dsPIC33CK256MP506 Digital Power Plug-In Module (PIM) User...
Transcript of dsPIC33CK256MP506 Digital Power Plug-In Module (PIM) User...
2018 Microchip Technology Inc. DS50002819A
dsPIC33CK256MP506Digital Power
Plug-In Module (PIM)User’s Guide
DS50002819A-page 2 2018 Microchip Technology Inc.
Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.
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• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
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== ISO/TS 16949 ==
TrademarksThe Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies.© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3763-5
dsPIC33CK256MP506 DIGITAL
POWER PIM USER’S GUIDETable of Contents
Preface ........................................................................................................................... 5Introduction............................................................................................................ 5Document Layout .................................................................................................. 5Conventions Used in this Guide ............................................................................ 6Recommended Reading........................................................................................ 7The Microchip Website.......................................................................................... 7Product Change Notification Service..................................................................... 7Customer Support ................................................................................................. 7Document Revision History ................................................................................... 7
Chapter 1. Overview....................................................................................................... 91.1 Introduction ..................................................................................................... 91.2 Features ......................................................................................................... 9
1.2.1 Test Points ................................................................................................ 101.2.2 Electrical Characteristics ........................................................................... 101.2.3 Analog and Digital Signals ........................................................................ 101.2.4 dsPIC33CK256MP506 DP PIM – PCB Edge Connector ........................... 11
1.3 UART Communication .................................................................................. 111.4 Low-Frequency Bode Plot Measurements ................................................... 11
Appendix A. Board Layout and Schematics.............................................................. 13A.1 Pinout ........................................................................................................... 13A.2 Board Schematics ........................................................................................ 15A.3 PCB Layout .................................................................................................. 17
Appendix B. Bill of Materials (BOM)........................................................................... 21B.1 Bill of Materials ............................................................................................. 21
Worldwide Sales and Service .................................................................................... 24
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dsPIC33CK256MP506 DIGITALPOWER PIM USER’S GUIDE
Preface
INTRODUCTIONThis chapter contains general information that will be useful to know before using the dsPIC33CK256GS806 Digital Power Plug-In Module (PIM). Items discussed in this chapter include:• Document Layout• Conventions Used in this Guide• Recommended Reading• The Microchip Website• Product Change Notification Service• Customer Support• Document Revision History
DOCUMENT LAYOUTThis document describes how to use the dsPIC33CK256MP506 Digital Power PIM as a development tool to emulate and debug firmware on a target board. The document is organized as follows:• Chapter 1. “Overview” — This chapter introduces the dsPIC33CK256MP506
Digital Power PIM and provides a brief overview of its various features.• Appendix A. “Board Layout and Schematics” — This appendix presents the
schematics and the board layouts for the dsPIC33CK256MP506 Digital Power PIM.
• Appendix B. “Bill of Materials (BOM)” — This appendix presents the Bill of Materials for the dsPIC33CK256MP506 Digital Power PIM.
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.
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dsPIC33CK256MP506 Digital Power PIM User’s Guide
CONVENTIONS USED IN THIS GUIDEThis manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONSDescription Represents Examples
Arial font:Italic characters Referenced books MPLAB® IDE User’s Guide
Emphasized text ...is the only compiler...Initial caps A window the Output window
A dialog the Settings dialogA menu selection select Enable Programmer
Quotes A field name in a window or dialog
“Save project before build”
Underlined, italic text with right angle bracket
A menu path File>Save
Bold characters A dialog button Click OKA tab Click the Power tab
N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.
4‘b0010, 2‘hF1
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>Courier New font:Plain Courier New Sample source code #define START
Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’
Italic Courier New A variable argument file.o, where file can be any valid filename
Square brackets [ ] Optional arguments mcc18 [options] file [options]
Curly brackets and pipe character: { | }
Choice of mutually exclusive arguments; an OR selection
errorlevel {0|1}
Ellipses... Replaces repeated text var_name [, var_name...]
Represents code supplied by user
void main (void){ ...}
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Preface
RECOMMENDED READINGThis user’s guide describes how to use the dsPIC33CK256MP506 Digital Power PIM. Other useful document(s) are listed below. The following Microchip document(s) are recommended as supplemental reference resources.• “dsPIC33EPXXXGS70X/80X Family Data Sheet” (DS70005258) is available for
download from the Microchip website (www.microchip.com)
THE MICROCHIP WEBSITEMicrochip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events; and listings of Microchip sales offices, distributors and factory representatives
PRODUCT CHANGE NOTIFICATION SERVICEMicrochip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.
CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:• Distributor or Representative• Local Sales Office• Corporate Application Engineer (CAE)• Embedded Solutions Engineer (ESE)Customers should contact their distributor, representative or Embedded Solutions Engineer (ESE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.Technical support is available through the website at: http://www.microchip.com/support.
DOCUMENT REVISION HISTORYRevision A (October 2018)This is the initial release of this document.
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dsPIC33CK256MP506 DIGITALPOWER PIM USER’S GUIDE
Chapter 1. Overview
1.1 INTRODUCTIONThe dsPIC33CK256MP506 Digital Power Plug-In Module (DP PIM) is a demonstration board that, in conjunction with different power boards, showcases the Microchip dsPIC33CK256MP506 16-bit Digital Signal Controller (DSC) features. The DP PIM provides access to the dsPIC33CK256MP506 analog inputs, the Digital-to-Analog Converter (DAC) output, the Pulse-Width Modulator (PWM) outputs and the General Purpose Input and Output (GPIO) ports. The Microchip series of DP PIMs for digital power share the same pinout at the mating socket. However, these PIM cards show slightly different performing characteristics.
1.2 FEATURESThe dsPIC33CK256MP506 DP PIM has the following features, as shown in Figure 1-1:
FIGURE 1-1: dsPIC33CK256MP506 DP PIM
1. Microchip dsPIC33CK256MP506 16-Bit Digital Signal Controller (64-pin TQFP package).
2. ICSP™ programming header (6-pin, 2.54 mm header).3. On-board LDO with Power Good (PG) function.4. Solder pad for ground connection.5. Micro USB connector.6. MCP2221A USB to UART/I2C serial converter.7. Power indicator LED (Green).8. User LED (Red).9. Board edge connection interface for analog inputs/outputs, PWM outputs and
GPIO ports.10. Analog input with op amp buffer via test point loop connector; can be used for
Bode plot measurements.11. Op amp buffer for Bode input.12. Test point loop for DAC output.13. Op amp buffers for shared ADC inputs.14. MEMS oscillator.Board dimensions are: 51 mm (length) x 38.5 mm (width).
1
2
4
5
78
611
10
13
12
14
3
9
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4
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dsPIC33CK256MP506 Digital Power PIM User’s Guide
1.2.1 Test PointsTable 1-1 lists the test points on the dsPIC33CK256MP506 DP PIM.
1.2.2 Electrical CharacteristicsTable 1-2 shows the electrical characteristics of the dsPIC33CK256MP506 DP PIM.
1.2.3 Analog and Digital SignalsThe dsPIC33CK256MP506 DP PIM ensures good signal integrity and provides all signals needed to control a power train. These signals are divided into two main sections: Analog, marked with A; Digital, marked with D (see Figure 1-1).1. Analog Section
The analog section is located at the left connector side (smaller section in Figure 1-1). It consists of 17 signals, all referenced to analog ground. These lines are split into four subsections:• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz
and maximum signal rise/fall time of 33 ns. These lines are designed to be used with on-chip comparators for signal zero-cross detections, etc.
• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and maximum signal rise/fall time of 180 ns. These lines are connected to the Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs.
• High-Speed ADC Inputs: Buffered through operational amplifiers. RC filtered with corner frequency of 1 MHz and maximum signal rise/fall time of 347 ns. These lines are connected to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs.
• Medium Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and maximum signal rise/fall time of 1.8 µs. These lines are connected to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs. The different RC filtering is needed because of the significant difference between T&H and S&H circuitry, and the sampling times.
TABLE 1-1: TEST POINTSTest Point Name Function/Description
TP1, TP2 Bode Measurement Signal Insert PointTP3 RA3_DAC1_OUT: Digital-to-Analog Converter OutputTP4 Test Point for Debug (right upper corner of the MCU)TP5 General Purpose Test Point Connected to Port RD15 together
with LD2 (Red LED) (near to the right bottom corner beside LD2)
TABLE 1-2: ELECTRICAL CHARACTERISTICSParameter Value
Input Voltage Range 3.6 VDC to 6.3 VDC
Current Consumption <100 mAPower Dissipation <0.6W max.Operating Temperature Range -40°C to +85°C
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Overview
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2. Digital SectionThe digital section is located at the right connector side (larger section in Figure 1-1). It consists of 31 signals, all referenced to digital ground. These lines are split into four subsections:• High-Speed PWM Outputs: Each line has a 75 series resistance.• Medium Speed GPIO: Each line has a 270 series resistance.• Programing/Debugging Lines: Each line has a 100 series resistance.• Communication Lines (I2C): Each line has a 100 series resistance.
1.2.4 dsPIC33CK256MP506 DP PIM – PCB Edge ConnectorThe dsPIC33CK256MP506 DP PIM has an edge connector compatible with any application board that provides a mating socket.The mating socket type is Samtec, Inc.: MECF-30-01-L-DV-WT.
1.3 UART COMMUNICATIONThe on-board USB to UART serial bridge enables easy serial connection to PCs. The USB port can provide power to the digital power PIM and allows the user to communicate with the dsPIC® Digital Signal Controller (DSC).
1.4 LOW-FREQUENCY BODE PLOT MEASUREMENTSThe dsPIC33CK256MP506 device, with the additional on-board circuitry, is able to perform Bode plot measurements without the need for an isolation transformer. The transformer might be difficult to use if the injecting signal tends to be at a very low frequency (for instance, in case of Power Factor Correction (PFC) applications).Perform the following steps:1. Solder the 150 resistor from position R74 to R94.2. Run the power stage in Open-Loop mode with a fixed duty cycle.3. Connect the Bode 100 AC output across TP2 and TP1. The on-board operational
amplifier is adding a VDD/2 (1.65V) offset. In this case, no injection transformer is needed.
4. Connect RA3_DAC1_OUT to CH2 of the Bode 100.5. Use the AN18 input to sample the signal from Bode 100 in every PWM cycle at
Frequency Switching (FSW) (action in firmware is needed).6. Remove the VDD/2 offset to regain a signal with no DC value (action in firmware
is needed).7. Add sampled AC signal to the nominal duty cycle (PDCx) (action in firmware is
needed).8. Use a second dedicated ADC core input (ANx) to sample the output of the plant
at FSW. The output can be:• Output voltage• Average coil current sampled at TON/2, where TON is the switch-on time.
9. Duty cycle input and plant output are converted into an analog signal using RA3_DAC1_OUT.
Note: RC filtering and series resistance are needed for good signal integrity, and for reducing EMI issues. Hence, the board can be used for development purposes under frequent plug-in/out cycles. This decoupling also increases robustness in case of accidental shorts and EMC issues.
dsPIC33CK256MP506 Digital Power PIM User’s Guide
Measured transfer function is the plant (Power Stage + Digital Modulator), after scaling and ADC sampling, versus digital duty cycle input (PDCx).
Figure 1-2 and Figure 1-3 show measuring procedure examples for plant and closed-loop measurements.
FIGURE 1-2: MEASURING PROCEDURE FOR PLANT MEASUREMENT
FIGURE 1-3: MEASURING PROCEDURE FOR CLOSED-LOOP MEASUREMENT
Note: Due to run-time delays of Sample-and-Hold circuits and conversion time of ADC and DAC, this measurement is only recommended for low-frequency measurements (a maximum of two decades below sampling frequency).
Power Stage
PWM
VOUTVIN
NominalDuty Ratio
Output
+Signal Injection
AN18
VDD/2
Remove Offset
InBode100
In
DAC1
Bode100Generator
VDD/2
50R
CH2
CH1
VBODE
G=2
VAMP=VDD/2+2xVBODE
Output
Power Stage
PWM
VOUTVIN
Compensator
Output
Bode100Generator
InBode100
In
VDD/2
SignalInjection
ANx
VDD/2
Remove Offset
Min/MaxClamp
Reference
AN18
+
DAC1
50R
CH2
CH1
VBODE
VAMP=VDD/2+2xVBODE
Output
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dsPIC33CK256MP506 DIGITALPOWER PIM USER’S GUIDE
Appendix A. Board Layout and Schematics
This appendix contains the pinout, the schematics and the board layouts for the dsPIC33CK256MP506 DP PIM.• Pinout• Board Schematics• PCB Layout
A.1 PINOUTPinout and electrical parameters are shown in Table A-1.
TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS
NameEdge
Connector Pin
Device Pin Function/Description Remark
GND_A 1 20 Analog Ground —GND_A 2 20 Analog Ground —RA3_DAC1_OUT 3 17 DAC Output, Optional RC
Filter560R series resistance
RC3_AN15_IN 4 27 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRB8_AN10_IN 5 48 Analog Input, RC Filtered,
BufferedFc = 1 MHz, tr = 347 ns
RB2_AN1_IN 6 33 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns— 7 — — —
RA4_CMP3B_IN 8 18 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 nsRC6_AN17_IN 9 24 Analog Input, RC Filtered,
BufferedFc = 1 MHz, tr = 347 ns
RB7_AN2_IN 10 47 Analog Input, RC Filtered, Buffered
Fc = 1 MHz, tr = 347 ns
RA1_ANA1_IN 11 15 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 nsRA0_AN0_IN 12 14 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 nsRD11_AN19_IN 13 30 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 nsRC7_AN16_IN 14 32 Analog Input, RC Filtered,
BufferedFc = 1 MHz, tr = 347 ns
RD10_AN18_IN 15 31 Analog Input, RC Filtered, Optional Bode Input
Fc = 1.9 MHz, tr = 180 ns
RC0_AN12_IN 16 13 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRC2_AN14_IN 17 23 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRC1_CMP1B_IN 18 22 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 nsRA2_AN9_IN 19 16 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRB1_AN6_IN 20 29 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs
slot 21 slot slot slotslot 22 slot slot slot
RB9_RP41 23 49 Digital General Purpose 270R series resistance
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RC8_RP56_ASDA1 24 36 Digital General Purpose 100R series resistanceRC10_RP58 25 52 Digital General Purpose 270R series resistanceRD14 26 11 Digital General Purpose 270R series resistanceRC11_RP59 27 53 Digital General Purpose 270R series resistanceRD9 28 38 Digital General Purpose 270R series resistance
— 29 — — —— 30 — — —
RC14_PWM6H 31 5 PWM Output 75R series resistanceRC9_RP57_ASCL1 32 37 Digital General Purpose 100R series resistanceRC15_PWM6L 33 6 PWM Output 75R series resistanceRD5_RP69 34 44 Digital General Purpose 270R series resistanceRC4_RP52 35 50 Digital General Purpose 270R series resistanceRD6_RP70 36 43 Digital General Purpose 270R series resistanceRB10_PWM3H 37 61 Digital General Purpose 75R series resistanceRC5_RP53 38 51 Digital General Purpose 270R series resistanceRD2_RP66 39 58 Digital General Purpose 270R series resistanceRB13_PWM2L 40 64 PWM Output 75R series resistanceRB11_PWM3L 41 62 PWM Output 75R series resistanceRB12_PWM2H 42 63 PWM Output 75R series resistanceRD1_PWM4H 43 59 PWM Output 75R series resistanceRD0_PWM4L 44 60 PWM Output 75R series resistanceRB14_PWM1H 45 1 PWM Output 75R series resistanceRC12_RP60 46 3 Digital General Purpose 270R series resistanceRB15_PWM1L 47 2 PWM Output 75R series resistanceRC13_RP61 48 4 Digital General Purpose 270R series resistanceMCLR_IN 49 7 Device Reset 100R series resistanceRD7_RP71 50 42 Digital General Purpose 270R series resistanceRB4_PGC2 51 35 Programing/Debugging 100R series resistanceRD8_RP72 52 39 Digital General Purpose 270R series resistanceRB6_SCL2 53 46 Digital General Purpose 100R series resistanceRD13 54 12 Digital General Purpose 270R series resistanceRB5_SDA2 55 45 Digital General Purpose 100R series resistanceRB3_PGD2 56 34 Programing/Debugging 100R series resistanceVDD 57 LDO VDD Rail 6.3V max, 70 mA maxGND_D 58 9,26,40,56 Digital Ground —VDD 59 LDO VDD Rail 6.3V max, 70 mA maxGND_D 60 9,26,40,56 Digital Ground —
TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS (CONTINUED)
NameEdge
Connector Pin
Device Pin Function/Description Remark
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Board Layout and Schematics
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100R
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100R
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75R
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1920
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4950
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5960
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+3.3
V_O
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1k 0402
1%R79
+3.3
V_O
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GN
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0.1 μ
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02
C22
GN
D_A
VIN-
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1VOUT
4VSS 2
VDD5
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TU
7
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A_3
+3.3
V_O
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+3.3
V_O
PA
GN
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0.1 μ
F50
V04
02
C23
GN
D_A
OP
A_4
+3.3
V_O
PA
1k 0402
1%R80
OPA_
1_IN
OPA_
2_IN
OPA_
3_IN
OPA_
4_IN
150R
0603
1%R74
150R
0603
1%R60
150R
0603
1%R63
150R
0603
1%R64
150R
0603
1%R70
150R
0603
1%R61
150R
0603
1%R62
150R
0603
1%R68
150R
0603
1%R69
5600
pF25
V06
03
C43
150R
0603
1%R71
VIN-
3
VIN+
1VOUT
4VSS 2
VDD5
MCP6
V91U
TU
4
27R
0603
1%R67
27R
0603
1%R66
27R
0603
1%R73
1 μF
10V
0402
C13
1 μF
10V
0402
C14
1 μF
10V
0402
C15
1 μF
10V
0402
C16MC
LR
+3.3
V
Pro
gram
min
g
GN
D_D
1 2 3 4 5 6
HDR-2.54 Male 1x6
J1
RB3_
PGD2
RB4_
PGC2
MCLR
+3.3
V
GN
D_D
100R
0402
1%R
1310
k04
021%R
12 56 pF
50V
0402
C25
MCLR
_INM
CLR
_IN
SDA
2
SCL2
UA
RT
TX
UA
RT
RX
MCLR
_IN
RC7_
AN16
RC0_
AN12
RC3_
AN15
RC1_
CMP1
B
RA2_
AN9
RA3_
DACO
UT1
RA1_
ANA1
RA1_
ANA1
_IN
RA4_
CMP3
B
RA0_
AN0_
INRA
0_AN
0
RC6_
AN17
RB1_
AN6
GN
D_A
150R
0603
1%R65
RB2_
AN1_
IN
RD10
_AN1
8RD
11_A
N19
5600
pF06
0325
V
C41
RC8_
RP56
_ASD
A1
RB12
_PW
M2H
RD14
RB13
_PW
M2L
RD9
RD6_
RP70
RD5_
RP69
RC9_
RP57
_ASC
L1
RB14
_PW
M1H
RB10
_PW
M3H
RB11
_PW
M3L
RD4_
RP68
_UAR
T_RX
RD3_
RP67
_UAR
T_TX
RB15
_PW
M1L
RD2_
RP66
RC5_
RP53
RC4_
RP52
RD1_
PWM4
HRD
0_PW
M4L
RC10
_RP5
8RC
11_R
P59
RC12
_RP6
0RC
13_R
P61
RD7_
RP71
RD8_
RP72
RB6_
SCL2
RB5_
SDA2
RB6_
SCL2
RB5_
SDA2
RD13
RC15
_PW
M6L
RC14
_PW
M6H
RD15
_LED
RB7_
AN2
RB8_
AN10
RB9_
RP41
0.1 μ
F50
V04
02
C18
GN
D_D
+3.3
V
75R
0402
1%R11
RB0_
CLKI
STB
1
GN
D2
OU
T3
VD
D4
8.000
MHz
DSC6
011J
I2A-0
08.00
00
Y1
0603
DNP
C46
560R
0603
1%R76
DB2S
3100
0LD
4
GN
D_ADB
2S31
000L
D3
DB2S
3100
0LD
6
GN
D_ADB
2S31
000L
D5
+3.3
V_O
PA
+3.3
V_O
PA
VD
D57
VD
D41
VD
D25
VD
D10
VSS
40V
SS26
VSS
9
RD
060
RD
159
RD
258
RD
355
RD
454
RD
544
RD
643
RD
742
RD
839
RD
938
RD
1031
RD
1130
RD
1221
RD
1312
RD
1411
RD
158
MC
LR7
VSS
56
AV
DD
19
AV
SS20
RA
014
RA
115
RA
216
RA
317
RA
418
RB
028
RB
129
RB
233
RB
334
RB
435
RB
545
RB
646
RB
747
RB
848
RB
949
RC
013
RC
122
RC
223
RC
327
RC
450
RC
551
RC
624
RC
732
RC
836
RC
937
RC
1052
RC
1153
RC
123
RC
134
RC
145
RC
156
RB
1061
RB
1162
RB
1263
RB
1364
RB
141
RB
152
dsPI
C33C
K256
MP50
6-I/P
T
U3
RC3_
AN15
_INOP
A_1_
IN
OPA_
3_IN
OPA_
4_IN
RA0_
AN0_
IN
RA2_
AN9_
IN
RA3_
DAC1
_OUT
RA4_
CMP3
B_IN
RA4_
CMP3
B_IN
RA2_
AN9_
IN
RB1_
AN6_
IN
RB1_
AN6_
IN
RB7_
AN2_
IN
RB7_
AN2_
IN
RB8_
AN10
_IN
RB8_
AN10
_IN
RB10
_PW
M3H
RB11
_PW
M3L
RB12
_PW
M2H
RB13
_PW
M2L
RB14
_PW
M1H
RB15
_PW
M1L
RC0_
AN12
_IN
RC0_
AN12
_IN
RC1_
CMP1
B_IN
RC1_
CMP1
B_IN
RC2_
AN14
_IN
RC2_
AN14
_IN
GN
D_A
27R
0603
1%R72
560 p
F50
V06
03
C44
RC3_
AN15
_IN
RC4_
RP52
RC5_
RP53
RC6_
AN17
_IN
RC6_
AN17
_IN
150R
0603
1%R75
GN
D_A56
0 pF
50V
0603
C45
RC7_
AN16
_IN
RC8_
RP56
_ASD
A1
RC9_
RP57
_ASC
L1
RC10
_RP5
8RC
11_R
P59
RC12
_RP6
0RC
13_R
P61
RC14
_PW
M6H
RC15
_PW
M6L
RD1_
PWM4
HRD
0_PW
M4L
RD13
RD14
RD10
_AN1
8_IN
RD10
_AN1
8_IN
RD11
_AN1
9_IN
RD11
_AN1
9_IN
RD2_
RP66
RD5_
RP69
RD6_
RP70
RD7_
RP71
RD8_
RP72
RD9
RD4_
RP68
_UAR
T_RX
RD3_
RP67
_UAR
T_TX
75R
R25
75R
R26
75R
R27
75R
R28
75R
R29
75R
R30
75R
R39
75R
R40
100R
R22
100R
R23
100R
R33
100R
R34
150R
0603
1%
DNP
R94
Bode
_Inj
R74
and
R94
are
alte
rnat
epl
aces
for t
he sa
me
resi
stor
.It
form
s an
isol
atio
n sw
itch
for B
ode
100
Sign
al In
ject
ion.
5600
pF06
0325
V
C37
560 p
F06
0350
V
C35
5600
pF06
0325
V
C42
5600
pF06
0325
V
C36
VIN-
3
VIN+
1VOUT
4VSS 2
VDD5
MCP6
V91U
TU
8
10k
0402
0.5%
R9549.9R
0805
1%R90
GN
D_A
TP LO
OP Y
ellow
Vbo
de_m
ax =
1 V
rms
TP2
VB
OD
E
TP LO
OP B
lack
TP1
49.9R
0603
1%R
93
GN
D_A
10k
0402
0.5%
R92 0.1
μF
50V
0402
C51
GN
D_A
10k
0402
0.5%
R91 3.3
k04
020.5
%
R96
+3.3
V_O
PA
+3.3
V_O
PA
GN
D_A
0.1 μ
F50
V04
02
C24
GN
D_A
+3.3
V_O
PA
VB
_inj
= V
cc/2
– V
BO
DE
22 pF
50V
0402
C50
Bode
_Inj
RB9_
RP41
+VD
D_E
XT
270R
R24
270R
R31
270R
R32
270R
R35
270R
R36
270R
R37
270R
R38
270R
R43
270R
R44
270R
R45
270R
R46
270R
R47
270R
R48
270R
R49
270R
R50
3.3k
0402
1%R81
OPA_
2_IN
RB2_
AN1_
IN
RA1_
ANA1
_IN
RC7_
AN16
_IN
TP LO
OP Y
ellow
DNP
TP4
RD12
TP LO
OP Y
ellow
DNP
TP5
2018 Microchip Technology Inc. DS50002819A-page 15
dsPIC33CK256MP506 Digital Power PIM User’s Guide
FIG
UR
E A
-2:
dsPI
C33
CK
256M
P506
DIG
ITA
L PO
WER
PIM
SC
HEM
ATI
C R
EV. 1
.0 (P
AG
E 2
OF
2)
10k
0402
1%R1
270R
0402
1%R
4
270R
0402
1%R
5
+3.3
V+3
.3V
MCP2
221A
VD
D16
GP0
1
GP1
2
RST
3
UA
RT
RX
4
UA
RT
TX5
GP2
6
GP3
7
SDA
8
SCL
9V
USB
10
D-
11D
+12
VSS
13
EP17
NC
14
NC
15
U1
4.7k
0402
1%R6
4.7k
0402
1%R7
SDA
2
SCL2
UA
RT
TX
UA
RT
RX
GN
D_D
+VD
D_E
XT
+3.3
V
GN
D_D
GN
D_D
3.6V
..6 V
MA
X fr
om E
dge
Con
nect
or
+5V
_USB
0.1 μ
F50
V04
02
C8
GN
D_D
GREE
N06
03
LD1
VIN
1
SHD
N3
GN
D2
PWR
GD
4
VO
UT
5MC
P175
5/3.3V
U2
MCLR
_INM
CLR
_IN
GN
D_A
0R 0603
R9
GN
D_D
0R 0603
R10
Shie
ld
“Shi
eld”
= B
otto
m C
oppe
r Pou
t Con
nect
ion
+3.3
V_A
GN
D_A
+3.3
V_O
PA+3
.3V
GN
D_A
1 μF
10V
0402
C6
0.47 μ
F6.3
V04
02
C7
10 μ
F10
V06
03
C9
10 μ
F10
V06
03
C10
10 μ
F10
V06
03
C11
10 μ
F10
V06
03
C12
600R
0402
900 m
A
FB3
600R
0402
900 m
A
FB5
600R
0402
900 m
A
FB6 60
0R04
0290
0 mA
FB7
GN
D_U
GN
D_U
SBR1
A20T
5
D2
12
34
50
DN
GV5+
-D
+D
DIM
icro
-AB
Rec
epta
cle
J3 USB
2.0 M
ICRO
-B F
EMAL
E
GN
D_S
+5V
_USB
USB_
N
USB_
P3
14
2
7442
3090
0
L1 WE
CN
SW
1
2
3456
8240
0152
D1
GN
D_U
US
BP
ort
0.1 μ
F50
V04
02
C3
47 pF
50V
0402
C1
47 pF
50V
0402
C2
GN
D_U
GN
D_U
GN
D_U
GN
D_U
600R
0402
900 m
A
FB4
US
B/U
AR
T-I2 C
Inte
rface
600R
0402
900 m
A
FB1
600R
0402
900 m
A
FB2
4.7k
0402
1%R
0
15R
0402
1%R
2
15R
0402
1%R
3
0.1 μ
F50
V04
02C
0
5V fr
om U
SB
Con
nect
or
1.5k
0402
1%R8
DS50002819A-page 16 2018 Microchip Technology Inc.
Board Layout and Schematics
A.3
PCB
LA
YOU
TTh
e ds
PIC
33C
K25
6MP
506
DP
PIM
is a
four
-laye
r FR
4, 1
.55
mm
, Pla
ted-
Thro
ugh-
Hol
e (P
TH) P
CB
con
stru
ctio
n. F
igur
eA
-3 th
roug
h Fi
gure
A-5
illust
rate
th
e P
CB
laye
rs a
nd F
igur
eA-
6 sh
ows
the
asse
mbl
y dr
awin
gs o
f the
dsP
IC33
CK
256M
P506
DP
PIM
.
FIG
UR
E A
-3:
dsPI
C33
CK
256M
P506
DIG
ITA
L PO
WER
PIM
TO
P SI
LKSC
REE
N A
ND
TO
P C
OPP
ER
Top
Silk
scre
enTo
p C
oppe
r
2018 Microchip Technology Inc. DS50002819A-page 17
dsPIC33CK256MP506 Digital Power PIM User’s Guide
FIG
UR
E A
-4:
dsPI
C33
CK
256M
P506
DIG
ITA
L PO
WER
PIM
MID
1 A
ND
MID
2 IN
NER
CO
PPER
(BO
TTO
M V
IEW
)
Mid
1 In
ner C
oppe
rM
id2
Inne
r Cop
per
DS50002819A-page 18 2018 Microchip Technology Inc.
Board Layout and Schematics
FIG
UR
E A
-5:
dsPI
C33
CK
256M
P506
DIG
ITA
L PO
WER
PIM
BO
TTO
M C
OPP
ER A
ND
BO
TTO
M S
ILK
SCR
EEN
(BO
TTO
M V
IEW
)
Bot
tom
Cop
per
Botto
m S
ilksc
reen
2018 Microchip Technology Inc. DS50002819A-page 19
dsPIC33CK256MP506 Digital Power PIM User’s Guide
FIG
UR
E A
-6:
dsPI
C33
CK
256M
P506
DIG
ITA
L PO
WER
PIM
TO
P A
ND
BO
TTO
M A
SSEM
BLY
Top
Asse
mbl
yBo
ttom
Ass
embl
y
15
0
0
1
234
0
0
6
1
121122
1
2
2
3 21211 331
2
3
1
1 2
1 21
121
2
21
122
21
21
12
2
1 2
32
2
12
1 2
3029282
12
2 1
1 2262524
2
12
222120
1
12
2 1
1817
2115 4 39 8 713 12 1116 15
221
1 211 11
22222
1 212
1212111
22
1
222
11
2
2 1
112
23 21
2 1
1
2
1224 11
221
21 21
1
1
1
3 12 2 2
1
57
121
12 2
112
1113
21
12
12
17
1
49
1
23
5352
51
1
27
5756
551
29
6160
59
2
336463
37
14 10 6 2
1
39
12
22 2
4345
1212
4921
53555
21
4
21
1211
12
591
43
3
12
109
12
112
4555 445
21
4
1
12
1 2
1 2
122
1
11
11
1 2
1 2
2
4846454442414038373634332
3127
223
12
2 121
21
2319
22
2
11
1
22
2
1 2
22
122 2
1211111
21
22
165
14138 72
21
6
25
1
11
1
3 25
4 5
22
93
1221
11
2519
15
5450
2
47433935
224
353162
58
11
1
5147
41
2
12
2
1111 1
57
1 212
156
34
11
2
22
2
0
4 1
00
17
0
2
1
15
0
0
1
234
0
0
6
1
26
812
1418
2428
3034
3840
4446
5054
5660
104
2620
1636
3252
4842
58
DS50002819A-page 20 2018 Microchip Technology Inc.
dsPIC33CK256MP506 DIGITALPOWER PIM USER’S GUIDE
Appendix B. Bill of Materials (BOM)
This appendix contains the Bill of Materials (BOM) for the dsPIC33CK256MP506 Digital Power PIM.• Bill of Materials
B.1 BILL OF MATERIALSTable B-1 shows the Bill of Materials for the dsPIC33CK256MP506.
TABLE B-1: dsPIC33CK256MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM)Qty. Designator Description Manufacturer Manufacturer Part Number
11 C0, C3, C8, C17, C18, C20, C21, C22, C23, C24, C51
Capacitor, Ceramic, 0.1 µF, 50V, 10%, X7R, SMD, 0402
TDK Corporation C1005X7R1H104K050BB
2 C1, C2 Capacitor, Ceramic, 47 pF, 50V, 5%, NP0, SMD, 0402
Murata Electronics® GRM1555C1H470JA01D
5 C6, C13, C14, C15, C16
Capacitor, Ceramic, 1 µF, 10V, 10%, X7S, SMD, 0402
TDK Corporation C1005X7S1A105K050BC
1 C7 Capacitor, Ceramic, 0.47 µF, 6.3V, 10%, X5R, SMD, 0402
Murata Electronics GRM155R60J474KE19D
4 C9, C10, C11, C12 Capacitor, Ceramic, 10 µF, 10V, 20%, X5R, SMD, 0603
Samsung Group CL10A106MP8NNNC
1 C25 Capacitor, Ceramic, 56 pF, 50V, 5%, C0G, SMD, 0402
TDK Corporation C1005C0G1H560J050BA
5 C30, C31, C35, C44, C45
Capacitor, Ceramic, 560 pF, 50V, 5%, C0G, NP0, SMD, 0603
KEMET C0603C561J5GACTU
9 C32, C34, C36, C37, C38, C40, C41, C42, C43
Capacitor, Ceramic, 5600 pF, 25V, 5%, C0G, SMD, 0603
TDK Corporation C1608C0G1E562J080AA
2 C33, C39 Capacitor, Ceramic, 100 pF, 50V, 5%, NP0, SMD, 0603
Cal-Chip Electronics Inc.
GMC10CG101J50NTLF
1 C50 Capacitor, HiQ, 22 pF, 50V, 5%, NP0, 1.95 GHz, SMD, 0402
Johanson Technology Inc.
500R07S220JV4T
1 D1 Diode, TVS Array, 82400152, 5V, USB 2.0, SMD, SOT-563
Wurth Elektronik 82400152
1 D2 Diode Schottky, SBR1A20T5-7, 520 mV, 1A, 20V, SOD-523
Diodes Incorporated® SBR1A20T5-7
4 D3, D4, D5, D6 Diode Schottky, DB2S31000L, 470 mV, 200 mA, 30V, SMD, SOD-523
Panasonic® - ECG DB2S31000L
7 FB1, FB2, FB3, FB4, FB5, FB6, FB7
Ferrite, 600R at 100 MHz, 0.23R, 900 mA, SMD, 0402
Murata Electronics BLM15PX601SN1D
2018 Microchip Technology Inc. DS50002819A-page 21
dsPIC33CK256MP506 Digital Power PIM User’s Guide
1 J1 Connector Header-2.54 Male, 1x6, Gold, 5.84MH, TH, Vertical
FCI 68000-106HLF
1 J3 Connector, USB 2.0 micro-B,Female, TH/SMD, R/A
FCI 10118194-0001LF
1 L1 Common-Mode Choke, 90R, 100 MHz, 0.145R, 550 mA, SMD, 0603
Wurth Elektronik 744230900
1 LD1 Diode LED Green, 2V,30 mA, 35 mcd, Clear, SMD,0603
Lite-On®, Inc. LTST-C190KGKT
1 LD2 Diode LED Red, 1.8V,40 mA, 10 mcd, Clear, SMD,0603
Lite-On, Inc. LTST-C190KRKT
3 R0, R6, R7 Resistor TKF, 4.7k, 1%, 1/10W, 0402
KOA Speer Electronics, Inc.
RK73H1ETTP4701F
2 R1, R12 Resistor TKF, 10k, 1%, 1/10W, SMD, 0402
Panasonic® - ECG ERJ-2RKF1002X
2 R2, R3 Resistor TKF, 15R, 1%, 1/10W, SMD, 0402
Panasonic - ECG ERJ-2RKF15R0X
17 R4, R5, R24, R31, R32, R35, R36, R37, R38, R43, R44, R45, R46, R47, R48, R49, R50
Resistor TKF, 270R, 1%, 1/10W, SMD, 0402
Panasonic - ECG ERJ-2RKF2700X
1 R8 Resistor TKF, 1.5k, 1%, 1/16W, SMD, 0402
Yageo Corporation RC0402FR-0775RL
2 R9, R10 Resistor TKF, 0R, 1/10W, SMD, 0603
NIC Components Corp.
NRC06Z0TRF
11 R11, R25, R26, R27, R28, R29, R30, R39, R40, R41, R42
Resistor TKF, 75R, 1%, 1/16W, SMD, 0402
Yageo Corporation RC0402FR-0775RL
7 R13, R20, R21, R22, R23, R33, R34
Resistor TKF, 100R, 1%, 1/10W, SMD, 0402
Panasonic - ECG ERJ-2RKF1000X
12 R60, R61, R62, R63, R64, R65, R68, R69, R70, R71, R74, R75
Resistor TKF, 150R, 1%, 1/10W, SMD, 0603
Stackpole Electronics, Inc.
RMCF0603FT150R
4 R66, R67, R72, R73 Resistor TKF, 27R, 1%, 1/10W, SMD, 0603
Yageo Corporation RC0603FR-0727RL
1 R76 Resistor TKF, 560R, 1%, 1/10W, SMD, 0603
Yageo Corporation RC0603FR-07560RL
4 R77, R78, R79, R80 Resistor TKF, 1k, 1%, 1/10W, SMD, 0402
Panasonic - ECG ERJ-2RKF1001X
1 R81 Resistor TKF, 3.3k, 1%, 1/10W, SMD, 0402
Panasonic - ECG ERJ-2RKF3301X
1 R90 Resistor TKF, 49.9R, 1%, 1/8W, SMD, 0805
Panasonic - ECG ERJ-6ENF49R9V
3 R91, R92, R95 Resistor TF, 10k, 0.5%, 1/16W, SMD, 0402
Susumu Co., Ltd. RR0510P-103-D
1 R93 Resistor TKF, 49.9R, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF49R9V
TABLE B-1: dsPIC33CK256MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM) (CONTINUED)Qty. Designator Description Manufacturer Manufacturer Part Number
DS50002819A-page 22 2018 Microchip Technology Inc.
Bill of Materials (BOM)
1 R96 Resistor TKF, 3.3k, 0.5%, 1/16W, SMD, 0402
Panasonic® - ECG ERA-2AED332X
1 TP1 Misc, Test Point Multipurpose Mini, Black
Keystone Electronics Corp.
5001
1 TP2 Misc, Test Point PC Mini,0.040", D, Yellow
Keystone Electronics Corp.
5004
1 TP3 Connector, Test Point, TAB, Silver, Mini, 3.8x2.03, SMD
Keystone Electronics Corp.
5019
1 U1 Microchip Interface, USB,I2C/UART, MCP2221A-I/ML,QFN-16
Microchip Technology Inc.
MCP2221A-I/ML
1 U2 Microchip Analog LDO, 3.3V,MCP1755T-3302E/OT,SOT-23-5
Microchip Technology Inc.
MCP1755T-3302E/OT
1 U3 Microchip MCU, 16-Bit, 100 MIPS, 256k, 24k, dsPIC33CK256MP506-I/PT, TQFP-64
Microchip Technology Inc.
dsPIC33CK256MP506-I/PT
5 U4, U5, U6, U7, U8 Microchip Analog Op Amp,1-Ch, 10 MHz, MCP6V91UT-E/LTYCT-ND, SC-70-5
Microchip Technology Inc.
MCP6V91UT-E/LTY
1 Y1 Microchip Clock Oscillator,Single, 8.000 MHz, DSC6011JI2A-008.0000, VDFN-4
Microchip Technology Inc.
DSC6011JI2A-008.0000
TABLE B-1: dsPIC33CK256MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM) (CONTINUED)Qty. Designator Description Manufacturer Manufacturer Part Number
2018 Microchip Technology Inc. DS50002819A-page 23
DS50002819A-page 24 2018 Microchip Technology Inc.
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08/15/18