DV102014 Projected Capacitive Multi-Touch with 3D GestIC...

2016 Microchip Technology Inc. DS40001834A

DV102014 Projected Capacitive

Multi-Touch with 3D GestIC® SensingDevelopment Kit User’s Guide

DS40001834A-page 2 2016 Microchip Technology Inc.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV

== ISO/TS 16949 ==

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

ISBN: 978-1-5224-0316-6

Object of Declaration: DV102014 Projected Capacitive with 3D GestIC® Sensing Development Kit

2016 Microchip Technology Inc. DS40001834A-page 3

Digital Power Starter Kit User’s Guide

NOTES:


DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH®
3D GestIC SENSING DEVELOPMENT KIT USER’S GUIDE
Table of Contents

Preface ........................................................................................................................... 7

Chapter 1. Overview1.1 Introduction ................................................................................................... 131.2 Working Principle ......................................................................................... 13

Chapter 2. Getting Started2.1 Setup ............................................................................................................ 162.2 Troubleshooting ............................................................................................ 25

Appendix A. SchematicsA.1 2D and 3D Boards ....................................................................................... 27A.2 Demonstrator Cross-Section Example ......................................................... 28

Worldwide Sales and Service .................................................................................... 31


DV102014 Projected Capacitive Multi-touch with 3D GestIC® Sensing Development Kit User’s Guide

NOTES:


Preface

INTRODUCTION

This chapter contains general information that will be useful to know before using the DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit. Topics discussed in this chapter include:

• Document Layout• Conventions Used in this Guide• Recommended Reading• The Microchip Website• Development Systems Customer Change Notification Service• Customer Support• Revision History

DOCUMENT LAYOUT

This user’s guide provides important details for using the projected capacitive 2D and 3D GestIC Sensing assembly as quick as possible. The document is organized as follows:

• Chapter 1. “Overview” – provides details on the kit contents, theory of operation and the block diagram.

• Chapter 2. “Getting Started” – includes information on the hardware and software setup, first-time parameterization and overview of the GUI.

• Appendix A. “Schematics” – includes reference material for the schematics, recommendations for adding a display and details about the PCAP touch screen.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.


DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or dialog

“Save project before build”

Underlined, italic text with right angle bracket

A menu path File>Save

Bold characters A dialog button Click OK

A tab Click the Power tab

N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.

4‘b0010, 2‘hF1

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be any valid filename

Square brackets [ ] Optional arguments mcc18 [options] file [options]

Curly brackets and pipe character: { | }

Choice of mutually exclusive arguments; an OR selection

errorlevel {0|1}

Ellipses... Replaces repeated text var_name [, var_name...]

Represents code supplied by user

void main (void){ ...}


Preface

WARRANTY REGISTRATION

Please complete the enclosed Warranty Registration Card and mail it promptly. Sending in the Warranty Registration Card entitles users to receive new product updates. Interim software releases are available at the Microchip website.

RECOMMENDED READING

This user’s guide describes how to configure the DV102014 Projected Capacitive with 3D GestIC assembly. Other useful documents are listed below. The following documents are available and recommended as supplemental reference resources:

MTCH6303 Projected Capacitive Touch Controller Data Sheet (DS40001803)

This data sheet provides specific information about the features and adjustable parameters of the MTCH6303, useful for configuring and tuning your application.

MGC3030/3130 3D Tracking and Gesture Controller Data Sheet (DS40001667)

This document provides specific information about the features and adjustable parameters of the MGC3130, useful for configuring and tuning your application.

MTCH650/2 Programmable Voltage Boost with Built-in Level Shifters and Serial Interface with Output Enable (DS40001749)

This document provides information to configure the MTCH652 in your application.

For the 2D-3D AUREA Utility software application and more information about Microchip’s human interface portfolio, visit:

www.microchip.com/DV102014.

To obtain any of Microchip’s documents, visit the Microchip website at www.microchip.com.


http://www.microchip.com


http://www.microchip.com/DV102014



THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip website at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

The Development Systems product group categories are:

• Compilers – The latest information on Microchip C compilers, assemblers, linkers and other language tools. These include all MPLAB C compilers; all MPLAB assemblers (including MPASM™ assembler); all MPLAB linkers (including MPLINK™ object linker); and all MPLAB librarians (including MPLIB™ object librarian).

• Emulators – The latest information on Microchip in-circuit emulators.This includes the MPLAB REAL ICE™ and MPLAB ICE 2000 in-circuit emulators.

• In-Circuit Debuggers – The latest information on the Microchip in-circuit debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit™ 3 debug express.

• MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows® Integrated Development Environment for development systems tools. This list is focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and MPLAB SIM simulator, as well as general editing and debugging features.

• Programmers – The latest information on Microchip programmers. These include production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included are non-production development programmers such as PICSTART® Plus and PICkit 2 and 3.


Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the website at:

http://www.microchip.com/support.

REVISION HISTORY

Revision A (February 2016)

Initial release of this document.


http://www.microchip.com/support


NOTES:


Chapter 1. Overview

1.1 INTRODUCTION

Microchip’s DV102014 development kit builds a complete reference system for evaluation and design of 2D multi-touch and 3D gesture human-machine interfaces. This combination enables user command input with multi-touch detection on surfaces as well as natural hand movements in free space.

The kit content is described below:

• 2D/3D Electronics Board with Microchip parts:

- MTCH6303 2D PCAP (Projected Capacitive) controller

- MGC3130 3D GestIC® controller

- MTCH652 high-voltage driver

• 2D/3D Sensor Module

- 8" PCAP touch screen

- 3D Printed Circuit Board (PCB) electrodes

• Micro-USB cable

1.2 WORKING PRINCIPLE

This combined 2D/3D technology solution uses Microchip’s MTCH6303 2D PCAP Controller, the MGC3130 3D GestIC Controller, and the MTCH652 High-Voltage Driver. The system works in Time-Multiplex mode that dynamically detects 2D and 3D operations.

FIGURE 1-1: BLOCK DIAGRAM

MTCH6303

2D RX

Touchscreen

3D: South

3D: North

3D: W

est

3D: E

ast

3D RX

2D3D TX

I2CTS

MCLRMode 2D3DSync (1 ms)

SPI

2D TX3D TX

OE

PWM OSCIN

MGC3130

MTCH652

USBI2C

HOST



NOTES:


Chapter 2. Getting Started

Follow the following steps to get started:

1. Download and install the 2D/3D design-in utility AUREA 2.x to your Windows® 7/8/10 PC from www.microchip.com/DV102014.

2. Connect the micro-USB cable to the 2D/3D Electronics Board and your PC, as shown in Figure 2-1.

FIGURE 2-1: BACKSIDE VIEW

3. Carefully turn the assembled hardware over and lay on a flat table surface. The six stand-offs support the hardware, creating a flat level touch surface.

FIGURE 2-2: TOPSIDE VIEW




2.1 SETUP

1. Launch the Aurea 2.x Software Utility, (note the green check on the USB symbol

to indicate a successful connection ).

2. Navigate to the Setup tab and select 3D Parameterization (see Figure 2-3).

FIGURE 2-3: SETUP TAB


Getting Started

3. Select Start Autoparameterization (this step automatically optimizes the settings for the development kit by pushing the Autoparameterization button).

FIGURE 2-4: AUTOPARAMETERIZE



4. The signals can be noticed in Figure 2-5 coming together and running through the center of the graph on the sample point (the dotted vertical line on the right side).

5. Once this happens, click Flash to save the new automatically-tuned parameters.

FIGURE 2-5: FLASH NEW SETTINGS


Getting Started

6. The Flash button will display a green check mark; exit this screen using the Exit button.

FIGURE 2-6: EXIT AUTOPARAMETERIZATION



7. Navigate to the Colibri Suite tab to demonstrate 2D and 3D capabilities, as briefly described below. See the utility documentation for a more detailed intro-duction to the various built-in features.

FIGURE 2-7: COLIBRI SUITE TAB


Getting Started

8. The Colibri Suite tab allows the user to turn on/off the 2D and 3D gesture reporting. These controls are found on the left side of the program and help simulate the conditions and features of the user’s application. Gestures that are performed by the user are seen in the Gesture output window in the bottom right corner.

FIGURE 2-8: COLIBRI SUITE – 2D AND 3D GESTURES



9. Real-time position data is provided in the other three windows. The Auto-default setting presents the real-time 2D or 3D data transmitted by the electronics. Selecting 2D or 3D will limit the output window visualization to the desired setting.

FIGURE 2-9: COLIBRI SUITE – 2D AND 3D DATA


Getting Started

10. Use your finger(s) to draw a circle on the touch screen surface area inside the black borders and verify that the points in the top center 2D Measurement window follow your circular motion.

FIGURE 2-10: COLIBRI SUITE – 2D TEST



11. Use your hand to swipe left to right over the 2D/3D sensor module. Verify that the red gesture arrows follow your movements in the bottom right Gestures window. The hand distance should be ~10 cm (up to 20 cm) above the sensor. Always check that the desired gesture is actually activated in the 2D and/or 3D overview on the left side of the screen.

FIGURE 2-11: COLIBRI SUITE – 3D TEST


Getting Started

2.2 TROUBLESHOOTING

• In case of problems, make sure the 2D/3D electronics board connection is secure; a loose connection may result in poor performance (see Figure 2-12).

• Check the AUREA HTML documentation for the latest news on the available code updates for the MTCH6303 and MGC3130 devices.

FIGURE 2-12: TROUBLESHOOTING – CHECK CONNECTIONS

• References: additional information about Microchip’s 2D and 3D electronic solutions may be found on the Microchip website at:

- MTCH6303 – 2D PCAP touch controller www.microchip.com/mtch6303

- MGC3130 – 3D GestIC® controller www.microchip.com/mgc3130

- MTCH652 – High-voltage driver www.microchip.com/mtch652


http://www.microchip.com/mgc3130

http://www.microchip.com/mtch6303



http://www.microchip.com/wwwproducts/Devices.aspx?product=MTCH6303

http://www.microchip.com/wwwproducts/Devices.aspx?product=MGC3130


NOTES:


Appendix A. Schematics

A.1 2D AND 3D BOARDS

FIGURE A-1: 2D/3D ELECTRONICS BOARD – DIMENSIONS (mm)

Full schematics, BOM and gerbers are available on the DV102014 Development Kit website www.microchip.com/DV102014.



Schematics

FIGURE A-2: 3D PCB ELECTRODES – DIMENSIONS (mm)

A.2 DEMONSTRATOR CROSS-SECTION EXAMPLE

When building up a demo, the following mechanical setup can be used:

FIGURE A-3: MECHANICAL SETUP WITH DISPLAY

Full schematics, BOM and gerbers are available on the DV102014 Development Kit website www.microchip.com/DV102014.

The 3D electrode consists of 2 parts: a) inner frame = electrodes b) outer frame = mounting frame * Optional feature: 12 break-away points for removing mounting frame

Display

CoverglassGIC-El GIC-ElTouchpanel-Stackup

Double adhesive

2-component Epoxy glue

PCB



Sch

ematics

2

01

6 M

icroch

ip T

ech

no

log

y Inc.

D

S4

00

01

83

4A

-pa

ge

29

FIG

GND

SRX0SRX1SRX2SRX3

SRX4SRX5SRX6SRX7SRX8SRX9

TX0TX1TX2TX3TX4TX5TX6TX7TX8TX9TX10TX11TX12TX13TX14TX15TX16TX17

GND

GND

PGC/RX15PGD/RX16

VDDMCLR

SCLSDA

VDDIRQ

SRX10SRX11SRX12SRX13SRX14SRX15SRX16SRX17SRX18SRX19SRX20SRX21SRX22SRX23SRX24SRX25SRX26

TX18

GND

GND

12345678910111213141516171819202122232425 26

272829303132333435363738394041424344454647484950

MNT

FFC/FPC 50P Female

J2

GIC_RX0

GIC_RX1

GIC_RX2

GIC_RX3

I2C Port

ICSP

0R 0603

R19

Touchpanel Interface

GND

GND

12

34

5

J6

DNP

12

34

5

J7

123456

HDR-1.27 Male 1x6

DNPJ4

0R 0603

DNPR18

123456

HDR-2.54 Male 1x6

J3

MCLR

GestIC Electrode Connector

DNP: Do Not Populate

12pF

C22

12pF

C21

12pF

C20

12pF

C11

10k

R16

10k

R17

10k

R24

10k

R25

5V0402

MOV15V0402

MOV2

5V0402

MOV35V0402

MOV45V0402

MOV5

URE A-4: DV102014 SCHEMATIC

VDD

GND

Pin 10,26,38,57,19

GND GND

VUSBVBUS

GND GND GND

VDD

TX0TX1TX2TX3TX4TX5TX6TX7TX8TX9TX10TX11TX12TX13TX14TX15TX16

TX17TX18

VPP

GND

GND

BOOST_CLKBOOST_DINBOOST_LE1

BOOST_PWM

BOOST_OE1

VDD

GND

RX3

RX4RX5RX6RX7

RX8

RX2RX1

SRX3

SRX4SRX5SRX6SRX7

SRX8

SRX2SRX1

RX9

RX0

SRX9

SRX0

VDD

VUSB

VDD

VUSB

VDD

D+D-

UART_TXUART_RX

SDASCL

GND

MCLRVDD

MGC_SyncCOMM_SEL

OSC1

OSC2

PGC/RX15PGD/RX16

MGC_MCLRMGC_Mode

IRQ

BOOST_PWM

BOOST_CLK

BOOST_LE1BOOST_LE2

BOOST_OE1

BOOST_DIN

BOOST_OE2

MGC_SDAMGC_SCL

MGC_TS

RX4

SRX10

SRX11SRX12SRX13SRX14



SRX23SRX24SRX25

RX10

RX11RX12RX13RX14

PGC/RX15PGD/RX16

RX17RX18

RX19RX20RX21RX22

RX23RX24RX25

RX11RX12RX13RX14

RX5RX6

RX7RX8RX9RX10

RX17RX18RX19RX20RX21RX22RX23RX24RX25RX26

RX0

RX1

RX2

RX3

GND

ID 4

VBUS 1

GND 5

D- 2

D+ 3

0

USB MICRO-AB Female

J1

1234 5

678

R11

1234 5

678

R8

1234 5

678

R2

1234 5

678

R51234 5

678

R6

1234 5

678

R9

1234 5

678

1k08045%

R10

8MHz

X1

BLUELD1

AN22/RPE5/PMD5/RE5 1AN23/PMD6/RE6 2AN27/PMD7/RE7 3

AN16/C1IND/RPG6/SCK2/PMA5/RG64 AN17/C1INC/RPG7/PMA4/RG75 AN18/C2IND/RPG8/PMA3/RG86

MCLR7

AN19/C2INC/RPG9/PMA2/RG98

VSS9

VDD10

AN5/C1INA/RPB5/VBUSON/RB5 11AN4/C1INB/RB4 12PGED3/AN3/C2INA/RPB3/RB3 13PGEC3/AN2/C2INB/RPB2/CTED13/RB2 14PGEC1/VREF-/CVREF-/AN1/RPB1/CTED12/RB1 15PGED1/VREF+/CVREF+/AN0/RPB0/PMA6/RB0 16

PGEC2/AN6/RPB6/RB6 17

PGED2/AN7/RPB7/CTED3/RB7 18

AVDD19

AVSS20

AN8/RPB8/CTED10/RB8 21

AN9/RPB9/CTED4/PMA7/RB9 22

TMS/CVREFOUT/AN10/RPB10/CTED11/PMA13/RB10 23

TDO/AN11/PMA12/RB11 24

VSS25

VDD26

TCK/AN12/PMA11/RB12 27

TDI/AN13/PMA10/RB13 28

AN14/RPB14/CTED5/PMA1/RB14 29

AN15/RPB15/OCFB/CTED6/PMA0/RB15 30

RPF4/SDA2/PMA9/RF431

RPF5/SCL2/PMA8/RF532

VBUS34

VUSB3V335

D-36 D+37

VDD38

OSC1/CLKI/RC12 39

OSC2/CLKO/RC15 40VSS41

RPD8/RTCC/RD8 42RPD9/SDA1/RD9 43RPD10/SCL1/PMCS2/RD10 44RPD11/PMCS1/RD11 45

RPD0/INT0/RD0 46

SOSCI/RPC13/RC13 47SOSCO/RPC14/T1CK/RC14 48

AN24/RPD1/RD1 49AN25/RPD2/SCK1/RD2 50AN26/RPD3/RD3 51RPD4/PMWR/RD4 52RPD5/PMRD/RD5 53RD6 54RD7 55

VCAP56

VDD57

RPF0/RF058

TRCLK/RPF1/RF159

TRD0/PMD0/RE0 60TRD1/PMD1/RE1 61TRD2/AN20/PMD2/RE2 62TRD3/RPE3/CTPLS/PMD3/RE3 63AN21/PMD4/RE4 64

Thermal Pad65

USBID/RPF3/RF333

MTCH6303-I/RG

U2

OUT05 1OUT04 2

LC3

OUT03 4OUT02 5OUT01 6OUT00 7

OUT18 8OUT17 9

OSCIN10

OE11

LE12

DIN13

CLK14

OUT16 15OUT15 16OUT14 17OUT13 18OUT12 19OUT11 20OUT10 21OUT09 22OUT08 23

VSS24 VDD25

VPP26

OUT07 27OUT06 28EX_PAD29

U3MTCH652 QFN-28

GND

GND

1.8k06031%

R4

10k 0603 5%

R7

2.2uH

L1

FERRITE 12A 0.05R SMD 0603

FB1 GND1

VIN3 VOUT 2

MCP1703T-3302E/CBU1

1uF50V0805

C6

GND

10uF 25V0805

C4

VCAPS1 VINDS2

VSS23

RX0 4

RX1 5

RX2 6

RX3 7

RX4 8

VCAPA9

VSS310

VCAPD11

EIO0 12

EIO1 13

EIO2 14

IS2 15

NC16

NC17

NC18 EIO3 19

SI0 20

SI1 21

SI2 22

SI3 23

MCLR24 TXD 25

NC26

VSS127

VDD28

EPAD29

MGC3130U4

GND

GND

GestIC Chip and Electrode Connector

NC1NC2NC3

GIC_RX1GIC_RX2GIC_RX3

IS2

MGC_TSEIO1MGC_ModeEIO3

MGC_MCLR

4.7uF10V0603

C184.7uF10V0603

C19

MGC_SDAMGC_SCL

VDD_GestIC

VDD_GestIC

MGC_Sync

GND

GND

GestIC Interface Selection

IS2

10k06035%

R31EIO1

10k06035%

R30

GND

MGC_TS

GND

MGC_SDAMGC_SCLMGC_MCLR

VDD_GestIC

GestIC Interface

COMM_SEL

PIC Decoupling Caps

1.8k06031%

R211.8k06031%

R2010k06035%

R2210k06035%

R23

GND

PCAP Voltage Booster

keep PIC in Reset, when connecting with I2C bridge (J4: MCLR-GND)

33k06035%

R15

BOOST_OE1

0.1uF25V0603

C130.1uF25V0603

C140.1uF25V0603

C150.1uF25V0603

C160.1uF25V0603

C17 0.1uF25V0603

C12

10uF25V0805

C1

0.1uF25V0603

C3

0.1uF25V0603

C5

0.1uF25V0603

C91uF50V0805

C10

J8, J10, J11: Improve mechanical stability

*NO STUFF*

GIC_RX0

10R 0603 5%

R1

10R 0603 5%

R3

D-

D+1 2 3

56 4

VBUS054B-HS3-GS08

D1

GND

GND

18pF50V0603

C718pF50V0603

C8

0R0603

R29

0R 0603

R12

0R 0603

DNPR13

TP7

TP5

TP3

TP1

TP6

TP4

TP2

TP8

EIO3

BOOST_LE2

MGC_Mode

MGC_SyncBOOST_LE1

BOOST_OE1

BOOST_OE2

BOOST_CLK

TP9BOOST_PWM

12

HDR-2.54 Female 1x2

J11

100k06035%

R14

TP10

TP11

GND

GND

GND

GND

0R0603

DNPR28

VDD

TP12SI2

SI2

0R0603

R32VDD

123456

HDR-1.27 Male 1x6

DNPJ9

SRX26RX26

COMM_SEL:

GND -> USB communciationVDD -> I2C communciation

Test PointsCommunication Select

Touch Controller

Series Resistors for Touch-RX-ChannelsUSB Connector + Power Supply

47uF6.3V0805

C2

1123

HDR-2.54 Female 1x3

J8

1123

HDR-2.54 Female 1x3

J10

DV

102014 Pro

jected C

apacitive M

ulti-to

uch

with

3D G

estIC®

Sen

sing

Develo

pm

ent K

it User’s G

uid

e

DS

40

00

18

34

A-p

ag

e 3

0

2

01

6 M

icroch

ip T

ech

no

log

y Inc.

4.

FIGURE A-5: 2D 8” PROJECTED CAPACITIVE TOUCH PANEL – PART NUMBER TXP080BA02

The downloadable PDF is available on the DV102014 development kit website www.microchip.com/DV10201


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07/14/15

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