND INDUCTORS, NONEXPLOSIVE,
GENERAL SPECIFICATION FOR 11,5-169MIL-T-83721 TRANSFORMERS, VARIABLE, POWER,
GENERAL SPECIFICATION FOR 11,5-169, 11,5-171MILITARY 11,2-1NAC TP-526 SEM PROGRAM MICROPROCESSOR APPLICATIONS HANDBOOK 11,5-22-NAC TP-528 SEM PROGRAM MEMORY APPLICArION HANDBOOK 11,5-222NAC TP-529 SEM THERMAL APPLICATION HANDBOOK II,5-222NAC TP-531 IN PROCESS MODULE DESCRIPTIONS HANDBOOK II,5-222NAC TP-532 SEM HARDWARE CATALOG 11,5-232NTIA-SP-79-4 OPTICAL WAVEGUIDE COMMUNICPTIONS GLOSSARY 11,5-214PROGRAM MODULE TESTING 11,5-222QQ-S-571 SOLDER, TIN ALLOY, TIN LEAD ALLOY, AND LEAD ALLOYS 11,5-217REPORT 393-2 SEM SYSTEMS APPLICATIONS REPORT II,5-212
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STANDARD RS-455 11,5-212WC-596 PLUG, RECEPTACLES AND CABLE OUTLET,
ELECTRICAL POWER CONNECTORS II,5-199SPECIFIED INTERMEDIATE LEVEL MAINTAINABILITY REQUIREMENTS 1,12-47SPECIFIED LIMITATION IN MAINTENANCE MANHOUR REQUIREMENTS 1,12-48SPEED/POWER CAPABILITIES OF DIGITAL TECHNOLOGIES 11,1-33
SPIKE PROBLEMS 1,7-36SSI-MSI LOGIC PERFORMANCE VS POWER 11,5-20STANDARD COMPONENTS AND CIRCUITS 1,7-16STANDARD COST FACTORS, TYPICAL 1,10-107STANDARD DEVIATION 11,4-3STANDARD ELECTRONIC MODULE (SEM) PROGRAM 1,7-18, 11,5-221
QUALITY AND RELIABILITY 11,5-223PART SELECTION AND CONTROL II,5-221REFERENCES 11,5-223
STANDARD ELECTRONIC MODULES, SELECTION AND USE CRITERIA 11,5-222STANDARD NORMAL CURVE AT Z, ORDINATES F(Z) I,5A-3STANDARD NORMAL DISTRIBUTION FUNCTION VALUES I,5A-1STANDBY REDUNDANCY I,7A-34, 1,7A-37, I,7A-38, 1,7-49, 1,7-69,STANDBY REDUNDANCY-WITH-REPAIR (CONTINUOUS MONITORING) I,7A-45STANDBY REDUNDANT TWO CHANNEL R RECEIVER 1,7-72STATE TRANSFORMATIONS FOR STAGES 1, 2, AND 3 I,6A-9STATISTICAL ANALYSIS INTRODUCTION 1,8-16STATISTICAL ANALYSIS 1,8-16STATISTICAL DISTRIBUTIONS 1,5-7STATISTICAL DISTRIBUTIONS USED IN MAINTAINABILITY MODELS 1,5-40
AIRBORNE FIRE CONTROL SYSTEM 1,5-13BINOMIAL DISTRIBUTION 1,5-17CALCULATIONS TO DETERMINE T' AND T 1,5-47COMPUTER EXAMPLE 1,5-14CONTINUOUS DISTRIBUTIONS 1,5-7DISCRETE DISTRIBUTIONS 1,5-17EXPONENTIAL APPROXIMATION 1,5-61EXPONENTIAL DISTRIBUTION 1,5-13, 1,5-59FATIGUE FAILURE 1,5-12GAMMA DISTRIBUTION 1,5-14LOGNORMAL DISTRIBUTION 1,5-12, 1,5-42MAINTAINABILITY FUNCTION M(T) 1,5-52MECHANICAL EQUIPMENT 1,5-11MEDIAN TIME TO REPAIR 1,5-52MICROWAVE TUBE 1,5-10MISSILE SYSTEM 1,5-15MTTR (MEAN TIME TO REPAIR) 1,5-52NORMAL (OR GAUSSIAN) DISTRIBUTION 1,5-7NORMAL DISTRIBUTION 1,5-56PERMISSIBLE NUMBER OF FAILURES 1,5-21POISSON DISTRIBUTION 1,5-20PROBABILITY DENSITY FUNCTION 1,5-46QUALITY CONTROL 1,5-18REDUNDAZT SYSTEM 1,5-21RELIABILITY 1,5-18RELIABILITY CALCULATIONS USING THE NORMAL DISTRIBUTION 1,5-10TIME TO REPAIR DATA 1,5-45WEIBULL DISTRIBUTION 1,5-16, 1,5-17
STATISTICAL QUALITY CONTROL II,4-14STEADY STATE AVAILABILITY 1,5-64STEP (STANDARDIZATION EVALUATION PROGRAM) 1,10-129STEP MTBF APPROXIMATION I, 11-17
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STIMULUS INPUT 1,7-93STORAGE FAILURE MODES 1,11-69, 11,8-13STORAGE FAILURE MODES ENCOUNTERED WITH ELECTRONIC COMPONENTS 11,8-3STORAGE LIFE (SHELF LIFFE) 11,3-5STORAGE SERVICEABILITY STANDARDS 1,11-72, 1,11-73STORAGE-INDUCED QUALITY DEFECTS 1,11-74STRESS ANALYSIS - RELIABILITY PREDICTION WORKSHEET 1,6-63
STRESS ANALYSIS TECHNIQUE 1,6-27, 1,6-41STRESS SCREENING GUIDELINES MATRIX I, 11-46
STRESS SCREENING MODEL REPRESENTATION OF THE PRODUCTION FLOW PROCESS 1,11-45STRESS-STRENGTH DISTRIBUTIONS AND UNRELIABILITY IN DESIGN 1,7-9STRESS-TEMPERATURE DERATING SCHEME 11,5-94STRUCTURED PROGRAMMING CONSTRUCTS 1,9-32
SUBSYSTEM REDUNDANCY I,7A-2SUBTRACTER AMPLIFIER ELIMINATES GROUND PROBLEMS 11,5-33SUCCESS COMBINATIONS IN TWO-ELEMENT LOAD-SHARING CASE I,7A-40SUMMARY OF COMPUTER PROGRAMS 1,6-52
SUPPLY DELAY TIME 1,3-6, 1,3-9SURFACE BREAKDOWN I,6-15SURVIVAL CURVES 1,8-19, 1,8-24SWITCH FAILURE RATES II,A-2SWITCHES 11,5-185, II,A-2
ACCELERATION 11,5-192ALTITUDE II,5-192APPLICATION CONSIDERATIONS II,5-189APPLICATION PRECAUTIONS II,5-192CHEMICAL ACTION OF SWITCH MATERIALS 11,5-191CONTACT LIFE 11,5-190CONTACT OPERATE AND BOUNCE TIMES 11,5-189CONTACT RATINGS II,5-189CONTACT RESISTANCE 11,5-190CONTACTS II,5-189DERATING II,5-193ENCLOSURES 11,5-189ENVIRONMENTAL CONSIDERATIONS II,5-191EXPLOSION RESISTANCE 11,5-192EXPOSURE TO LOW TEMPERATURE 11,5-191INSULATION RESISTANCE 11,5-191INTRODUCTION 11,5-185LIFE CYCLE 1,12-1LIFE OPERATIONS FOR TOTAL LIFE 11,5-191LOW LEVEL (DRY CIRCUIT) APPLICATIONS 11,5-191MOISTURE 11,5-192PART SELECTION AND CONTROL 11,5-185PRESSURE SWITCHES II,5-185SAND AND DUST 11,5-192SELECTION OF SWITCHES II,5-186SHOCK AND VIBRATION 11,5-192TEMPERATURE 11,5-191THE OSTATIC SWITCHES 11,5-185USAGE 11,5-186USAGE AND SELECTION GUIDELINES FOR SWITCHES 11,5-187VARIATIONS IN TEMPERATURE 11,5-191
SWITCHING EFFICIENCY 11,5-88SWITCHING REDUNDANCY 1,7-54SYMBOLIC LOGIC BLOCK DIAGRAM 1,7-104, 1,7-105, 1,7-115SYSTEM APPORTIONMENT FACTORS 1,6-16SYSTEM DESIGN REVIEW 1,9-27
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SYSTEM EFFECTIVENESS 1,3-1, 1,3-8, 1,4-12, 1,4-13, 1,10-1, 1,10-2AVAILABILITY I, 10-1CALCULATIONS 1,10-7CAPABILITY I,10-1COMPUTER PROGRAMS 1,10-52CONCEPTS 1,10-2DEPENDABILITY 1,10-I, 1,10-42EVALUATION 1,10-18FACTORS INFLUENCING SYSTEM EFFECTIVENESS 1,4-14OPTIMIZATION 1,4-16R/M CONSIDERATIONS 1,4-13SYSTEM R&M PARAMETERS 1,10-11THE AIR FORCE (WSEIAC) CONCEPT (REF. 2) 1,10-4THE ARINC CONCEPT 1,10-3THE NAVY CONCEPT 1,10-6TRADEOFF TECHNIQUES 1,10-56
SYSTEM EFFECTIVENESS MODELS 1,10-8SYSTEMS EFFECTIVENESS EVALUATION COMPUTER PROGRAM I,10-55SYSTEM ENGINEERING PROCESS 1,4-9SYSTEM MANAGEMENT ACTIVITIES 1,4-10SYSTEM PERFORMANCE VARIABLES AND ATTRIBUTES 1,6-10SYSTEM R&M MODELING 1,10-14
AVAILABILITY MODELS 1,10-19COMPUTER PROGRAMS, COMPLEX MODELS 1,10-52MISSION RELIABILITY AND DEPENDABILITY MODELS I, 10-41OPERATIONAL READINESS MODELS 1,10-43
SYSTEM R&M PARAMETERS 1,10-12, 1,10-11, 1,10-15AVAILABILITY 1,10-14,1, 10-15DEPENDABILITY I, 10-15DIRECT-MAINTENANCE-MANHOURS-PER-MAINTENANCE-ACTION (DMMH/MA) I, 10-15LOGISTIC SUPPORT COST 1,10-12MAINTENANCE MANPOWER COST 1,10-12MEAN-TIME-BETWEEN-DOWNING-EVENTS (MTBDE) 1,10-15MEAN-TIME-BETWEEN-MAINTENANCE-ACTIONS (MTBMA) 1,10-15MEAN-TIME-TO-RESTORE-SYSTEM (MTTRS) 1,10-15MISSION RELIABILITY 1,10-15MISSION SUCCESS 1,10-12MISSION-TIME-BETWEEN-CRITICAL-FAILURES (MTBCF) 1,10-15MISSION-TIME-TO-RESTORE-FUNCTIONS (MTTRF) 1,10-15OPERATIONAL READINESS 1,10-15READINESS OR AVAILABILITY 1,10-12
SYSTEM REDUNDANCY I,7A-2SYSTEM RELIABILITY
DEMONSTRATION I, 10-81PREDICTION I,10-81PROBLEM 1,4-2SPECIFICATION 1,10-81
SYSTEM RELIABILITY WITH STANDBY REDUNDANCY 1,7A-37SYSTEM RELIABILITY WITH OPERATIVE REDUNDANCY I,7A-12SYSTEM REQUIREMENTS REVIEW 1,9-27SYSTEM SPECIFICATION REQUIREMENTS FOR AVIONICS, MISSILE SYSTEM,
AND AIRCRAFT 1,6-11SYSTEMS RELIABILITY ENGINEERING 1,10-1
ALLOCATION OF AVAILABILITY, AND FAILURE AND REPAIR RATES I, 10-69COMPLEX MODELS 1,10-52COST CONSIDERATIONS 1,10-90INTRODUCTION I,10-1SYSTEM DESIGN CONSIDERATIONS I,10-86
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SYSTEM EFFECTIVENESS 1,10-1, 1,10-2SYSTEM R&M MODELING 1,10-14SYSTEM R&M PARAMETERS 1,10-11TRADEOFF TECHNIQUES 1,10-56
SYSTEMS USE CONDITIONS CHECKLIST II,7B-14
T
TABLE OF EFFORT FUNCTIONS I,6A-6TANTALUM FOIL CAPACITORS, FAILURE MECHANISM ANALYSIS II,8-12
TECHNICAL APPROACH TO STORAGE SERVICEABILITY STANDARDS 1,11-73
TEMP-CYCLE ENVIRONMENTAL PROFILE, PCB 1,11-37TEMPERATURE II,4-18
CONSTANT SCREEN 1,11-35CONSIDERATIONS FOR PRECISION RESISTORS 11,5-31CYCLING 1,11-36CYCLING SCREEN 1,11-35EFFECTS ON FAILURE RATE II,4-17EFFECTS, RESISTORS 11,5-109PROFILE 1,6-8PROTECTION 1,7-76RANGE 1,11-27RATE OF CHANGE 1,11-27
TEMPERATURE/FAILURE RATE RELATIONSHIP OF NPN TRANSISTORS 1,7-7TEST, ANALYZE AND FIX (TAAF) 1,8-69TEST CONDITIONING MATRIX (TAKEN FROM MIL-STD-781C) I, 11-52TEST EFFECTIVENESS, SCREENING I, 11-43TEST METHOD COMPARISON II,7-31TEST PATH TRACING 1,9-33TEST PLAN, SOFTWARE R & M 1,12-75TESTABILITY HAZARD 1,7-36TESTING OF ELECTRONIC PARTS Ii, 1-25TESTING OF LSI RANDOM LOGIC 11,7-32TEXAS INSTRUMENTS SBP 9989 II,5-70THE AVIONICS LABORATORY PREDICTIVE OPERATIONS AND SUPPORT (ALPOS)
COST MODEL 1,10-129THERMAL CIRCUIT OF A DISCRETE ELECTRONIC PART II,6-36THERMAL CIRCUIT OF A HEAT SINK II,6-37THERMAL CYCLE SCREENING I,11-27THERMAL EFFECTS ELECTRICAL CONNECTORS II,5-201THERMAL IMPACT ON RELIABILITY II,6-46THERMAL RESISTANCE 11,5-36THERMAL SCREENS, ASSEMBLY LEVEL DEFECT TYPES PRECIPITATED I, 11-40THERMAL SECONDARY BREAKDOWN (AVALANCHE DEGRADATION) II,6-14THERMAL SYSTEMS 1,7-76THERMAL SYSTEMS MANAGEMENT PROGRESS FLOW CHART II,6-47THERIALLY CONDUCTIVE COMPOUND USE II,6-42THERP (TECHNIQUE FOR HUMAN ERROR RATE PREDICTION) 1,7-100THICK FILM CIRCUITS I,1-23
THIN FILM CIRCUITS II,1-24
THREE PARALLEL ELEMENT CIRCUIT, STATES OF OPERATION 1,7A-32
THREE PARALLEL ELEMENTS I,7A-30
THREE-ELEMENT REDUNDANT CONFIGURATIONS WITH SWITCHING 1,7A-31
THREE-ELEMENT VOTING REDUNDANCY I,7A-33
TRIBOELECTRIC CHARGING 11,6-18
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THYRATRON II,B-1THYRISTORS II,5-80TI 9900A ii,5-70TIGER 1,10-54TIME CATEGORIES 1,3-9
ACTIVE TIME 1,3-9ADMINISTRATIVE TIME 1,3-10ALERT TIME 1,3-10CORRECTIVE MAINTENANCE TIME 1,3-10DELAY TIME 1,3-9DOWNTIME 1,3-9INACTIVE TIME 1,3-9MAINTENANCE TIME 1,3-9MISSION TIME 1,3-10MODIFICATION TIME 1,3-9NOT OPERATING TIME 1,3-10PREVENTIVE MAINTENANCE TIME 1,3-10REACTION TIME 1,3-10SUPPLY DELAY TIME 1,3-9UPTIME 1,3-9
TIME CONCEPTS, TIME RELATIONSHIPS (MIL-STD-721) 1,3-7TIME MEASURE 1,6-7TIME TEMPERATURE REGRESSION 11,5-77TIME TO FAILURE, RANKS AND PERCENTILES II,4-10TIME TO REPAIR 11,8-24TIME TO REPAIR DATA 1,5-45TIME TO REPAIR DISTRIBUTION 1,5-41, 1,12-46TIME TO REPAIR, MEAN 1,5-40TIME TO REPAIR, MEDIAN 1,5-40TOLERANCE ANALYSIS, ELECTRONIC PARTS/CIRCUIT 1,12-36TOPOGRAPHS, SOFTWARE 1,7-142TP-532 (NAC) SEM HARDWARE CATALOG 11,5-222TRADEOFFS, RELIABILITY-AVAILABILITY-MAINTAINABILITY 1,10-42TRADEOFF TECHNIQUES 1,10-56
ALTERNATIVE DESIGN TRADEOFF CONFIGURATIONS 1,10-65COST COMPARISON OF ALTERNATIVE DESIGN CONFIGURATIONS 1,10-65RELIABILITY - AVAILABILITY - MAINTAINABILITY 1,10-58
TRANSFERRED ELECTRON DEVICE (TED) II,5-92TRANSIENT AND OVERSTRESS PROTECTION 1,7-18TRANSIENT PROTECTION 1,7-18TRANSIENT STRESS 1,7-38TRANSISTOR MAXIMUM POWER DISSIPATION II,5-81TRANSISTOR MAXIMUM VOLTAGES 11,5-81TRANSISTOR PROTECTION 1,7-21, 11,5-96TRANSISTORS (SEE DISCRETE SEMICONDUCTOR DEVICES) 11,5-81TRANSISTORS (SILICON, NPN), STRESS/TEMPERATURE PLOT Ii, 6-28TRANSISTORS, ACTUAL CONSTANT JUNCTION TEMPERATURE CURVE 11,6-31TRAVELLING WAVE TUBES II,B-1TRENDS IN MINIATURIZATION II, 1-30TRIBOELECTRIC SERIES 11,6-19TROUBLESHOOTING I, 11-90TRUNCATED TESTS 1,8-44TTL (TRANSISTOR-TRANSISTOR-LOGIC) 1,7-35TTL PROTECTION 1,7-24, 11,5-99TWO PARALLEL ELEMENTS I,7A-28TWO-DIMENSIONAL PROJECTION OF AVAILABILITY SURFACE 1,10-120TWO-SIDED CONFIDENCE LEVEL, INTERVAL, AND LIMITS 1,8-37TWYSTRON (HYBRID TWT-KLYSTRON) II,B-1
52
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TYPICAL APPLICATIONS REQUIRING CAREFUL PRINTED CIRCUIT TECHNIQUES 11,5-35TYPICAL CHECKLIST FOR THE DESIGN REVIEW 1,7-160TYPICAL CIRCUIT ANALYSIS TECHNIQUES 1,7-34TYPICAL ITEMS TO BE COVERED IN A DESIGN REVIEW 1,7-157TYPICAL OPERATING CHARACTERISTIC CURVE 1,8-63TYPICAL OPERATING CHARACTERISTIC CURVE II,4-16TYPICAL OPERATIONAL SEQUENCE FOR AIRBORNE FIRE CONTROL SYSTEM I,6-8TYPICALPRODUCTION PROCESS I, 11-23TYPICAL SWITCHING WAVEFORMS 11,5-86
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UNAVAILABILITY CURVES 1,10-80UNRELIABILITY IN DESIGN 1,7-9, 1,7-1IUNRELIABILITY, FACTORS EFFECTING 1,7-12UNRELIABILITY FUNCTION 1,5-2UPPER TEST MTBF 1,6-3UPTIME 1,3-6, 1,3-9USAGE AND SELECTION GUIDELINES FOR RESISTORS 11,5-104USAGE AND SELECTION GUIDELINES FOR SWITCHES 11,5-187USEFUL 11,3-5
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VALIDATION PHASE PLANNING 1,12-5VALIDATION PHASE RELIABILITY AND MAINTAINABILITY DECISION POINTS 1,12-58VALIDATION PHASE RELIABILITY AND MAINTAINABILITY TASKS 1,12-57VALIDATION PHASE TRADEOFF STUDIES 1,12-25VALIDITY, TESTS FOR 1,8-47VAPOR PHASE SOLDERING II,5-218VARACTORS II,5-80VARIABILITY ANALYSIS METHODS 1,7-30VARIABLE RESISTORS II,5-111VARIATIONS DUE TO LIFE AND ENVIRONMENTS OVER SPECIFICATIONS II,5-172VARIOUS COOLING TECHNIQUES, LIMITATIONS II,6-39VERY HIGH SPEED INTEGRATED CIRCUITS (VHSIC) (1980) 1,1-29, 11,1-11VERY LARGE SCALE INTEGRATED CIRCUITS (VLSI) (1980) 1,1-29, 11,1-11VIBRATION SCREEN
ASSEMBLY LEVEL DEFECT TYPES PRECIPITATED I,11-40RANDOM I, 11-32SINGLE (FIXED) FREQUENCY I, 11-34SWEPT-SINE 1,11-33
VIRENE, RELIABILITY GROWTH MODELS I,8B-2VOLTAGE FOLLOWER CIRCUIT 11,5-39VOLTAGE REGULATOR II,5-42VOLTAGE REGULATOR SUPPLY, REDUNDANT 1,7-60, 1,7-62VOTING REDUNDANCY 1,7-68, I,7A-32VZAP 1,7-19
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WARRANTY 1,12-19WARRANTY APPLICATION CRITERIA 1,12-21WARRANTY/GUARANTEE PLANS 1,12-19
53
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WARRANTY OF SUPPLIES 1,12-1WARRANTY OF TECHNICAL DATA 1,12-1WAVE SOLDERING II,5-218WC-596 ELECTRICAL POWER CONNECTORS 11,5-199WEAROUT 11,3-5WEAROUT PERIOD 1,5-23WEAR OUT FAILURE DISTRIBUTION I,5-7WEIBULL DISTRIBUTION 1,5-16, I,8A-21,1,8A-34, 11,4-7WEIBULL DISTRIBUTION, EXAMPLE 1,8-52WEIBULL DISTRIBUTION, GRAPHICAL POINT ESTIMATION I, 8-15WEIBULL FAILURE RATE 1,8-76WEIBULL PLOT EXAMPLE 11,4-11WEIBULL PROBABILITY PAPER 11,4-8WEIGHTED RESISTOR NETWORK 11,5-45WEIGHTING CRITERIA TO DETERMINE RELATIVE PROGRAM EMPHASIS,
QUANTITATIVE EXAMPLE OF 1,12-39WIREWOUND RESISTORS 11,5-114WOLMAN, RELIABILITY GROWTH MODELS I,8B-2WORST CASE ANALYSIS 1,7-28WORST CASE METHOD OF VARIABILITY ANALYSIS 1,7-31WSEIAC 1,10-4
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ZILOG Z8 FAMILY 11,5-71ZILOG Z80 II,5-71ZILOG Z8000 FAMILY ii,5-71
54
ADDITIONAL RAC SERVICES
PROD UCT FEE SCHEDULEPrice Per CopyU.S. Non-U.S.
COMPONENT RELIABILITYDATABOOKS
DSR-4 Discrete Semiconductor Device Reliability - 1988 100.00 120.00NPRD-3 Nonelectronic Parts Reliability Data 1985 - (Printed Copy) 80.00 90.00FNPRD-3 Diskette of NPRD-3 Data (IBM PC Compatible) 125.00 135.00VZAP-2* Electrostatic Discharge Susceptibility Data - 1989 125.00 135.00FVZAP-2* Diskette of VZAP-2 Data (IBM PC Compatible) 185.00 195.00MDR-21 Trend Analysis Databook - 1985 95.00 105.00MDR-21A Field Experience Databook - 1985 125.00 135.00FMDR-21A Diskette of MDR-21A Data (IBM PC Compatible) 175.00 185.00MDR-22 Microcircuit Screening Analysis - 1987 125.00 135.00MDR-22A Microcircuit Screening Data - 1987 75.00 90.00NONOP-1 Nonoperating Reliability Data - 1987 150.00 160.00TOOLKIT RADC Reliability Engineer's ToolKit 10.00 20.00
*The complete set of VZAP-2 including the hard copy and diskette version 200.00 220.00
EQUIPMENT DATABOOKS
EERD-2 Electrric Equipment Reliability Data - 1986 80.00 95.00EEMD-1 Electronic Equipment Maintainability Data - 1980 60.00 70.00
HANDBOOKS
RDH-376 Reliability Design Handbook 36.00 46.00MFAT-1 Microelectronics Failure Analysis Techniques Procedural Guide 125.00 135.00NPS-1 Analysis Techniques for Mechanical Reliability 56.00 66.00PRIM-1 A Primer for DoD Reliability, Maintainability and Safety Standards 95.00 115.00
PRODUCTS FOR PERSONAL COMPUTERS
RAC-NRPS Nonoperating Reliability Prediction Software 1400.00 1450.00(Price includes NONOP-1 listed above)
STATE-OF-THE-ART REPORTS
SOAR-2 Practical Statistical Analysis for the Reliability Engineer 36.00 46.00SOAR-3 IC Quality Grades: Impact on System Reliability and Life Cycle Cost 46.00 56.00SOAR-4 Confidence Bounds for System Reliability 46.00 56.00SOAR-5 Surface Mount Technology: A Reliability Review 56.00 66.00SOAR-6 ESD Control in the Manufacturing Environment 56.00 66.00
TECHNICAL RELIABILITY STUDIES
TRS-2 Search and Retrieval Index to IRPS Proceedings - 1968 to 1978 24.00 34.00TRS-2A Search and Retrieval Index to IRPS Proceedings - 1979 to 1984 24.00 34.00TRS-3A EOS/ESD Technology Abstracts - 1982 36.00 46.00TRS-4 Search and Retrieval Index to EOS/ESD Proceedings - 1979 to 1984 36.00 46.00TRS-5 Search and Retrieval Index to ISTFA Proceedings - 1978 to 1985 36.00 46.00
ADDITIONAL RAC SERVICES
Literature SearchesLiterature Searches are conducted at a flat fee of $50. For best results, please call or write for assistance informulating your search question. An extra charge, based on engineering time and costs, will be made for evaluating,extracting or summarizing information from the cited references.
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Place orders or obtain additional information directly from the Reliabiity Analysis Center. Specify the publications and services desired. Lxzept for bilarjwpurchase orders, prepayment Is required. All Non-U.S. orders must be accompanied by a check drawn on a US bank. Please make ,;hecks payable toIITRIIRAC.
Priority Handling - Add $15.00 per book (Non-U.S.) for Air Mail, add $3.00 per book (U.S.) for First Class.
Quantity Discounts - are available, when ordering 10 or more copies. For details call or write Gina Iash at the Reliability Analysis Center, P.O. Box 4700, Rome,NY 13440.8200 (315) 330-4151.
Military Agencies. Blanket Purchase Agreement, DD Form 1155, may be used for ordering RAC reports and/or services. Please indicate maximum dollaramount authorized and cutoff date on your order. Also specify services (i.e., publications, search services, etc.) to be provided. Identify vendor as lITResearch Institute/Reliability Analysis Center.
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