Direct Optical Registration - A B R A C I · PDF fileDirect Optical Registration ......
Transcript of Direct Optical Registration - A B R A C I · PDF fileDirect Optical Registration ......
Direct Optical Registration Achieving optimum registration
Registration accuracy of typical systems•Punch or drill w/ heat bonding systems - 6 to 8 layer low technology
•Punch or drill w/ rivet systems – 6 to10 lyr, some HDI, small panel sizes
•Post etch punch w/ pin lam – limited panel sizes 75-100 micron typ -expensive $
•Post etch punch w/ DIS coupled inductive welding – more consistent registration, expanded sizes, not limited by lamination and separator plates
Direct Optical Registration Achieving optimum registration
Direct Optical Registration accuracy by DIS
•30 to 75 micron layer to layer registration typical after lamination
•high layer count, current customers process 24 to 34 layer and higher
•HDI & sub-laminated panels
•expanded sizes
Optimization of Direct Optical Registration using CMS
Direct Optical Registration of Multilayers
• All layers are optically aligned via the vision/positioning system
• Layers are held in position by a clamping mechanism
• Vision system maintains position of target during complete alignment/clamping cycles
CCD CAMERA
CCD CAMERA
Direct Optical Registration Capabilities
– +/-0.7 mil (17micron) nominal final registration accuracy prior to lamination.
– High layer count and HDI capable.– Improved sequential lamination registration.– Improves upon any current pin registration
approaches. – Provides a technical path for improvement in
layer to layer registration.
Direct Optical Registration
Machine vision based layup station. Eliminates punch/drill and pin registration processes.Improved layer to layer registration coupled with increased process stability.Reduces core handling.Layers are welded together using the DIS patented SmartWeld Welding Technology
SmartWeld Welding Technology
• Coupled Inductive energy transmission from top and bottom heads.
• Top and bottom heads can function as stand alone units
• Thermocouple imbedded in weld heads for precise control
A C
A C
Top SmartHead
Bottom SmartHead
tc
tc
SmartWeld Welding Technology
• Coupled Inductive energy for rapid, precise heating independent of layer count.
• Each weld coupon on each core is a heat source• Uniform heating from top to bottom on every layer. • Active pressure foot controls panel thickness and ensures heat transfer. • Programmable profile including ramp up, soak and cool down. • Simulates complete press profile on the weld area.
Direct Optical Registration vs. Pin RegistrationBenefits
• Operation benefits: – Accuracy is increased by the elimination of
punching operations.
– Utilizes existing lay up station labor.
– Simplified book break down, eliminates pin cleaning, bushing replacement.
Direct Optical Registration vs. Pin RegistrationCost and Process Savings
• Material Savings: – No yield loss from damaged cores during layup (thin
cores)
– No Rivet machines or templates required
– No tooled materials required: Foils, prepreg, CAC
– Panel size may vary without purchasing new tooling.
Direct Optical Registration Systems
• Layers are continuously checked by the vision system at all critical alignment step
• All systems utilize Coupled Induction to weld the layers
• No need for templates for different panel sizes
Equipment Features
Pre-align camera Touch Screen PC Interface
Pre-align platform
Panel unload
Alignment and welding area
PWS - Pin Welding System
PWS is a stepping stone to better registration accuracy
Utilizes SmartWeld coupled induction technology
Eliminates pin lamination processes.
Improved layer to layer registration coupled with increased process stability.
Reduces core handling.
Core Measurement Station :Precise measurement of actual target locations.Utilizes up to 10 cameras to maximize registration data collection.
Direct Optical Registration Technology Roadmap
Tolerances: Standard PEP/Rivet
Punched hole size variation due to thickness of laminate on innerlayer.
Location tolerance of hole to hole on innerlayer.
Location tolerance of image to punched slot on innerlayer.
Rivet size variation, tolerance increases with different quality rivets.
Alignment tolerance of tooling and tooling wear.
Layer shift due to rivet distortion.
+/- 13 micron (+/- 0.0005 inch)
+/- 25 micron (+/- 0.001 inch)
+/- 25 micron (+/- 0.001 inch)
+/- 25 micron (+/- 0.001 inch)
+/- 25 micron (+/- 0.001 inch)
+/- ??? micron
Tolerances: Rivet Template & Pin Lamination
Location tolerance of bushing in lamination plates
Location tolerance of slot to center of bushing
Lamination pin size
Distortion of innerlayer slots at lay up (thin cores)
Lamination bushings break in lamination plates
Lamination pins bend or break
+/- 8 micron (+/- 0.0003 inch)
+/- 25 micron (+/- 0.001 inch)
+/- 8 micron (+/- 0.0003 inch)