Die Attach Filmbetween DAF and Dicing Film Adhesive Properties N/25㎜ After UV 0.14 0.10 Adhesion...
Transcript of Die Attach Filmbetween DAF and Dicing Film Adhesive Properties N/25㎜ After UV 0.14 0.10 Adhesion...
Die Attach FilmDie Attach FilmINNOSEM WL SeriesINNOSEM WL Series
January. 2012January. 2012
R&D CenterR&D Center-- PKG materials 1team PKG materials 1team --
목 차
▣ Activities of INNOX DAF
▣ Structure of INNOX DAF
▣ Product Code Description
▣ DAF Product Line-up
▣ General Properties of WL Series
▣ Recommend Condition of DAF
▣ Evaluation of DAF
▣ Appendix. Appendix.
1. PKG Description
2. Process Condition
3. Workability & Reliability
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Customer Model Application PKG Reliability
MSL L1
MSL L2a
MSL L1
MSL L2aH社 WL -03D
End-customer
S社(PKG) uSD&SD PKG Qualified S社
A社LGA PKG Qualified
BGA PKG Qualified
B社
K社
W社 MCP PKG Qualified Taiwan customer
Se社TSOP PKG Qualified
FBGA PKG QualifiedH社 外
B社(Card)
WL -02DS
(WL -05A)
uSD&SD, UFD Qualified L社
DDP PKG Qualified
DDP/ODP PKG Qualified
Ha社WL -02DS
(WL -05A)TSOP PKG Under Eval’
A社
(Non-filler type)
H社
■ Customer List _ Domestic
▣ Activities of INNOX DAF
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Customer Model Application PKG Reliability
MSL L2a
End-customer
S社(TWN)
uSD/SD Card QualifiedTFBGA Qualified TSOP QualifiedLGA Under Eval’
S社/Sa社Sa社Sa社M社
O社(TWN)uSD/SD Card QualifiedTFBGA Qualified LGA Under Eval’
S社/Sa社Sa社
K社(TWN)MCP PKG QualifieduSD/BGA Under Eval’
Sd社(TWN) uSD Card Qualified Sa社
E社(CHN)
WL -02DS
(WL -05A)
uSD/SD Card Qualified Sa社
P社(TWN) uSD/TFBGA Under Eval’ T社/E社
Sa社(CHN) uSD/LGA/BGA/MCP Under Eval’
A社(TWN) FBGA/aQFN Under Eval’
C社(CHN) uSD/LGA/BGA/MCP Under Eval’
WL -02DS
(WL -05A)
I社
▣ Activities of INNOX DAF
■ Customer List _ Overseas
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WL SeriesItems Material
WL0010 WL0020 WL0025 WL0040
Cover Film PET Film 36㎛
Die Attach Film Epoxy Composite 10㎛ 20㎛ 25㎛ 40㎛
PSA UV Adhesive 10㎛Dicing Film
Base Film PO Film 100㎛
▣ Structure of INNOX DAF
Cross-sectionPrecut shape
A
B
Cover film
Adhesive Layer
PSA
Base filmDicing film
Precut dimension
A B C
8” 220±1mm 279±5mm 290±2mm
12” 320±1mm 378±5mm 390±2mm
C
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INNOSEM WL 0 020 02DS
Revision No.
Die Attach Film Thickness(㎛)
Base Film Thickness(mil)
WL : Wafer Backside Lamination Film
PW : Penetration WBL
Products Name
▣ Product Code Description
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INNOX H社Item Unit
WL -02DS FH-9211S
Test Method
Cover Film ㎛ 36 38
Die Attach Film ㎛ 20 20Dimension ThicknessMicro-Gauge
Dicing Film ㎛ 110 110
Glass Transition Temperature (Tg) ℃ 208 197 DMA
α1 ( < Tg ) ppm /℃ 86.8 89.2CTE
α2 ( > Tg ) ppm /℃ 213.6 215.2TMA
35℃(Before Cure) MPa 36.67 36.73
ThermalProperties
Elastic Modulus 250℃(After Cure) Mpa 8.59 4.93
DMA
Before UV 1.20 1.80Peel Strength between DAF and
Dicing FilmAdhesiveProperties
N/25㎜After UV 0.14 0.10
Adhesion Strength of DAF N/m 840 1150
UTM
Dwell time (@150℃) Min. 120 30
Die Shear Strength kgf > 10.0 > 10.0
Moisture Absorption % < 0.5 < 0.5Others
Work Life (at room temp.) Day < 90 -
INNOXMethod
▣ General Properties of WL Series
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Process Item Unit Recommend Condition
Temp ℃ 65~70Wafer Mount
Temp ℃ 125~150D/A Cure
Time
Pressure N/㎠ 10~15
Blade Rotation rpm 40~45K
Feed Speed ㎜/sec 30~80Sawing
Blade height ㎛ 70~80
Center Wave Length ㎚ 365
Illumination mw/㎠ 60~80UV Cure
Light Amount mj/㎠ 200
Temp ℃ 120~150
Time sec 0.5~2.0D/A
Pressure Kgf 1.0~2.0
min 30~60
Wire Bond Temp ℃ 120~175
EMC Mold User Condition
Temp ℃ 175~180Cure
Time min 60~120
▣ Recommend Condition of DAF
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Wafer Mount Dicing Pick up
Blade Rotation :
40,000~45,000rpm
Feed Speed : 30~80㎜/sec
Blade Height : 70㎛
Temp. : 65~70℃
UV Cure
UV Radiation :
150~200mj/㎠
1st Die Attach
Temp. : 120~150℃
Time : 0.5~2.0sec
Press : 1.0~2.0kgf
2nd Die Attach
Temp. : 120~150℃
Time : 0.5~2.0sec
Press : 1.0~2.0kgf
BT Substrate
UV Dicing
DAF
Wafer
▶▶ Application of Application of 4Die Stack
3rd Die Attach
Temp. : 120~150℃
Time : 0.5~2.0sec
Press : 1.0~2.0kgf
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4th Die Attach
Temp. : 120~150℃
Time : 0.5~2.0sec
Press : 1.0~2.0kgf
▶▶ Application of Application of 4Die Stack
Wire Bonding
Temp. : 120~150℃
Die Attach Cure
Temp. : 125℃
Time : 30min
Mode : Ramp up 30min
Molding
Temp. : 175~180℃
Time : 60~120min
Mode : Ramp up 30min
Cure
User Condition
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Package Description(unit : ㎜)
ID Items Dimension
ASubstrate Thickness
0.19㎜
B Mold clearance 0.43㎜
C1~C4 Film Thickness 20+/-3㎛
D Die Thickness 0.070㎜
Assembly BOM set
Item Supplier Model
Substrate L Co. ADS37312-002
Film Adhesive INNOX WL0020-02DS
Gold Wire H Co. 0.8mil Pd Alloy(US-U Type)
Mold Compound C Co. SG-8300BA(14pi * 5.8g)
1. PKG Description
C1A
C2
DC3
C4
B
▣ Evaluation of DAF
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ParameterItems Unit
Nand Controller
Machine - YAMAHA YV100XT
Lamination Temp. ℃ 67 67
Lamination Pressure MPa 0.5 0.5
Lamination Speed mm/sec 17 17
Wafer Thickness ㎛ 70 200
Items UnitParameter
Nand Controller
Machine - DISCO DFD-6361
Die Size ㎜ 12.530 x 13.590 2.425 x 4.782
Blade Type - ZH05 CD / ZH05 BB 27HDCD / 27HCBC
Blade Height ㎛ 160 / 70 200 / 70
Rotation Speed RPM 40K / 50K 40K / 45K
Feed Speed ㎜/sec 40 40
2-1. Wafer Lamination Condition
2-2. Sawing Condition
2. Process Condition
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ParameterItems Unit
Nand Controller
Machine - Shinkawa SPA-300
Die Size ㎜ 12.530 x 13.590 2.425 x 4.782
Die Thickness ㎛ 70 200
Quantity of Pin EA 13 2
Pick-up Time [msec.] 200 200
Pin Height ㎛ 350 200
Wafer Expanding ㎜ 4.0 4.0
Items Unit Parameter
Lamp Type - High Pressure Mercury Lamp
Illumination mw/㎠ 80
Light Amount mj/㎠ 200
2-3. UV Cure Condition
2-4. Pick-up Condition
▣ Evaluation of DAF
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ParameterItems Unit
Nand Controller
Machine - Shinkawa SPA-300
Temperature ℃ 120 135
Bond Force gf 500~1000 400
Bond Time msec. 1000 500
2-5. Die Attach Condition
▣ Evaluation of DAF
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Sawing Result (Nand)
3-1. Workability of WL0020
3. Workability & Reliability
Rotation Speed Feed Speed Wafer Sawing Line Base Film Sawing Line
45k rpm 40㎜/s
Pick up Result (Nand)
Pin Height Pick-up missPick-up Quantity
Sub Parameter
300㎛ 0 1500ea
Wafer Expanding : 4.0㎜
Pin Quantity : 13ea
Pick up Force : 70gf
Pick up Time : 200㎳
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3-2. Reliability of WL0020
(1) MRT L2 : Pass
Reliability Condition of WL0020
Item MRT(85℃/60%RH, 168hr)
WL0020 Level 2 Pass (0/190ea)
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▣ Appendix 1. Appendix 1. Storage Condition
Items Specification
Shelf Life Before openingBelow 5℃ / 1 year
RT / 3 month
Aging condition RT / 4hr
After wafer mount RT / 60 daysWorking
ConditionAfter UV Irradiation RT / 60 days
It is recommended that UV cure should be proceeded within 60days from wafer
mount process.
After UV Irradiation, pick up process should be finished within 60days
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1. Test Purpose
- Checking Void after Mold by Stage Hold Time / Temperature
2. Test Item
1. Mold testing by Stage Hold Time / Temperature
- 30, 60, 90, 120min / 150℃
3. Test Condition
` Die Attach Stage Hold Mold PMC & MRT
30min
60min
90min
Reliability(Dwell Time)
Process
130℃
Roll Lamination150℃
190℃
120sec,
50kgf
PMC : 180℃ 120min
(Rising 30min)
MRT : 115℃ Boiling
120min
Solder 260℃
30sec 120min
BT Sub.
GlassAdhesive
[ Sample Structure ]
4. Test Result
30min 60min 90min 120min
WL0020-02DS Vanish Vanish Vanish Vanish
FH-9211S Vanish Trap Trap Trap
▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)
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Sub attach Stage hold Mold PMC MRT Result
150℃
30minVanish
150℃
60minVanish
150℃
90minVanish
02DS
150℃
120minVanish
(stage hold 150℃ ; 30,60,90,120min)(stage hold (stage hold 150150℃℃ ; ; 30,60,90,120min30,60,90,120min))
▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)
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Sub attach Stage hold Mold PMC MRT Result
150℃
30minVanish
150℃
60minTrap
150℃
90minTrap
FH-9211S
150℃
120minTrap
▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)
(stage hold 150℃ ; 30,60,90,120min)(stage hold (stage hold 150150℃℃ ; ; 30,60,90,120min30,60,90,120min))