echniques Using the Gatan Precision Etching and Coating...
Transcript of echniques Using the Gatan Precision Etching and Coating...
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SEM Techniques
Using the Gatan
Precision Etching
and Coating
System (PECS™)
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The Tool
The Technique
The Total Solution
PECS™
Precision Etching and Coating System
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The perfect match for a FESEM or
Optical Microscope
Eliminate:Chemical Mess
Chemical HandlingChemical Spills
Chemical HazardsChemical Disposal
Not just another new tool
But a NEW
Sample Preparation
Technique
A Clean Green Technique:
ION BEAM ETCHING
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Cleaning
SEM images of tungsten plugs, sample was first mechanically polished. Image A shows leftover debris and contamination from polishing process (arrow). Image B is after Etch, sample is cleaned and reveals a variety of micro structural features.
a
b
20kx
4
Precision Etching Coating System
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High-resolution cross-section through different coating layers of C and Cr sputtered on Si substrate.
Coating
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PECS Coating Sub-nanometer grain deposition of Chromium (Cr), thin amorphous Cr coatings can be deposited without masking delicate specimen features.
100 nm
200kx
6
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Magnetron Coating
Chromium deposition by comparison is not sub-nanometer or amorphous.
100 nm
200kx
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Before etch and after etch SEM images of bonded copper structures (Cu I. & Cu II). After etching shows grain size and grain morphology of each Cu structure is entirely different. Bonded interface area is also visible after etching (see arrows).
Etching
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SEM image of tungsten plugs and transistors, starting sample as cleaved. Sample etched and coated.
Parameter: 6 / 250 / 2 / 60° / Fix / Rotating 6 / 250 / 1 / 0 - 30° / Rock / RotatingEtch gas I2 7.5 / 200 / 1.5 / 0 - 30° / Rock / RotatingCoating Pt 6 / 200 / 0.3 / 0 - 30° / Rock / Rotating
30kx
8 9
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SEM image of tungsten plugs and transistors, starting sample as cleaved. Sample etched and coated.
Parameter: 5 / 250 / 1 / 60° / Fix / Rotating 5 / 250 / 1.5 / 0 - 45° / Rock / RotatingEtch gas I2 5 / 250 / 1 / 50° / Fix / RotatingEtch gas I2 5 / 250 / 1.5 / 0 - 45° / Rock / RotatingCoating Pt 6 / 200 / 0.3 / 0 - 30° / Rock / Rotating
23kx
8 9 10
Precision Etching Coating System
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SEM image of tungsten plugs and transistors, starting sample as cleaved. Sample etched and coated.
Parameter: 5 / 250 / 1 / 60° / Fix / Rotating 5 / 250 / 1.5 / 0 - 45° / Rock / RotatingEtch gas I2 5 / 250 / 1 / 50° / Fix / RotatingEtch gas I2 5 / 250 / 1.5 / 0 - 45° / Rock / RotatingCoating Pt 6 / 200 / 0.3 / 0 - 30° / Rock / Rotating
22kx
8 9 10 11
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Metallographic
High-Purity Titanium Structure, after Etching, Micrograph with POL Filters.
Parameters: 6 / 400 / 12 / 60º / Rotating
500x
12
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High-Purity Titanium Structure, after Etching, DIC Micrograph.
Parameters: 6 / 400 / 8 / Vertical / Rotating
500x
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High-purity-Cu deformed and annealed with tin coating (< 2um) Grain Boundaries and Twins of high-purity-Cu developed after etching, DIC Micrograph.
Parameter: 6 / 370 / 2.4 / Vertical / Rotating
200x
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High-purity-Cu deformed and annealed with tin coating (< 2um)Grain Boundaries and Twins of high-purity-Cu developed after etching, DIC Micrograph, Section of previous Figure.
Parameter: 6 / 370 / 2.4 / Vertical / Rotating
500x
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Structure development for Machine Brass CuZn39Pb3, after etching, DIC Micrograph, Lead Droplets Retained, in part Twinning visible in Lead Droplets.
Parameter: 6 / 400 / 0.5 / 65° / Rotating plus 6 / 400 / 1.2 / Vertical / Rotating
500x
16
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Structure of High-Purity-Aluminum, after etching, POL Micrograph (rough to grainy grain surfaces appear in color).
Parameter: 6 / 400 / 12 / 53° / Rotating plus 6 / 400 / 24 / 45° / Rotating
50x
17
Precision Etching Coating System
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Section of previous figure, after etching, DIC Micrograph.
200x
18
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Structure of Al Casting AlloyAlMg4.5Mn after Etching Micrograph with DIC, Grain Boundaries and Intermetallic Phases Etched.
Parameter: 6 / 400 / 10 / 65° / Rotating 6 / 400 / 3.4 / Vertical / Rotating 6 / 400 / 12 / 55° / Rotating
1000x
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Superconductor CuSn+NbTi+Ta Covered with Cu Coating, after Etching, Overview Micrograph with DIC. Parameter: 6 / 400 / 12 / 45° / Rotating 6 / 400 / 2.4 / Vertical / Rotating 6 / 400 / 2 / 10° / Rotating
50x
20
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Superconductor CuSn+NbTi+Ta Covered with Cu Coating, after Etching, Lower Area of previous Figure, CuSn Matrix with NbTi fibers, Micrograph with DIC.
100x
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Precision Etching Coating System
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Structure from the Edge of Permanent Magnet FeNdB(1%) with protective layers of Cu and Ni, after Etching, Micrograph with DIC, improved contrast of tarnished layer by means of additional O2 etching
Parameter: 6.5 / 480 / 5 / 40° / Rotating 6.5 / 510 / 7 / 10° / RotatingEtch gas O2 8 / 450 / 4 / Vertical / Rotating
500x
22
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EBSD
EBSP
Indexed Pattern
DetectedBands
CrystallographicOrientation
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Cu sample, Image Quality = 193 Votes = 35, 15 keV SEM acceleration voltage.
Parameters: 7.5 / 175 / 240 / 70°/ Rotating
Cu sample, Image Quality = 204 Votes = 35, 30 keV SEM acceleration voltage.
Parameters: 7.5 / 175 / 240 / 70°/ Rotating
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Precision Etching Coating System
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Cu film, Image Quality = 228, 25 keV SEM acceleration voltage, spot size 4.
Parameters: 2.5 / 60 / 115 / 50°/ Rotating
25
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Aluminum film, Image Quality = 114, 25 keV SEM acceleration voltage, spot size 4.
Parameters: 2.5 / 60 / 30 / 50°/ Rotating
26
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Die Package, after Ar etch, overall view of Via hole, Delamination between solder resist and via hole inner wall. Metal grain structure not visible at all before etch.See following pages for indicated areas.
Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / RotatingEtch gas I2 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
300x
DIE Package
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Die Package, after Ar etch, enlarged view from Right side of Via hole, Delamination between solder resist and via hole inner wall. No grain structure visible before etch.
Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / RotatingEtch gas I2 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
1500x
28
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Die Package, after Ar etch, enlarged view from Left side of Via hole, No delamination. No grain structure visible before etch.
Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / RotatingEtch gas I2 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
1500x
29
Precision Etching Coating System
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Die Package, after Ar etch, Overall view of Die attach and Solder resist with delamination between Metal trace of Cu and 0.5um Ag. No grain structure visible before etch. See enlarged area on next page.
Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
1000x
30
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Die Package, after Ar etch, enlarged view from previous page, Die attach and Solder resist with delamination between Metal trace of Cu and 0.5um Ag. Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
Die AttachSolderResist
5000x
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Precision Etching Coating System
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Die Package, after Ar etch, Overall view of Die attach, Solder resist and Metal trace of Pb, Cu and 6um Ag.
Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
350x
32
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Die Package, after Ar etch, Enlarged view of Die attach, Solder resist and Metal trace of Pb, Cu and 6um Ag.
Parameter: 7 / 200 / 3 / 50° / Fix / Rotating 5 / 200 / 5 / 0 - 30° / Rock / Rotating 6 / 200 / 0.5 / 0 - 30° / Rock / Rotating
2000x
33
Precision Etching Coating System
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