DOCUMENT COVER PAGE - Digi-Key Sheets/Panasonic Semiconductors... · DOCUMENT COVER PAGE ... Wire...
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����������Panasonic Semiconductor Singapore A Division of Panasonic Semiconductor Asia Pte Ltd Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486
Note: This cover page establishes the Doc No., Title and current status of the attached document.
Revision History
FMSC-GEN-M1-01
DOCUMENT COVER PAGE
Removed physical product marking indications.4
RemarksChange DetailsPageS/NEff DateRevIssue
Eff DateRevIssue LevelSDSC-PSE-AN17808BDoc No.
Doc Title Product Specifications for AN17808BTotal no. of pages(excluding this page)
1
14
28-MAR-054
4-NOV-0421 Added this cover page.-1Added this page for leadfree specification.7A2
Amended Outer Lead Surface Process &7A2Chip Mounting Method.
28-MAR-05 61
Removed this page.3 15-DEC-04 71
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28-MAR-05
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.FMSC-PSDA-002-01 REV 1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17808BRef No.
Total Page
Page No.
E
14
6
Package Name
Unit : mm
FP-12S29
.96
± 0.
3
28.0
± 0
.3
20.0
±0.1
0.6
6.4 ± 0.3∅ 3.6 7.7 ± 0.3 7.8 ± 0.3
0.6
± 0.
12.
54
3.5
± 0.
30.25
+0.1
-0.0
5
1.2
± 0.
1
R1.
8
112
29.6
± 0
.3
Lim Fuey Sheen
Kenneth Law
Yasuo Higuchi
12-SIL(FP)
*4
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Chip surface passivation
Lead frame material
Inner lead surface process
Outer lead surface process
Chip mounting method
Wire bonding method
Wire material
Mold material
Molding method
Fin material
SiN,
Fe group,
Ag plating,
Solder plating (98Sn-2Bi),
Ag paste,
Thermalsonic bonding,
Au,
Epoxy,
Transfer mold,
Cu group,
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
1
2 , 6
PSG,
Cu group,
Au plating,
Solder dip,
Multiplunger mold,
2
6
3
4
4
5
5
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.FMSC-PSDA-002-01 REV 1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
Ref No.
Total Page
Page No.
F
14
7A
(Structure Description)
Package FP-12S
AN17808B
-
65
7
7
1
4
2
3
Lim Fuey Sheen
Kenneth Law
Yasuo Higuchi
4-NOV-04
*3
(Leadfree)
Solder (95.5Pb-2.5Ag-2Sn)**Au-Si alloy,
15-DEC-04
*3
**Under RoHS exemption clause, Lead (Pb) in high meltingtemperature type solder (i.e. tin-lead solder alloys containing morethan 85% of lead), is exempted until 2010.
-
*3
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