Dinesh P R Thanu, Platform Lead & Process Manager

Intel Corporation

Microprocessor Evolution

Semiconductor Outlook

Semiconductor Fabrication to Packaging

Opportunities for Ceramic Materials

Executive Summary

Ceramics Expo, Apr 26' 2017, OH

• Continuous growth market

• Moore’s law extends to make faster,

smaller and energy efficient packages

• Mobile, Automotive and Artificial

Intelligence segment continues to flourish

• IoT brings in a connected world

• Advanced fabrication and packaging

requisite raises

• Economy of silicon manufacturing

and packaging R&D becoming

challenging

• Performance and cost driving

technological development

• High competition and mounting need

for novel designs and materialsCeramics Expo, Apr 26' 2017, OH

Communication and Automotive market is thriving. Fast computing and data storage/processing is the keyCeramics Expo, Apr 26' 2017, OH

1970

20002010

Organic Substrate

Customer needs driving form factor and

computing needs driving complexity

Motherboard

IC is just a combination of thousands of transistors

and small wires onto semiconductor (Si)

Number of transistors in a chip

increased 10 foldNumber of transistors reaches a billion

Ceramic Substrate

Material Evolution

Technology

Evolution

Ceramics Expo, Apr 26' 2017, OH

• The power requirements are

increasing but the Si size is getting

smaller

• Getting the power in and dissipating

the heat out are two major

challenges

• There is need to optimize complete

Si package integrated power delivery

solution

• There is also corresponding need to

reduce the system heat with

efficient package designs and

materials

Ceramics Expo, Apr 26' 2017, OH

An unprocessed Si wafer costs a

few hundred bucks but is worth

in millions after assembly

Automotive and AI products

have multiple chips on one

package. ROI, reliability and

data processing are huge

challenges

For Si fabrication all fabs need to

be identical to make a robust,

reliable part

Maintenance of each fab costs

billions

It takes a few years to

make a new technology

part but less years to

obsolete them

Fabrication process involves

hundreds of cleaning, etching

and processing steps

Ceramics Expo, Apr 26' 2017, OH

Complexity

Cost

Apple River:Small Form Factors

Pathfinding on new Server architectures:

complex MCP’s, Multiple lids on package,

Stiffener designs, new materials

Ceramics Expo, Apr 26' 2017, OH

• Materials with good

electronic properties

are required at front

end of line processing

• Materials with good

electrical conductivity

is desired at the back

end of line processing

• Materials with good

thermal and optical

properties are needed

at packaging sector

Ceramics Expo, Apr 26' 2017, OH

Semiconductor evolution, its applications as well as fabrication and

packaging challenges are reviewed

Microelectronic packaging applications are growing rapidly in the past

decade. Performance, Integration and Reliability are the key drivers

IoT, data storage and processing demands will drive this growth further

Innovative technology, smart designs and novel materials are absolutely

required in the future

Ceramic materials with good electronic and/or electrical and/or thermal

properties with cost benefit will serve to address some of the current

fabrication and packaging process challenges

Ceramics Expo, Apr 26' 2017, OH

Intel Corporation | Dinesh Thanu | Email: dinesh.thanu@intel.com | Mobile: 5738236428

Ceramics Expo, Apr 26' 2017, OH