LTE : A driver to device complexity for smart experiencesIDATE 2011

2

Emerging Regions Smartphones

New Device Categories

Advanced Technology

GROWTH DRIVERS

2G to 3GMigration

3

� Deploy 3G enhancements that increase capacity and performance

� Leverage advanced topology solutions

� Deploy next-gen LTE to complement 3G and boost data capacity

� Continue to optimize Airlink technology

� Spectrum

Addressing Data Demand Growth

4

3G and 4G continue parallel evolution2012 2013 2014+2011

1X AdvancedCDMA20001X

SIMULTANEOUS 1X VOICE AND EV-DO/LTE DATA (SVDO/SVLTE)

DO AdvancedMulticarrier

EV-DORev A H/W Upgrade

EV-DO Rev. B(Commercial)

HSPA+ Advanced

HSPA+(Future)

Rel-11 & BeyondRel-10Rel-9

HSPA+(Commercial)

Rel-8Rel-7

HSPA

Rel-11 & BeyondRel-10Rel-9Rel-8LTE

AdvancedLTE

FDD andTDD

Created 09/19/2011

LTE Leverages new, wider and unpaired spectrum

LTE(Future)

Up to 4x voice capacity increase

DL: 3.1 MbpsUL: 1.8 Mbps

DL: 14.7 MbpsUL: 5.4 Mbps

DL: 14.7 MpsUL: 5.4 Mbps

DL: 9.3 MbpsUL: 5.4 Mbps

DL: 14.4 MbpsUL: 5.7 Mbps

DL: 28 MbpsUL: 11 Mbps

DL: 42 MbpsUL: 11 Mbps

DL: 84 Mbps (10 MHz)UL: 23 Mbps(10 MHz)

DL: 73 – 150 Mbps 2 (10 MHz – 20 MHz)UL: 36 – 75 Mbps 2 (10 MHz – 20 MHz)

DL: 1+ Gbps 3 (Up to 100 MHz)UL: 375+ Mbps 3 (Up to 100 MHz)

DL: 168 Mbps (20 MHz)UL: 23 Mbps (10 MHz)

DL: 336+ Mbps 1 (40MHz)UL: 46+ Mbps

1R11 expands multicarrier to 40 MHz to reach up to 336 Mbps, 2Peak rates for 10 and 20 MHz FDD using 2x2 MIMO, standard supports 4x4 MIMO enabling peak rates of 300 Mbps. Peak data rates takes overhead into account, per standards 172 Mbps is achievable in 20 Mhz. 3Peak rates can exceed 300 Mbps by aggregating multiple 20 MHz carriers planned for LTE Advanced (LTE Rel-10). Peak data rate can exceed 1 Gbps using 4x4 MIMO and at least 80 MHz of spectrum

CommercialNote: Estimated commercial dates.

5

More RF Bands for Mobile BroadbandNorth America

UMTS /CDMA AWS

UMTS/CDMA1900

UMTS/CDMA850

Extended AWS

LTE700

TD-LTE2600 (B41)

MSS 1500 (L-Band)

MSS2100 (S-band)

China

UMTS/CDMA2100

CDMA850

CDMA450

TD-SCDMA1900

TD-SCDMA2000

TD-LTE2300

TD-LTE 2600 (B38)

Japan

CDMA/UMTS850

UMTS/CDMA2100

UMTS1700

UMTS/LTE1500 (B11)

LTE1500(B21)

LTE850

LTE900

TD-LTE2600 (Bxx)

South America

UMTS2100

UMTS1800

UMTS1900

UMTS850

Europe

UMTS2100

UMTS900

CDMA450

LTE1800

UMTS1800

UMTS2600

LTE800

LTE2600-FDD

TD-LTE2100 (B34)

India

CDMA850

UMTS2100

UMTS900

TD-LTE2300 S Korea

UMTS850

LTE850

UMTS2100

CDMA1700

Australia

UMTS2100

UMTS850

UMTS900

LTE2600

6

LEVERAGE WIDER BANDWIDTH

Carrier aggregation acrossmultiple carriers and multiple bands

PRIMARILY HIGHER DATA RATES

(bps)

CARRIER AGGREGATION

LTECarrier #5

LTECarrier #4

LTECarrier #3

LTECarrier #2

LTECarrier #1 Aggregated

Data PipeUp to

100 MHz

ENHANCES USER EXPERIENCE

HIGHER PEAK AND USER DATA RATES

(OVER 1 GBPS POSSIBLE)

LEVERAGES ALL SPECTRUM ASSETS

7

Device and OS Choice

8

Multi-Mode Connectivity2G, 3G, 4G, LTE, WiFi, Powerline, NFC, Bluetooth, FM, Location

MACRO

MICRO

PICO

HOMEAPPLIANCES

BODY AREASENSORS

AUTOMOBILES

FEMTOCELL CONSUMERELECTRONICS

SMARTMETERS

12

Smart ExperiencesCombining Powerful Local Processing and Cloud Connectivity

13

The Future Mobile Experience

Devices PersonifiedEverything Connected

The World Organized Around You

14

Increasing Smartphone Compute PowerDMIPS

0

5 000

10 000

15 000

20 000

25 000

30 000

35 000

1996 1998 2000 2002 2004 2006 2008 2010 2012 2014

3.3 DMIPS/MHz x 2.5GHz x 4 Cores

15

The Power Management CrisisBalancing Usage and Battery Management—An Ongoing Crisis

Pow

er

2000 2008 2010

2G < 1W 2.5G~2-3W 3G up to 5W 4G up to 10W

Application and Services Requirements

Improvement

Battery Capacity

Hardware and Power Management Improvement

Battery Crisis

Source: Informa Telecom and Media

16

Modems need to be Complete

Built Smarter to Work Smarter

Connectivity

Qualcomm Designs, Integrates and Delivers

all the Pieces

Multimode3G/4G

Broadcast

OS Support

GPS

RF Multiband

Simplified APIs

Soft AP

Voice

Power Optimization

DSPAdvanced Receivers

17

� Industry leading technologies

� Real-time connection choices

� Smart signal clean-up

� Real-time optimized capacity loads

� Seamless handoffs

� HD Voice

� Noise cancellation

� Pre-designed to work best with apps processors

� 3G/4G, WLAN, BT, FM

� Multimode/Multiband

� Strong reliable connection in more places

� Smart power management and savings

� Support for connected applications

Always Connected

Fastest Connections

Smoothest Voice and Data

Modems need to be Complete Solutions That Adapt to Network Conditions Delivering Faster, Smoother Real-time Connections

18

Processors need to be CompleteBuilt Smarter to Work Smarter

Qualcomm Designs, Integrates and Delivers

all the Pieces

Multimedia

GPU

GPS

DSP

CPU

Modem

Power Mgmt

RF

Connectivity

Memory

Software/HLOS

19

Industry needs to Deliver Full Benefits of Integration

SMALLER FOOTPRINT

LOWER CHIP COSTS

POWER EFFICIENT

LOWER SYSTEM COSTS

LESS ENGINEERING,FASTER TIME TO MARKET

~10–20% savings

Up to 35% better

10–20% smaller

>745 devices launched in Fiscal 2010

~$3–$6 BOM savings

Source: Qualcomm estimates.

20

World’s First Multi-Mode 3G / 4G Integrated ChipsetMSM8960

MDM 8960LTE/TD LTE

MULTI-MODE3G DUAL CORE

CPU UPGRADE � New micro-architecture

� ~5x performance

� ~75% lower power

GRAPHICS UPGRADE� ~4x performance

INTEGRATED CONNECTIVITY� WLAN, GPS, Bluetooth, FM

MULTI-MODE MODEM� Integrated LTE Multi-Mode

� All 3G modes supported

FIRST CHIP OF THE NEW SNAPDRAGON FAMILY

Thanks