Electronic Costing & Technology Experts€¦ · Freescale Rx/Tx/VCO 77GHz Radar Chipset ... –...

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Electronic Costing & Technology Experts

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March 2016 – Version 1 – Written by Stéphane ELISABETH

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Freescale Rx/Tx/VCO 77GHz Radar Chipset

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Glossary1. Overview / Introduction 4

– Executive Summary

– Observations

– Reverse Costing Methodology

2. Company Profile 8– NXP

– Freescale Radar Chips

– WLSCP & RCP

3. Physical Analysis 16– Synthesis of the Physical Analysis

– Module Analysis 18

– Module Views, Dimensions

– Redistributed Chip Package Analysis 21

– View, Dimensions & Marking

– Chipset package Overview

– RCP Cross-Section

– RCP redistribution Layer

– Summary of physical Data

– Rx Analysis – MR2001RVK die 38


– Die RF Main Blocks ID

– Die Delayering & Digital/Analog Main Blocks ID

– Rx Details Function

– Rx Module Overview – Buffer

– Tx Analysis – MR2001TVK die 51




– VCO Analysis – MR2001VVK die 58




– VCO Details Function – Frequency Divider

– Die Common Module Analysis 67

– State Machine Module Analysis

– SPI Module Analysis

– Voltage Regulation Analysis

– Die Cross-Section 72

– SiGe:C xHBT Transistor Cross-Section

– Resistors & Capacitors Cross-Section

– Process Characteristics

4. Manufacturing Process Flow 84– Chip Fabrication Unit

– RCP Fabrication Unit & Reconstitution Flow

5. Cost Analysis 96– Main steps of economic analysis

– Yields Hypotheses

– SiGe Die Cost Analysis 101

– SiGe Wafer Front-End Cost

– SiGe die Front-End Cost

– RCP Cost Analysis 106

– RCP Wafer Front-End Cost

– Component Cost

6. Estimated Price Analysis 113– Manufacturer Financial Ratios

– Estimated Selling Price

– Chipset Estimated Selling Price

7. Radar Chipset Comparison 117– Rx/Tx/VCO Comparison

– Package Comparison

– Cross-Section Chipset Comparison

Contact 127


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Freescale Rx/Tx/VCO Radar Chipset

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Module top view Module bottom view

Module Side View

6.0 mm

0.65 mm

6.0 mm

• Marking: PC33

MR2001RVK

• Package: RCP 85-ball (10x11 array)

• Dimensions: 6.0 x 6.0 x 0.65 mm

• Pin Pitch: 0.5 mm

• The four sides show the same shape. Two pieces of copper in the molding. It’s seems to be cut in the singularity step for the packaging. On-Board Side View


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimatescompleted by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on themanufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

Electronic Costing & Technology Experts€¦ · Freescale Rx/Tx/VCO 77GHz Radar Chipset ... –...

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