ECE 477 Design Review Team 4 Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

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ECE 477 Design Review ECE 477 Design Review Team 4 Team 4 Spring 2006 Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe

Transcript of ECE 477 Design Review Team 4 Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Page 1: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

ECE 477 Design Review ECE 477 Design Review Team 4 Team 4 Spring 2006 Spring 2006

Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe

Page 2: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

OutlineOutline• Project overview Project overview • Project-specific success criteriaProject-specific success criteria• Block diagramBlock diagram• Component selection rationaleComponent selection rationale• Packaging designPackaging design• Schematic and theory of operationSchematic and theory of operation• PCB layoutPCB layout• Software design/development statusSoftware design/development status• Project completion timelineProject completion timeline• Questions / discussionQuestions / discussion

Page 3: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Project OverviewProject Overview

• The Digital Real-time Intelligent Networked The Digital Real-time Intelligent Networked Kegerator will address safety, legal, usability, Kegerator will address safety, legal, usability, and economic concerns of draft beverage and economic concerns of draft beverage distribution. Alcohol consumption distribution. Alcohol consumption monitoring will provide a tool to allow a monitoring will provide a tool to allow a person to know exactly how much they have person to know exactly how much they have consumed, learn estimated legal limits, and consumed, learn estimated legal limits, and reduce unauthorized or unlawful drinking. reduce unauthorized or unlawful drinking. System control and monitoring will allow System control and monitoring will allow users to track inventory, decrease beverage users to track inventory, decrease beverage waste, and predict future resource needs. waste, and predict future resource needs.

Page 4: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Project-Specific Success CriteriaProject-Specific Success Criteria

• An ability to sense and control beverage An ability to sense and control beverage temperature. temperature.

• An ability to identify authorized users via electronic An ability to identify authorized users via electronic identification. identification.

• An ability to track consumption on an individual An ability to track consumption on an individual basis.basis.

• An ability to display user/device status on an LCD.An ability to display user/device status on an LCD.• An ability to control the function of and report the An ability to control the function of and report the

status of the kegerator via an embedded web server.status of the kegerator via an embedded web server.

Page 5: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Block DiagramBlock Diagram

RCM3315 MicrocontrollerModule

TemperatureProbes

Flowmeters

Solenoids

CompressorContactor

RFID Module

Graphical LCDScreen

Optical Encoderw/Pushbutton

$1-$20 BillAcceptor

BiometricIdentification

Module

ExpansionPLD

RS-232

Se

ria

l

RS

-23

2

RS

-23

2

User Authentication

Human-Machine Interface

Quadrature Input

Control and Monitoring

Eth

ern

et

Web Interface

Page 6: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Microprocessor SelectionMicroprocessor SelectionDevice Model RCM3315 CM-HCS12NE64 HCS12NE64Module Manufacturer Rabbit Semiconductor Softec Microsystems N/APackaging Core Module Board Core Module Board 112-Pin LQFPSRAM 512K Program + 512K data 8K 8KFlash 512K 64K 64KExtended Memory 4 Mbyte Serial Flash (single chip) 8 Mbyte Serial Flash (1 Mbyte x 8) NoneGeneral-Purpose I/O 49 Up to 70 Up to 70

Serial Interfaces 5 total w ith 5 configurable as SCI, 3 as SPI 2 SCI, 1 SPI, 1 I2C 2 SCI, 1 SPI, 1 I2CReal-Time Clock Yes No NoSRAM Battery Backup Yes No NoTimers Ten 8-bit and one 10-bit Ten 8-bit and four 16-bit Ten 8-bit and four 16-bitPulse-Width Modulators 10-bit free-running counter and 4 PWM regs None NoneAnalog to Digital No Yes YesQuadrature Decoder Yes No NoEthernet 10/100 10/100 10/100Power 3.15-3.45V DC, 275 mA @ 3.3V 3.3V 3.3VCost $99 $600 @ $120 each (Minimum Qty 5) 8 (+$25 for components)

Page 7: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

LCD SelectionLCD SelectionDevice Model ezLCD-001 F-51851GNFQJ-LY-AND CFAG320240C-FMI-TModule Manufacturer ezLCD Apollo Displays CrystalfontzScreen Manufacturer Sony Optrex CrystalfontzScreen Technology Active Matrix TFT STN Transmissive STN TransmissiveColor Yes No NoResolution (pixels) 240x160 240x64 320x240Diagonal Size 2.7" 5.7" 5.7"

Viewable Area (cm2) 37.03 48.96 110.4Contrast Ratio 13 to 1 6 to 1 3 to 1Response Time (ms) 15 310 350Controller ezLCD-001 CDS-51405 S1D3305Controller Flash 94k None None

Interface Serial, USB, I2C, Parallel Serial, Parallel ParallelHigh level control functions Yes Yes NoEvaluation Board Yes No NoSamples Available Yes Cannot get controller YesCost $200 ($150 for students) $171 $142.73

Page 8: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

RFID Reader SelectionRFID Reader SelectionDevice Model RI-K3A-001A Low Frequency Micro RFID Kit Phidget USB RFID Kit RX-MFR-RNLK

Module Manufacturer Texas Instruments Phidget USA Texas InstrumentsModule Package 32 pin DIP PCB PCBFrequency 134.2 kHz 125 kHz 134.2 kHz/13.56 MhzAntenna 80mm Disk 63mm Onboard Coil LF/HF AntennasReplaceable Antenna Yes No YesInterface Board RS232 IF Port, Power and Antenna ConnectorsUSB RS-232, RS-485Typical Read Range (cm) 15 4 cm 10+ cmTransponder Samples Yes Yes YesSoftware Yes No YesCables Yes Yes YesCost $284 $76.95 $625 ($350 for students)

Page 9: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Packaging DesignPackaging Design

• Self contained unitSelf contained unit• Easy to add on to existing Easy to add on to existing

systemsystem

Page 10: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.
Page 11: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 12: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 13: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 14: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 15: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 16: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 17: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 18: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Schematic/Theory of OperationSchematic/Theory of Operation

Page 19: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

PCB LayoutPCB Layout

236 mm

117mm

Page 20: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Bottom CopperBottom Copper

Analog Gnd / Power Gnd 50 mil

i

Digital Gnd

Pins 2 and 3 Internally Connected Single Point of Analog and Digital Ground

Page 21: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Top CopperTop Copper

12V 50 mil 12V 60 mil

5V Traces 50 mil

3.3V

Page 22: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

PCB LayoutPCB Layout

Common Beverage Interface

Temp/ Compress

RCM3315 Microcontroller Module

5V and 3.3V Converters

Serial InterfaceBiometric

Future Dev

Page 23: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Common Beverage InterfaceCommon Beverage Interface

•Have common I/0 simplified easily through symmetry

•Segregates High Current Analog From Rest of Circuit

Page 24: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

DC to DC ConverterDC to DC Converter

•Traces made short and large as possible

•Bypass Capacitors mounted underneath to get as close as possible

• Power and Signal Gnds Segregated

•EMI reduction

Page 25: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Software Design/Development StatusSoftware Design/Development Status

• All functions built into costate statements.All functions built into costate statements.– Temperature pollingTemperature polling– Rabbit webRabbit web

• External events triggered by interupts.External events triggered by interupts.– Flowmeters: code working on rabbitFlowmeters: code working on rabbit

• Other hardware over serial communication.Other hardware over serial communication.– Bill Validator: code working on rabbitBill Validator: code working on rabbit– RFID: code working on rabbitRFID: code working on rabbit– LCD: code working on computerLCD: code working on computer

Page 26: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Project Completion TimelineProject Completion Timeline

• Week 8 – PCB and Schematic finalization and test Week 8 – PCB and Schematic finalization and test circuitscircuits

• Week 9 – Finalize PCB and test circuitsWeek 9 – Finalize PCB and test circuits• Week 10 – Complete all functional software modules Week 10 – Complete all functional software modules

and hardware testingand hardware testing• Week 11 – PCB integration and testingWeek 11 – PCB integration and testing• Week 12 – Integrate controller functions with web Week 12 – Integrate controller functions with web

and hardware testingand hardware testing• Week 13 – Add complex featuresWeek 13 – Add complex features• Week 14 – Test complex features, create video and Week 14 – Test complex features, create video and

posterposter• Week 15 – Final Presentation, ReportWeek 15 – Final Presentation, Report

Page 27: ECE 477 Design Review Team 4  Spring 2006 Justin Thacker, Matt Kocsis, Ian Snyder, Dustin Poe.

Questions / DiscussionQuestions / Discussion