EDM Products Brochure Q107 v1

��

AEM envisions to be among the world’s Top 3 companies supplying world-class assembly, packaging

equipment, materials and services for the global microelectronic industry through our innovative people.

Coupled with the diverse experience of the management team and the investments into our manufacturing capacities and R&D innovations as well as the excellent collaborations with our strategic

customers and suppliers, we have now evolved into a one-stop total solution provider of a whole spectrum

of solutions ranging from advanced automated equipment, precision engineering products and materials to manufacturing services. Over the years, we have successfully developed World Class Products to meet

the dynamic challenges of the microelectronics industry and is well positioned to become a World Class

Company. AEM Headquarter, Singapore

AEM Platronics (S) Pte Ltd

Microcircuit Technology (S) Pte Ltd

AEM Microtronics (M) Sdn. Bhd AEM (Suzhou) Co. Ltd AEM (Tianjin) Co. Ltd

��

Substrates ManufacturingMicrocircuit Technology (S) Pte Ltd, a wholly-owned subsidiary of AEM Holdings Ltd, is pioneer in

advanced interconnects substrate manufacturing in Singapore. We provide total semiconductor solution

from substrate design to fabrication for prototype and high volume production.

AEM Platronics (M) Sdn. Bhd

Chemicals

We develop processes and associated chemical formulations

for surface finishing including deflashing, solder dipping and

plating for IC packages, connectors, base coil.

PlatingWe provide value-added manufacturing & plating services to the IC Manufacturing/SMT/Connector industries. We perform

re-packing and re-balling services in Tianjin - China.

With a well-equipped facility and huge capacity, we also provide quality Plating services to the leadframes and

connectors industries.

Distribution Offers a wide range of materials and products to the

semiconductor and general industries. Our key distribution products involves supplying engineering plastic stock shapes

and raw resins that we carry under established brand names

from Dupont, Quadrant and Victrex.plc.

��

Our unique capabilities are integrated to offer an effective

package of equipment, precision components, engineering materials, substrates manufacturing, chemicals and plating

services to our customers in semiconductor assembly, testing

and finishing.

Equipment Development & ManufacturingSpecializing in automated equipments for the semiconductor industry, providing needs for the assembly and end-of-line

operations. Key components are manufactured in our factory

which incorporate the latest technologies which are developed in-house or jointly with industry partners.Precision Engineering Offers a wide range of precision engineering parts that are

designed and manufactured in-house to support the assembly, testing and finishing processes. These encompass: Test

Sockets, Device Change Kit, Stiffeners and Precision Spare

Parts.

��

© Copyright 2007 AEM Singapore Pte Ltd

�� ! ��

" �#�$��!�� %#$& '�

AEM Singapore Pte Ltd specializes in providing total backend machine and solutions to the microelectronics

applications. In particular, the company has developed a wide range of application specifically machine

vision inspection systems, marking systems and lead conditioning system and many more.

We are the first supplier to develop an integrated system which combines four types of processes (Mark,

Lead inspection with conditioning and Tape & Reel) into a single machine.

Through material and process research our highly experienced engineers can adapt to all customer

specifications. With know-how and quality engineering, custom-made systems produced optimum

efficiency. The ultimate compact electromechanically design with its high throughput and small footprint

enhances an optimum cost of ownership.

Last but not least, the final analysis during the debugging stage guarantees customer satisfaction during

buy-off.

p. 2

�� (�%��(

52 Serangoon North Avenue 4, Singapore 555853T 65 6483 1811 F 65 6483 1321Email [email protected] http://www.aem-evertech.comCo. Reg No 199200632M

" �#�$�� "� %&

Wafer Sorter

Vision Inspection Systems

Laser Marking Systems

Lead Conditioning

Laser Deflash

Packaging

Wet process

Plating Systems

Deflash System (Wet process)

Backend Auto In-line System

)��&��

Optimus T-1100

• Fully automated of 3D vision inspection system

• High throughput up to 45,000 UPH

• In-pocket check

• 3D “On-The-Fly” lead ball/pad inspection

• Integrated with mark inspection module

• User-defined output: tray-to-tray or tray-to-tape Dual taper output

• Small footprint

• Solution for BGA, QFN, QFP packages (JEDEC thin trays)

DSR-400A

• Fully automated 3D vision inspection system

• Input/output in tube (stacked form)

• Integrated with mark, lead inspection and rework modules


• 3D lead inspection capability

- Pitch, lead, skew, span, spread, Co-line

• Capable of sorting devices into “Good”, “Mark reject”, “Lead

reject” & “Rework” modules

• Rework capabilities:

- Lead bent, Co-line, lead sweep, lead spread

• Small footprint

• Solution for PDIP packages

© Copyright 2007 AEM Singapore Pte LtdFor the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.

* ��

ADS-1000

• High throughput up to 10,000UPH

• Dual head flipper

• OEM vision system

• 2D vision inspection for bump damage, edges chips/crack,

laser marks, surface defects and tape seal quality

• High placement accuracy

• For wafer size: 6” or 8”

%�� +��

LR-510

• Fully automated of laser marking system

• Laser mark types of SMD devices from tray

– eliminate lead bent defects


• Servo driven mechanism - for high speed & accuracy

• Programmable conversion for different types through

auto-hostlink & bar-coding

• 2 axes tilting mechanism - to ensure marking accuracy

• Specially designed tray referencing aligner

• Solution for all packages in JEDEC or EIAJ trays


LSR-680DE

• Fully automated laser marking system

• Integrated with 2D vision inspection

• Pre-vision module - for lead/ball/orientation inspection

• Tray flipper module - for flipping the tray (ball device only)

• Post-vision module - ensure mark quality

• Pick & place sorting arm module

- process good & reject device into tray respectively

• Solution for packages in JEDEC trays

LS-338

• Fully automated strip-to-strip leadframe laser marking system

• Single track strip handler with double galvo head laser marker

• Strip positioned by servo system - for high speed & accuracy

• Programmable conversion capability, through auto-hostlink &

bar-coding

• Pre-vision module - for strip orientation

• “On The Fly” Post-vision module - ensure mark quality

• Capable of process good & reject device into stack magazine

and reject bin respectively

• Solution for all packages in strip form


%��

FP-550

• Fully automated standalone rework station

• User-defined input/output tray-to-tray or tube-to-tube

• High throughput up to 550 UPH

• Use of servo motor controller for rework

– minimize conversion time

• Rotary arm module – to maximize production time

• Dynamic Precisor module

– ensure no stoppage and achieve error free productivity

• Lead conditioning capabilities

- Lead bent, pitch, sweep, skew, copplanarity, package standoff,

terminal dimension

• Solution for QFP, TQFP, PQFP,TSOP packages (stacked in JEDEC

or EIAJ trays)PGR-380


• High throughput of 800 UPH


- Lead bent, standoff, coplanarity, sweep, pitch, skew,

terminal dimension

• Dynamic Precisor module

- ensure no stoppage and achieve error free productivity

• Mechanical Incoming Jig Lead Inspection

– ensure rework capabilities

• Solution for PGA & µPGA packages (in JEDEC trays)



• Flipper module

• Singulator module

• Input orientation module


- Lead bent, pitch, sweep, skew, copplanarity, package

standoff, terminal dimension

• Solution for TSSOP, SSOP & SOIC packages (stacked tube)

SI-2700


LD-100

• Fully automated single track laser deflashing system

• No media & chemical contact to package

• Quick & simple conversion

• Pre-vision to check on position before cutting

%��

LD-310

• Fully automated laser deflashing system

• Servo system mechanism – ensure accurate positioning

• Programmable conversion for different types through auto-

hostlink & bar-coding

• Uses mask for deflashing

• For all strip subrates leadframe (slotted magazine)

• Semi-automated lead conditioning single tube input machine

• Manual dual tube output station

• High throughput of 1,200 UPH


- lead bent, standoff, coplanarity, sweep, pitch, terminal

dimension

• Solution for TSSOP, SOIC packages (in tube form)

SP-300

%��

��+��

TTT-300

• Fully automatic transfer machine

• User-defined input/output tray-to-tube or tube-to-tray


• ID Matrix Decoder – to determine “good” or “bad” devices

• Shutter station - to flipped devices & shuttered into two different

buffer tracks position

• Pick & place module with orientation module

• Incline tracks with air assist module (for tray-to-tube operation)

• Solution for TSSOP, SSOP, SOIC packages

TTR-280VD

• Fully automatic transfer machine

• Input tray-to-tape & reel


• 2D In-pocket Mark Inspection

• Implied/Gross Lead Inspection

• Single or Dual tape & reel module

• New sealing module

• SPC reporting

• Dual pick & place arm

• Auto reject replacement

• Optional module: De-taping module & Barcode reader

• Solution for BGA, QFN, QFP in JEDEC trays


AEM specializes in the design and manufacture of wet process

stations to meet the varied needs and demand from the

following industries : Semiconductor, Disk Media,

Pharmaceutical, Aviation industries as well as institutions of

research & development.

Modular designs are custom-built to suit our customers’ process

needs. It is available in automated, semi-automated and manual

benches. It also comes in stainless steel, PVDF, Polypropylene

and flame retardant materials that qualified and met Factory

mutual FM4910 Protocol construction standards.

* ��

Wet Bench

a) Disk Media

• Class 100 clean room environment

automated Disk media Cleaning station

• Disk Pre-Texture Cleaning Bench

• Disk Post –Texture Cleaning Bench

• Media surface scrubbing machine

• Acid etching Bench

• Wet Conveyor for Disk transfer

• Upgrading/Reconfiguration machine

b) For semiconductor industry: Acid Cleaning, Solvent

Cleaning, Pre-Oxidation Cleaning, Pre-Diffusion

Cleaning, Nitride Etching, Photo-resist Stripping


Applications

c) For Research Institution: Wafer Auto-Etching Testing

chamber, Gold plating cleaning bath, AOT analytical

system, VOCs testing mini-lab, Ultrasonic water

analytical tank, Smart lab for wastewater treatment

process

d) Ultrasonic Cleaning Line

An Environment Friendly Cleaning method for Electronic,

Disk Drive & Aviation Industries & Research Institution.

Multi-Stage/tanks system with Ultrasonic cleaning, multi-

cascading overflow rinse, High-pressure jet spray rinse,

vacuum/Hot air dying process, and PLC controlled auto-

trans robotics system. Available in single piece or

batch/continuous production cycle.

e) For Aviation Automation: Process cleaning for

HPVT/LP Vanes, Mini-NDT/FPI inspection cleaning,

Batch Ultrasonic Processing Cleaning Line

AEM808

• Fully enclosed for safe and clean environment

• Independent Dual Strand processing

• Continuous selective plating

• Brush and Immersion selective plating

• Fully computerized touch screen control system

• Statistical process control

• Adjustable reel speed from 2m ~ 10m/min

Reel-to-Reel Selective

��


• Step and repeat system


• Statistical process control

Reel-to-Reel Spot Plating

Related chemicals include plating chemicals, pre-cleaning solution, post-cleaning solution, stripper and neutralizer are available too.

Ag Spot Plating

De-reeler and Accumulator

Indexing System

De-reeler & accumulator

Minimum tension throughout the continuous process is achieved

with careful design of accumulator and re-reel system. (Non

stopping process without, changing of the reel of material.

Spot Plating

The sparger system is capable for selective silver-plating of 4microns

over a length of 600mm lead within 3 second.

• Specially designed sparger system

• High flow rate systems

• High silver concentration (100g/I) make-up solution

• Two flow system

• Stoppers are used to ensure consistent sealing

• Hydraulic system is used instead of air to give consistent pressure

Indexing System

In the step and repeat system, location of the strip is dictated by

indexing mechanism with carrier pin. An indexing system is use to

push the strip through the plating cells when the masks are

opened and the cell is not flooded, the amount of strip push

through has to be equal registration on the selective plating

Specifications

Dimension of Machine : 28000mm x 1500mm x 1350mm

Machine Capacity: 6m/min x2

LeadFrame Dimension: 20 ~ 70mm (W), 0mm (thickness)

Lead Frame Material: Cu/Cu alloy/ A42/Ni Plated

Plating Specification

• Thickness: Ag - 4µm, accuracy: +0.15, area accuracy: +0.20mm, each pad center: +10%


��

Techplater

• Small and compact

• Flexibility in package application any package size

• Use in clean room environment


• Highly recommended to high lead count & Pilot line

• Within same floor space

• No transaction & mixing

• Ownership by shop-floor

• For small volume stand alone machine & flexibility for auto-line

The Techplater is a new age Strip-to-Strip Plating machine. Its modernity is best suited for today’s needs for

space saving and clean room environment. Solder plating can be done for both standard and matrix lead

frames. As a standalone machine, the Techplater is able to plate and produce the needed result and capacity

required of it. However, it can be a ‘team player’ as well when it is interfaced with other machines in an auto-

line. All in all, the Techplater is the plating system for the semiconductor manufacturers towards the next

millennium.

Loading / Unloading System

• Able to perform fully automatic, semi-automatic, manual

operation

• Flexibility to link to auto line

• Both loading / unloading are physical identical, which

results in high grade of standardization

• Fast and easy conversion for different types of packages

Strip Holder

• Zero droppages

• No distortion of thin and high density frames

• No limitation of strip length, width, and weight

• No requirement of minimum rail width for gripping

• Individual gripping holders are easy to replace

Machine Specification

Cu/ Cu Alloy/ Ni Plated/ A42Thickness: More than 2mm

Lead Frame Material

length: 150mm ~ 250mm, width: 20mm ~ 70mm

Strip Dimension

Standard: 400 strips/hrMatrix: 200 strips/hr

Machine Capacity

Length: 2000mm, Width: 2000mm, Height: 2000mm

Dimension of Machine


Strip holder

��

Electrolytic Strip-to-Strip

AEM specializes in the design and manufacturing of semiconductor deflashingequipment and its related chemicals.

• Electrolytic strip-to-strip carrier deflash


• Continuous movement conveyor system


• High-pressure water jet to remove loosen flash

Loading/Unloading System

• Able to perform fully automatic, semi-

automatic and manual operation

• Both the loading and unloading are

physically identical which results in

high grade of standardization

• Fast and easy conversion for different

types of packages

Strip Holder

• Zero droppages

• No distortion of thin and high load density frames

• No limitation of strips in length, width and weight

• No requirement of minimum rail width for gripping

• Individual gripping holders are easy to replace

• Top and bottom contacts for better current distribution

• Individual contact monitoring by computer

AEM offers total solution of both

the Equipment and Chemicals for

our customer to achieve the best

results in all aspects. Related

Chemicals is Electrolytic

Deflashing solution.Machine Specification

Cu/ Cu Alloy/ Ni Plated/ A421200 ~ 1800 strip

Lead Frame MaterialMachine Capacity

Strip length: 150mm ~ 250mmStrip width: 20mm ~ 70mm

Length: 8360 to 16850mmWidth: 1500mmHeight: 1350mm

Lead Frame DimensionDimension of Machine


��



• Continuous movement conveyor belt system


• Belt speed of 8m/min (top speed)

• Strip-on-process tracking System

• Integrated Cassette and Stack

• Stack & Slot magazine loading and unloading system

��+��&�,%��

��

• Plug-in flexible buffer

• Solder plating in-line

• Laser deflash in-line

• One ownership

• Flexibility in package type

(able to switch to other products)

• All stations are in independent module

(can be sold as individual)

• Cost effective

• High quality & yield

• Fast cycle time

Belt Deflashing

EDM Products Brochure Q107 v1

Documents

Transcript of EDM Products Brochure Q107 v1