Dow CorningDow Corning OE-6662 Optical EncapsulantOct 08, 2014 · OE-6631 Optical Encapsulant...
Transcript of Dow CorningDow Corning OE-6662 Optical EncapsulantOct 08, 2014 · OE-6631 Optical Encapsulant...
Dow Corning® OE-6662Dow Corning OE-6662Optical Encapsulant
Typical Values of OE-6662
Property Units Value Property Units Value
One or Two Part - 2-part Adhesion - DieShear (Al)
MPa 5.9
Mix Ratio - 1:4 Tensile Strength MPa 7.5
Color - Colorless to pale yellow Yeong Modulus MPa 290
Viscosity/Flowability(part A)
cP 12,000 Complex Modulus MPa 95
Viscosity/Flowability(part B)
cP 3,000 Enlogation % 55
Viscosity/Flowability(average of A&B) cP 4,000 CTE (Alpha 1) ppm 100
Hardness Shore D 65 CTE (Alpha 2) ppm 210
Refractive Index - 1.53 Tg oC 43H2O Permeability g/m2/24h 13.7
O2 Permeability cm3/m3/24h/atm 495100%Light Transmittance
@450nm, 1mm thickness
How to Use
• Typical process- Mix at recommended standard ratio
• OE-6662 A/B=1/4
Designed for conventional dispensing process• Curing at 150C for 1 hr after de-gas under reduced
pressure
Silicone
Heat cureDispensing
Low Gas Permeability
13.7Dow Corning® OE‐6662 Optical Encaps lant (D65) 495OE 6662 (D65)
14.5
12.1
Dow Corning® OE‐6650 Optical Encapsulant (D50)
Dow Corning® OE‐6665 Optical Encapsulant (D70)
Optical Encapsulant (D65)
510
495
OE‐6665 (D70)
OE‐6662 (D65)
16.6
14.5
Dow Corning® OE‐6636 Optical Encapsulant (D30)
Dow Corning® OE‐6630 Optical Encapsulant (D40)
730
630
OE‐6636 (D30)
OE‐6630 (D40)
0 5 10 15 20
H20 (g/m2/24h)
0 100 200 300 400 500 600 700 800
O2 (cm3/m2/24h/atm)
Moisture PermeabilityTest Method: JIS Z 0208
40C/90%
Oxygen PermeabilityTest Method : JIS K 7126
23C/0%40C/90%Thickness: 0.9 mm
23C/0%Thickness: 0.9 mm
Low Surface Tackiness
Tackiness Force (gf)
Dow Corning®
OE-6631 Optical Encapsulant OE-6636 OE-6650 OE-6662
0 5k1 7.8 10.2 0.9 0.3
0.5kg Load Cell
2 9.3 10.3 1.4 0.23 7.9 10.2 0.7 0.5
A e 8 3 10 2 1 0 0 3
• Equipment: Texture analyzer TA XT Plus
Ave. 8.3 10.2 1.0 0.3
Equipment: Texture analyzer TA XT Plus• Probe size: ¼” spherical stainless probe
Improved Reliability - 5050 PKG Thermal Cycle Testing5050 PKG, Thermal Cycle Testing
PKG failure # / Total #
Cycles OE-6662(D65)
OE-6665(D70)
OE-6630(D40)
PKG failure # / Total #
0 0/12 0/11 0/12
250 0/12 10/11 0/12
300 6/12 10/11 10/12
350 7/12 10/11 12/12
400 11/12 - -
TCT condition:-40C(30min)/125C(30min)
Light Transmittanceg100
80
90
ance
% OE-6662
60
70
Tra
nsm
itta
50
60
400 450 500 550 600 650 700 750 800
Transmittance spectrum (2 mm thick)
Wave length nm
No particular light absorption in visible wavelength (400 -800 nm)
Pot Life
8000
6000
7000-s
)
3000
4000
5000
cosi
ty (m
Pa-
1000
2000
3000
Vis
c
OE-6662
00 2 4 6 8 10 12 14
Time (hr)
Viscosity change at 25 C for 8 Hr, 20% - 30% rangeTime (hr)
Viscosity with Temperature
5000
4000
OE 66623000
iscos
ity m
Pas
OE-6662
1000
2000Vi
020 40 60 80 100
T t CTemperature C
Temp ramp rate:5C/min
Cure Profile
30
25
30
15
20
que (
dNm
)
110C
5
10Torq
130C
150C
0
5
0 100 200 300 400 500 600
Time (sec)
Summary
• OE-6662 is a 1:4 mixing ratio HRI product designed f i l di i
g p gfor conventional dispensing process.
Key features areLower gas permeability than most of OE-66XXLower gas permeability than most of OE 66XX Low surface tackiness Improved reliability compared with OE 6665 Improved reliability compared with OE-6665
Package Information
• Package InformationPackage Information– 1.875 Kg –
A: 375g Bottle X 1, g ,B: 500g Bottle X 3
– Storage condition is below 32Cg– Shelf life is 12 months after
manufacturing
The information provided in this presentation does not constitute a contractual commitment by Dow Corning. While Dow Corning does its best to assure that information contained in this presentation is accurate and fully up-to-date Dow Corning does notdoes its best to assure that information contained in this presentation is accurate and fully up-to-date, Dow Corning does not guarantee or warranty the accuracy or completeness of information provided in this presentation. Dow Corning reserves the right to make improvements, corrections and/or changes to this presentation in the future.