RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS

CouvertureDos

RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS

Our SiP solutions embeds best standard semiconductor devices and

technology in one single highly miniaturized package with almost no limit for the

merging of heterogeneous technology (Die – Package – Sensors - Passives)

and form factors.

3D PLUS SiP design capabilities include Digital, Analog, Power and RF

electronics.

Our SiP modules can be shaped with various form factors and can be delivered

with several I/OS types.

Achieving a combination that cannot be realized with monolithic System-on-

Chip (SoC) approaches, and, relying on a proven “first time right” design flow,

3D PLUS Space Qualified SiPs are used in all the Space Application fields.

SPACE PRODUCTSSYSTEM-IN-PACKAGES

RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS

AN INNOVATIVE

COMPANY

RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS

3D PLUS is a world leading supplier of advanced high density 3D

microelectronic products and Die and Wafer Level stacking technology meeting

the demand for high reliability, high performance and very small size of today’s

and tomorrow’s electronics. We offer standard products and custom System-in-

Package (SiP) solutions based on our Space qualified and patented technology

portfolio. The company is ISO 9001:2008 certified and its stacking technologies

are qualified by European Space Agency for Space applications.

S PAC E S Y S T E M - I N -PAC K AG E S E X P E R T I S E

F L I G H T P R O V E N P R O D U C T S

With more than 110,000 modules in orbit today and a failure-free flight heritage

of more than 17 years, 3D PLUS is the largest Space Qualified MCM

manufacturer in Europe. 3D PLUS products are used by all the major space

agencies and customers worldwide. They fly in numerous missions : Smart-1,

Solar Probe, Proba-1, Mars Express, ISS, Rosetta, MMS, Bepi-Colombo…

K E Y B E N E F I T S

HETEROGENEOUS ELECTRONICS MIXED IN ONE SINGLE PACKAGE

HIGH DENSITY

HIGH SPEED PERFORMANCE

SMALL FORM FACTOR75 % space and weight savings in the design

HIGH RELIABILITY20 years lifetime

SPACE QUALIFIED TECHNOLOGY

FLIGHT PROVEN SIP PRODUCTS

RADIATION HARDENED (TID, SEE)

LONG TERM SUPPLY GUARANTY

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RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS

CouvertureDos

RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS

INITIAL CONCEPT ANALYSIS AND

FEASIBILITY STUDY

REQUIREMENTS DETAILED ANALYSIS

PRELIMINARY DESIGN DETAILED DESIGNPROTOTYPES

MANUFACTURING

INDUSTRIALIZATION AND FLIGHT MODELS

MANUFACTURING

ONE-STOP SOURCE FORSPACE SYSTEM-IN-PACKAGES

I N I T I AL C O N C E P T AN ALY S I S AN D F E AS I B I L I T Y S T U D Y

+ Initial requirements analysis

+ Initial feasibility study and SiP technology selection

+ Manufacturing line selection

R E Q U I R E M E N T S D E TAI L E D AN ALY S I S

+ Detailed requirements specification analysis

+ Final design trade-offs & feasibility studies

+ Product Requirement Specification

D E TAI L E D D E S I G N

+ Detailed design and lay-out of the module

+ Electrical Analysis and simulation

+ Final thermal and mechanical analysis

+ Detailed design report

+ Test equipment and procedure definition

+ Product validation and qualification plan

P R O T O T Y P E S M A N U F A C T U R I N G A N D T E S T

+ Design and manufacturing of themanufacturing and test specific tools,

+ Parts and materials procurement

+ Manufacturing and test of prototypes

+ Validation and Qualification tests report

+ Final updated Product specification anddata sheet

I N D U S T R I AL I Z AT I O N AN D F L I G H T M O D E L S M AN U FAC T U R I N G

+ Procurement of the additional specificmanufacturing and test tools

+ Flight Models Manufacturing

P R E L I M I N ARY D E S I G N

+ Functional and physical partitioning analysis

+ Module physical architecture and layers’ definition

+ Preliminary mechanical outline

+ Electrical analysis (power, critical signal paths,I/Os,…)

+ Thermal and mechanical analysis

+ Environmental compatibility analysis includingspace radiations (TID,SEL,SEU)

F R O M C O N C E P T TO D E S I G N A N D M A N U FA C T U R I N GYO U R D E S I G N S TA R T S H E R E

S I P D E S I G N F L O WAN D Q U AL I T Y AS S U R AN C E

First time right design approach

As highly integrated applications require a close partnership between

the customer and the design team to get the highest benefit from the

3-D Technology, 3D PLUS SiP design flow is organized as per a

proven “first time right” design and development methodology where:

+ the SiP electrical schematics and part list are provided by the

customer,

+ the SiP detailed feasibility study and design activities are performed

by 3D PLUS with close links with the users engineers,

+ the final electrical and qualification tests are reviewed and approved

by the customer.

Quality

3D PLUS SiP flows are certified by ESA and NASA for Space

applications. A Radiation Assurance Policy covers all the effects

induced on the semiconductor devices by the Space radiation

environment. 3D PLUS facilities are certified ISO 9001:2008.

A U N I Q U ET E C H N O L O G Y P O R T F O L I O

3D PLUS provides different very flexible Stack Technology Flows

qualified for Space and that can be used for the design of various

styles of SiPs:

+ Standard Packages Stack

+ Flex Process – Die Stack

+ Flex Process – SiP Stack (Heterogeneous components and mixed

technology stacks)

This technology can be used to develop Digital, Analog, Power, RF

and mixed signals electronics. The SiP modules can be shaped with

various form factors and can be delivered with several I/Os types.

Depending on the SiP performance requirements and targeted

market, the relevant stacking process will be selected within 3D PLUS

technology portfolio in order to bring the best added value and

benefits for our customer designs.

S Y S T E M - I N - PAC K AG E S ( S I P )O V E R V I E W

A System-In-Package consists of a number of dissimilar integrated

circuits enclosed in a single highly miniaturized package. The SiP

performs all or most of the functions of an electronic system, and, it

can contain several silicon components (bare die or package) and

passive components.

3D PLUS provides a one-stop source for customer’s concept analysis,

feasibility study, design, manufacturing and test of High Reliability and

High Performance SiP.

Our State-of-the Art stacking technologies for SiP allow us to bring the

best standard semiconductor devices and technologies in one single

highly miniaturized package with almost no limit for the merging of

heterogeneous technology (Die – package – Sensors - Passives).

Achieving a combination that cannot be realized with monolithic

System-on-Chip (SoC) approaches, 3D PLUS SiP stacks are more

effective and have also a lower development cost and a faster time to

market.

INDISPUTABLEBENEFITS

System In Package

Mixing of heterogeneous technologies ( bare dice -packages – sensors - passives) and form factors in one single highly miniaturized package.Enable achieving a combination that cannot be realized with other technology.

Miniaturization

Size reduction for the PWB and weight savings for theapplication.

Increased electrical performances

Interconnections are reduced and simplified.

Resistance to Harsh environments

Extended thermal cycles – High mechanical resistance -High temperature.

High Reliability

Proven technology combined with a unique design andmanufacturing know-how developed for more than 15years.

Space Qualified

Sole Space Qualified stacking technology worldwide.“Design for Space” Products definition.Space Flight heritage upward to 20 years missions in Geostationary Orbit.

Efficient Technology - Manufacturing Process

Excellent yield thanks to the test/screening of each layer before stacking.Flexibility and short development lead time.Simple and well proven technology process.Supply Chain for low volume - Space qualified applications.

Long Term Availability

Worldwide delivery guarantee.More than 10 years availability guarantee

Customer Support

Dedicated technical support team.Local sales network.

RSRKICK-OFF CDRPDR DDR

FROM YOUR NEEDS…

… TO OUR SIP MODULE